iNEMI Review Update

David Godlewski, iNEMI

March 5, 2012

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Contents

Introductions; Roles & Interests

iNEMI Overview & Membership

Technology Roadmap

Collaborative Projects; Packaging

Collaborative Projects; MEM’s

Summary & Discussion/Feedback

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2

About iNEMI

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International Electronics Manufacturing Initiative (iNEMI) is an

industry-led consortium of 99 global manufacturers, suppliers,

industry associations, government agencies and universities. Working

on advancing manufacturing technology since 1994.

Visit us at www.inemi.org.

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities Documents

• Proactive Forums

• Position Papers

4 Major Focus Areas:

• Miniaturization

• Environment

• Energy

• Medical Electronics

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

3

Global Operations

• iNEMI is headquartered in Herndon, Virginia, USA.

• Opened an office in Shanghai and added a team member in Europe in 2007.

• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.

• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.

4

Unique Attributes of the iNEMI Consortia

• Strong Global Membership accompanied by a mission that

focuses on identifying global manufacturing challenges

• Delivery of a total industry set of priorities every two years:

– A Technical Plan that defines key collaborative

opportunities and gaps in the 1-5 year horizon

– A set of Research priorities for the 5-10 year horizon

• A proven methodology for effective pre competitive

collaboration.

• Ability to execute an integrated supply chain approach on

solving complex manufacturing and systems integration

issues.

• A growing reputation as a proactive leading organization in

the environment and sustainability

4

5 5

Product

Needs

Technology

Evolution

GAP Analysis

Technology Plan

Research

Priorities

Research

Projects

Methodology

Competitive

Solutions

Roadmap

Industry Solution

Needed

Academia

Government

iNEMI

Members

Collaborate

No Work

Required

Available

to Market

Place

Global

Industry

Participation Disruptive

Technology

6

International Members

Across The Total Supply Chain (Q311)

6

Key Observations:

• New members joining to participate in Environmental and Packaging Projects and

in collaborative R&D opportunities

• 170% Growth in Europe Since 1/1/2010; 60% Industry Growth Overall

• 160% Growth in University/Research Institutes Since 1/1/2010

Total Global Supply Chain Integration

The International Membership Incorporated Location; Number of Members

INEMI Member Business Type North America

Asia Region

Europe Totals

OEM 14 2 2 18

ODM/EMS (inc. pkg. & test services) 4 7 11

Material Suppliers 8 14 11 33

Equipment Suppliers 8 1 2 11

Universities & Research Institutes 8 2 3 13

Organizations/consulting 10 1 2 13

Totals 52 27 20 99

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Why Organizations Participate in iNEMI

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• Opportunity to broaden your organization’s engagement in the

industry

• Better anticipate technology trends & inflexion points

• Collaborate with key players, industry experts, customers and

suppliers, globally – in all major markets

• Get access to learning and knowledge experts within iNEMI

members

• Help influence and create industry-standard solutions that lead to

competitive and best in class products and product attributes

• Help guide and benefit from industry innovation and funded

research

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• Cost Reduction by leveraging resources – Typically in the 8X to

20x range on key projects and thrusts:

– Reduce resource demands and $ investments for each

company.

– Ensure technology readiness when required.

– Projects can result in cost reduction (ex. Copper wire bonding).

• Reduce risk of technology introduction

– Reliability – Hard to measure the negative impact of poor

reliability, but can be disastrous.

– Source of supply – Also hard to apply general cost impact

numbers to being late to market – Can also be huge.

Motivation to Participate in Collaborative Projects

9 9

Annual Participation Fees

Participating Members (For Profit)

Corporate Sales (USD) Membership Dues

$0-5M $5,000

$5-10M $10,000

$10-100M $15,000

$100M-1B $25,000

$1-10B $40,000

$10-15B $55,000

$15B+ $75,000

Affiliate Members (Not-For-Profit)

Category Membership Dues

University $5,000

RI/Org./Gov. Lab/R&D

Center $10,000

Membership

3/2/12

OEM/ODM/EMS Members

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Supplier Members

12

Supplier Members – PWB Supply Chain

13

Association/Consortium, Government, Consultant

& University Members

14

pinfa

iNEMI Areas of “Critical Mass” • Leading OEMs &

Semiconductors

– IBM

– HP

– Dell

– Lenovo

– Intel

– Microsoft

– Delphi

– RIM

– Cisco

– Huawei

– Alcatel Lucent

– Juniper Networks

– Many Medical OEM’s

• Packaging Firms

– STATS ChipPAC

– Amkor

– ASE Group

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• Laminate/substrate suppliers

– Ibiden

– Samsung Electro Mechanics Co

– NGK/NTK

– Rogers

– Doosan

– Multek

– ITEQ

– Nanya

– Shengyi Sci. Tech.

– Endicott Interconnect Tech.

– Elec & Eltek

– Dyconex

– AT&S

• ODM/EMS firms

– Celestica

– Quanta

– Sanmina SCI

– Plexus

– Flextronics

– Foxconn

• Test Firms

– Agilent

– Asset

– Corelis

– TRI

– Teradyne

• Chemical/Adhesives/Metals

- Dow -- Nippon

- Inventec -- Heraeus

- Henkel

- Indium

Board of Directors

Directors

Dr. Nasser Grayeli, Exec VP of TMG; Director of Corp Q & R, Intel– Chairman

Dr. Marc Benowitz, Director, Reliability & Eco-Env Eng, Alcatel-Lucent

Dr. B.J. Han, Exceutive VP & CTO, STATS ChipPAC

Kevin Keller Chief Engineer, Mfg. Eng & Customer Sat., Delphi

Kim Hyland, Sr. Director of Mfg. Operations Eng., Cisco Systems

Dr. Sundar Kamath, Senior VP – Customer Eng & Technology, Sanmina-SCI

Dr. Jean-Luc Pelissier, CEO, CBA Group LLC

Rob Shaddock, CTO, Senior VP, Tyco Electronics

Michael Toben, Director, Pkg. & Finishing Technology, Dow Electronic Mtls

Barbara Reed, VP, Worldwide ISC Engineering, IBM Integrated Supply Chain

Ex-officio Members

Bill Bader, CEO, iNEMI

Dr. James Olthoff, Deputy Director, EEE Laboratory, NIST

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iNEMI Roadmap

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Statistics for the 2011 iNEMI Roadmap • > 575 participants

• > 310 companies/organizations

• 18 countries from 4 continents

• Greater than 7 man years of resources in the development

• 21 Technology Working Groups (TWGs)

• 6 Product Emulator Groups (PEGs)

• > 1800 pages of information

• Roadmaps the needs for 2011-2021

• New roadmaps on:

– MEMS/Sensors

– Energy Storage & Conversion

– Aerospace & Defense

• Over 55 long term research priorities identified

• And 160 short to medium term key technical gaps

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19 19

19

2011 Technology Working Groups (TWGs)

Organic PCB Board

Assembly Customer

RF Components &

Subsystems

Optoelectronics Large Area, Flexible Electronics

Energy Storage &

Conversion Systems

Modeling, Simulation,

and Design

Packaging

&

Component

Substrates

Semiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Information

Management

Systems

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

MEMS/

Sensors

Red=Business Green=Engineering Purple=Manufacturing Blue=Component &

Subsystem

Solid State Illumination

Photovoltaics

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Roadmap Development

20

Product Emulator Groups TWGs

Med

ical P

rod

uc

ts

Au

tom

oti

ve

Net

Co

m/D

ata

Co

m

Semiconductor Technology

Design Technologies

Manufacturing Technologies

Comp./Subsyst. Technologies

Modeling, Thermal, etc.

Board Assy, Test, etc.

Packaging, Substrates, Displays, etc.

Business Processes

Prod Lifecycle Information Mgmt.

Po

rtab

le / C

on

su

mer

Off

ice / L

arg

e S

yste

ms

Product Sector Needs Vs. Technology Evolution

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Optoelectronics and

Optical Storage

Organic Printed

Circuit Boards

Magnetic and

Optical Storage

Supply Chain

Management

Semiconductors

iNEMI

Information

Management

TWG

iNEMI

Mass Data

Storage TWG

iNEMI / IPC / EIPC

/ TPCA

Organic PWB

TWG

iNEMI / ITRS /

MIG/PSMA

Packaging

TWG

iNEMI

Board

Assembly

TWG

Interconnect

Substrates—Ceramic

iNEMI Roadmap

iNEMI

Optoelectronics

TWG

Fourteen Contributing Organizations

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iNEMI / MIG

/ ITRS

MEMS

TWG

iNEMI

Passives

TWG

Focus Areas

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Approach to Drive iNEMI Focus Areas

• Steering Committees in place in all four areas of focus

• Have each of these focused teams represented by

active BOD members in addition to iNEMI senior staff.

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• Chair: Bill Bader, iNEMI

• BoD Sponsor: Marc Benowitz, Alcatel-Lucent

• Todd Brady, Intel

• Jackie Adams, IBM

• Jay Celorie, HP

• Frank Elsesser, Agilent Technologies, Inc.

• William Guthrie, Lenovo

• Joe Johnson, Cisco

• Scott O’Connell, Dell

• Tom Okrasinski, Alcatel-Lucent

• Bob Pfahl, iNEMI

• Tamim Sidiki, DSM Engineering Plastics

• Mary Liz Burns; I.H.S and iSuppli

Leadership Steering Committee (ELSC)

Environmental

The iNEMI Environmental Vision

• We will take the initiative to fully leverage the iNEMI

roadmap and aggressively drive the key environmental

gaps and opportunities in and through the mfg

electronics supply chain

– Focused collaborative research with universities and key

governmental labs working in sync with industry.

– Proactive member led environmental improvement projects that

close the technology gaps.

– Strengthen ties with policy decision makers. Ensure sustainable

solutions are put in place

• Problems will be attacked with scientific depth and rigor

and the solutions implemented will be far reaching and

sustainable.

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• BoD: Byung Joon Han – STATS ChipPAC

• Co-Chairs: Hamid Azimi – Intel; Jie Xue – Cisco

• Leader: Bob Pfahl – iNEMI

• John Savic – Cisco

• Mahadevan Iyer– Texas Instruments

• Charan Gurumurthy – Intel

• Jim Wilcox, IBM

• ASE – Bernd Appelt

• Amkor – Lee Smith

• IBIDEN

• NTK

• imec

iNEMI Packaging Leadership Steering

Committee

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Collaborative Projects

28

iNEMI Initiatives (Examples; 23 in Process)

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Number Focus Area Project / Initiative Title

1 OTHER

Optical Device Inspection & Cleaning Program’s Connector

Particles Thickness

2 ALTERNATIVE ENERGY Structured R&D into truly high power and high thermal performance capabilities that enable much higher wind systems efficiency

3 ENVIRONMENTAL Alternatives Assessment to Identify Environmentally Preferred Materials for Electronics

4 MEDICAL ELECTRONICS Define optimized reliability testing for medical implantable products

5 MEDICAL ELECTRONICS Define standardized medical component specs that meet DFM, DFT and Reliability Requirements

6 MINIATURIZATION Advanced Si-node Pb-free Underfill Reliability

7 OTHER Counterfeit Electronic Components Assessment

8 OTHER Standardization of Safety Requirements for Semiconductor Packaging Equipment

9 MEDICAL ELECTRONICS Create industry wide standard medical reliability qualification methods

10 MEDICAL ELECTRONICS Drive progress in medical supply chain alignment and capabilities

11 MINIATURIZATION Drive radical ODM/EMS improvements in new technology qualification and certification method and results

12 MINIATURIZATION Board Flexure Standardization - White Paper ~4Q11 Start

www.inemi.org Email contacts:

Bill Bader

bill.bader@inemi.org

Bob Pfahl

bob.pfahl@inemi.org

Grace O’Malley - Europe

gomalley@inemi.org

Haley Fu - Asia

haley.fu@inemi.org