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Contents
Introductions; Roles & Interests
iNEMI Overview & Membership
Technology Roadmap
Collaborative Projects; Packaging
Collaborative Projects; MEM’s
Summary & Discussion/Feedback
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About iNEMI
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International Electronics Manufacturing Initiative (iNEMI) is an
industry-led consortium of 99 global manufacturers, suppliers,
industry associations, government agencies and universities. Working
on advancing manufacturing technology since 1994.
Visit us at www.inemi.org.
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
4 Major Focus Areas:
• Miniaturization
• Environment
• Energy
• Medical Electronics
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
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Global Operations
• iNEMI is headquartered in Herndon, Virginia, USA.
• Opened an office in Shanghai and added a team member in Europe in 2007.
• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.
• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.
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Unique Attributes of the iNEMI Consortia
• Strong Global Membership accompanied by a mission that
focuses on identifying global manufacturing challenges
• Delivery of a total industry set of priorities every two years:
– A Technical Plan that defines key collaborative
opportunities and gaps in the 1-5 year horizon
– A set of Research priorities for the 5-10 year horizon
• A proven methodology for effective pre competitive
collaboration.
• Ability to execute an integrated supply chain approach on
solving complex manufacturing and systems integration
issues.
• A growing reputation as a proactive leading organization in
the environment and sustainability
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5 5
Product
Needs
Technology
Evolution
GAP Analysis
Technology Plan
Research
Priorities
Research
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
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International Members
Across The Total Supply Chain (Q311)
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Key Observations:
• New members joining to participate in Environmental and Packaging Projects and
in collaborative R&D opportunities
• 170% Growth in Europe Since 1/1/2010; 60% Industry Growth Overall
• 160% Growth in University/Research Institutes Since 1/1/2010
Total Global Supply Chain Integration
The International Membership Incorporated Location; Number of Members
INEMI Member Business Type North America
Asia Region
Europe Totals
OEM 14 2 2 18
ODM/EMS (inc. pkg. & test services) 4 7 11
Material Suppliers 8 14 11 33
Equipment Suppliers 8 1 2 11
Universities & Research Institutes 8 2 3 13
Organizations/consulting 10 1 2 13
Totals 52 27 20 99
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Why Organizations Participate in iNEMI
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• Opportunity to broaden your organization’s engagement in the
industry
• Better anticipate technology trends & inflexion points
• Collaborate with key players, industry experts, customers and
suppliers, globally – in all major markets
• Get access to learning and knowledge experts within iNEMI
members
• Help influence and create industry-standard solutions that lead to
competitive and best in class products and product attributes
• Help guide and benefit from industry innovation and funded
research
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• Cost Reduction by leveraging resources – Typically in the 8X to
20x range on key projects and thrusts:
– Reduce resource demands and $ investments for each
company.
– Ensure technology readiness when required.
– Projects can result in cost reduction (ex. Copper wire bonding).
• Reduce risk of technology introduction
– Reliability – Hard to measure the negative impact of poor
reliability, but can be disastrous.
– Source of supply – Also hard to apply general cost impact
numbers to being late to market – Can also be huge.
Motivation to Participate in Collaborative Projects
9 9
Annual Participation Fees
Participating Members (For Profit)
Corporate Sales (USD) Membership Dues
$0-5M $5,000
$5-10M $10,000
$10-100M $15,000
$100M-1B $25,000
$1-10B $40,000
$10-15B $55,000
$15B+ $75,000
Affiliate Members (Not-For-Profit)
Category Membership Dues
University $5,000
RI/Org./Gov. Lab/R&D
Center $10,000
iNEMI Areas of “Critical Mass” • Leading OEMs &
Semiconductors
– IBM
– HP
– Dell
– Lenovo
– Intel
– Microsoft
– Delphi
– RIM
– Cisco
– Huawei
– Alcatel Lucent
– Juniper Networks
– Many Medical OEM’s
• Packaging Firms
– STATS ChipPAC
– Amkor
– ASE Group
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• Laminate/substrate suppliers
– Ibiden
– Samsung Electro Mechanics Co
– NGK/NTK
– Rogers
– Doosan
– Multek
– ITEQ
– Nanya
– Shengyi Sci. Tech.
– Endicott Interconnect Tech.
– Elec & Eltek
– Dyconex
– AT&S
• ODM/EMS firms
– Celestica
– Quanta
– Sanmina SCI
– Plexus
– Flextronics
– Foxconn
• Test Firms
– Agilent
– Asset
– Corelis
– TRI
– Teradyne
• Chemical/Adhesives/Metals
- Dow -- Nippon
- Inventec -- Heraeus
- Henkel
- Indium
Board of Directors
Directors
Dr. Nasser Grayeli, Exec VP of TMG; Director of Corp Q & R, Intel– Chairman
Dr. Marc Benowitz, Director, Reliability & Eco-Env Eng, Alcatel-Lucent
Dr. B.J. Han, Exceutive VP & CTO, STATS ChipPAC
Kevin Keller Chief Engineer, Mfg. Eng & Customer Sat., Delphi
Kim Hyland, Sr. Director of Mfg. Operations Eng., Cisco Systems
Dr. Sundar Kamath, Senior VP – Customer Eng & Technology, Sanmina-SCI
Dr. Jean-Luc Pelissier, CEO, CBA Group LLC
Rob Shaddock, CTO, Senior VP, Tyco Electronics
Michael Toben, Director, Pkg. & Finishing Technology, Dow Electronic Mtls
Barbara Reed, VP, Worldwide ISC Engineering, IBM Integrated Supply Chain
Ex-officio Members
Bill Bader, CEO, iNEMI
Dr. James Olthoff, Deputy Director, EEE Laboratory, NIST
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Statistics for the 2011 iNEMI Roadmap • > 575 participants
• > 310 companies/organizations
• 18 countries from 4 continents
• Greater than 7 man years of resources in the development
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• > 1800 pages of information
• Roadmaps the needs for 2011-2021
• New roadmaps on:
– MEMS/Sensors
– Energy Storage & Conversion
– Aerospace & Defense
• Over 55 long term research priorities identified
• And 160 short to medium term key technical gaps
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2011 Technology Working Groups (TWGs)
Organic PCB Board
Assembly Customer
RF Components &
Subsystems
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Purple=Manufacturing Blue=Component &
Subsystem
Solid State Illumination
Photovoltaics
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Roadmap Development
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Product Emulator Groups TWGs
Med
ical P
rod
uc
ts
Au
tom
oti
ve
Net
Co
m/D
ata
Co
m
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
Business Processes
Prod Lifecycle Information Mgmt.
Po
rtab
le / C
on
su
mer
Off
ice / L
arg
e S
yste
ms
Product Sector Needs Vs. Technology Evolution
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Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
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iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
Approach to Drive iNEMI Focus Areas
• Steering Committees in place in all four areas of focus
• Have each of these focused teams represented by
active BOD members in addition to iNEMI senior staff.
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• Chair: Bill Bader, iNEMI
• BoD Sponsor: Marc Benowitz, Alcatel-Lucent
• Todd Brady, Intel
• Jackie Adams, IBM
• Jay Celorie, HP
• Frank Elsesser, Agilent Technologies, Inc.
• William Guthrie, Lenovo
• Joe Johnson, Cisco
• Scott O’Connell, Dell
• Tom Okrasinski, Alcatel-Lucent
• Bob Pfahl, iNEMI
• Tamim Sidiki, DSM Engineering Plastics
• Mary Liz Burns; I.H.S and iSuppli
Leadership Steering Committee (ELSC)
Environmental
The iNEMI Environmental Vision
• We will take the initiative to fully leverage the iNEMI
roadmap and aggressively drive the key environmental
gaps and opportunities in and through the mfg
electronics supply chain
– Focused collaborative research with universities and key
governmental labs working in sync with industry.
– Proactive member led environmental improvement projects that
close the technology gaps.
– Strengthen ties with policy decision makers. Ensure sustainable
solutions are put in place
• Problems will be attacked with scientific depth and rigor
and the solutions implemented will be far reaching and
sustainable.
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• BoD: Byung Joon Han – STATS ChipPAC
• Co-Chairs: Hamid Azimi – Intel; Jie Xue – Cisco
• Leader: Bob Pfahl – iNEMI
• John Savic – Cisco
• Mahadevan Iyer– Texas Instruments
• Charan Gurumurthy – Intel
• Jim Wilcox, IBM
• ASE – Bernd Appelt
• Amkor – Lee Smith
• IBIDEN
• NTK
• imec
iNEMI Packaging Leadership Steering
Committee
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iNEMI Initiatives (Examples; 23 in Process)
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Number Focus Area Project / Initiative Title
1 OTHER
Optical Device Inspection & Cleaning Program’s Connector
Particles Thickness
2 ALTERNATIVE ENERGY Structured R&D into truly high power and high thermal performance capabilities that enable much higher wind systems efficiency
3 ENVIRONMENTAL Alternatives Assessment to Identify Environmentally Preferred Materials for Electronics
4 MEDICAL ELECTRONICS Define optimized reliability testing for medical implantable products
5 MEDICAL ELECTRONICS Define standardized medical component specs that meet DFM, DFT and Reliability Requirements
6 MINIATURIZATION Advanced Si-node Pb-free Underfill Reliability
7 OTHER Counterfeit Electronic Components Assessment
8 OTHER Standardization of Safety Requirements for Semiconductor Packaging Equipment
9 MEDICAL ELECTRONICS Create industry wide standard medical reliability qualification methods
10 MEDICAL ELECTRONICS Drive progress in medical supply chain alignment and capabilities
11 MINIATURIZATION Drive radical ODM/EMS improvements in new technology qualification and certification method and results
12 MINIATURIZATION Board Flexure Standardization - White Paper ~4Q11 Start
www.inemi.org Email contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia
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