History of ISA SP76 NeSSI Current Standards ANSI/ISA-76.00.02(2002)

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Complete, Modular, Ready Today www.circortech.com CONFIDENTIAL 1 History of ISA SP76 NeSSI Current Standards ANSI/ISA-76.00.02(2002) IEC 62339-1 (2006-12) reference IEC 62339-1:2006(E) design

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History of ISA SP76 NeSSI Current Standards ANSI/ISA-76.00.02(2002) IEC 62339-1 (2006-12) reference IEC 62339-1:2006(E) design. NeSSI / SP76 History/Standards. Initially Semiconductor Industry Concept C enter for P rocess A nalytical C hemistry ( CPAC ) - PowerPoint PPT Presentation

Transcript of History of ISA SP76 NeSSI Current Standards ANSI/ISA-76.00.02(2002)

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History of ISA SP76 NeSSICurrent Standards

ANSI/ISA-76.00.02(2002)

IEC 62339-1 (2006-12) reference

IEC 62339-1:2006(E) design

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NeSSI / SP76 History/StandardsNeSSI / SP76 History/Standards Initially Semiconductor Industry Concept Center for Process Analytical Chemistry (CPAC)

University of Washington at SeattleNew Sampling / Sensor Initiative (NeSSI)

Ad Hoc group of manufacturers, end users, integrators worked together to improve technology and achieve ‘Smart’ systems

http://www.cpac.washington.edu/NeSSI/NeSSI.htm

US Standard: ANSI / ISA –76.00.02 ( 2002 ) World Standard: IEC 62339-1: 2006(E) (listed 2007)

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GEN I (hardware) System

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Roots in Semiconductor IndustryFirst Sprouts in HPI/CPI

• 1998 Vision and Patents– Don Mayeaux A+ Corporation– 09DEC1998 New Orleans, LA

• “Industry Forum on Modular Sample Systems (MSS)”

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Industry Forum Companies (now)

• ARCO Chemical (Basell)

• Chevron Refining & Research (ChevronTexaco)

• Equilon (division of Shell)

• Esso-Canada, Exxon-BOP & R&E (ExxonMobil)

• Shell-Oil, Products, Development (Shell)

• Union Carbide (Dow)

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Seeds in Refining Industry

• 1998 ISA EXPO1998 Houston, TX

• Paul Otteman– Displays Autoflow unit

• Dan Podkulski– Borrows Autoflow unit– Demonstrates to Chevron

• Best Practices Process Analyzer Meeting Attendees

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Growth in Refining Industry

• 1999 ISA SP76 Working Group

• Dan Podkulski, Chair, OCT1999

• Initial Writing/Ballot– ANSI / ISA Standard– “Modular Sample Conditioning Component Interface”

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Growth in Academia

• 2001 CPAC Users’ Meeting

• This (CPAC) solved Legal Problems– Monopoly / Restraint of Trade

• CPAC User Proponents– Jim Tatera – CPAC (Dow Corning)– Rob Dubois – Dow– Dan Podkulski – Chevron (ExxonMobil)

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CPACOil & Petrochemical Focus Group

• A+ Corporation

• Autoflow

• DuPont

• ExxonMobil

• Rosemount

• Swagelok

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NeSSI Appears

• 2000– Rob Dubois Dow– Peter van Vuuren ExxonMobil Chemical

• 2001– IFPAC Professional Presentation– Rob Dubois

http://www.cpac.washington.edu/NeSSI/NeSSI.htm

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NeSSI Generations Announced;SAM is Introduced

• 2001 Rob Dubois Dow

Mel Koch CPAC

Peter van Vuuren ExxonMobil Chemical• Generations

– I. Functional Subassemblies– II. Open Communications Network and – III. Sensor-on-Chip Analyzers

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Initial NeSSI Roadmap

Gen IFluid handling

Gen I INetworked

Gen I I Iu-AnalyticalSAM:

Gen II

Sensor

Actuator

Manager

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Technology Roadmap

GEN III(micro-

Analyzers)

GEN II(standardized digital bus

components and embeddedor discreet sample system controller)

GEN I(standardized mechanical interconnect

and component footprint)

Current NeSSI™ Roadmap

NeSSI™ is a trademark of the Center for Process Analytical Chemistry, U of WA

Initiative started 1999

True Gen 2 devices in Lab and Field Test applications since FEB2007;

Commercial availability since OCT2007 (except SAM)

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14Gen II “NeSSI-Bus” Devices

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Gen II Future DevelopmentsGen II Future DevelopmentsExample of CANbus IS Network (courtesy of CiA CANbus IS Work Group)

Future development and certification Current development

Current development

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End User Value Gainfrom

Gen I to Gen II using ANSI/ISA-76 Devices• Lower device wiring cost

– 40% less

• Real estate benefits– Multiple outputs from single devices

• Resource optimization– Does more with less hardware

• Remote troubleshooting and diagnostics• Sample system uptime increased

– Preventive vs. reactive maintenance operations

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Initial Physical System Proposals

• 2000 CPAC RFP - Six Common Designs

• Responses– Substrate Designs by

• Autoflow, Parker, Swagelok (Rosemount)

– Surface Mount Components by• CIRCOR and Tescom

– Constructive Criticism by• ABB and Siemens Applied Automation Inc.

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Life Cycle Considerations (LCC)

• 1998 John Sablatura ExxonMobil– Key Performance Indicators (KPI)

• 2000 Jeff Gunnell / Peter van Vuuren– Today’s Cost of Build– Today’s Cost of Ownership– Hidden LCC Costs in Process Analyzer Systems

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ANSI / ISA Standard

• 2002 Elastomer Seals (o-rings)

• ANSI / ISA-76.00.02(2002) granted

• IEC SC 65D/119/CDV 62339-1 initiated

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ISA 48th Annual AD Meeting

• 2003 Responses to Dow RFQ

• In-depth Review by Bac Vu (Dow)

• Four System Responses– CIRCOR Tech– Fujikin– Parker– Swagelok

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IEC (world) Standards

• IEC 62339-1 2006-12 reference

• IEC 62339-1 : 2006 (E) design

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Q1 and Q2 2007 Developments

• Smart Sampling Connectivity Bus

• Closed bus– Siemens i2C

• Open bus– CIRCOR iCAN – IS CAN bus Product– ISO CANOpen Basis

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ISA EXPO2007

• Smart Sampling / Bus Components– Digital Multivariable Transmitter (P, T, Q)– Digital Flow Transmitter– Digital Pressure Transmitter– Digital Temperature Transmitter– Digital Combi (pilot) Valve

• All i2C Siemens & iCAN CIRCOR Tech compatible

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