Herbert Reichl - Springer978-3-642-45678-7/1.pdf · Herbert Reichl (Editor) MICRO SYSTEM...
Transcript of Herbert Reichl - Springer978-3-642-45678-7/1.pdf · Herbert Reichl (Editor) MICRO SYSTEM...
Herbert Reichl (Editor)
MICRO SYSTEM Technologies 90 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10-13 September 1990
With 642 Figures
Springer-Verlag Berlin Heidelberg New York London Paris Tokyo Hong Kong Barcelona
Prof. Dr.-Ing. Herbert Reichl Technische Universitat Berlin Forschungsschwerpunkt Technologie der Mikroperipherik Einsteinufer 17 1000 Berlin 10
Organized by
AMKBerlin Ausstellungs-Messe-Kongref3 GmbH
MESAGO Messe & Kongref3 GmbH Stuttgart
This event is supported by the West-Berlin Senat, Dept. for Economics
ISBN 978-3-642-45680-0 ISBN 978-3-642-45678-7 (eBook) DOl 10.1007/978-3-642-45678-7
This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically those of translation, reprinting, re-use of illustrations, recitation, broadcasti ng, reproduction on microfilms orin otherways,and storage in data banks. Duplication ofthis publication or parts thereof is only permitted under the provisions of the German Copyright Law ofSeptember9, 1965, in its current version and a copyright fee must always be paid. Violations fall under the prosecution act of the German Copyright Law.
© Springer-Verlag Berlin Heidelberg 1990 Softcover reprint of the hardcover 1 st edition 1990
The use of registered names, trademarks, etc. in this pUblication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.
2161/3020-5432\0 - Printed on acid-free paper
Prof. Dr.-Ing. Herbert Reichl Technische Universitat Berlin Forschungsschwerpunkt Technologie der Mikroperipherik Einsteinufer 17 1000 Berlin 10
Organized by
AMKBerlin Ausstellungs-Messe-Kongref3 GmbH
MESAGO Messe & Kongref3 GmbH Stuttgart
This event is supported by the West-Berlin Senat, Dept. for Economics
ISBN 978-3-642-45680-0 ISBN 978-3-642-45678-7 (eBook) DOl 10.1007/978-3-642-45678-7
This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically those of translation, reprinting, re-use of illustrations, recitation, broadcasti ng, reproduction on microfilms orin otherways,and storage in data banks. Duplication ofthis publication or parts thereof is only permitted under the provisions of the German Copyright Law ofSeptember9, 1965, in its current version and a copyright fee must always be paid. Violations fall under the prosecution act of the German Copyright Law.
© Springer-Verlag Berlin Heidelberg 1990 Softcover reprint of the hardcover 1 st edition 1990
The use of registered names, trademarks, etc. in this pUblication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.
2161/3020-5432\0 - Printed on acid-free paper
Preface
On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center.
Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected.
The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies.
The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules.
Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets.
For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed.
New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies.
The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.
New CAD and simulation tools are to be developed, which are able to take into account thermal, electrical and mechanical properties of the device. Design for reliability and testing becomes an important part of the technological evolution.
I thank all the authors from 15 countries in Europe, USA and Asia for their contributions, the members of the steering committee for their cooperation, the organizers, AMK Berlin and MESAGO Europe, for their engagement and the local organizing committee for doing the hard work of organizing the conference. In the name of all of them I wish you a successful congress.
September 1990 Herbert Reichl
General Chairman
H. Reichl Technische Universitat Berlin
Technical Programme Chairmen
C. Baack Heinrich-Hertz-Institut Berlin A. Heuberger FhG IMT Berlin E. Obermeier Technische Universitat Berlin
Steering Committee
H. DeMan M. Esashi B. Freund W. Kroy W.H.Ko K. Kurzweil J.P. Lazarri C.R. Lowe H. Luginbuhl H. Melchior S. Middelhoek H.Ohnsorge A. Paoletti H.-J. Queisser M. Sage D. Seipler H. Smith S. Sugiyama K.D. Wise H. Wurmus
IMEC Leuven Tohoku University Siemens AG Munich MBB GmbH Munich Case Western Reserve University Bull Les-Clayes-Sous-Bois LETI Grenoble University of Cambridge CSEM Neuchatel ETH ZOrich Delft University of Technology SEL AG Stuttgart Universita degli Studi di Rana MPI Stuttgart BPA Ltd Surrey Robert Bosch GmbH Reutlingen MIT Cambridge Toyota Inc. Aichi-ken University of Michigan, Ann Arbor Technische Hochschule IImenau
Local Organizing Committee
W. Germany
W. Germany W. Germany W. Germany
Belgium Japan W. Germany W. Germany USA France France England Switzerland Switzerland Netherlands W. Germany Italy W. Germany England W. Germany USA Japan USA E. Germany
H. Reichl W.Tornow H.J. Griese G. Zimmer H.-P. Nolting W.D6ldissen W. Benecke S. Jakob
Technische Universitat Berlin Technische Universitat Berlin Technische Universitat Berlin Technische Universitat Berlin Heinrich-Hertz-Institut Berlin Heinrich-Hertz-Institut Berlin FhG IMT Berlin FhG IMT Berlin
Table of Contents
Simulation and Design
Design of Micro Systems
Microsystems : a challenge for CAD development (Plenary Talk) De Man, Hugo. . . . . . • . . . • • . • . • . . . • . . • • . . . . . . . . . • . . . . . . . 3
A specification driven environment for microsystem design (Invited Paper) MOiler-Glaser, Klaus D.; Rauch, H.; Wolz, W.; Bortolazzi, J.; Kuntzsch, C.; Zippelius, R. . . . . • . . . . . . • . . . • . • • . . . • . . . . . . . . . . . 9
Conceptual design of micro-electro-mechanical systems Crary, Selden; Kota, Sridhar. • • • . . . . . • . . . • . . • . . . • • • . . . . . . . .. 17
Intelligent CAD for micro mechanics Amster, Richard; Tavrow, Lee S.; Flynn, Anita M.. • . . • • . • . • • . . • . . . .. 23
CAD of Optical Devices
Computer aided engineering for microsystems - status and trends (Plenary Talk) Marz, Reinhard. • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Numerical simulation of optical devices Weinert, C.M.; Nolting, H.-P .. .•••..........•................ 38
CAD-tool for integrated optic coupling gratings Sychugov, V.A.; Tishchenko, A. V.; Klimov, M.S.; Parriaux, 0 .. ........... 44
Simulation on lateral detector - optical waveguide coupling Kapser, K.; Deimel, P.P. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 52
Simulation and Design - Electrical and Thermal Properties
Electrical connections through silicon wafer: application to 3D-multichip modules (Invited Paper) Nicolas, Gerard; Dupeux, T. . . . . . • . . • . . • . . . . • . . . . . . . . . . . . . .. 61
Design methods for multichip systems (Invited Paper) DOmcke, Rolf. . . . . • . . . . . . • . . . . . . . • • . . . . . . . . . . . . . . . . . . . 71
A fully-automatic macro modeling procedure for the electrical simulation of integrated circuits Turchetti, C.; V.-Kovacs, Zs.M.; Masetti, G.; Conti, M .................. 79
KOSIM - a multi-level simulator for the design of integrated circuits Schwarz, Peter. . . • . . . • • . . • . . . • . . . • • . . . . . . . . . . . . . . . . . . . 85
Waveform estimation and hazard detection in digital MOS circuits Sass, D.; Warmers, H.; Horneber, E.-H. • • . . . • . . . . . • . . . . . . . . • . . .. 91
Modelling of interconnects by boundary element method Wlodarczyk, W . •...•.••..•.....••.•..•..•.............. 97
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Thermal analysis of integrated circuits Rudolph, H.; Seitzer, Dieter . .•.....•.•..................... 103
Sensitivity analysis in thermal wave measurement Wiedemann, Martin. . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . .. 109
Simulation and Design of Sensors
Design and simulation of sensors (Invited Paper) Baltes, Henry. . • • • • . • • . . • • . • . • • . • . . • . . . . • • • . . . . . . . . .. 117
Finite-element simulation of silicon accelerometers Moser, David; Sigg, Paulo; Ansermet, Stephane; Baltes, Henry. . . . • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 125
Accelerometer design considerations Dunn, William C.. • . . • . . • . . • • . • . . • . . • . • • . . • . . • . . . . . . . .. 131
Measurement and Testing
Testing
Development of a thermal test chip Helm, Jan. . . . . . . . . . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . .. 139 Infrared microscopy - contactless temperature measurement on miniaturized electronic components Wallin, Bo. • . • • . . • . . . . . • • . • . . . • . . . . . . . • . . . . . . . . . . . .. 146
Highly sensitive strain sensor for the qualification of epoxy compounds designed for the encapsulation of microsystems Weidner, Hermann; Borner, H.; Villain, J.. . . . . . . . . . . . . . . . . . . . . . . . 153
Material Characterization· Physical Properties
Mechanical reliability of electronic devices Kawai, S.; Nishimura, A.; Kitano, M.; Shimizu, T.. . . . . . . . . . . . . . . . . .. 161
Measurement of internal stress in thin silicon membranes BOttgenbach, S.; Engelhardt, W.; Kulcke, W. . . . . . . . • . . . . . . . . . . . .. 177
Measurement of the thermal diffusivity of electrically nonconducting substrates Drost, A; Hemmetzberger, D.; Emmer, J.. . . . . . . . . . . . . . . . . . . • . .. 183
Characterization of supersmooth surfaces with roughness below 0.1 nm Schmitt, Dirk-Roger. . . . . . . . . . • . • • . . . . . . . . • • . . • . . . . . . . .. 190
Material Characterization· Semiconductor Characteristics
Non-destructive testing of semiconductor materials using microwave photoconductivity Betz, G.; Ploschies, R.; Walk, Ch.; Winter, Ch.; Valldorf. J •. ............ 199
Electrical characterization of IIIN materials for heterostructure devices Bach, H.G .. •...•.•.•...•.......•••••..•.....•....... 205
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Material Characterization· Optical Methods
Assessment of III-V epitaxial layers by optical methods Sartorius, B .. ........................................ 213
Ellipsometry for process control in reaktive ion etching MOiler, Roland. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 219
Thin film ellipsometric measurements - a tool for research and production Tamme, M.; Kamifli, R.; Paduschek, P.; StadtmOller, M .•.•..•......... 225
High precision non-contacting metrology based on short coherence interferometry Jones, Robert; Hazell, M.S.; Welford, R .. ....................... 231
VIS-IR-ellipsometry for control and characterization of thin film processes Doi, Bui Dang; Hammann, K.; Roseler, A.; Schneider, U.; Schwiecker, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 238
Materials
Materials for Packaging and Passivation
Deposition, patterning, properties, and applications of AI20 3 films Burghardt, H.; Cebulla, H.; Leimbrock, W.; Leyffer, W.; Thess, D.; Drescher, K .. ........................................ 247
PECVD-passivation layers for printheads in micro-syste m-tech nology Unger, E.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 255
Hybrid integrated circuits on polycrystalline aluminium nitride Philippov, Philip; Nicolov, N.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 261
High performance resin system for printed circuit boards Huber, J.; Wilhelm, D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
Z-axis conductive, stress free, thermally conductive adhesive films and pastes for die- and component attach Chung, Kevin K. T.; Dreier, Garrett; Avery, Eldon; Boyle, Andy; Koehn, William; Govaert, Guido; Theunissen, Dirk. . . . . . . . . . . . . . . . . . 273
Integrated Optics Materials and Technologies
Integrated optics in silicon SchOppert, Bernd; Schmidtchen, J.; Splett, A.; Petermann, K. . ......... , 277
Integrated optics on silicon with PECVD-fabricated waveguides Bezzaoui, Hocine; Baus, Andreas; Voges, Edgar . .................. 283
Polymer waveguides in integrated optics Keil, N.; Strebel, B.; Yao, H.H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
x
Technologies
Pattern Generation and Image Transfer
Aspects of patterning inorganic-organic copolymers (ORMOCERs) Popall, Michael; Meyer, H.; Schulz, J . .......................... 297
Photopatternable layers from amorphous, diamond-like carbon - an innovative material for microsystems technology Hammerschmidt, A; Birkfe, S.; Kammermaier, J.; Leuschner, R.; Schmidt, w.; Schulte, R.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 307
Submicrometer photolithography by surface imaging -experiments and simulation Bauch, L.; Jagdhold, U.; Hoppner, w.; Bauer, J.; Klabes, R.; MehfiB, G.; Abraham, W .. ................................ 313
X-ray imaging system Weaver, H. Joseph; Sommargren, Gary E.. . . . . . . . . . . . . . . . . . . . . . . 319
Laser Supported Deposition
Laser induced gold deposition on polyimide layers Metzger, Dieter; Paredes, Alvaro; Kruck, Thomas; Reichl, Herbert. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 325
Selective pattern deposition of Sn02 thin film by laser pyrolysis Zhang, Bingfin; Wenlou, Wei. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330
Plane surface embedding technique for thin film hybrids MOfler, Heinrich G.; Jassim, Kahtan; Buschick, Klaus; Reichl, Herbert. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 335
Pulsed laser-plasma deposition of polycomponent thin-film structures - a review Metev, S.. . . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . . . . ..... 341
Laser-induced chemical vapour deposition of thin films in microelectronics Reisse, G.; Gansicke, F.; Fischer, A; Zimmer, K.; Zscherpe, G. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 348
Reactive Etching and Deposition
Plasma-assisted etching (Invited Paper) Mader, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 357
Reactive etching with ECR plasma source Castrischer, G.; Kretschmer, K.-H.; Lorenz, G.; Kessler, I.. . . . . . . . . . . .. 366
Production of resist masks by means of RIE Hefler, G.; Richter, K.; Kandler, E.; GOntzel A ..................... 372
Contact Methods
A new explanation for the degradation of gold-aluminium bonds
XI
Haag, Jo Frieder 0 0 0 ••••• 0 •••• 0 • • • ••• 0 • • 0 •• 0 • 0 ••• 0 • • • • 0 381
Simulation of the inner lead bonding process Eberle, Arno. . . . ........ 0 • • 0 • • 0 • 0 0 0 0 • • 0 0 • 0 0 0 0 0 0 0 0 0 0 0 0 389
The application of an eutectic Gold-Tin cushion for TAB-inner lead bonding with reduced bonding pressure Zakel, Elke; Schuler, Siegfried; Simon, JOrgen. . . . • . . 0 • 0 • 0 0 0 • 0 0 • o' 400
Bonding techniques on microsystem in cryogenics and microelectronic engineering Howitz, St.; Gerber, Dietrich 0 •••••• 0 •••••••••• 0 ••• 0 • 0 0 0 0 0 • 0 407
Laser soldering of TAB inner lead bonds Azdasht, Ghassem; Zakel, Elke; Reichl, Herbert . ..... 0 •• 0 0 0 0 0 • 0 0 0 0 413
Packaging
Solderable bumps for TAB and flip-chip bonding (Invited Paper) Drescher, Kurt 0 • • 0 0 0 0 0 0 0 0 • 0 • 0 0 0 0 • 0 0 0 • 0 • 0 0 0 0 0 0 0 0 0 0 • 0 0 0 421
Electroless bumping Simon, JOrgen; Zakel, Elke 0 0 0 • 0 0 • 0 • 0 0 • 0 • 0 0 • 0 0 0 0 • 0 0 0 0 0 0 0 0 0 0 423
Hybridization of cooled mosaic sensors by indium-bumps PlOtner, Mathias; Blasek, Go; Sadowski, Go; Rzepka, So 0 0 0 0 0 0 0 0 0 0 • 0 0 0 0 429
Development of a fine pitch bumping process Engelmann, Gunter; Ehrmann, Oswin; Simon, JOrgen, Reichl, Herbert 0 0 0 0 0 0 • 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 • 435
Tape automated bonding for high-density electronic packaging Plite, Gerard Jo. 0 0 0 0 0 0 0 • 0 0 0 0 • • • 0 0 0 •• 0 • 0 0 0 0 0 0 0 0 • 0 0 0 0 0 o. 441
Adhesiveless copper-polyimide laminates for TAB's Fronz, Viktor 0 0 0 • 0 • 0 • 0 • 0 0 0 • 0 0 • 0 0 0 0 0 • 0 • • 0 0 0 0 0 0 0 0 0 0 0 0 0 0 • 447
Optical Assembly and Interconnection Technologies
Application of micro machining and micromechanics to components for optical communication (Invited Paper) Hillerich, Bernd 0 0 0 • 0 0 0 • 0 0 0 0 0 • 0 •• 0 0 0 0 • • 0 0 0 0 • 0 0 0 • 0 0 0 0 0 0 0 457
Thermal tunable minimized semiconductor laser-module GroBmann, E; Hilbk, Uo; Peters, K. 0 0 0 •• 0 0 0 0 • 0 •• 0 0 • 0 0 0 0 0 0 0 0 0 0 • 465
Micro collimated light source using micro fresnel lens Goto, Hiroshi; Ito, Yoshinori; Sekii, Hiroshi; Ogata, Shiro; Imanaka, Koichi 0 0 0 0 0 0 0 0 0 •• 0 0 • 0 0 • 0 • 0 0 • 0 • 0 0 0 •• 0 0 0 0 • 0 0 • 0 0 471
Monomode fused optical system elements Lochmann, S; Labs, JOrgen Mo; Thiel, A; Lang, K.D. 0 0 •• 0 0 0 0 0 • 0 0 0 0 0 • 0 477
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Sensor and Actuator Technologies
Sensor packaging (Invited Paper) Esashi, Masayoshi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495
A method for thermal insulation of microstructures Stoev, I.; Bogdanova, N.. • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 503
Machining of metal foils for use in microcompact heat exchangers Friedrich, Craig R.; Warrington, Robert 0.. . . . . . . . . . . . . . . . . . . . . . . 509
Novel stress free assembly technique for micromechanical devices Offereins, H.L.; Sandmaier, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515
The LlGA process for microsystems (Invited Paper) Ehrfeld, Wolfgang. . . . . . . • . . . . . . . . • . . . . . . . . . . . . . . . . . . .. 521
Movable microstructures manufactured by the LlGA process as basic elements for microsystems Mohr, J.; Burbaum, C.; Bley, P.; Menz, Wolfgang; Wallrabe, U.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 529
Ion beam techniques for micro electro mechanical systems (Invited Paper) Kuwano, Hiroki. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
A novel mask compensation pattern for etched microstructures with several convex corners Gerlach, Gerald. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 545
Wafer bonding and etch back techniques for silicon-on-insulator systems Harencit, Christine; Appel, Wolfgang; Graf, Heinz-Gerd; H6fflinger, Bernd; Penteker, Elisabeth. . . . . . . . . . . . . . . . . . . . . . . .. 551
Basic Components and Applications
Sensors for Physical Parameters
Silicon microsystems as an industry (Invited Paper) Knutti, James W.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559
Micromachined silicon devices integrated with standard IC processes RiethmOller, w.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
Design of an integrated humidity sensor with digital output in double metal CMOS technology Boltshauser, Thomas; Charbon, Edoardo; Baltes, Henry. . . . . . . . . . . . .. 568
CMOS compatible capacitive pressure sensor with read-out electronics Kandler, Michael; Eichholz, J6rg; Manoli, Yiannos; Mokwa, Wilfried. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 574
Piezoresistive pressure sensors representing the 2nd generation avoid the physical limits based on conventional designs Sandmaier, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... 581
High performance miniaturized piezoresistive pressure transducers
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Whittier, Robert M.. . • . • . • • • . . . • . . . . • • • • . • . . • . . . • . . . • . . . 587
Fully integrated silicon pressure sensor with on-chip CMOS evaluation circuit and on-chip trimming Kress, H.-J.; Bantien, F.; Marek, J.; Willmann, M .• ••••••.•••••..•..• 593
Optimization of bipolar magneto-transistors Kaneko, H.; Muro, H.; French, P.J.. • . • • • . . . . . . • • . . . . . • . . . . . .. 599
Silicon RF power sensor from DC to microwave Kopystynski, P.; Obermeier, E; Delfs, H.; Hohenester, w.; Loser, A.. • . . . . • . . • . • • . . . . • • • • . • . • • • • • . . • . . • . . . . . • . . 605
Self-testable accelerometer microsystem Terry, Stephen C.; Bruin, Diederik W. de; Allen, Henry V . .............. 611
Micromechanical capacitive acceleration sensor with force compensation Schlaak, H.F.; Amdt, F.; Steckenbom, A; Gevatter, H.J.; Kiesewetter, L.; Grethen, H.. . • • . . • . . . • . • . . . . . . . . . . . . . . . . .. 617
Capacitive accelerometer made by silicon micromechanics Gerlach-Meyer, U.E.. . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . . . 623
Micromechanical acceleration sensor Breng, U.; GeBner, T.; Lorenz, P.; Rauch, M.; Leyf/er, W.; Dittmann, M.; Kuttner, B.; Schwenzer, G.; Wetzel, M.; Zichner, N. . • . . . . . . . • . . . • . . • . . . • . . . . . . ..•............ 629
CMOS readout electronics for capacitive acceleration sensors Buckhorst, Rolf; Hosticka, Bedrich J.; Seidel, Helmut. . . . . . . . . . . . . . .. 636
Gas and Ionic Sensors
Development of basic structures for integrated chemical sensors for S02 and NH3 Lin, J.; Moller, S.; Obermeier, E .. ....•.....••......•......... 645
Technology and application of suspended gate field effect transistors for gas detection Lorenz, H.; Peschke, M.; Riess, H.; Eisele, I. . • . . . . . • . . . . . . . . . . • .. 651
Preparation of Ti02 films for oxygen sensors Fischer, D.; Koppen, H .. •..•..•.....••.••....•..•.•...... 657
Solid state chemical sensors in thick film technique Chu, W.F.; Erdmann, H.; IIgenstein, M.; Leonhard, V. . . . • . • • • . . . . . . .. 663
Ionic sensor layers on microelectronic structures for the detection of solvent vapours Dickert, F.L.; Bertlein, G.; Reif, K.; Mages, G.; Kimmel, H.. . . . . . . . . . . .. 669
An integrated ISFET-sensorarray with a CMOS signal-processing circuit Miiller, Eckart; Koch, S.; Woias, P.. . • . . . . • . . • . . • • • . • . . . • . . • .. 675
CVD-AI20 3-layers: applicability in sensor devices Rober, J.; Erben, E; Cebulla, H . .•..••••.••••..•..•.......... 681
XIV
Sensors for Biological and Medical Application
Biochemical sensors for microsystems (Plenary Talk) Scheller, F. W.; Hintsche, R.; Wollenberger, U.. . . . . . . . . . . . . . . . . . " 687
Miniaturised thin-film biosensors (Invited Paper) Pittner, Fritz; Schalkhammer, T.; Mann-Buxbaum, E.; Urban, G. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 699
Chip-biosensors - integration of bioactive components with transducers made in silicon technology Hintsche, Rainer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 706
Smart silicon system for a multi sensor catheter Manoli, Yiannos; Eichholz, Jorg; Kandler, Michael; Kordas, Norbert; Langerbein, Anke; Mokwa, Wilfried . ................ 710
A digital output monolithic temperature sensor for invasive applications Kordas, Norbert; Eichholz, Jorg; Langerbein, Anke; Manoli, Yiannos; Mokwa, Wilfried. . . . . • . . . . . . . . . . . -' . . . . . . . . .. 716
Optical Sensors
New nanomechanical integrated optical devices as modulators, switches, and microphones; integrated optical (bio-)chemical sensors (Invited Paper) Lukosz, W .. ......................................... 725
High resolution interferometric displacement sensor using integrated optics in glass Jestel, D.; Baus, A.; Voges, E. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733
Integrated optical devices in LiNbOa for sensors Konz, W .. .......................................... 739
Optical Components
Optoelectronic components and modules for multigigabitls fibre optic transmission Spalthoff, Ulrich. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749
Elements for integrated optics coherent receiver networks Heidrich, H.; Hoffmann, D.; Nolting, H.-P.; Schlak, M.; Weinert, C.M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755
Wavelength division multiplexers for optical communication systems Bornholdt, C.; Kappe, F.; Nolting, H.-P.; Stenzel, R.; Venghaus, H.; Weinert, C.M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761
Pin photodiodes and field-effect transistors for monolithically integrated InP/lnGaAs optoelectronic circuits Albrecht, H.. . . . • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 767
Semiconductor laser amplifiers as multifunctional devices Weber, H.G.; GroBkopf, G.; Ludwig, R.; Schnabel, R.; Schunk, N.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 773
Fiber optical amplifiers: technology and system applications Veith, Gustav. . • . . • . . . . . • . . . . . . • • • • . • . . • • . • . • . . . . . . .. 779
Integrated optic polarimetric refractometer Voirin, G.; Debergh, P.; Parriaux, 0.; Zogmal, 0.. . . • . . . . . . . . . . . . . . . 785
Actuators
Integrated fluid control systems on a silicon wafer (Invited Paper) Nakagawa, Shigeru; Shoji, Shuichi; Esashi, Masayoshi. • . • • . • . . • . . • .. 793
Micro liquid-handling devices - a review Pol, F.C.M. van de,· Branebjerg, J . .•.......•••.•..•.....•..... 799
Electrically-activated, micromachined diaphragm valves Jerman, J.HaI. • • . • • . • • . . • • • • • . . • • . • . • . • • . • • . . . . . . . . • . 806 An electro hydrodynamic injection pump - a novel actuator for microsystem technology Richter, Axel; Sandmaier, Hermann; Plettner, Andreas. . . . • . • . . . . . . .. 812
Electrostatic and superconducting microactuators (Invited Paper) Fujita, Hiroyuki. . . . . . . . . • . . • . . • • . • . . • . . . . . . . . . . . • . • . .. 818
Levitational bearing systems by meissner effect Kitamura, Tadashi; Komori, Mochimitsu. . . . . • . . . . . . . . . . . . . . . . .. 826 Rotational behaviour of living cells with reference to micro-motors Fuhr, G.; Hagedom, R.; Gimsa, J . ............................ 832
Magnetically driven microactuators: design considerations Wagner, B.; Benecke, W. . . . . . . . . . . . . • . . . . . . . • . . . . . . . . . . . . 838
Development of micro grippers Ando, Yasuhisa,· Sawada, H.; Okazaki, Y.; Ishikawa, Y.; Kitahara, T.; Tatsue, Y.; Furuta, K.. . . . . . . . . . . • . . . . . . . . . . . . . .. 844
Micro-actuator for micro-particles Nishimura, Kunitoshi. • . . . . . • . . . . . . . . . . . . . . • . . • . . . . . . . . . . 850
Author Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 856