FUNCTION ANALYSIS REPORT Microcontroller Part No. … · 2019. 11. 13. · Science Vision...

FUNCTION ANALYSIS REPORTFUNCTION ANALYSIS REPORT

Microcontroller Part No.—— XXXXXXXXXXXXXXXXXXXXX

Science VisionVisualized Fact Utmost Science

Manufacturer Part No.Microcontroller

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Important notice regarding the use of this report:

Published: XXX XX, 2014


Part No.

Date

Table of Contents

XXXXXXXX

2014-XX-XX

Memory Information

>> Device Summary

>>

>> Device Identification

>> Process

>> Function Analysis


Manufacturer Part No.Microcontroller

Contents1.0 Device Summary ---------------------------------------------------------------------------------------------52.0 Device Identification ----------------------------------------------------------------------------------------6

2.1 Package Photo ---------------------------------------------------------------------------------------------62.2 Die Markings -----------------------------------------------------------------------------------------------82.3 Die Photo ----------------------------------------------------------------------------------------------------9 2.3.1 Top View ------------------------------------------------------------------------------------------------9 2.3.2 Detail View ------------------------------------------------------------------------------------------ 11

3.0 Process -------------------------------------------------------------------------------------------------------- 123.1 Cross-sectional View ---------------------------------------------------------------------------------- 123.2 Minimum Pitch Metal ---------------------------------------------------------------------------------- 133.3 Minimum Gate Length Transistor ----------------------------------------------------------------- 14

4.0 Function Analysis ------------------------------------------------------------------------------------------ 154.1 Die Architecture ----------------------------------------------------------------------------------------- 154.2 Function Blocks Measurements ------------------------------------------------------------------- 16

5.0 Memory Information -------------------------------------------------------------------------------------- 175.1 Memory Blocks Identification ---------------------------------------------------------------------- 175.2 EEPROM --------------------------------------------------------------------------------------------------- 18 5.2.1 EEPROM Region ----------------------------------------------------------------------------------- 18 5.2.2 EEPROM Array ------------------------------------------------------------------------------------- 19 5.2.3 EEPROM Unit --------------------------------------------------------------------------------------- 205.3 FLASH ------------------------------------------------------------------------------------------------------ 21 5.3.1 FLASH Region -------------------------------------------------------------------------------------- 21 5.3.2 FLASH Array ---------------------------------------------------------------------------------------- 22 5.3.3 FLASH Unit ------------------------------------------------------------------------------------------ 235.4 SRAM ------------------------------------------------------------------------------------------------------- 24 5.4.1 SRAM1 Region ------------------------------------------------------------------------------------- 24 5.4.2 SRAM1 Array --------------------------------------------------------------------------------------- 25 5.4.3 SRAM1 Unit ----------------------------------------------------------------------------------------- 26 5.4.4 SRAM2 Region ------------------------------------------------------------------------------------- 27 5.4.5 SRAM2 Array --------------------------------------------------------------------------------------- 285.5 Memory Parameter ------------------------------------------------------------------------------------- 29


5Manufacturer Part No.Microcontroller

1.0 Device Summary

Item Content

Part Number / Project Number XXXXXXXX / 9130561

Manufacturer XX

Device Type Microcontroller

Package Marking

XX;XXXXXXX;XXXXX;XX; XX

Package Type Smart Card

Die MarkingXXXXXX;XXXXX;XXX; XXXXX;

Die Size 1.927 mm × 2.742 mm = 5.284 mm2

Number of Metal Layers 6

Number of Poly Layers 2

Process Type CMOS

Interconnect Level (Width/Pitch(um))

Process Generation 0.13 um

Feature Measure to Determine Process Generation Gate Length

Transistor Gate Length 0.13 um

Table 1.0 Device Summary



2.0 Device Identification

Photograph 2.1.1 Package (top) Photograph 2.1.2 Package (bottom)

This section contains information regarding the packaging, die marking and die photo of (Manufacturer Part No.).

Section 2.1 contains the package photo.Section 2.2 provides die photo.

2.1 Package Photo

This (Manufacturer Part No.) is a smart card.

Photographs of the top and bottom view of the packages are shown in Photograph 2.1.1 and 2.1.2.Photograph 2.1.3 is an x-ray photograph of the device presenting external pins.



Photograph 2.1.3 Package X-ray

x-ray photograph



2.2 Die Markings

Photograph 2.2 Die Markings



2.3 Die Photo

Photograph 2.3.1 Die Photo(Metal6 Image)

This (Manufacturer Part No.) is produced using a 6 metal, 2 poly 0.13 um CMOS process.The die measures 5.284 mm2=1.927 mm × 2.742 mm and is presented in Photograph 2.3.1 and 2.3.2. The detail photo is shown in Photograph 2.3.3.

2.3.1 Top View



Photograph 2.3.2 Die Photo(Poly Image)



Photograph 2.3.3 Detail Photo

2.3.2 Detail View

Detail Photograph



3.0 Process

This section includes the following process information about the die:

• Cross-sectional View• Minimum Pitch Metal• Minimum Gate Length Transistor

3.1 Cross-sectional View

Photograph 3.1 Cross-sectional Photo

Cross-sectional View



3.2 Minimum Pitch Metal

Item Content

Metal 1 Minimum Width X.XX um

Metal 1 Minimum Pitch X.XX um











Table 3.2 Minimum Pitch Metal



3.3 Minimum Gate Length Transistor

Item Content

Minimum Contacted Pitch X.XX um

Gate Length Transistor 0.13 um

Table 3.3 Minimum Gate Length Transistor



4.0 Function Analysis

Photograph 4.1 Die Architecture(PL Image)

This section includes the following functional information about the die:

• Die Architecture• Function Blocks Measurements

4.1 Die Architecture1.927mm

2.74

2mm

APAD

FLASH_ARRAY

Capacity=1904K bit

SRAM1_ARRAY

Capacity=5.479K*4=21.914K bit

SRAM2_ARRAY

Capacity=7.477K*4=29.906K bit

EEPROM_ARRAY

Capacity=432K bit

LOGIC

0.894mm

0.21

4mm

B

0.438mm

0.36

9mm C

0.438mm

0.43

7mm

DA

CC

ES

S

0.027mm

E

0.833mm

1.56

0mm

F

0.693mm

1.13

2mm

1.55

8mm

GPAD

1.061mm

0.21

4mm

HANALOG

I

0.372mm

0.82

0mm

0.862mm

0.93

1mm

0.647mm

0.83

2mm



4.2 Function Blocks Measurements

Item Content Proportion

Block A Size 0.894 mm × 0.214 mm = 0.191 mm2 3.615%

Block B Size 0.438 mm × 0.369 mm = 0.162 mm2 3.066%

Block C Size 0.438 mm × 0.437 mm = 0.191 mm2 3.615%

Block D Size 0.027 mm × 1.558 mm = 0.042 mm2 0.795%

Block E Size 0.833 mm × 1.560 mm = 1.300 mm2 24.603%

Block F Size 0.693 mm × 1.132 mm = 0.785 mm2 14.856%

Block G Size 1.061 mm × 0.214 mm = 0.227 mm2 4.296%

Block H Size 0.372 mm × 0.820 mm = 0.305 mm2 5.772%

Block I Size 0.882 mm × 0.931 mm +0.647 mm × 0.832 mm= 1.341 mm2 25.379%

Total effective area of the chip =1.927mm*2.742mm=5.284mm²

Table 4.2 Function Blocks Measurements



5.1 Memory Blocks Identification

Photograph5.1MemoryBlocksIdentification

5.0 Memory Information

FLASH

SRAM1

EEPROM

0.438mm

0.36

9mm

0.438mm

0.43

7mm

0.833mm

1.56

0mm

0.693mm

1.13

2mm

SRAM2



Photograph 5.2.1 EEPROM Region

5.2 EEPROM

5.2.1 EEPROM Region

S=0.693mm*1.132mm=0.785mm²

0.693mm

1.13

2mm



5.2.2 EEPROM Array

Photograph 5.2.2 EEPROM Array

0.576mm

10.2

80um

…X 164…

0.01

um*6

4=0.

640m

m

S=0.576mm*0.640mm=0.369mm²



5.2.3 EEPROM Unit

Photograph 5.2.3 EEPROM Unit

2 EEPROM Unit

S=(1.961um*0.885um)/2=0.868um²

0.88

5um

1.961um



Photograph 5.3.1 FLASH Region

5.3 FLASH

5.3.1 FLASH Region0.833mm

1.56

0mm

S=0.833mm*1.560mm=1.300mm²



5.3.2 FLASH Array

Photograph 5.3.2 FLASH Array

0.055mm*2+0.110mm*6=0.770mm

0.01

2um

*48+

0.01

6um

*32=

1.08

8mm

S=0.770mm*1.088mm=0.838mm²

0.01

2um

0.055um

0.01

6um

0.01

2um

0.110um

0.01

6um

X direction=2Y direction=48






5.3.3 FLASH Unit

Photograph 5.3.3 FLASH Unit

0.52

5um

1.681um

S=(1.681um*0.525um)/2=0.441um²



Photograph 5.4.1 SRAM1 Region

5.4 SRAM

5.4.1 SRAM1 Region

SRAM1 Array

S=0.438mm*0.369mm=0.162mm²

0.438 mm

0.36

9 m

m



5.4.2 SRAM1 Array

Photograph 5.4.2 SRAM1 Array

0.179mm

0.11

3mm

2X2 SRAM Unit

S=0.179mm*0.113mm=0.020mm²



5.4.3 SRAM1 Unit

Photograph 5.4.3 SRAM1 Unit

S=(5.511um*2.682um)/4=3.695um²

4 SRAM1 Unit

2.68

2um

5.511um



5.4.4 SRAM2 Region

Photograph 5.4.4 SRAM2 Region

0.438mm

0.43

7mm

S=0.438mm*0.437mm=0.191mm²

SRAM2 Array



5.4.5 SRAM2 Array

Photograph 5.4.5 SRAM2 Array

0.179mm

0.15

6mm

2X2 SRAM Unit

S=0.179mm*0.156mm=0.028mm²



5.5 Memory Parameter

Item Content

Memory Type EEPROM

Memory Cells Number 512 × 864 = 442368

Memory Capacity 442368/1024=432K bit

EEPROM Region

EEPROM Area 0.693 mm × 1.132 mm = 0.785 mm2

Proportion (Whole Die) 14.856%

EEPROM Array

EEPROM Array Area 0.576 mm × 0.640 mm = 0.369 mm2

Proportion (EEPROM Region) 46.960%

EEPROM Unit

One Unit Area (1.961 um × 0.885 um)/2=0.868 um2 Table 5.5.1 EEPROM Table

Item Content

Memory Type FLASH

Memory Cells Number 952 × 2048 = 1949696

Memory Capacity 1949696/1024=1904K bit

FLASH Region

FLASH Area 0.833 mm × 1.560 mm = 1.300 mm2


FLASH Array

FLASH Array Area 0.770 mm × 1.088 mm = 0.838 mm2

Proportion (FLASH Region) 64.462%

FLASH Unit

One Unit Area (1.681 um × 0.525 um)/2=0.441 um2 Table 5.5.2 FLASH Table

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Item Content

Memory Type SRAM1

Memory Cells Number (66 × 85) × 4 = 5610 × 4 = 22440

Memory Capacity 22440/1024=21.914K bit

SRAM1 Region

SRAM1 Area 0.438 mm × 0.369 mm = 0.162 mm2


SRAM1 Array

SRAM1 Array Area 0.179 mm × 0.113 mm = 0.020 mm2

Proportion (SRAM1 Region) 12.486%

SRAM1 Unit

One Unit Area (5.511 um × 2.682 um)/4=3.695 um2 Table 5.5.3 SRAM1 Table

Item Content

Memory Type SRAM2

Memory Cells Number (66 × 116) × 4 = 7656 × 4 = 30624

Memory Capacity 30624/1024=29.906K bit

SRAM2 Region

SRAM2 Area 0.438 mm × 0.437 mm = 0.191 mm2


SRAM2 Array

SRAM2 Array Area 0.179 mm × 0.156 mm = 0.028 mm2

Proportion (SRAM2 Region) 14.620%

SRAM2 Unit

One Unit Area (5.511 um × 2.682 um)/4=3.695 um2 Table 5.5.4 SRAM2 Table

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FUNCTION ANALYSIS REPORT Microcontroller Part No. … · 2019. 11. 13. · Science Vision...

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