From Submicron to From Submicron to NanoNanoThe View from the The View from the

EditorEditor’’s Chairs Chair

Presented by Tom Cheyney, Presented by Tom Cheyney, Editor in Chief, Editor in Chief, MICROMICRO and and www.www.micromagazinemicromagazine.com.com

Key Magazine Dates and Key Magazine Dates and MilestonesMilestones

Nov. 1987 Nov. 1987 ---- My first issue as associate editor of My first issue as associate editor of MicrocontaminationMicrocontaminationMarch 1992 March 1992 ---- My first issue as editorMy first issue as editorJanuary 1995 January 1995 ---- Name changed to Name changed to MICROMICROJanuary 1997 January 1997 –– Launch of Website, Launch of Website, www.www.micromagazinemicromagazine.com.comJanuary 1998 January 1998 ---- Defect/yield focus repositioning Defect/yield focus repositioning January 2002 January 2002 –– APC/AEC focus addedAPC/AEC focus added2005 2005 –– Exclusive ISMI Manufacturing Effectiveness Exclusive ISMI Manufacturing Effectiveness article seriesarticle series

Industry trends since sitting Industry trends since sitting down in the editordown in the editor’’s chairs chair

Global chip manufacturing industry grows from 10s of Global chip manufacturing industry grows from 10s of billion$ to 100s of billion$billion$ to 100s of billion$Equipment, materials, and subsystems industries grow Equipment, materials, and subsystems industries grow in size, technological importance, complexity in size, technological importance, complexity Wafers get bigger: 150 mmWafers get bigger: 150 mm––200 mm200 mm––300 mm300 mm----450??450??The robots take over and the software rules: Tools and The robots take over and the software rules: Tools and fabs get more automated, esp. at 300 mmfabs get more automated, esp. at 300 mmFeature sizes get REALLY small (ye shall obey MooreFeature sizes get REALLY small (ye shall obey Moore’’s s Law): micron to submicron to nanometer (1.0 Law): micron to submicron to nanometer (1.0 µµmm ––0.065 0.065 µµmm, or 65 nm, with 45 nm around the corner), or 65 nm, with 45 nm around the corner)Critical defect size careens toward atomic scale, Critical defect size careens toward atomic scale, shrinking from 0.5 shrinking from 0.5 µµmm to 0.032 to 0.032 µµmm, or 32 nm, and soon , or 32 nm, and soon to 22 nmto 22 nmExploiting the periodic table: Materials innovation keys Exploiting the periodic table: Materials innovation keys chipmaking chipmaking advances, dozens of elements now in play advances, dozens of elements now in play

How much would R2R and FDC improve How much would R2R and FDC improve the MTBF on the STI CMP tools? the MTBF on the STI CMP tools?

Alternative Acronyms and Alternative Acronyms and InitialismsInitialisms

PPW PPW –– parts per whateverparts per whateverPOM POM –– point of misusepoint of misuseMTTL MTTL –– mean time mean time ‘‘tiltil lunchlunchMTBS MTBS –– mean time between screwmean time between screw--upsupsFPE FPE –– fingerfinger--pointing exercise pointing exercise WIP WIP –– wafers in perilwafers in perilFUCT FUCT –– flagrantly unacceptable cycle timesflagrantly unacceptable cycle timesZVA ZVA –– zero value addedzero value added

CMP Market Trends CMP Market Trends and Comparisonsand Comparisons

Worldwide CMP Equipment Market Worldwide CMP Equipment Market History, 1998History, 1998--2004 (million$)2004 (million$)

(source: Dataquest)(source: Dataquest)

02 0 04 0 06 0 08 0 0

1 0 0 01 2 0 01 4 0 01 6 0 01 8 0 0

1 9 9 8 1 9 9 9 2 0 0 0 2 0 0 1 2 0 0 2 2 0 0 3 2 0 0 4

D a t a q u e s t

WWorldwide CMP Equipment Market orldwide CMP Equipment Market Forecast, 2005Forecast, 2005--2010 (million$)2010 (million$)

(sources: Dataquest, VLSI Research)(sources: Dataquest, VLSI Research)

02 0 04 0 06 0 08 0 0

1 0 0 01 2 0 01 4 0 01 6 0 01 8 0 02 0 0 0

2 0 0 5 2 0 0 6 2 0 0 7 2 0 0 8 2 0 0 9 2 0 1 0

D a t a q u e s tV L S I R e s e a r c h

CMP Materials Market (slurries, CMP Materials Market (slurries, pads) 2004pads) 2004--2009 (million$)2009 (million$)

(sources: (sources: TechcetTechcet, SEMI), SEMI)

02 0 04 0 06 0 08 0 0

1 0 0 01 2 0 01 4 0 01 6 0 01 8 0 0

2 0 0 4 2 0 0 5 2 0 0 6 2 0 0 7 2 0 0 8 2 0 0 9

T e c h c e tS E M I

CMP Forecast Comparisons, Tools vs. CMP Forecast Comparisons, Tools vs. Materials, 2005Materials, 2005--2009 (million$) 2009 (million$)

(sources: Dataquest, (sources: Dataquest, TechcetTechcet))

02 0 04 0 06 0 08 0 0

1 0 0 01 2 0 01 4 0 01 6 0 01 8 0 02 0 0 0

2 0 0 5 2 0 0 6 2 0 0 7 2 0 0 8 2 0 0 9

E q u i p m e n tM a t e r i a l s

Total Annual Combined CMP Total Annual Combined CMP Tool/Materials Market vs. Weekly Tool/Materials Market vs. Weekly

Revenues of Major Companies (million$)Revenues of Major Companies (million$)

01 0 0 02 0 0 03 0 0 04 0 0 05 0 0 06 0 0 07 0 0 08 0 0 0

C M P I n t e l S a m s u n g W a l -M a r t

E x x o nM o b i l

AcknowledgmentsAcknowledgments

Stats:Stats: KareyKarey Holland, Holland, TechcetTechcet; Dan ; Dan Tracy, SEMI; Dean Freeman, Gartner Tracy, SEMI; Dean Freeman, Gartner Dataquest; Aida Dataquest; Aida JebensJebens, VLSI Research, VLSI ResearchPhotos: Ed Photos: Ed ShvartzmanShvartzman, ESP , ESP Photography; Intel IrelandPhotography; Intel IrelandCountless industry professionals who Countless industry professionals who have helped educate me about the have helped educate me about the chipmaking bizchipmaking biz

Thank You for Your AttentionThank You for Your Attention