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Background Statement for SEMI Draft Document #5047 REVISION TO SEMI P10-0709, SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Note: Additions are indicated by underline and deletions are indicated by strikethrough. Note: Both additions and deletions appear in dark yellow text. Hyperlinks (if preserved by the text editing software) may appear as blue. The dark yellow text will be restored to black for the formal SEMI published standard. Note: Any references to P010-xxxx, or P10-xxxx are intended as placeholders for the ultimately published standard name. These will be editorially corrected at the time the standard is published. Background This revision to the P10 Standard for Data Structures for Photomask Orders results from input by a wide range of photomask users and photomask suppliers. This includes significant input from SEMI standards participants in Japan and Europe. The ballot contains a multitude of corrections, clarifications and minor additions. The following significant changes were made: 1. Adjusted the <mask_order> and <mask_results> syntaxes to avoid ambiguity in the translation into XML. Such changes are highlighted in yellow. Many of these changes necessitated the creation of new <collections>. No effect is expected on P10 files using the BNF format.

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Background Statement for SEMI Draft Document #5047REVISION TO SEMI P10-0709, SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERSNotice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Note: Additions are indicated by underline and deletions are indicated by strikethrough.

Note: Both additions and deletions appear in dark yellow text. Hyperlinks (if preserved by the text editing software) may appear as blue. The dark yellow text will be restored to black for the formal SEMI published standard.

Note: Any references to P010-xxxx, or P10-xxxx are intended as placeholders for the ultimately published standard name. These will be editorially corrected at the time the standard is published.

Background This revision to the P10 Standard for Data Structures for Photomask Orders results from input by a wide range of photomask users and photomask suppliers. This includes significant input from SEMI standards participants in Japan and Europe.

The ballot contains a multitude of corrections, clarifications and minor additions. The following significant changes were made:

1. Adjusted the <mask_order> and <mask_results> syntaxes to avoid ambiguity in the translation into XML. Such changes are highlighted in yellow. Many of these changes necessitated the creation of new <collections>. No effect is expected on P10 files using the BNF format.

2. Added MEASURED_PERCENT_CLEAR to <pattern_group_results> under <mask_results>.3. Clarified Instructions and Conventions (section 6.4) regarding whether option hierarchy is

applied as cumulative or superseding, and particularly with respect to SCALE_FACTOR (in Terminology and Usage, section 8).

4. Keywords were added for PATTERN_FIGURE_OVERLAP and PATTERN_FILE_OVERLAP including the action to be taken if they are encountered while processing a mask order.

The only thing missing is the hyperlinks between <collections> and their usage in the syntaxes (section 7.4 and 7.5).  I’ll hand-edit these into the clean copy before SEMI publishes it.

The results of this ballot will be adjudicated at the Microlithography Committee meeting on July 10 in conjunction with SEMICON West 2012.

Wes ErckP10 Task Force Leader

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Review and Adjudication InformationTask Force Review Committee Adjudication

Group: Mask Orders (P10) TF NA Microlithography CommitteeDate: --- Tuesday July 10, 2012Time & Timezone: --- 9:30 AM to 11:30 AM, Pacific TimeLocation: --- SEMICON West 2012

San Francisco Marriott Marquis HotelCity, State/Country: --- San Francisco, CaliforniaLeader(s): Wes Erck (Wes Erck and Associates) Wes Erck (Wes Erck and Associates)

Rick Silver (NIST)Standards Staff: Michael Tran (SEMI NA)

[email protected]

Michael Tran (SEMI NA)[email protected]

*This meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Contact the task force leaders or Standards staff for confirmation.

Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will not be able to attend these meetings in person but would like to participate by telephone/web, please contact Standards staff.

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DRAFTDocument Number:

Date: 5/9/23

SEMI Draft Document #5047REVISION TO SEMI P10-0709, SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS

This standard was technically approved by the global Micropatterning Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2009. It was available at www.semi.org in June 2009 and on CD-ROM in July 2009. Originally published in 1990; previously published July 200820XX.

Table of Contents1 Purpose.........................................................................................................................................................................22 Scope............................................................................................................................................................................23 Limitations...................................................................................................................................................................24 Referenced Standards and Documents.........................................................................................................................25 Terminology.................................................................................................................................................................36 Instructions and Conventions.......................................................................................................................................37 Syntax Specification....................................................................................................................................................5

7.1 Syntax Symbol Definition......................................................................................................................................57.2 Record Syntax.......................................................................................................................................................57.3 Multi-value Data Field Syntax..............................................................................................................................57.4 Mask Order Structure Syntax................................................................................................................................77.5 Mask Results Data Structure Syntax...................................................................................................................23

8 Terminology and Usage.............................................................................................................................................349 Computing the Checksum..........................................................................................................................................79RELATED INFORMATION 1....................................................................................................................................80RELATED INFORMATION 2....................................................................................................................................82RELATED INFORMATION 3....................................................................................................................................89RELATED INFORMATION 4....................................................................................................................................93RELATED INFORMATION 5....................................................................................................................................95RELATED INFORMATION 6..................................................................................................................................103RELATED INFORMATION 7..................................................................................................................................111RELATED INFORMATION 8..................................................................................................................................114RELATED INFORMATION 9..................................................................................................................................115

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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1 Purpose1.1 These data structure specifications are intended to facilitate the transmittal of mask order data between software systems to allow:

automated order placement by mask customers and to allow the automatic processing of such orders by mask shops, and

automated delivery of actual mask results and qualification data by mask shops and to allow the automatic processing of such data by mask customers.

1.2 By using these standardized structures, software written independently for either mask customers or mask shops should be able to communicate unambiguously with software written by other parties.

2 Scope2.1 This structure only defines the data format for the transmitted file. No particular database or programming language is specified by this standard, except that an authorized implementation in Extensible Markup Language (XML) format will be posted on the SEMI P10 Web site for those that choose to use it. The data file is to be transmitted as a UTF-8 file. As such, it is compatible with the SECS-II standard.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

3 Limitations3.1 For a given customer, all pattern file names must be unique (i.e., Pattern files which are different may not have the same name).

3.2 For a given customer, all mask writing control file (job file) names must be unique (i.e., Mask writing control files which are different may not have the same name).

3.3 For a given customer, each mask set must have a unique identification.

3.4 For a given customer, each magnetic tape or other physical media delivered to the mask shop must have a unique identification.

3.5 For a given customer, each SEMI P10 <mask_order> file transmitted to a mask supplier must have a unique identification. In particular, revisions to a <mask_order> file must have a revised and unique identification.

3.6 All <pattern_data>, <job_data>, FRACTURE_FILE, MEASURE_FILE_NAME and CD_MATRIX_FILE_NAME files should be introduced through a <data> structure to be used within the <mask_order>. If such files are referenced in a <mask_order> without identification through <data>, specific methods to identify and locate such files must be established between the customer and the vendor.

4 Referenced Standards and Documents4.1 SEMI Standards

SEMI P1 — Specification for Hard Surface Photomask Substrates

SEMI P2 — Specification for Chrome Thin Films for Hard Surface Photomasks

SEMI P4 — Specification for Round Quartz Photomask Substrates

SEMI P5 — Specification for Pellicles

SEMI P6 — Specification for Registration Marks for Photomasks

SEMI P21 — Guidelines for Precision and Accuracy Expression for Mask Writing Equipment

SEMI P22 — Guideline for Photomask Defect Classification and Size Definition

SEMI P24 — CD Metrology Procedures

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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SEMI P29 — Guideline for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and Mask Blanks

SEMI P35 — Terminology for Microlithography Metrology

SEMI P37 — Specification for Extreme Ultraviolet Lithography Mask Substrates

SEMI P38 — Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Lithography Mask Blanks

SEMI P39 — Specification for Open Artwork System Interchange Standard (OASIS)

SEMI P43 — Photomask Qualification Terminology

SEMI P44 — Specification for Open Artwork System Interchange Standard (OASIS) Specific to Mask Tools

4.2 ISO Standards1

ISO 4217:20012008 — Currency and funds code list2

ISO 8601: 20002004 — Date and time notation3

ISO/IEC 10646 — UTF-8 character set4

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology5.1 See § 8.

6 Instructions and Conventions6.1 Each record in the file will be composed of a specific keyword identifier followed by one or more data values. In the case of BNF syntax, each record will be terminated by a carriage return and/or linefeed.

6.2 Only records which are required to specify the order need to be included in the transmitted <mask_order> file, but each record included must appear in the sequence shown in the syntax specification.

6.3 Subsequent modifications or additions to the mask set require transmittal of all the information for the specific masks involved, including previously transmitted keywords and data fields if they still apply. Masks previously ordered which are not affected by the new order transmission may have their <mask_definition>, <mask_group> or <mask_set> omitted as appropriate.

6.4 Options are specified hierarchically such that those specified at a higher level are the default for all masks below, unless overridden at a lower level. The hierarchy is such that mask set options are overridden by mask group options, followed by mask definition, cell definition, cell instance, pattern group definition, and pattern definition.

6.4.1 Some pattern options are hierarchical in a cumulative way. For example, MIRROR_MASK is compounded by MIRROR_PATTERN (i.e., the pattern would then become unmirrored when written if both are used). MIRROR_PATTERN is further cumulative when used at multiple levels in the cell hierarchy (i.e., MRROR_PATTERN at one cell level is reversed when MIRROR_PATTERN is used again at a lower cell level or as an option for a pattern group or individual pattern).

6.4.2 SCALE_FACTOR is also cumulative when used at multiple levels in the cell hierarchy (i.e., SCALE_FACTOR at one cell level is multiplied when SCALE_FACTOR is used again at a lower cell level or as an option for a pattern group or individual pattern). (Note that this convention is different than the convention used in MEBES job files because MEBES job files do not need to support hierarchical cell layout.)

6.4.3 All other option keywords are hierarchically superseding.

1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http:// www.iso.ch 22 http://en.wikipedia.org/wiki/ISO_42173 http://www.cl.cam.ac.uk/~mgk25/iso-time.html4 http://en.wikipedia.org/wiki/Universal_Character_Set

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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6.4.4 All pattern options are treated hierarchically, including when they are used in any combination of <cell_definition>, <cell_instance>, <pattern_instance>, <pattern_group>, <pattern_definitions>.

6.5 Mask groups describe sets of masks which are similarly constructed. In simple cases there will be only one mask group per mask set. Multiple mask groups will be needed to describe mix-and-match sets, or for situations within a mask set where different features are required on some masks.

6.6 Pattern group definitions are intended for patterns which are similarly placed on all or most masks within a mask group (e.g., primary pattern files or test pattern files).

6.7 Cell definitions describe the construction of clusters of pattern groups and/or other cells. The PLACEMENT_TOP_CELL under a mask group describes the overall layout of the cells on all masks within the mask group.

6.8 Within a given mask set, each mask must have a unique identification (MASK_ID), independent of any titles on the mask.

6.9 Masks which require multiple writing operations (such as phase shift masks) will find those MASK_ID’s identified with the same group number by the MULTIWRITE keyword.

6.10 The MASK_ID’s defined under a mask group specify the masks to be built. The MASK_ID’s also identify which patterns are to appear on the mask. A pattern is placed on the mask if and only if the MASK_ID matches the LEVEL_ID of a pattern referenced under the mask group’s PLACEMENT_TOP_CELL.

6.11 <cell instance> and <pattern group instance> LOCATION’s position the center of the patterns relative to the center of the CELL_ID referencing them. The cell referenced by the PLACEMENT_TOP_CELL is positioned at the center of the mask.

6.12 Job file data may be supplied in place of cell and pattern group data. In this case, the MASK_ID is understood to correspond to JOB_LEVEL in JOB_NAME.

6.13 For coordinate locations, unless otherwise specified for a given keyword, mask options are relative to the nominal center of the mask, while cell or pattern options are relative to the center of the cell or pattern. Mask coordinates are after scaling and mirroring, whereas cell and pattern options are before scaling and mirroring. The coordinates and directions refer to right-handed, rectangular (Cartesian) coordinates, applied to the substrate being written. All of these features and the orientation of all other patterns written on the substrate assume that it is from the perspective of the mask writing tool (i.e., “chrome side up”). The nominal center of the mask is determined using the bottom and left edges (chrome side up) and assumes nominal substrate dimensions (see SEMI P1).

6.14 All data in the structure will be in the UTF-8 character set. The keyword in each record must include only upper case alphanumeric characters and underscore.

6.15 Records (keyword, data value, comment and new line) may not exceed 256 characters. Some records may be repeated (e.g., BUSINESS_ADDRESS) in order to allow for longer field requirements; these are explicitly indicated in the syntax specification.

6.16 Comments may be included in records by preceding them with an exclamation point (!). Any data following an exclamation point and preceding a carriage return and/or linefeed will be ignored. Such comments are included in the 256 character record limit. If a record starts with an exclamation point, the entire record will be ignored. Only printable/displayable UTF-8 characters (plus spaces and tabs) are permitted in comments. Comments are for development and diagnostic purposes only. In commercial use, comments may always be ignored by the recipient without consequence. On the other hand, ADDITIONAL_..._INFO records must be evaluated by the recipient and applied to the masks being ordered, and may justify delay in mask delivery.

6.17 Spaces or tabs preceding the keyword will be ignored. At least one space or tab must precede the data field. Spaces and tabs embedded in text data fields will be preserved. Spaces or tabs may not be embedded within integer or real number data values, but may be used to separate data values in multi-value numeric data fields. At least one comma must appear between adjacent data values in multi-value data fields; more than one comma may not appear between adjacent data values. Spaces or tabs trailing the last data value in a data field will be ignored.

6.18 All numeric record values which require units will be in metric unless otherwise specified in § 8. Units of length or position will be in microns unless otherwise specified.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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6.19 Dates will be in the numeric format YYYY-MM-DD. Times will be in the format HH:MM:SSZ or HH:MMZ. Within the transmitted file, times and dates will always be Coordinated Universal Time (UTC) and times will be followed by the suffix Z.

6.20 Sizing to achieve a CD_TARGET from a CD_DATA must be applied to all pattern files hierarchically affected by the CD_TARGET record.

6.21 Binary data manipulation operations expect operands (input pattern files) to align center-to-center. This requires that DATA_PATTERN_WINDOW be defined for patterns which do not contain an explicit record of file extents.

6.22 All references to horizontal (or “x”) and vertical (or “y”) correspond to normal Cartesian coordinates and assume the rotational orientation of the substrate when the mask was written.

6.23 All <shippable_data> keywords can be followed by <ship_to> specifying the destination and/or method of transmission for the transmitted data. Whenever applicable, the SEMI <mask_results> file (see § 7.5) should be sent accordingly if electronic transmission is specified.

6.24 <shippable_data> keywords which require reference to specific mask feature locations will reference CD_SITE_ID and/or REGISTR_MARK_ID which must be unique for each location within all transmissions of <mask_order> for a given MASK_SET_ID.

6.25 When modifications to this standard are required between ballot cycles (e.g., new data field values “on request”), users should contact the N.A. SEMI P10 task force leader directly. After a poll of the active task force members, a tentative recommendation will be posted on the SEMI P10 task force Web site at SEMI so that all users can adopt a common interim solution until a formal ballot can officially resolve the issue.

6.26 Every effort should be made to construct a SEMI P10 file without inconsistencies or ambiguities. If a vendor detects such flaws in a file from a customer, the vendor should contact the customer to correct the inconsistencies and/or remove the ambiguities before proceeding with making the mask.

6.27 Data values may be integer, numeric, text, Boolean, or date (with or without time). Some data fields may contain more than one type of data. “text” should be considered to be any printable/displayable UTF-8 character except carriage return, tab or linefeed. Text data corresponds with “string” in the xsd syntax. Boolean data will only have values of “T” or “F.”

7 Syntax SpecificationThe following specifies the syntax for the mask order structures. The record order is specific; records must appear in the sequence shown. Terminology for the individual records and their allowed data values are specified in § 8.

7.1 Syntax Symbol Definition — The lower case syntactic names within < > are used to refer to collections of records. The use of { } around records or collections of records means an arbitrary number of repetitions of the records, including none at all. The use of [ ] around a record or collection of records means that the collection is optional.

7.2 Record Syntax — A keyword is followed by a data field which is followed by an optional comment. The record is terminated by a carriage return and/or linefeed. Each of these elements may be preceded by any combination of spaces or tabs, which will be ignored. At least one space or tab is required preceding the first data value in the record. An exclamation point (!) is required to initiate a comment. Exclamation points, carriage returns, and linefeeds are not allowed in keywords, data values or comments. Note that a record consisting of a comment only is also allowed. The syntax for individual records is defined as:

<record> = [{<separator>} <keyword> <separator> {<separator>} <data_field>] [{<separator>} ! <comment>] {<separator>} <new_line>

where “separator” is a space or a tab, “comment” is any string of printable ASCII characters (plus spaces and tabs), and “new_line” is a carriage return, linefeed or both.

7.3 Multi-value Data Field Syntax — When a numeric data_field contains more than one data_value, such as (x,y) pairs or (x1,y1,x2,y2) double pairs (see § 8), the individual values must be separated by a comma and any

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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combination of spaces or tabs. One comma is required between each data_value, but not more than one comma. Two commas without an intervening data value are not permissible.

(x,y) = data_value {separator} comma {separator} data_value(x,y,z) = (x,y) {separator} comma {separator} (z)(x1,y1,x2,y2) = (x1,y1) {separator} comma {separator} (x2,y2)(x,y,x1,y1,x2,y2) = (x,y) {separator} comma {separator} (x1,y1,x2,y2)

For data manipulation operations only, a semicolon separates layers from its datatype, and a dash indicates a range of layers or a range of datatypes.

layer1;datatype6 , layer3-layer4;datatype1-datatype9

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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7.4 Mask Order Structure Syntax — The following syntax definition uses the upper case keyword to represent the permissible applications of the corresponding data record within the mask order structure.

Relocate new collections to where they are usedVerify all hyperlinks

start_bnf maskOrder<mask_order> = START_ORDER SEMI_REVISION CUSTOMER VENDOR

FILE_DATE_TIME [OPERATOR_NAME] <mask_set> END_ORDER [CHECKSUM]

<mask_set> = MASK_SET_ID <mask_set_options> END_MASK_SET_OPTIONS{<mask_group>} END_MASK_SET

<mask_set_options> = [BUSINESS_CONTACT] {BUSINESS_ADDRESS} {BUSINESS_PHONE} {BUSINESS_FAX} [BUSINESS_EMAIL][BILLING_CONTACT] {BILLING_ADDRESS} {BILLING_PHONE} {BILLING_FAX} [BILLING_EMAIL][DESIGN_RULE] [FAB_TECHNOLOGY] [WAFER_FAB]{<customer_spec_def>}{CUSTOMER_SPEC CUSTOMER_SPEC_REVISION}

{WAIVER} {WAIVER_OVERRIDE}[PRICE_UNITS]{MASK_EXPORT_NUMBER} [SECURITY_CLASS] [QS9000][ENGINEERING_CONTACT] {ENGINEERING_ADDRESS} {ENGINEERING_PHONE} {ENGINEERING_FAX} [ENGINEERING_EMAIL][SHIPPING_CONTACT] {SHIPPING_ADDRESS} {SHIPPING_PHONE} {SHIPPING_FAX} [SHIPPING_EMAIL]{SHIPPING_METHOD}[REPAIRS_AUTHORIZED][<shippable_data>]{<data>}{<standard_pattern>}[<milestones_def>] [<periodic_updates_def>] [<estimated_arrivals_def>] [MILESTONES <ship_to>] [PERIODIC_UPDATES <ship_to>][ESTIMATED_ARRIVALS <ship_to>][JOB_ONLY_APPROVAL_REQD] [JOB_WITH_PATTERNS_APPROVAL_REQD]{PATTERN_APPROVAL_REQD} [ALL_PATTERNS_APPROVAL_REQD]{APPROVAL_REQD}{REVIEW_REQD}[MASK_SET_NAME [MASK_SET_VERSION] ] [CUSTOMER_MASK_SET_NAME][ORDER_ID]{ <device_name_def>} { DEVICE_NAME [DEVICE_REVISION] }{ADDITIONAL_MASK_SET_INFO}

<customer_spec_def> = CUSTOMER_SPEC CUSTOMER_SPEC_REVISION<device_name_def> = DEVICE_NAME [DEVICE_REVISION]<data> = DATA_MEDIUM [DATA_LOCATION] [DATA_FILE_NAME] [DATA_ID]

[DATA_FORMAT [DXF_ANGLE DXF_UNIT] ]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Date: 5/9/23

[DATA_DENSITY] [DATA_FILE_SIZE][TRANSFER_FILE_NAME [DATA_COMPRESSION] [DATA_CONSOLIDATION] [DATA_ENCRYPTION] ][DATA_CHECKSUM DATA_CHECKSUM_TYPE ]{<pattern_data>} {<job_data>}{<fracture_file_def>} {<measure_file_def>} {< cd_matrix_file_def>} {FRACTURE_FILE FRACTURE_FILE_FORMAT}{MEASURE_FILE_NAME [MEASURE_FILE_FORMAT] }{CD_MATRIX_FILE_NAME [CD_MATRIX_FILE_FORMAT] }END_DATA_MEDIUM

<fracture_file_def> = FRACTURE_FILE FRACTURE_FILE_FORMAT<measure_file_def> = MEASURE_FILE_NAME [MEASURE_FILE_FORMAT]< cd_matrix_file_def> = CD_MATRIX_FILE_NAME [CD_MATRIX_FILE_FORMAT]<pattern_data> = DATA_PATTERN_NAME [FILE_IDENTIFIER] <pattern_attributes>

{PATTERN_FORMAT} [DATA_FILE_NUMBER][PATTERN_UNITS] [PATTERN_CHARACTER_SET][FRACTURE_FILE]{<pattern_preparation>}{ [<data_ m a n ipu l ation >] [<data_function>] }END_DATA_PATTERN_NAME

<pattern_preparation> = [< data_manipulation >] [< data_function >] <pattern_attributes> = [UNSCALED_PATTERN_SIZE] [PATTERN_ADDRESS_SIZE] [STRIPE_HEIGHT]

[DIGITIZED_DATA_DARK] [MFG_BIAS_PREAPPLIED] [PERCENT_CLEAR][DATA_FILE_SIZE] [DATA_CHECKSUM DATA_CHECKSUM_TYPE ][PATTERN_FIGURE_OVERLAP][PATTERN_VISUAL_ID]

<data_manipulation> = START_DATA_MANIPULATION[BOOLEAN[PATTERN_GENERATION_AREA]<data_file_ p arameters > { <data_file_par a meters > } ]{<data_fra c ture >}END_D A TA_MAN I PULATION

<data_file_parameters> = DATA_SOURCE_FILE [PATTERN_FORMAT][DATA_TOP_CELL] [DATA_LAYER_ID][DATA_PATTERN_WINDOW]{<data_f r acture >}END_DATA_SOURCE_FILE

<data_function> = START_DATA_FUNCTIONDATA_FUNCTION_PURPOSE{<software_def>}{ SOFTWARE_NAME {SOFTWARE_REVISION}

{ RUNSET_NAME [RUNSET_REVISION] [DATA_LOCATION]{ PARAMETER_FILE_NAME [PARAMETER_FILE_REVISION] }{ INPUT_FILE_NAME INPUT_FILE_FORMAT

[TOP_CELL] [DATA_LOCATION] }{RESULT_FILE_NAME}{SUMMARY_FILE_NAME}{LOG_FILE_NAME} } }

END_DATA_FUNCTION<software_def> = SOFTWARE_NAME {SOFTWARE_REVISION} {<runset_def>}

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

<runset_def> = RUNSET_NAME [RUNSET_REVISION] [DATA_LOCATION] {<parameter_file_def>} {<input_file_def>} {RESULT_FILE_NAME} {SUMMARY_FILE_NAME} {LOG_FILE_NAME}

<parameter_file_def> = PARAMETER_FILE_NAME [PARAMETER_FILE_REVISION]<input_file_def> = INPUT_FILE_NAME INPUT_FILE_FORMAT [TOP_CELL] [DATA_LOCATION]<data_fracture> = START_DATA_FRACTURE

[SIZING [SIZING_RULE] [SIZING_BORDER_RULE] ][FRACTURING_SCALE] [DATA_SCALE_FACTOR][PATTERN_ADDRESS_SIZE][DARK_INTERNAL_WINDOW] [CLEAR_INTERNAL_WINDOW][EXTERNAL_WINDOW] [ROTATION] [MIRROR]END_DATA_FRACTURE

<job_data> = DATA _ J OB _ NAME JOB_F O R MAT <standard_pattern> = STD_PATTERN_NAME PATTERN_FORMAT<milestones_def> = MILESTONES <ship_to><periodic_updates_def> = PERIODIC_UPDATES <ship_to><estimated_arrivals_def> = ESTIMATED_ARRIVALS <ship_to><mask_group> = MASK_GROUP_ID [<mask_options>] END_MASK_GROUP_OPTIONS

PLACEMENT_TOP_CELL {<mask_definition>}{<cell_definition>} {<pattern_group>} END_MASK_GROUP

<mask_options> = [BLANKET_PO_NUMBER] [PO_NUMBER] [SO_NUMBER] [ORDER_ID][RELEASE_NUMBER] [LINE_ITEM_NUMBER] [QUOTE_NUMBER][STATUS][DUE_DATE_TIME_REQUESTED] [DUE_DATE_TIME_COMMITTED][DELIVERY_PRIORITY][LAYER_PRIORITY [ELAPSED_TIME] ][<milestones_def>] [<periodic_updates_def>] [<estimated_arrivals_def>] [MILESTONES <ship_to>] [PERIODIC_UPDATES <ship_to>][ESTIMATED_ARRIVALS <ship_to>][BUSINESS_CONTACT] {BUSINESS_ADDRESS} {BUSINESS_PHONE} {BUSINESS_FAX} [BUSINESS_EMAIL][BILLING_CONTACT] {BILLING_ADDRESS} {BILLING_PHONE} {BILLING_FAX} [BILLING_EMAIL][PRICE]{<premium_time_def>}{PTC_HOURS [PTC_RATE] [PTC_FIXED] }[EWT_THRESHOLD EWT_RATE [EWT_CEILING] ][SECURITY_CLASS] [QS9000][SHIPPING_CONTACT] {SHIPPING_ADDRESS} {SHIPPING_PHONE} {SHIPPING_FAX} [SHIPPING_EMAIL]{SHIPPING_METHOD}[REPAIRS_AUTHORIZED][<shippable_data>]{ MFG_SITE_REQD }{<litho_equip_def>}{ [LITHO_EQUIP_REQD] {EQUIP_SITE_REQD}{ [LITHO_MODEL_REQD] {LITHO_MODE_REQD} } }PRODUCT_TYPE [SERVICE_TYPE]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[PRODUCT_MAGNIFICATION] [PRODUCT_IMAGING_TYPE][QUANTITY] [PRODUCT_AS_DUPLICATE][MULTIWRITE]{WAFER_EXPOSURE_TOOL}[<wafer_exposure_data> <aerial_image_data>][FAB_TECHNOLOGY] [WAFER_FAB][MFG_BIAS_PREAPPLIED][JOB_NAME] [JOB_LEVEL][RETROFIT_JOB_NAME] [RETROFIT_JOB_LEVEL][RETROFIT_MASK_SET_ID] [RETROFIT_MASK_ID][RETROFIT_MASK_SET_NAME [RETROFIT_MASK_SET_VERSION] [RETROFIT_MASK_NAME] ]{<title_data>}{<barcode_data>}[JOB_ONLY_APPROVAL_REQD] [JOB_WITH_PATTERNS_APPROVAL_REQD]{PATTERN_APPROVAL_REQD} [ALL_PATTERNS_APPROVAL_REQD]{APPROVAL_REQD} {REVIEW_REQD}[ PATTERN_FILE_OVERLAP] [SERIAL_NUMBER][MIRROR_MASK] [MASK_ROTATION]<subst r ate >[<phase_shift>][UT1X_UNCUT] [PROCESS] [PROCESS_ETCHING_TYPE]{<customer_spec_def>}{CUSTOMER_SPEC CUSTOMER_SPEC_REVISION}

{WAIVER} {WAIVER_OVERRIDE}{<top_pellicle_def>}{<bottom_pellicle_def>}[<guides_def>]{TOP_PELLICLE_TYPE [TOP_PELLICLE_CENTRALITY_ERROR] [PRICE] }{BOTTOM_PELLICLE_TYPE [BOTTOM_PELLICLE_CENTRALITY_ERROR] [PRICE]}[GUIDES_REQD [PRICE] ][CENTRALITY]{<registration>}[REGISTR_CLOSURE [REGISTR_CLOSURE_REFERENCE_ONLY]

{REGISTR_CLOSURE_EQUIP_REQD} {EQUIP_SITE_REQD}[REGISTR_CLOSURE_BEGIN REGISTR_CLOSURE_END] ]

[BUTTING_ERROR [BUTTING_ERROR_METHOD] ]{<cd_group>}{<cd_set>}{<cd_xy_definition>}{<cd_clear_dark_definition>}{<cd_same_tone_definition>}[MIN_MASK_FEATURE_SIZE] [MIN_CORNER_TO_CORNER_GAP][MULTI_LAYER_MASK]{<multi_layer_field_def>}[PERCENT_CLEAR [PERCENT_CLEAR_WINDOW]][PERCENT_CLEAR PERCENT_CLEAR_WINDOW]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

{<opc_definition>}{<defect_definition>}[INSPECTION_REF_LOCATION]{<surface_definition>}[INSPECT_THROUGH_PELLICLE <defect_definition>]{<contamination>}{<sem_photo>}[QUALITY_GROUP_ID][COMPACT_LABEL]{<package_def>}{PACKAGE [MAX_MASKS_IN_PACKAGE] }{ADDITIONAL_MASK_INFO}

<premium_time_def> = PTC_HOURS [PTC_RATE] [PTC_FIXED]<litho_equip_def> = [ LITHO_EQUIP_REQD] {EQUIP_SITE_REQD} {<litho_model_def>} <litho_model_def> = [LITHO_MODEL_REQD] {LITHO_MODE_REQD}<wafer_exposure_data> = START_WAFER_EXPOSURE_DATA

WAFER_EXPOSURE_WAVELENGTHWAFER_EXPOSURE_NUMERICAL_APERTURE[WAFER_EXPOSURE_SIGMA][WAFER_EXPOSURE_SIGMA_INNER WAFER_EXPOSURE_SIGMA_OUTER]WAFER_EXPOSURE_ILLUMINATION [POLARIZATION]END_WAFER_EXPOSURE_DATA

<aerial_image_data> = START_AERIAL_IMAGE_DATAAIM_WAVELENGTH[AIM_INTENSITY_VARIATION_DELTA][AIM_FLUX_INTENSITY_DELTA][AIM_CD_DELTA]END_AERIAL_IMAGE_DATA

<title_data> = START_TITLE [TITLE_TEXT] [TITLE_TYPE] [TITLE_FONT] [TITLE_HEIGHT][TITLE_WIDTH] [TITLE_CHARACTER_SPACING][TITLE_MAG] [TITLE_JUSTIFICATION] [TITLE_LOCATION] [MIRROR_TITLE][ROTATE_TITLE] [ROTATE_TITLE_CHARACTERS] END_TITLE

<barcode_data> = START_BARCODE [BARCODE_TYPE][BARCODE_TEXT [BARCODE_TEXT_REFERENCE_ONLY] ][BARCODE_LOCATION][BARCODE_ROTATION] END_BARCODE

<substrate> = START_SUBSTRATE[BLANK_SIZE] [BLANK_TYPE] [BLANK_GRADE] [BLANK_FLATNESS][MASK_COATING] [RESIST_TYPE] [RESIST_THICKNESS][BLANK_BIREFRINGENCE_REQD][ATTENUATOR] [COATING_GRADE][MINIMUM_COATING_OPTICAL_DENSITY][MINIMUM_BINARY_TRANSMITTANCE][BLANK_LOT_REQD][<euv_blank_type>]END_SUBSTRATE

<euv_blank_type> = START_EUV_BLANK_TYPEEUV_BLANK_TYPE

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

EUV_FLATNESS_FRONTEUV_FLATNESS_BACKEUV_MULTILAYER_COMPOSITIONEUV_CAPPING_COMPOSITIONEUV_MMR_WAVELENGTHEUV_MEAN_PEAK_REFLECTIVITYEUV_PEAK_REFLECTIVITY_UNIFORMITYEUV_ABSORBER_COMPOSITIONEUV_ABSORBER_OPTICAL_PROPERTIESEUV_BLANK_RESISTANCEEUV_EXPANSION_COEFFEND_EUV_BLANK_TYPE

<ship_plot> = START_SHIP_PLOTPLOT_TYPE PLOT_SCALE QUANTITY [PRICE] [PLOT_FORMAT] [PATTERN_PLOT_NORMAL_TONE][<ship_to>]END_SHIP_PLOT

<phase_shift> = START_PHASE_SHIFT [PHASE_SHIFT_QUALITY_ID]PSM_WAVELENGTH[TRANSMISSION_TARGET

[TRANSMISSION_REFERENCE_ONLY][TRANSMISSION_TOLERANCE][TRANSMISSION_RANGE] [TRANSMISSION_ERROR]{<transmission_equip_def>}{<transmission_mark_site_def>}{TRANSMISSION_EQUIP_REQD [TRANSMISSION_MODE_REQD] }{ [TRANSMISSION_MARK_SITE_ID] TRANSMISSION_MARK_LOCATION }[TRANSMISSION_MARK_FEATURE][TRANSMISSION_MARK_LOCATION_DRAWING][TRANSMISSION_MARK_DRAWING] ]

[PHASE_ANGLE_TARGET[PHASE_ANGLE_REFERENCE_ONLY][PHASE_ANGLE_TOLERANCE][PHASE_ANGLE_RANGE] [PHASE_ANGLE_ERROR]{<phase_angle_equip_def>}{<phase_angle_mark_site_def> } {PHASE_ANGLE_EQUIP_REQD [PHASE_ANGLE_MODE_REQD] }{ [PHASE_ANGLE_SITE_ID] PHASE_ANGLE_MARK_LOCATION }[PHASE_ANGLE_MARK_FEATURE][PHASE_ANGLE_MARK_LOCATION_DRAWING][PHASE_ANGLE_MARK_DRAWING] ]

[ETCH_DEPTH_TARGET[ETCH_DEPTH_REFERENCE_ONLY][ETCH_DEPTH_TOLERANCE][ETCH_DEPTH_RANGE] [ETCH_DEPTH_ERROR]{<etch_depth_equip_def>}{<etch_depth_mark_site_def> } {ETCH_DEPTH_EQUIP_REQD [ETCH_DEPTH_MODE_REQD] }

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

{ [ETCH_DEPTH_SITE_ID] ETCH_DEPTH_MARK_LOCATION }[ETCH_DEPTH_MARK_FEATURE][ETCH_DEPTH_MARK_LOCATION_DRAWING][ETCH_DEPTH_MARK_DRAWING] ]

END_PHASE_SHIFT<transmission_equip_def> = TRANSMISSION_EQUIP_REQD [TRANSMISSION_MODE_REQD]<transmission_mark_site_def> = [TRANSMISSION_MARK_SITE_ID] TRANSMISSION_MARK_LOCATION<phase_angle_equip_def> = PHASE_ANGLE_EQUIP_REQD [PHASE_ANGLE_MODE_REQD]<phase_angle_mark_site_def> = [PHASE_ANGLE_SITE_ID] PHASE_ANGLE_MARK_LOCATION<etch_depth_equip_def> = ETCH_DEPTH_EQUIP_REQD [ETCH_DEPTH_MODE_REQD]<etch_depth_mark_site_def> = [ETCH_DEPTH_SITE_ID] ETCH_DEPTH_MARK_LOCATION<customer_spec_def> = CUSTOMER_SPEC CUSTOMER_SPEC_REVISION<top_pellicle_def> = TOP_PELLICLE_TYPE [TOP_PELLICLE_CENTRALITY_ERROR] [PRICE] <bottom_pellicle_def> = BOTTOM_PELLICLE_TYPE [BOTTOM_PELLICLE_CENTRALITY_ERROR] [PRICE]<guides_def> = GUIDES_REQD [PRICE]<registration> = START_REGISTR [REGISTR_QUALITY_ID]

[REGISTR_ERROR [REGISTR_ERROR_REFERENCE_ONLY] ][REGISTR_SCALE [REGISTR_SCALE_REFERENCE_ONLY] ][REGISTR_ANISOTROPIC_SCALE [REGISTR_ANISOTROPIC_SCALE_REFERENCE_ONLY] ][REGISTR_RESIDUAL [REGISTR_RESIDUAL_REFERENCE_ONLY] ][REGISTR_THREE_SIGMA [REGISTR_THREE_SIGMA_REFERENCE_ONLY] ][REGISTR_RESIDUAL_THREE_SIGMA [REGISTR_RESIDUAL_THREE_SIGMA_REFERENCE_ONLY] ][REGISTR_TOLERANCE [REGISTR_TOLERANCE_REFERENCE_ONLY] ][REGISTR_ORTHO [REGISTR_ORTHO_REFERENCE_ONLY] ][REGISTR_RELATIVE [REGISTR_RELATIVE_REFERENCE_ONLY] ]{<registr_ref_mask_id_def>}{<registr_ref_mask_name_def>}{REGISTR_REF_MASK_ID REGISTR_REF_MASK_SET_ID}{REGISTR_REF_MASK_NAME REGISTR_REF_MASK_SET_NAME [REGISTR_REF_MASK_SET_VERSION] }{REGISTR_EQUIP_REQD} {EQUIP_SITE_REQD}[REGISTR_STD_GRID] {REGISTR_REF_METHOD_REQD}[REGISTR_ALGORITHM_TYPE [REGISTR_ALGORITHM_COORDINATES] ][REGISTR_COMPENSATION_TEMPERATURE]{<registr_site_def>}{ [REGISTR_MARK_ID] [MASK_REGISTR_MARK] [CELL_REGISTR_MARK] [MEASURE_FILE_NAME] [REGISTR_MARK_FEATURE] [REGISTR_MARK_LOCATION_DRAWING] [REGISTR_MARK_DRAWING] [REGISTR_MARK_SEPARATION REGISTR_MARK_COUNT] }END_REGISTR

<registr_ref_mask_id_def> = REGISTR_REF_MASK_ID REGISTR_REF_MASK_SET_ID<registr_ref_mask_name_def> = REGISTR_REF_MASK_NAME REGISTR_REF_MASK_SET_NAME

[REGISTR_REF_MASK_SET_VERSION]<registr_site_def> = [REGISTR_MARK_ID] [MASK_REGISTR_MARK] [CELL_REGISTR_MARK]

[MEASURE_FILE_NAME]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[REGISTR_MARK_FEATURE] [REGISTR_MARK_LOCATION_DRAWING] [REGISTR_MARK_DRAWING] [REGISTR_MARK_SEPARATION REGISTR_MARK_COUNT]

<cd_group> = START_CD[<cd_definition>][NUMBER_OF_CDS]{cd_site_def>}{ [CD_SITE_ID] CD_LOCATION } [CD_MATRIX_FILE_NAME]END_CD

<cd_definition> = [CD_QUALITY_ID] [CD_DATA] [CD_DIGITIZED] [CD_TONE_CLEAR][CD_MORPHOGRAPHY][CD_PERCENT_CLEAR] [CD_PERCENT_CLEAR_WINDOW][CD_TARGET] [CD_ORIENTATION] [CD_PITCH][CD_FEATURE] [CD_LOCATION_DRAWING] [CD_DRAWING][CD_REFERENCE_ONLY][CD_TOLERANCE][CD_RANGE] [CD_THREE_SIGMA][CD_DEVIATION_FROM_TARGET] [CD_DEVIATION_FROM_MEAN][CD_STD] [CD_CORRELATION_ID]{CD_EQUIP_REQD} {EQUIP_SITE_REQD}

<cd_site_def> = [CD_SITE_ID] CD_LOCATION<cd_set> = START_CD_SET

{CD_GROUP_NAME}[CD_REFERENCE_ONLY][CD_QUALITY_ID][CD_TOLERANCE] [CD_RANGE] [CD_THREE_SIGMA][CD_DEVIATION_FROM_TARGET] [CD_DEVIATION_FROM_MEAN][CD_STD] [CD_CORRELATION_ID]END_CD_SET

<cd_xy_definition> = START_CD_XY_DEFINITION{CD_X_GROUP} {CD_Y_GROUP}{<cd_xy_site>}[CD_XY_TOLERANCE] [CD_XY_DEVIATION][CD_FEATURE] [CD_LOCATION_DRAWING] [CD_DRAWING][CD_XY_REFERENCE_ONLY]END_CD_XY_DEFINITION

<cd_xy_site> = START_CD_XY_SITE{ <cd_xy_site_def>}{ [CD_HORIZONTAL_ID] CD_HORIZONTAL_LOCATION

[CD_VERTICAL_ID] CD_VERTICAL_LOCATION }END_CD_XY_SITE

<cd_xy_site_def> = [CD_HORIZONTAL_ID] CD_HORIZONTAL_LOCATION[CD_VERTICAL_ID] CD_VERTICAL_LOCATION

<cd_clear_dark_definition> = START_CD_CLEAR_DARKCD_CLEAR_SETCD_DARK_SET[CD_CLEAR_DARK_TOLERANCE][CD_CLEAR_DARK_REFERENCE_ONLY]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

END_CD_CLEAR_DARK<cd_same_tone_definition> = START_CD_SAME_TONE

CD_SAME_TONE_SETCD_SAME_TONE_SET[CD_SAME_TONE_TOLERANCE][CD_SAME_TONE_REFERENCE_ONLY]END_CD_SAME_TONE

<multi_layer_field_def> = MULTI_LAYER_FIELD [<percent_clear_def>][<percent_clear_reuested_def>]

<percent_clear_def> = PERCENT_CLEAR [PERCENT_CLEAR_WINDOW]<percent_clear_reuested_def> = PERCENT_CLEAR_REQUESTED [PERCENT_CLEAR_WINDOW]<opc_definition> = START_OPC

[OPC_TYPE [OPC_MINIMUM_FEATURE_SIZE] [OPC_MINIMUM_GAP][OPC_PATTERN_SEPARATE] [OPC_PATTERN_MODIFIABLE] ]END_OPC

<defect_definition> = START_DEFECT_DEFINITION [DEFECT_QUALITY_ID][VISUAL_INSPECTION_OK] [VISUAL_INSPECTION_REQD]{VISUAL_INSP_CRITERIA}[AUTO_INSPECTION_REQD] [DIE_TO_DIE_INSPECTION][DEFECT_SIZE] [DEFECT_SIZE_CL] [DEFECT_SIZE_DK][DEFECT_SIZE_CL_ADJ] [DEFECT_SIZE_CL_ADJ_REP][DEFECT_SIZE_DK_ADJ] [DEFECT_SIZE_DK_ADJ_REP][DEFECT_SIZE_CL_ISO] [DEFECT_SIZE_CL_ISO_REP][DEFECT_SIZE_DK_ISO] [DEFECT_SIZE_DK_ISO_REP][DEFECT_DENSITY] [DEFECT_COUNT] [DEFECT_COUNT_REP][DEFECTIVE_DIE_DENSITY] [DEFECTIVE_DIE_COUNT][DEFECTIVE_DIE_COUNT_REP][PERCENT_DEFECTIVE_DIE][EDGE_ROUGHNESS]{INSPECTION_AREA} [INSPECTION_BORDER] {INSPECTION_AREA_EXCLUDE}{<scratch_size_front_def>}{<scratch_size_back_def>}{SCRATCH_SIZE_FRONT {SCRATCH_INSP_AREA {SCRATCH_INSP_EXCLUDE }}}{SCRATCH_SIZE_BACK {SCRATCH_INSP_AREA {SCRATCH_INSP_EXCLUDE }}}[GOOD_FIELDS]{<defect_equip_def>}{DEFECT_EQUIP_REQD {EQUIP_SITE_REQD} [DEFECT_INSP_MODE_REQD]

[DEFECT_INSP_PIXEL_SIZE_REQD]{ DEFECT_TYPE DEFECT_INSP_SENSITIVITY_REQD

{ BIN_SIZE SEVERITY_CRITERION_REQD } }[ DEFECT_SETUP_FILE_NAME_REQD] }

[<database_inspection>][<repair_definition>]END_DEFECT_DEFINITION

<scratch_size_front_def> = SCRATCH_SIZE_FRONT {<scratch_insp_area_def>} <scratch_size_back_def> = SCRATCH_SIZE_BACK {<scratch_insp_area_def>} <scratch_insp_area_def> = SCRATCH_INSP_AREA {SCRATCH_INSP_EXCLUDE}

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

<defect_equip_def> = DEFECT_EQUIP_REQD {EQUIP_SITE_REQD} [DEFECT_INSP_MODE_REQD] [DEFECT_INSP_PIXEL_SIZE_REQD]{<defect_type_def>}[ DEFECT_SETUP_FILE_NAME_REQD]

<defect_type_def> = DEFECT_TYPE DEFECT_INSP_SENSITIVITY_REQD {<bin_size_def>}<bin_size_def> = BIN_SIZE SEVERITY_CRITERION_REQD<database_inspection> = DATABASE_INSPECTION [PRICE]

[DATABASE_SOURCE][DATABASE_TOP_CELL DATABASE_LAYER][DATABASE_FILE_NAME][DATABASE_UNIT] [USER_UNIT][DATABASE_WITH_JOB [DATABASE_JOB_NAME DATABASE_JOB_LEVEL] ]{DATABASE_AREA}

<repair_definition> = START_REPAIR_DEFINITION{<repair_equip_def>}{ REPAIR_EQUIP_REQD {EQUIP_SITE_REQD} }END_REPAIR_DEFINITION

<repair_equip_def> = REPAIR_EQUIP_REQD {EQUIP_SITE_REQD}<surface_definition> = START_SURFACE_DEFINITION

[SURFACE_INSPECTION] [SURFACE_QUALITY_ID]{<surface_equip_def>}{ [SURF_INSP_EQUIP_REQD] {EQUIP_SITE_REQD} [SURF_INSP_MODE_REQD]

[SURF_INSP_PIXEL_SIZE_REQD]{SURF_DEFECT_TYPE

SURF_INSP_SENSITIVITY_REQD{ BIN_SIZE SEVERITY_CRITERION_REQD } }

[SURF_INSP_SETUP_FILE_NAME_REQD] }[SURF_INSP_METHOD] [SURF_INSP_AREA][SURF_INSP_PELL_TOP][SURF_INSP_PELL_TOP_ON_CLEAR_PATTERN][SURF_INSP_PELL_TOP_ON_OPAQUE_PATTERN][SURF_INSP_PELL_TOP_OUTSIDE_FRAME] [SURF_INSP_PELL_TOP_OUTSIDE_ON_OPAQUE][SURF_INSP_PELL_TOP_OUTSIDE_MEMBRANE][SURF_INSP_PELL_TOP_INSIDE_MEMBRANE][SURF_INSP_PELL_TOP_OUTSIDE_ON_FRAME][SURF_INSP_PELL_TOP_INSIDE_ON_FRAME][SURF_INSP_PELL_BOTTOM][SURF_INSP_GLASS_SIDE] [SURF_INSP_PATTERN_SIDE][TRANSMISSION_DEFECT_CLEAR] [TRANSMISSION_DEFECT_DARK]END_SURFACE_DEFINITION

<surface_equip_def> = [SURF_INSP_EQUIP_REQD] {EQUIP_SITE_REQD} [SURF_INSP_MODE_REQD] [SURF_INSP_PIXEL_SIZE_REQD]{<surface_defect_type_def>} [SURF_INSP_SETUP_FILE_NAME_REQD]

<surface_defect_type_def> = SURF_DEFECT_TYPE SURF_INSP_SENSITIVITY_REQD { <bin_size_def> }<contamination> = CONTAMINANT CONTAMINATION_LEVEL [CONTAMINATION_METHOD]<sem_photo> = START_SEM_PHOTO

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

{<sem_photo_def>}{ [SEM_PHOTO_SITE_ID] SEM_PHOTO_LOCATION }[SEM_PHOTO_MATRIX_FILENAME][CD_FEATURE] [CD_LOCATION_DRAWING] [CD_DRAWING][SEM_PHOTO_SCALE][SEM_PHOTO_TILT] [SEM_PHOTO_ROTATION]END_SEM_PHOTO

<sem_photo_def> = [SEM_PHOTO_SITE_ID] SEM_PHOTO_LOCATION<package_def> = PACKAGE [MAX_MASKS_IN_PACKAGE]<mask_definition> = MASK_ID [ MASK_NAME [MASK_NAME_VERSION] ]

[CUSTOMER_LAYER_NAME]DELIVERABLE_MASK<mask_options> END_MASK

<cell_definition> = CELL_ID [<pattern_o p tions >] END_CELL_OPTIONS{<cell_instance>} {<pattern_instance>} END_CELL

<pattern_group> = PATTERN_GROUP_ID [<patter n _options >]END_PATTERN_GROUP_OPTIONS {<pattern_definitions>}END_PATTERN_GROUP

<pattern_definitions> = LEVEL_ID[PATTERN_NAME] [PATTERN_VISUAL_ID] [FIGURE_COUNT][MINIMUM_FEATURE_SIZE {MINIMUM_FEATURE_LOCATION} ]{<opc_definition>}[OPTICAL_MASK_SET_ID OPTICAL_MASK_ID][OPTICAL_MASK_TITLE][<pat t ern_options >]END_PATTERN_DEFINITION

<cell_instance> = CELL_INSTANCE [<patt e rn_options >]END_CELL_INSTANCE_OPTIONS {<placement>}END_CELL_INSTANCE

<pattern_instance> = PATTERN_GROUP_INSTANCE [<pattern_options>]{<placement>}END_PATTERN_GROUP_INSTANCE

<placement> = START_PLACEMENT{<location_def>}{ LOCATION [STEPPING_DISTANCE STEPPING_COUNT]{DROPOUT [SCRIBE_TONE SCRIBE_INSIDE_CORNERS SCRIBE_OUTSIDE_CORNERS] } }[ARRAY_DIAMETER ARRAY_CENTER [ARRAY_DIAMETER_INCLUSIVE] ][LOCATION_SPEC]END_PLACEMENT

<location_def> = LOCATION [STEPPING_DISTANCE STEPPING_COUNT]{<dropout_def>}

<dropout_def> = DROPOUT [SCRIBE_TONE SCRIBE_INSIDE_CORNERS SCRIBE_OUTSIDE_CORNERS]

<pattern_options> = START_PATTERN_OPTIONS [PATTERN_FUNCTION]{PATTERN_EXPORT_NUMBER} {CHIP_EXPORT_NUMBER}[DATA_FILE_SIZE] [DATA_CHECKSUM DATA_CHECKSUM_TYPE ][PATTERN_ADDRESS_SIZE] [SCALE_FACTOR]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[DIGITIZED_DATA_DARK] [PATTERN_FIGURE_OVERLAP][STRIPE_HEIGHT][UNSCALED_PATTERN_SIZE][MFG_BIAS_PREAPPLIED]{LITHO_MODE_REQD} [VIRTUAL_ADDRESS][SURROUNDING_TONE SURROUNDING_WIDTH SURROUNDING_HEIGHT][DATA_PATTERN_WINDOW][MIRROR_PATTERN]{<ship_plot>} [PATTERN_PLOT_APPR_REQD][<phase_shift>]{<registration>}{<cd_group>}{<cd_set>}{<cd_xy_definition>}{<cd_clear_dark_definition>}{<cd_same_tone_definition>}[<multi_layer_field_def>][MULTI_LAYER_FIELD [PERCENT_CLEAR_REQUESTED

[PERCENT_CLEAR_WINDOW] ] ][PERCENT_CLEAR [PERCENT_CLEAR_WINDOW]][PERCENT_CLEAR PERCENT_CLEAR_WINDOW] [INSPECT_ALL_SITES]{<defect_definition>}{<sem_photo>}[BUTTING_ERROR [BUTTING_ERROR_METHOD] ]{ADDITIONAL_PATTERN_INFO}END_PATTERN_OPTIONS

<shippable_data> = START_SHIPPABLE_DATA[<send_ mask_shipped_date_time_def>] [SEND_MASK_SHIPPED_DATE_TIME [<ship_to>] ][<send_final_audit_date_time_def>][SEND_FINAL_AUDIT_DATE_TIME [<ship_to>] ][<ship_cd_data_def>][SHIP_CD_DATA [<ship_to>] ][<ship_cd_printout_def >] [SHIP_CD_PRINTOUT [<ship_to>] ][<ship_cd_uniformity_map_def >] [SHIP_CD_UNIFORMITY_MAP [<ship_to>] ][<ship_aim_data _def>] [SHIP_AIM_DATA [<ship_to>] ][<ship_defect_data_def>][SHIP_DEFECT_DATA [<ship_to>] ][<ship_thru_pellicle_data _def>] [SHIP_THRU_PELLICLE_DATA [<ship_to>] ][<ship_manual_inspection_form _def>] [SHIP_MANUAL_INSPECTION_FORM [<ship_to>] ][<ship_insp_database_data_def>][SHIP_INSP_DATABASE_DATA [INSP_DATABASE_DATA_FORMAT] [<ship_to>] ]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

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[<ship_first_prepell_die_db_msk_map_def>][SHIP_FIRST_PREPELL_DIE_DB_MSK_MAP [<ship_to>] ][<ship_first_prepell_die_db_ptn_map_def>][SHIP_FIRST_PREPELL_DIE_DB_PTN_MAP [<ship_to>] ][<ship_first_prepell_die_die_map _def>] [SHIP_FIRST_PREPELL_DIE_DIE_MAP [<ship_to>] ][<ship_first_rot_prepell_die_die_map _def>] [SHIP_FIRST_ROT_PREPELL_DIE_DIE_MAP [<ship_to>] ][<ship_final_prepell_die_db_msk_map _def>] [SHIP_FINAL_PREPELL_DIE_DB_MSK_MAP [<ship_to>] ][<ship_final_prepell_die_db_ptn_map _def>] [SHIP_FINAL_PREPELL_DIE_DB_PTN_MAP [<ship_to>] ][<ship_final_prepell_die_die_map _def>] [SHIP_FINAL_PREPELL_DIE_DIE_MAP [<ship_to>] ][<ship_final_rot_prepell_die_die_map_def>][SHIP_FINAL_ROT_PREPELL_DIE_DIE_MAP [<ship_to>] ][<ship_first_postpell_die_db_msk_map_def>][SHIP_FIRST_POSTPELL_DIE_DB_MSK_MAP [<ship_to>] ][<ship_first_postpell_die_db_ptn_map _def>] [SHIP_FIRST_POSTPELL_DIE_DB_PTN_MAP [<ship_to>] ][<ship_first_postpell_die_die_map _def>] [SHIP_FIRST_POSTPELL_DIE_DIE_MAP [<ship_to>] ][<ship_first_rot_postpell_die_die_map _def>] [SHIP_FIRST_ROT_POSTPELL_DIE_DIE_MAP [<ship_to>] ][<ship_final_postpell_die_db_msk_map _def>] [SHIP_FINAL_POSTPELL_DIE_DB_MSK_MAP [<ship_to>] ][<ship_final_postpell_die_db_ptn_map _def>] [SHIP_FINAL_POSTPELL_DIE_DB_PTN_MAP [<ship_to>] ][<ship_final_postpell_die_die_map _def>] [SHIP_FINAL_POSTPELL_DIE_DIE_MAP [<ship_to>] ][<ship_final_rot_postpell_die_die_map_def>][SHIP_FINAL_ROT_POSTPELL_DIE_DIE_MAP [<ship_to>] ][<ship_repair_data _def>] [SHIP_REPAIR_DATA [<ship_to>] ][<ship_registr_data _def>] [SHIP_REGISTR_DATA [<ship_to>] ][<ship_array_registr_map _def>] [SHIP_ARRAY_REGISTR_MAP [<ship_to>] ][<ship_closure_data _def>] [SHIP_CLOSURE_DATA [<ship_to>] ][<ship_die_fit_map _def>] [SHIP_DIE_FIT_MAP [<ship_to>] ][<ship_measure_file_registr_map_def>][SHIP_MEASURE_FILE_REGISTR_MAP [<ship_to>] ][<ship_field_fit_map _def>] [SHIP_FIELD_FIT_MAP [<ship_to>] ][<ship_centrality_data_def>][SHIP_CENTRALITY_DATA [<ship_to>] ]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[<ship_centrality_map _def>] [SHIP_CENTRALITY_MAP [<ship_to>] ][<ship_surf_insp_measurements _def>] [SHIP_SURF_INSP_MEASUREMENTS [<ship_to>] ][<ship_surf_inspection_map _def>] [SHIP_SURF_INSPECTION_MAP [<ship_to>] ][<ship_surf_insp_pell_top_map_def>][SHIP_SURF_INSP_PELL_TOP_MAP [<ship_to>] ][<ship_surf_insp_pell_bottom_map _def>] [SHIP_SURF_INSP_PELL_BOTTOM_MAP [<ship_to>] ][<ship_surf_insp_glass_side_map _def>] [SHIP_SURF_INSP_GLASS_SIDE_MAP [<ship_to>] ][<ship_surf_insp_pattern_side_map _def>] [SHIP_SURF_INSP_PATTERN_SIDE_MAP [<ship_to>] ][<ship_starlight_map _def>] [SHIP_STARLIGHT_MAP [<ship_to>] ][<ship_phase_shift_measurements _def>] [SHIP_PHASE_SHIFT_MEASUREMENTS [<ship_to>] ][<ship_phase_shift_report _def>] [SHIP_PHASE_SHIFT_REPORT [<ship_to>] ][<ship_sem_photos _def>] [SHIP_SEM_PHOTOS [<ship_to>] ]{<ship_plot>}[<ship_certificate_of_conformance_def>][SHIP_CERTIFICATE_OF_CONFORMANCE [<ship_to>] ]{<ship_customer_quality_form_def>}{SHIP_CUSTOMER_QUALITY_FORM [<ship_to>] }[<ship_traveler_def>][SHIP_TRAVELER [<ship_to>] ][<percent_clear_requested_def>][PERCENT_CLEAR_REQUESTED [PERCENT_CLEAR_WINDOW] [<ship_to>] ]{<ship_special_request > } {SHIP_SPECIAL_REQUEST [<ship_to>] }END_SHIPPABLE_DATA

<send_ mask_shipped_date_time_def> = SEND_MASK_SHIPPED_DATE_TIME [< ship_to >] <send_final_audit_date_time_def> = SEND_FINAL_AUDIT_DATE_TIME [< ship_to >] <ship_cd_data_def> = SHIP_CD_DATA [< s h i p_to >] <ship_cd_printout_def > = SHIP_CD_PRINTOUT [< ship_to >] <ship_cd_uniformity_map_def > = SHIP_CD_UNIFORMITY_MAP [< ship_to >] <ship_aim_data _def> = SHIP_AIM_DATA [< ship_to >] <ship_defect_data_def> = SHIP_DEFECT_DATA [< ship_to >] <ship_thru_pellicle_data _def> = SHIP_THRU_PELLICLE_DATA [< ship_to >] <ship_manual_inspection_form _def> = SHIP_MANUAL_INSPECTION_FORM [< ship_to >] <ship_insp_database_data_def> = SHIP_INSP_DATABASE_DATA [INSP_DATABASE_DATA_FORMAT]

[< ship_to >] <ship_first_prepell_die_db_msk_map_def> = SHIP_FIRST_PREPELL_DIE_DB_MSK_MAP [< ship_to >] <ship_first_prepell_die_db_ptn_map_def> = SHIP_FIRST_PREPELL_DIE_DB_PTN_MAP [< ship_to >]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

<ship_first_prepell_die_die_map _def> = SHIP_FIRST_PREPELL_DIE_DIE_MAP [< ship_to >] <ship_first_rot_prepell_die_die_map _def> = SHIP_FIRST_ROT_PREPELL_DIE_DIE_MAP [< ship_to >] <ship_final_prepell_die_db_msk_map _def> = SHIP_FINAL_PREPELL_DIE_DB_MSK_MAP [< ship_to >] <ship_final_prepell_die_db_ptn_map _def> = SHIP_FINAL_PREPELL_DIE_DB_PTN_MAP [< ship_to >] <ship_final_prepell_die_die_map _def> = SHIP_FINAL_PREPELL_DIE_DIE_MAP [< ship_to >] <ship_final_rot_prepell_die_die_map_def> = SHIP_FINAL_ROT_PREPELL_DIE_DIE_MAP [< ship_to >] <ship_first_postpell_die_db_msk_map_def> = SHIP_FIRST_POSTPELL_DIE_DB_MSK_MAP [< ship_to >] <ship_first_postpell_die_db_ptn_map _def> = SHIP_FIRST_POSTPELL_DIE_DB_PTN_MAP [< ship_to >] <ship_first_postpell_die_die_map _def> = SHIP_FIRST_POSTPELL_DIE_DIE_MAP [< ship_to >] <ship_first_rot_postpell_die_die_map _def> = SHIP_FIRST_ROT_POSTPELL_DIE_DIE_MAP [< ship_to >] <ship_final_postpell_die_db_msk_map _def> = SHIP_FINAL_POSTPELL_DIE_DB_MSK_MAP [< ship_to >] <ship_final_postpell_die_db_ptn_map _def> = SHIP_FINAL_POSTPELL_DIE_DB_PTN_MAP [< ship_to >] <ship_final_postpell_die_die_map _def> = SHIP_FINAL_POSTPELL_DIE_DIE_MAP [< ship_to >] <ship_final_rot_postpell_die_die_map_def> = SHIP_FINAL_ROT_POSTPELL_DIE_DIE_MAP [< ship_to >] <ship_repair_data _def> = SHIP_REPAIR_DATA [< ship_to >] <ship_registr_data _def> = SHIP_REGISTR_DATA [< ship_to >] <ship_array_registr_map _def> = SHIP_ARRAY_REGISTR_MAP [< ship_to >] <ship_closure_data _def> = SHIP_CLOSURE_DATA [< ship_to >] <ship_die_fit_map _def> = SHIP_DIE_FIT_MAP [< ship_to >] <ship_measure_file_registr_map_def> = SHIP_MEASURE_FILE_REGISTR_MAP [< ship_to >] <ship_field_fit_map _def> = SHIP_FIELD_FIT_MAP [< ship_to >] <ship_centrality_data_def> = SHIP_CENTRALITY_DATA [< ship_to >] <ship_centrality_map _def> = SHIP_CENTRALITY_MAP [< ship_to >] <ship_surf_insp_measurements _def> = SHIP_SURF_INSP_MEASURE M ENTS [< ship_to >] <ship_surf_inspection_map _def> = SHIP_SURF_INSPECTION_MAP [< ship_to >] <ship_surf_insp_pell_top_map_def> = SHIP_SURF_INSP_PELL_TOP_MAP [< ship_to >] <ship_surf_insp_pell_bottom_map _def> = SHIP_SURF_INSP_PELL_BOTTOM_MAP [< ship_to >] <ship_surf_insp_glass_side_map _def> = SHIP_SURF_INSP_GLASS_SIDE_MAP [< ship_to >] <ship_surf_insp_pattern_side_map _def> = SHIP_SURF_INSP_PATTERN_SIDE_MAP [< ship_to >] <ship_starlight_map _def> = SHIP_STARLIGHT_MAP [< ship_to >] <ship_phase_shift_measurements _def> = SHIP_PHASE_SHIFT_ M EASUREMENTS [< ship_to >] <ship_phase_shift_report _def> = SHIP_PHASE_SHIFT_REPORT [< ship_to >] <ship_sem_photos _def> = SHIP_SEM_PHOTOS [< ship_to >] <ship_plot> = START_SHIP_PLOT

PLOT_TYPE PLOT_SCALE QUANTITY [PRICE][PLOT_FORMAT] [PATTERN_PLOT_NORMAL_TONE] [<ship_to>] END_SHIP_PLOT

<ship_certificate_of_conformance_def> = SHIP_CERTIFICATE_OF_CONFORMANCE [< ship_to >] <ship_customer_quality_form_def> = SHIP_CUSTOMER_QUALITY_FORM [< ship_to >] <ship_traveler_def> = SHIP_TRAVELER [< ship_to >] <percent_clear_requested_def> = PERCENT_CLEAR_REQUESTED [PERCENT_CLEAR_WINDOW]

[< ship_to >] <ship_special_request > = SHIP_SPECIAL_REQUEST [< ship_to >] <ship_to> = START_SHIP_TO

{EMAIL_ADDRESS} [<ftp_address>] [WEB_ADDRESS]{MAILING_ADDRESS} [SHIP_TO_FAX][DUE_DATE_TIME_REQUESTED]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 21 Doc. jn l SEMI

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DRAFTDocument Number:

Date: 5/9/23

END_SHIP_TO<ftp_address> = FTP_HOST_NAME [FTP_LOGIN] [FTP_PASSWORD] [FTP_DIRECTORY]

[FTP_MODE] END_FTP_HOSTend_bnf maskOrder

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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7.5 Mask Results Data Structure Syntax The following syntax definition uses the upper case keyword to represent the permissible applications of the corresponding data record within the mask results data structure. This structure allows the vendor to deliver to the customer actual data regarding masks being built.

start_bnf maskResults

<mask_results> = START_MASK_RESULTS SEMI_REVISION CUSTOMER VENDOR

FILE_DATE_TIME [OPERATOR_NAME]MASK_SET_ID [MASK_SET_NAME [MASK_SET_VERSION] ][CUSTOMER_MASK_SET_NAME] [BLANKET_PO_NUMBER] [PO_NUMBER] [SO_NUMBER][ORDER_ID][RELEASE_NUMBER] [LINE_ITEM_NUMBER] [QUOTE_NUMBER][<vendor_info>]{<mask_group_results>}{MASK_GROUP_ID [<vendor_info>]

{MASK_ID [ MASK_NAME [MASK_NAME_VERSION] ][CUSTOMER_LAYER_NAME]<mask_r e sults_options >END_MASK}

END_MASK_GROUP}END_MASK_SETEND_MASK_RESULTS[CHECKSUM]

<mask_group_results> = MASK_GROUP_ID [ < vendor_info >] {<mask_results>}END_MASK_GROUP

<mask_results> = MASK_ID [ MASK_NAME [MASK_NAME_VERSION] ][CUSTOMER_LAYER_NAME]<mask_results_options>END_MASK

<mask_results_options> = START_MASK_RESULTS_OPTIONS[STATUS][<vendor_info>][<billing_information>][<materials_used >]{MFG_SITE_REQD} [MFG_SITE_USED]PRODUCT_TYPE [SERVICE_TYPE][PRODUCT_MAGNIFICATION] [PRODUCT_IMAGING_TYPE]{<title_data >} { TITLE_TEXT [TITLE_TYPE] }[DUE_DATE_TIME_COMMITTED] [ELAPSED_TIME_COMMITTED][MILESTONE [ADDITIONAL_MILESTONE_INFO] ][PERIODIC_UPDATE [ADDITIONAL_MILESTONE_INFO] ][ESTIMATED_ARRIVAL [ADDITIONAL_MILESTONE_INFO] ][MASK_SHIPPED_DATE_TIME][FINAL_AUDIT_DATE_TIME][DESIGN_RULE]{MASK_EXPORT_NUMBER} [SECURITY_CLASS]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[<wafer_exposure_data> <aerial_image_data>][FAB_TECHNOLOGY] [WAFER_FAB][JOB_ONLY_APPROVED] [JOB_WITH_PATTERNS_APPROVED][ALL_PATTERNS_APPROVED][APPROVAL_GRANTED][MIRROR_MASK] [MASK_ROTATION]{customer_spec_def>}{CUSTOMER_SPEC CUSTOMER_SPEC_REVISION}{WAIVER} {WAIVER_OVERRIDE}{ <barcode_data>} { [BARCODE_TYPE] BARCODE_TEXT [BARCODE_TEXT_REFERENCE_ONLY]

BARCODE_ROTATION }[SHIPPING_METHOD_USED]{<percent_clear_def>}{ [MULTI_LAYER_FIELD] MEASURED_PERCENT_CLEAR

[PERCENT_CLEAR_WINDOW] }[CENTRALITY] [MEASURED_CENTRALITY]{<litho_information>}{<pattern_group_results>}[<phase_shift_m e asurements >]{<registr_measurements>}{<closure_measurements>}{<cd_group_measurements>}{<cd_set_results>}{<cd_xy_results>}{<cd_clear_dark_results>}{<cd_same_tone_results>}{<defect_measurements>} [THROUGH_PELLICLE_DEFECTS {<defect_measurements>} ]{<surface_insp_measurements>}{<contamination_measurements>}[QUALITY_GROUP_ID][FINAL_QC_AUDITOR]{ADDITIONAL_RESULTS_INFO}END_MASK_RESULTS_OPTIONS

<vendor_info> = START_VENDOR_INFO[VENDOR_CONTACT] [VENDOR_PHONE] {VENDOR_ADDRESS}[VENDOR_FAX] [VENDOR_EMAIL][FINAL_QC_AUDITOR][VENDOR_ORDER_ID]END_VENDOR_INFO

<billing_information> = START_BILLING_INFORMATION[BLANKET_PO_NUMBER] [PO_NUMBER] [SO_NUMBER] [RELEASE_NUMBER]END_BILLING_INFORMATION

<materials_used> = START_MATERIALS_USED[TOP_PELLICLE_USED] [BOTTOM_PELLICLE_USED][PACKAGE_USED][<substrate>] END_MATERIALS_USED

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

<substrate> = START_SUBSTRATEBLANK_LENGTH [BLANK_WIDTH] BLANK_THICKNESS [BLANK_SIZE]BLANK_TYPE [BLANK_GRADE][BLANK_FLATNESS] [BLANK_FLATNESS_USED] [BLANK_VENDOR][BLANK_BIREFRINGENCE_REQD] [BLANK_BIREFRINGENCE_USED]{<coating>}[BLANK_INDEX_OF_REFRACTION][MINIMUM_BINARY_TRANSMITTANCE][MEASURED_BINARY_TRANSMITTANCE][BLANK_LOT_REQD] [BLANK_LOT] [BLANK_DATE_OF_MFG][MASK_BLANK_ID][ADDITIONAL_SUBSTRATE_INFO][<euv_blank_type>] END_SUBSTRATE

<coating> = START_COATINGCOATING_TYPE [COATING_COMPOSITION] [COATING_THICKNESS][COATING_REFLECTANCE] [COATING_TRANSMITTANCE][COATING_WAVELENGTH] [COATING_GRADE][COATING_PHASE][MINIMUM_COATING_OPTICAL_DENSITY] [COATING_OPTICAL_DENSITY][COATING_LOT_NUMBER] [COATING_DATE_TIME][COATING_MASK_VENDOR_APPLIED] [COATING_EQUIP_USED]END_COATING

<euv_blank_type> = START_EUV_BLANK_TYPEEUV_BLANK_TYPEEUV_FLATNESS_FRONTEUV_FLATNESS_BACKEUV_MULTILAYER_COMPOSITIONEUV_CAPPING_COMPOSITIONEUV_MMR_WAVELENGTHEUV_MEAN_PEAK_REFLECTIVITYEUV_PEAK_REFLECTIVITY_UNIFORMITYEUV_ABSORBER_COMPOSITIONEUV_ABSORBER_OPTICAL_PROPERTIESEUV_BLANK_RESISTANCEEUV_EXPANSION_COEFFEND_EUV_BLANK_TYPE

<title_data > = TITLE_TEXT [TITLE_TYPE] <wafer_exposure_data> = START_WAFER_EXPOSURE_DATA

WAFER_EXPOSURE_WAVELENGTHWAFER_EXPOSURE_NUMERICAL_APERTURE[WAFER_EXPOSURE_SIGMA][WAFER_EXPOSURE_SIGMA_INNER WAFER_EXPOSURE_SIGMA_OUTER]WAFER_EXPOSURE_ILLUMINATIONEND_WAFER_EXPOSURE_DATA

<aerial_image_data> = START_AERIAL_IMAGE_DATAAIM_WAVELENGTH[AIM_INTENSITY_VARIATION_DELTA][AIM_FLUX_INTENSITY_DELTA]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[AIM_CD_DELTA]END_AERIAL_IMAGE_DATA

<customer_spec_def> = CUSTOMER_SPEC CUSTOMER_SPEC_REVISION<barcode_data> = [BARCODE_TYPE] BARCODE_TEXT [BARCODE_TEXT_REFERENCE_ONLY]

BARCODE_ROTATION<percent_clear_def> = [MULTI_LAYER_FIELD]

MEASURED_PERCENT_CLEAR [PERCENT_CLEAR_WINDOW]<litho_information> = START_LITHO_INFORMATION

{<litho_reqd>}{ [LITHO_EQUIP_REQD] {EQUIP_SITE_REQD}

{ [LITHO_MODEL_REQD] {LITHO_MODE_REQD} } }[LITHO_EQUIP_USED] [EQUIP_SITE_USED]

[LITHO_MODEL_USED] [LITHO_MODE_USED][MACHINE_SERIAL_NUMBER][MASK_SERIAL_NUMBER][PROCESS][WRITE_DATE_TIME] [ELAPSED_WRITE_TIME][OPERATOR]END_LITHO_INFORMATION

<litho_reqd> = [LITHO_EQUIP_REQD] {EQUIP_SITE_REQD}{<litho_model_mode_def>}{ [LITHO_MODEL_REQD] {LITHO_MODE_REQD} }

<litho_model_mode_def> = [LITHO_MODEL_REQD] {LITHO_MODE_REQD} <pattern_group_results> = START_PATTERN_GROUP_RESULTS

PATTERN_GROUP_ID{PATTERN_APPROVED}{PATTERN_EXPORT_NUMBER} {CHIP_EXPORT_NUMBER}{<phase_shift_measurements>}{<registr_measurements>}{<closure_measurements>}{<cd_group_measurements>}{<cd_set_results>}{<cd_xy_results>}{<cd_clear_dark_results>}{<cd_same_tone_results>}{<defect_measurements>}END_PATTERN_GROUP_RESULTS

<phase_shift_measurements> = START_PHASE_SHIFT_MEASUREMENTSPSM_WAVELENGTH[PHASE_SHIFT_QUALITY_ID][ START_TRANSMISSION_MEASUREMENTS

[TRANSMISSION_MEASUREMENT_DATE][TRANSMISSION_EQUIP_USED][TRANSMISSION_MODE_USED][TRANSMISSION_MEASUREMENT_FILE_NAME]TRANSMISSION_TARGET[TRANSMISSION_REFERENCE_ONLY][TRANSMISSION_TOLERANCE]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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DRAFTDocument Number:

Date: 5/9/23

[TRANSMISSION_RANGE][TRANSMISSION_ERROR][MEASURED_TRANSMISSION_AVERAGE][MEASURED_TRANSMISSION_TOLERANCE][MEASURED_TRANSMISSION_RANGE][TRANSMISSION_MARK_FEATURE][TRANSMISSION_MARK_LOCATION_DRAWING][TRANSMISSION_MARK_DRAWING]{<transmission_mark_site_def>}{MEASURED_TRANSMISSION_MARK_SITE_ID[ TRANSMISSION_MARK_LOCATION ]MEASURED_TRANSMISSION_MARK_LOCATIONMEASURED_TRANSMISSION[MEASURED_TRANSMISSION_ERROR]END_MEASURED_TRANSMISSION_SITE }

END_TRANSMISSION_MEASUREMENTS ][ START_PHASE_ANGLE_MEASUREMENTS

[PHASE_ANGLE_MEASUREMENT_DATE][PHASE_ANGLE_EQUIP_USED][PHASE_ANGLE_MODE_USED][PHASE_ANGLE_MEASUREMENT_FILE_NAME]PHASE_ANGLE_TARGET[PHASE_ANGLE_REFERENCE_ONLY][PHASE_ANGLE_TOLERANCE][PHASE_ANGLE_RANGE][PHASE_ANGLE_ERROR][MEASURED_PHASE_ANGLE_AVERAGE][MEASURED_PHASE_ANGLE_TOLERANCE][MEASURED_PHASE_ANGLE_RANGE][PHASE_ANGLE_MARK_FEATURE][PHASE_ANGLE_MARK_LOCATION_DRAWING][PHASE_ANGLE_MARK_DRAWING]{ <phase_angle_mark_site_def>} {MEASURED_PHASE_ANGLE_MARK_SITE_ID[ PHASE_ANGLE_MARK_LOCATION ]MEASURED_PHASE_ANGLE_MARK_LOCATIONMEASURED_PHASE_ANGLE[MEASURED_PHASE_ANGLE_ERROR]END_MEASURED_PHASE_ANGLE_SITE }

END_PHASE_ANGLE_MEASUREMENTS ][ START_ETCH_DEPTH_MEASUREMENTS

[ETCH_DEPTH_MEASUREMENT_DATE][ETCH_DEPTH_EQUIP_USED][ETCH_DEPTH_MODE_USED][ETCH_DEPTH_MEASUREMENT_FILE_NAME]ETCH_DEPTH_TARGET[ETCH_DEPTH_REFERENCE_ONLY][ETCH_DEPTH_TOLERANCE]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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DRAFTDocument Number:

Date: 5/9/23

[ETCH_DEPTH_RANGE][ETCH_DEPTH_ERROR][MEASURED_ETCH_DEPTH_AVERAGE][MEASURED_ETCH_DEPTH_TOLERANCE][MEASURED_ETCH_DEPTH_RANGE][ETCH_DEPTH_MARK_FEATURE][ETCH_DEPTH_MARK_LOCATION_DRAWING][ETCH_DEPTH_MARK_DRAWING]{<etch_depth_mark_site_def>}

` {MEASURED_ETCH_DEPTH_MARK_SITE_ID[ETCH_DEPTH_MARK_LOCATION]MEASURED_ETCH_DEPTH_MARK_LOCATIONMEASURED_ETCH_DEPTH[MEASURED_ETCH_DEPTH_ERROR]END_MEASURED_ETCH_DEPTH_SITE }

END_ETCH_DEPTH_MEASUREMENTS ][OPERATOR]END_PHASE_SHIFT_MEASUREMENTS

<transmission_mark_site_def> = MEASURED_TRANSMISSION_MARK_SITE_ID[ TRANSMISSION_MARK_LOCATION ] MEASURED_TRANSMISSION_MARK_LOCATIONMEASURED_TRANSMISSION[ MEASURED_TRANSMISSION_ERROR ] END_MEASURED_TRANSMISSION_SITE

<phase_angle_mark_site_def> = MEASURED_PHASE_ANGLE_MARK_SITE_ID[ PHASE_ANGLE_MARK_LOCATION ] MEASURED_PHASE_ANGLE_MARK_LOCATIONMEASURED_PHASE_ANGLE[ MEASURED_PHASE_ANGLE_ERROR ] END_MEASURED_PHASE_ANGLE_SITE

<etch_depth_mark_site_def> = MEASURED_ETCH_DEPTH_MARK_SITE_ID[ ETCH_DEPTH_MARK_LOCATION ] MEASURED_ETCH_DEPTH_MARK_LOCATIONMEASURED_ETCH_DEPTH[ MEASURED_ETCH_DEPTH_ERROR ] END_MEASURED_ETCH_DEPTH_SITE

<registr_measurements> = START_REGISTR_MEASUREMENTS[REGISTR_QUALITY_ID]{REGISTR_EQUIP_REQD} {EQUIP_SITE_REQD} {REGISTR_REF_METHOD_REQD}[REGISTR_STD_GRID][REGISTR_ALGORITHM_TYPE [REGISTR_ALGORITHM_COORDINATES] ][REGISTR_COMPENSATION_TEMPERATURE][REGISTR_EQUIP_USED] [EQUIP_SITE_USED] [REGISTR_REF_METHOD_USED][REGISTR_STD_GRID_USED] [REGISTR_ALGORITHM_USED][REGISTR_MEASUREMENT_DATE][REGISTR_REF_MASK_ID REGISTR_REF_MASK_SET_ID][REGISTR_ERROR [REGISTR_ERROR_REFERENCE_ONLY] ][REGISTR_SCALE [REGISTR_SCALE_REFERENCE_ONLY] ]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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DRAFTDocument Number:

Date: 5/9/23

[REGISTR_ANISOTROPIC_SCALE [REGISTR_ANISOTROPIC_SCALE_REFERENCE_ONLY] ][REGISTR_RESIDUAL [REGISTR_RESIDUAL_REFERENCE_ONLY] ][REGISTR_THREE_SIGMA [REGISTR_THREE_SIGMA_REFERENCE_ONLY] ][REGISTR_RESIDUAL_THREE_SIGMA [REGISTR_RESIDUAL_THREE_SIGMA_REFERENCE_ONLY] ][REGISTR_TOLERANCE [REGISTR_TOLERANCE_REFERENCE_ONLY] ][REGISTR_ORTHO [REGISTR_ORTHO_REFERENCE_ONLY] ][REGISTR_RELATIVE [REGISTR_RELATIVE_REFERENCE_ONLY] ]{<measured_registr_mark>}[MEASURED_REGISTR_ERROR] [MEASURED_REGISTR_SCALE][MEASURED_REGISTR_ANISOTROPIC_SCALE][MEASURED_REGISTR_THREE_SIGMA][MEASURED_REGISTR_RESIDUAL][MEASURED_REGISTR_RESIDUAL_THREE_SIGMA][MEASURED_REGISTR_TOLERANCE][MEASURED_REGISTR_MINIMUM] [MEASURED_REGISTR_MAXIMUM][MEASURED_REGISTR_ORTHO] [MEASURED_REGISTR_RELATIVE][MEASURED_REGISTR_FILE_NAME][OPERATOR]END_REGISTR_MEASUREMENTS

<measured_registr_mark> = START_MEASURED_REGISTR_MARKMEASURED_REGISTR_MARK_ID[VENDOR_REGISTRATION_MARK_ID][ MASK_REGISTR_MARK_LOCATION ]MEASURED_REGISTR_MARK_LOCATION[ MEASURED_REGISTR_MARK_ERROR ][ MEASURED_REGISTR_MARK_RESIDUAL ]END_MEASURED_REGISTR_MARK

<closure_measurements> = START_CLOSURE_MEASUREMENTS{REGISTR_CLOSURE_EQUIP_REQD} {EQUIP_SITE_REQD}[REGISTR_CLOSURE_EQUIP_USED] [EQUIP_SITE_USED][REGISTR_CLOSURE][REGISTR_CLOSURE_REFERENCE_ONLY]MEASURED_REGISTR_CLOSURE{<measured_closure_def>}{ MEASURED_CLOSURE_READING [MEASURED_CLOSURE_LOCATION] }[OPERATOR]END_CLOSURE_MEASUREMENTS

<measured_closure_def> = MEASURED_CLOSURE_READING [MEASURED_CLOSURE_LOCATION] <cd_group_measurements> = START_CD_GROUP_MEASUREMENTS

[CD_QUALITY_ID][CD_TONE_CLEAR][CD_MORPHOGRAPHY][CD_PERCENT_CLEAR] [CD_PERCENT_CLEAR_WINDOW][CD_TARGET][CD_ORIENTATION][CD_PITCH]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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DRAFTDocument Number:

Date: 5/9/23

[CD_FEATURE][CD_REFERENCE_ONLY][CD_TOLERANCE][CD_RANGE] [CD_THREE_SIGMA][CD_DEVIATION_FROM_TARGET][CD_DEVIATION_FROM_MEAN][CD_STD] [CD_CORRELATION_ID]{CD_EQUIP_REQD} {EQUIP_SITE_REQD}[CD_EQUIP_USED] [EQUIP_SITE_USED][CD_MEASUREMENT_DATE][NUMBER_OF_CDS]{<cd_measurement>}[MEASURED_CD_MEAN] [MEASURED_CD_MIN] [MEASURED_CD_MAX][MEASURED_CD_TOLERANCE][MEASURED_CD_RANGE] [MEASURED_CD_THREE_SIGMA][MEASURED_CD_DEVIATION_FROM_TARGET][MEASURED_CD_DEVIATION_FROM_MEAN][MEASURED_CD_FILE_NAME][OPERATOR]END_CD_GROUP_MEASUREMENTS

<cd_measurement> = START_CD_MEASUREMENT[ [CD_SITE_ID] CD_LOCATION ]MEASURED_CD_SITE_IDMEASURED_CD_LOCATIONMEASURED_CDEND_CD_MEASUREMENT

<cd_set_results> = START_CD_SET_RESULTS{CD_GROUP_NAME}[CD_REFERENCE_ONLY][CD_QUALITY_ID][CD_TOLERANCE] [CD_RANGE] [CD_THREE_SIGMA][CD_DEVIATION_FROM_TARGET] [CD_DEVIATION_FROM_MEAN][MEASURED_CD_MEAN] [MEASURED_CD_MIN] [MEASURED_CD_MAX][MEASURED_CD_TOLERANCE][MEASURED_CD_RANGE] [MEASURED_CD_THREE_SIGMA][MEASURED_CD_DEVIATION_FROM_TARGET][MEASURED_CD_DEVIATION_FROM_MEAN]END_CD_SET_RESULTS

<cd_xy_results> = START_CD_XY_RESULTS{CD_X_GROUP} {CD_Y_GROUP}{<cd_xy_site>}[CD_XY_TOLERANCE] [CD_XY_DEVIATION] [CD_XY_REFERENCE_ONLY][MEASURED_CD_XY_TOLERANCE] [MEASURED_CD_XY_DEVIATION][MEASURED_CD_XY_MORPHOGRAPHY][MEASURED_CD_XY_TONE_CLEAR]END_CD_XY_RESULTS

<cd_xy_site> = START_CD_XY_SITE[CD_HORIZONTAL_ID CD_HORIZONTAL_LOCATION ][CD_HORIZONTAL_MORPHOGRAPHY] [CD_HORIZONTAL_TONE_CLEAR]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

MEASURED_HORIZONTAL_CD[CD_VERTICAL_ID CD_VERTICAL_LOCATION ][CD_VERTICAL_MORPHOGRAPHY] [CD_VERTICAL_TONE_CLEAR]

MEASURED_VERTICAL_CDEND_CD_XY_SITE

<cd_clear_dark_results> = START_CD_CLEAR_DARK_RESULTSCD_CLEAR_SETCD_DARK_SET[CD_CLEAR_DARK_TOLERANCE][CD_CLEAR_DARK_REFERENCE_ONLY][MEASURED_CD_CLEAR_SET_MEAN MEASURED_CD_DARK_SET_MEAN][MEASURED_CD_CLEAR_SET_TOLERANCE

MEASURED_CD_DARK_SET_TOLERANCE][MEASURED_CD_CLEAR_DARK_TOLERANCE]END_CD_CLEAR_DARK_RESULTS

<cd_same_tone_results> = START_CD_SAME_TONE_RESULTSCD_SAME_TONE_SETCD_SAME_TONE_SET[CD_SAME_TONE_TOLERANCE][CD_SAME_TONE_REFERENCE_ONLY][MEASURED_CD_SAME_TONE_SET_MEAN

MEASURED_CD_SAME_TONE_SET_MEAN][MEASURED_CD_SAME_TONE_TOLERANCE]END_CD_SAME_TONE_RESULTS

<defect_measurements> = START_DEFECT_MEASUREMENTS[DEFECT_QUALITY_ID][INSPECTION_REF_LOCATION]{INSPECTION_AREA} [INSPECTION_BORDER] {INSPECTION_AREA_EXCLUDE}{VISUAL_INSP_CRITERIA}DIE_TO_DIE_INSPECTIONDIE_TO_DIE_MEASUREMENTS{<defect_measurement_reqd>}[<defect_measurement_used>][DEFECT_INSP_DATE]{<repair_equip_def>}{REPAIR_EQUIP_REQD {EQUIP_SITE_REQD} }[REPAIR_EQUIP_USED [EQUIP_SITE_USED] ]{MEASURED_INSPECTION_AREA} {MEASURED_INSPECTION_AREA_EXCLUDE}<defect_measurement_site>[DEFECT_SIZE] [DEFECT_SIZE_CL] [DEFECT_SIZE_DK][DEFECT_SIZE_CL_ADJ] [DEFECT_SIZE_CL_ADJ_REP][DEFECT_SIZE_DK_ADJ] [DEFECT_SIZE_DK_ADJ_REP][DEFECT_SIZE_CL_ISO] [DEFECT_SIZE_CL_ISO_REP][DEFECT_SIZE_DK_ISO] [DEFECT_SIZE_DK_ISO_REP][ [DEFECT_DENSITY] MEASURED_DEFECT_DENSITY][ [DEFECT_COUNT] MEASURED_DEFECT_COUNT][ [DEFECT_COUNT_REP] MEASURED_DEFECT_COUNT_REP][MEASURED_DEFECT_COUNT_WITHIN_SPEC]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

[ [DEFECTIVE_DIE_DENSITY] MEASURED_DEFECTIVE_DIE_DENSITY][ [DEFECTIVE_DIE_COUNT] MEASURED_DEFECTIVE_DIE_COUNT][ [DEFECTIVE_DIE_COUNT_REP] MEASURED_DEFECTIVE_DIE_COUNT_REP][ [PERCENT_DEFECTIVE_DIE] MEASURED_PERCENT_DEFECTIVE_DIE]{MEASURED_DEFECT_FILE_NAME}[PRE_PELL_INSPECTION_ID] [PRE_PELL_INSPECTION_DATE_AND_TIME][POST_PELL_INSPECTION_ID] [POST_PELL_INSPECTION_DATE_AND_TIME][OPERATOR]END_DEFECT_MEASUREMENTS

<defect_measurement_reqd> = DEFECT_EQUIP_REQD {EQUIP_SITE_REQD}[DEFECT_INSP_MODE_REQD] [DEFECT_INSP_PIXEL_SIZE_REQD]{<defect_type_reqd_def>}{DEFECT_TYPE DEFECT_INSP_SENSITIVITY_REQD

{BIN_SIZE SEVERITY_CRITERION_REQD } }[DEFECT_SETUP_FILE_NAME_REQD]

<defect_type_reqd_def> = DEFECT_TYPE DEFECT_INSP_SENSITIVITY_REQD {<bin_size_reqd_def>}<bin_size_reqd_def> = BIN_SIZE SEVERITY_CRITERION_REQD<defect_measurement_used> = DEFECT_EQUIP_USED [EQUIP_SITE_USED]

[DEFECT_INSP_MODE_USED] [DEFECT_INSP_PIXEL_SIZE_USED]{<defect_type_used_def>}{DEFECT_TYPE DEFECT_INSP_SENSITIVITY_USED

{BIN_SIZE SEVERITY_CRITERION_USED } }[DEFECT_SETUP_FILE_NAME_USED]

<defect_type_used_def> = DEFECT_TYPE DEFECT_INSP_SENSITIVITY_REQD {<bin_size_used_def>}<bin_size_used_def> = BIN_SIZE SEVERITY_CRITERION_USED<repair_equip_def> = REPAIR_EQUIP_REQD {EQUIP_SITE_REQD}<defect_measurement_site> = START_DEFECT_SITE

[DEFECT_TYPE] [DEFECT_TYPE_P22]MEASURED_DEFECT_LOCATION[MEASURED_DEFECT_SIZE][ADDITIONAL_DEFECT_MEASUREMENTS_INFO]END_DEFECT_SITE

<surface_insp_measurements> = START_SURFACE_INSP_MEASUREMENTS[SURFACE_QUALITY_ID]{<surface_insp_reqd>}[<surface_insp_used>][MEASURED_DEFECT_COUNT][MEASURED_DEFECT_COUNT_WITHIN_SPEC][PRE_PELL_INSPECTION_ID] [PRE_PELL_INSPECTION_DATE_AND_TIME][POST_PELL_INSPECTION_ID] [POST_PELL_INSPECTION_DATE_AND_TIME][OPERATOR]END_SURFACE_INSP_MEASUREMENTS

<surface_insp_reqd> = SURF_INSP_EQUIP_REQD {EQUIP_SITE_REQD}[SURF_INSP_MODE_REQD] [SURF_INSP_PIXEL_SIZE_REQD]{<surf_defect_type_reqd_def>}{SURF_DEFECT_TYPE SURF_INSP_SENSITIVITY_REQD

{BIN_SIZE SEVERITY_CRITERION_REQD } }[SURF_INSP_SETUP_FILE_NAME_REQD]

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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<surf_defect_type_reqd_def> = SURF_DEFECT_TYPE SURF_INSP_SENSITIVITY_REQD {<bin_size_reqd_def>}<surface_insp_used> = SURF_INSP_EQUIP_USED [EQUIP_SITE_USED]

[SURF_INSP_MODE_USED] [SURF_INSP_PIXEL_SIZE_USED]{<surf_defect_type_used_def>}{SURF_DEFECT_TYPE SURF_INSP_SENSITIVITY_USED

{ BIN_SIZE SEVERITY_CRITERION_USED } }[SURF_INSP_SETUP_FILE_NAME_USED ]

<surf_defect_type_used_def> = SURF_DEFECT_TYPE SURF_INSP_SENSITIVITY_USED {<bin_size_used_def>}<contamination_measurements> = CONTAMINANT CONTAMINATION_LEVEL [CONTAMINATION_METHOD]

MEASURED_CONTAMINATION_LEVEL[MEASURED_CONTAMINATION_METHOD]

end_bnf maskResults

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8 Terminology and Usage8.1 Syntax for Keywords

8.1.1 Keyword names will always be followed by the data type (enclosed in parentheses) of their data_field. Data types will consist of numeric, integer, text, Boolean and date (which may include time as well) (e.g., “(text)”).

8.1.2 When the data_field allows a multi-value data field (see § 7.3), the data type will be followed by the sequenced list of those parameters enclosed in parentheses and separated by commas (e.g., “(x,y)” which indicates the acceptable data value must be an ordered pair of dimensions, coordinates, repeat counts, file names, or other parameters, “(x,y,z)” indicates an ordered triple, or “(x1,y1,x2,y2)” which indicates a window with two ordered pairs, (x1,y1) and (x2,y2), describing the lower left and upper right corners respectively).

8.1.3 When specific alternative data values for the keyword are enumerated, they will be surrounded by square brackets (“[ ]”) and separated by the “pipe” operator (“|”) (e.g., “[ A | B | C | D | E ]”) . These values must be transmitted exactly as shown with the same spelling and case. Boolean data fields imply data values [ T | F]. Data fields without specified alternative values may have any appropriate data value.

8.1.4 If, in addition to the specifically listed alternative data values for the keyword, additional values chosen by the user are allowed, the list will be followed by an ellipsis (e.g., “[A | B | C | D | E | … ]”). Such additional values should be submitted to the SEMI P10 Task Force so they may be considered for inclusion in future revisions to the standard. They should also be discussed with the mask supplier before implementation.

8.2 start_dictionary — Delimiter denoting start of dictionary for automatic translation to XML format.

8.3 ADDITIONAL_DEFECT_MEASUREMENTS_INFO — (text) Additional information supplied by the vendor regarding the associated defect measurements.

8.4 ADDITIONAL_MASK_INFO — (text) Any information necessary to specify the overall mask set which cannot be specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.

8.5 ADDITIONAL_MASK_SET_INFO — (text) Any information necessary to specify the overall mask set which cannot be specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.

8.6 ADDITIONAL_MILESTONE_INFO — (text) Additional information supplied by the vendor regarding the status of the mask.

8.7 ADDITIONAL_PATTERN_INFO — (text) Any information necessary to specify the pattern(s) which cannot be specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.

8.8 ADDITIONAL_RESULTS_INFO — (text) Any information necessary to supply information to the customer which cannot be specified elsewhere in the <mask_results> structure; must be brought to the attention of customer personnel.

8.9 ADDITIONAL_SUBSTRATE_INFO — (text) Additional information supplied by the vendor regarding the substrate used.

8.10 AIM_CD_DELTA — (numeric) For aerial imaging metrology, the percentage CD width variation between comparable non-defective features. Used for CD defect measurement across or between features. If this keyword appears as a <mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERTURE, WAFER_EXPOSURE_SIGMA, and WAFER_EXPOSURE_ILLUMINATION must all also appear under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask maker, based on their negotiated agreements with the customer.

8.11 AIM_FLUX_INTENSITY_DELTA — (numeric) For aerial imaging metrology, the percentage dimensional area variation between comparable non-defective areas. Used for contact and via defect measurement. If this appears as a <mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERTURE, WAFER_EXPOSURE_SIGMA, and WAFER_EXPOSURE_ILLUMINATION must also appear under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask maker, based on their negotiated agreements with the customer.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.12 AIM_INTENSITY_VARIATION_DELTA — (numeric) For aerial imaging metrology, the percentage intensity variation between comparable non-defective areas. Used for edge or isolated defect measurement. If this keyword appears as a <mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERTURE, WAFER_EXPOSURE_SIGMA, and WAFER_EXPOSURE_ILLUMINATION must all also appear under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask maker, based on their negotiated agreements with the customer.

8.13 AIM_WAVELENGTH — (numeric) Wavelength in nanometers to be used for <aerial_image_data> measurements. AIM_WAVELENGTH would usually match WAFER_EXPOSURE_WAVELEGHTH, but is provided as a separate parameter in the case that aerial image measurement needs to be done at a different wavelength. This keyword may also appear in addition to PSM_WAVELENGTH for a single MASK_ID, though the values of the two should usually be the same.

8.14 ALL_PATTERNS_APPROVAL_REQD — (Boolean) All patterns must be approved before the mask(s) may be written.

8.15 ALL_PATTERNS_APPROVED — (date) Date of approval of all patterns was granted by customer.

8.16 APPROVAL_REQD — (text) If present, indicates that no mask(s) are to be written until the approval is explicitly granted by the customer. The data field describes the items to be approved.

8.17 APPROVAL_GRANTED — (date) date approval was granted by customer for APPROVAL_REQD.

8.18 ARRAY_CENTER — (numeric) (x,y) Center of circular array limit, relative to the nominal center of the mask (chrome side up).

8.19 ARRAY_DIAMETER — (numeric) Diameter of circular array limit to be applied to pattern files.

8.20 ARRAY_DIAMETER_INCLUSIVE — (Boolean) If T, then die which are at least partially included within the circular array limit must be included in the array. If F, then only die which are wholly included within the circular array limit may be included in the array.

8.21 ATTENUATOR — (text) [MoSi | TiNSiN | ZrSi | OMOG | … ] Attenuator Mask_Coating used for Embedded Attenuated Phase Shift Masks, or any other material agreed upon between customer/vendor. May be used in conjunction with other Mask_Coatings.

8.22 AUTO_INSPECTION_REQD — (Boolean) Automated inspection of the mask for defects is required.

8.23 BARCODE_LOCATION — (numeric) (x,y) Location to place the center of the vendor-generated barcode, relative to the nominal center of the mask (chrome side up).

8.24 BARCODE_ROTATION — (integer) [0 | 90 | 180 | 270] Degrees the barcode is to be rotated counterclockwise (before mirroring).

8.25 BARCODE_TEXT — (text) Encoded content to be used by the vendor to build the barcode.

8.26 BARCODE_TEXT_REFERENCE_ONLY — (Boolean) If T, indicates that BARCODE_TEXT is not to be used by the mask supplier to construct a barcode. When barcodes are supplied by the customer as pattern files, this gives the customer a way to identify the textual content of a barcode pattern, and the mask supplier the same information to supply in <mask_results>.

8.27 BARCODE_TYPE — (text) [ASM | ASET | CANON | GCA | NIKON_STD | NIKON_CODE39 | UT1X_10 | UT1X_24 | UT_XLS | … ] Encoding system to be used by the vendor to build the required barcode.

8.28 BILLING_ADDRESS — (text) Address for billing.

8.29 BILLING_CONTACT — (text) Name of person to contact for billing purposes.

8.30 BILLING_EMAIL — (text) Internet address for BILLING_CONTACT.

8.31 BILLING_FAX — (text) Phone number for facsimile machine of BUSINESS_CONTACT.

8.32 BILLING_PHONE — (text) Phone number for BILLING_CONTACT.

8.33 BIN_SIZE — (numeric) size of defect for SEVERITY_CRITERION_REQD sorting.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.34 BLANK_BIREFRINGENCE_REQD — (numeric) The required degree to which the substrate used to make the mask refracts an incident beam of unpolarized light into two separate beams of opposite polarization, expressed as nanometers per centimeter (nm/cm).

8.35 BLANK_BIREFRINGENCE_USED — (numeric) The measured degree to which the substrate used to make the mask refracts an incident beam of unpolarized light into two separate beams of opposite polarization, expressed as nanometers per centimeter (nm/cm).

8.36 BLANK_DATE_OF_MFG — (date) The date of manufacture of the substrate used to make the mask as supplied by the mask blank vendor.

8.37 BLANK_FLATNESS — (numeric) [0.25 | 0.5 | 1 | 2 | 5 | 10 | 15 | 20 | … ] Flatness within quality area (see SEMI P1).

8.38 BLANK_FLATNESS_USED — (numeric) The flatness within the quality area of the mask blank used, as specified by the mask blank supplier or as measured by the mask vendor.

8.39 BLANK_GRADE — (text) A designation of the relative defectivity of the substrate as specified by the mask blank vendor.

8.40 BLANK_INDEX_OF_REFRACTION — (numeric) The ratio of the velocity of light of a given wavelength in a vacuum to the velocity of light in the substrate used to make the mask.

8.41 BLANK_LENGTH — (numeric) The x-axis dimension of the substrate used to make the mask, as specified by the mask blank vendor.

8.42 BLANK_LOT — (text) The mask blank vendor’s manufacture lot identification for the substrate used to make the mask.

8.43 BLANK_LOT_REQD — (text) The mask blank vendor’s manufacturing lot identification for the substrate required to be used to make the mask.

8.44 BLANK_SIZE — (text) [2.5/60 | 3/60 | 3.5/60 | 4/60 | 4/90 | 4/250 | 5/60 | 5/90 | 5/250 | 6/90 | 6/120 | 6/150 | 6/250 | 7/120 | 7/150 | 7/250 | 7.25R/150 | 9/120 | 9/350 | 14/120 | 14/190 | 29/1570 | ... ] Nominal edge length (in inches) and thickness (in mils) of square substrate; 7.25R/150 is a round substrate (see SEMI P1) . BLANK_SIZE in <mask_results> simply mimics the value in the <mask_order>; it does not report the substrate material actually used or delivered.

8.45 BLANK_THICKNESS — (numeric) The z-axis dimension of the substrate used to make the mask, as specified by the mask blank vendor.

8.46 BLANK_TYPE — (text) [DFS | MFS | HTE | LTE | ULTE | SFS | DSFS | WC | SL | EUV | POLY | NIL_CUT | E-FORM/ETCHED | SS-MESH ] Durable Fused Silica, Modified Fused Slica, high-, low-, and ultralow thermal expansion glass (see SEMI P1). SFS is synthetic fused silica and is commonly referred to as “quartz ,” having ultralow thermal expansion. DSFS is durable synthetic fused silica, is suitable for 193 nm exposure, and also has ultralow thermal expansion. ULTE is retained only for backward compatibility and vendors should interpret it to be SFS. WC and SL indicate White Crown and soda lime glass. EUV is for Extreme Ultraviolet applications. POLY, NIL_CUT, E-FORM/ETCHED and SS-MESH are for stencil and screen masks.

8.47 BLANK_VENDOR — (text) Standard vendor identification code for the mask blank vendor of the substrate used to make the mask.

8.48 BLANK_WIDTH — (numeric) The y-axis dimension of the substrate used to make the mask, as specified by the mask blank vendor.

8.49 BLANKET_PO_NUMBER — (text) Blanket purchase order number.

8.50 BOOLEAN — (text) [NONE | OR | AND | NOT | XOR | MINUS | REVERSE] Logical operation to be performed on one or more following pattern files. Data value meanings are:

8.50.1 NONE — no logical operation to be performed; sizing/scaling may still be performed,

8.50.2 OR — logical union of two files,

8.50.3 AND — logical intersection of two files,

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.50.4 NOT — logical inverse of one file,

8.50.5 XOR — logical union of two files, excluding all areas in which the two intersect, and

8.50.6 MINUS — logical difference between input file 1 and input file 2 (i.e., logically removing from input file 1 the portions of all digitized geometry which overlap with digitized geometry in input file 2).

8.50.7 REVERSE — reverse the tone of the output layer to produce a negative image of the layer. REVERSE is performed after all sizing and scaling have been completed for the current data manipulation step.

8.51 BOTTOM_PELLICLE_CENTRALITY_ERROR — (numeric) (x,y,rotation) Maximum misplacement in micrometers and microradians of pellicle mounting, relative to the nominal center of the mask. The nominal center is determined using the bottom and left edges (chrome side up).

8.52 BOTTOM_PELLICLE_TYPE — (text) Brand and model of acceptable pellicle for the glass side of the mask. If multiple pellicles are listed, they are listed with the most preferred first and then in declining preference.

8.53 BOTTOM_PELLICLE_USED — (text) The pellicle vendor’s part number of the pellicle applied to the nonpatterned surface of the mask.

8.54 BUSINESS_ADDRESS — (text) Address of person placing the order.

8.55 BUSINESS_CONTACT — (text) Name of person placing the order.

8.56 BUSINESS_EMAIL — (text) Internet address for BUSINESS_CONTACT.

8.57 BUSINESS_FAX — (text) Phone number for facsimile machine of BUSINESS_CONTACT.

8.58 BUSINESS_PHONE — (text) Phone number for BUSINESS_CONTACT.

8.59 BUTTING_ERROR — (numeric) Maximum misalignment of features due to stitching of adjacent fields in the segmented writing of a mask.

8.60 BUTTING_ERROR_METHOD — (text) Description of the method to be used to measure butting error.

8.61 CD_CLEAR_DARK_TOLERANCE — (numeric) ( P [ , M ] ) Maximum acceptable difference between the mean-to-target of all measured critical dimensions in CD_CLEAR_SET and the mean-to-target of all measured critical dimensions in CD_DARK_SET. As these CDs are of opposite tone, the difference is computed by adding the mean-to-target of all CD measurements of the CD_DARK_SET to the mean-to-target of all CD measurements of the CD_CLEAR_SET. If only one data value (P) appears in the data field, the tolerance is considered symmetrical (+/−) about zero. If two data values ( P [ , M ] ) appear, then the first is the maximum positive value and the second is the maximum negative value (and should be entered as a negative number). The comma and second half of the argument are optional in the syntax ( P [ , M ] ) where P = the positive and M = the negative value for non-symmetric tolerances; if only P is specified, the positive and negative tolerances are assumed to be symmetric.

8.62 CD_CLEAR_DARK_REFERENCE_ONLY — (Boolean) If T, indicates that the CD_CLEAR_DARK_TOLERANCE is to be measured and the data transmitted to the customer (if requested by SHIP_CD_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection. (This does not exempt mishandling of the data in pattern preparation from being a cause for mask rejection.)

8.63 CD_CLEAR_SET — (text) Identifies a <cd_set> or <cd_group> for critical dimension analysis. Data field must match data field of START_CD in the <cd_group> or START_CD_SET in the <cd_set>. The CD_TONE_CLEAR of all groups referenced must be explicitly “T.”

8.64 CD_CORRELATION_ID — (text) Date or other identification of the vendor/customer correlation test to be used in measuring CDs. (This is one method of satisfying the “measured feature width … correlation” described in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_STD.)

8.65 CD_DARK_SET — (text) Identifies a <cd_set> or <cd_group> for critical dimension analysis. Data field must match data field of START_CD in the <cd_group> or START_CD_SET in the <cd_set>. The CD_TONE_CLEAR of all groups referenced must be explicitly “F.”

8.66 CD_DATA — (numeric) Size of critical dimension feature in data as supplied in the pattern file.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.67 CD_DEVIATION_FROM_MEAN — (numeric) ( P [ , M ] ) Maximum acceptable deviation of any of the customer-required CD measurements from the mean of those measurements. If only one data value (P) appears in the data field, the tolerance is considered +/− symmetrically about CD_TARGET. If two data values ( P [ , M ] ) appear, then the first is the maximum amount by which deviation is allowed larger than CD_MEAN, and the second is the maximum amount by which deviation is allowed smaller than CD_MEAN. The comma and second half of the argument are optional in the syntax ( P [ , M ] ) where P = the positive and M = the negative value for non-symmetric tolerances; if only P is specified, the positive and negative tolerances are assumed to be symmetric. If M is entered, it should appear as a negative number (see Related Information 1 at the end of this standard).

8.68 CD_DEVIATION_FROM_TARGET — (numeric) ( P [ , M ] ) Maximum acceptable deviation of any of the customer-required CD measurements from the CD_TARGET. If only one data value (P) appears in the data field, the tolerance is considered +/− symmetrically about CD_TARGET. If two data values ( P [ , M ] ) appear, then the first is the maximum amount by which deviation is allowed larger than CD_TARGET, and the second is the maximum amount by which deviation is allowed smaller than CD_TARGET. The comma and second half of the argument are optional in the syntax ( P [ , M ] ) where P = the positive and M = the negative value for non-symmetric tolerances; if only P is specified, the positive and negative tolerances are assumed to be symmetric. If M is entered, it should appear as a negative number (see Related Information 1 at the end of this standard) . (This corresponds to “maximum feature width deviation from target” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY. When used in combination with START_CD_SET comprised of multiple START_CD groups with differing CD_TARGET, this can also satisfy the “feature linearity error” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY. Furthermore, when used in combination with START_CD_SET comprised of multiple START_CD groups with differing CD_TARGET, CD_FEATURE, CD_ORIENTATION and/or CD_PITCH, this can also satisfy the “feature linearity error” and/or “feature inter-proximity error” in SEMI P43.)

8.69 CD_DIGITIZED — (Boolean) If T, critical dimension in pattern is digitized data. If F, critical dimension in pattern is non-digitized data.

8.70 CD_DRAWING — (text) The uniquely identified (for each customer) document which shows the CD structure itself, and may show the place within the CD structure to be measured.

8.71 CD_EQUIP_REQD — (text) Identification of acceptable equipment for measuring critical dimensions. (This is one method of satisfying the “measured feature width … measurement tool” described in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_EQUIP_USED.)

8.72 CD_EQUIP_USED — (text) Identification of equipment used for measuring critical dimensions. (This is one method of satisfying the “measured feature width … measurement tool” described in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_EQUIP_REQD.)

8.73 CD_FEATURE — (text) Description of the feature to be used for CD measurement. (This corresponds to “type of feature” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.74 CD_GROUP_NAME — (text) Identifies a <cd_group> to be included in the <cd_set>. The data field must match the data field of START_CD in the referenced <cd_group>.

8.75 CD_HORIZONTAL_ID — (text) CD_SITE_ID of CD_HORIZONTAL_LOCATION.

8.76 CD_HORIZONTAL_LOCATION — (numeric) (x,y) Location of critical dimension feature. The CD_ORIENTATION of the feature must be HORIZONTAL. If CD_HORIZONTAL_LOCATION appears in <mask_options>, then the (x,y) coordinates are relative to the nominal center of the mask (chrome side up). If CD_HORIZONTAL_LOCATION appears in <pattern_options>, then the (x,y) coordinates are relative to the center of the pattern or cell, before mirroring or scaling. If CD_HORIZONTAL_LOCATION appears in <mask_results>, then the (x,y) coordinates are relative to the nominal center of the mask (chrome side up), even if the original CD_HORIZONTAL_LOCATION was in <pattern_options>.

8.77 CD_HORIZONTAL_MORPHOGRAPHY — (text) CD_MORPHOGRAPHY of the individual CD_HORIZONTAL_ID feature.

8.78 CD_HORIZONTAL_TONE_CLEAR — (Boolean) CD_TONE_CLEAR of the individual CD_HORIZONTAL_ID feature. If T, the critical dimension feature on mask is clear. If F, the critical dimension feature on mask is opaque.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.79 CD_LOCATION — (numeric) (x,y) Location of critical dimension feature. If CD_LOCATION appears in <mask_options>, then the (x,y) coordinates are relative to the nominal center of the mask (chrome side up). If CD_LOCATION appears in <pattern_options>, then the (x,y) coordinates are relative to the center of the pattern or cell, before mirroring or scaling. If CD_LOCATION appears in <mask_results>, then the (x,y) coordinates are relative to the nominal center of the mask (chrome side up), even if the original CD_LOCATION was in <pattern_options>. (This is one method of satisfying the “spatial distribution” of SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_LOCATION_DRAWING.)

8.80 CD_LOCATION_DRAWING — (text) The uniquely identified (for each customer) document which shows the location of the CD structure. (This is one method of satisfying the “spatial distribution” of SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_LOCATION.)

8.81 CD_MATRIX_FILE_NAME — (text) Name of file to be used for critical dimension measurement locations. It is not to be used in conjunction with CD_LOCATION within the same START_CD to END_CD set.

8.82 CD_MATRIX_FILE_FORMAT — (text) [MF2 | MF3 | KMS | ... ]

8.83 CD_MEASUREMENT_DATE — (date) Date CD measurement was made.

8.84 CD_MORPHOGRAPHY — (text) [DENSE | ISOLATED | ... ] Feature density surrounding CD location. (This corresponds to “description of the surrounding area” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.85 CD_ORIENTATION — (text) [VERTICAL | HORIZONTAL] Direction in which the CD feature is to be scanned for measurement. In other words, a HORIZONTAL CD is scanned in the x direction (left to right), and a VERTICAL CD is scanned in the y direction (top to bottom). (Note that this is the opposite of “orientation of feature” as used in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, wherein orientation is determined by the feature’s length, rather than by the direction in which it is scanned.)

8.86 CD_PERCENT_CLEAR — (numeric) Calculated percentage of clear area within CD_PERCENT_CLEAR_WINDOW in the mask data.

8.87 CD_PERCENT_CLEAR_WINDOW — (numeric) (x1,y1,x2,y2) window coordinates over which CD_PERCENT_CLEAR is calculated, relative to the nominal center of the mask.

8.88 CD_PITCH — (numeric) Local spacing of the critical dimension from the center of the geometry to the center of adjacent geometries. This will be designated by the customer as required and reported in <mask_results> for analysis by the customer. (This corresponds to “pitch of feature” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY. When used in combination with START_CD_SET comprised of multiple START_CD groups with differing CD_PITCH, this can also satisfy the “interval of pitches” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.89 CD_QUALITY_ID — (text) Customer’s label for a collection of CD quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. This may not be used in combination with QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.90 CD_RANGE — (numeric) Maximum acceptable variation of all measured critical dimensions of same nominal size, same tone and same orientation, relative to each other (see Related Information 1 at the end of this standard). (This is one method of satisfying the “feature width uniformity…critereon” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.91 CD_REFERENCE_ONLY — (Boolean) If T, indicates that the CD location, <cd_group> or <cd_set> is to be measured and the data transmitted to the customer (if requested by SHIP_CD_DATA_), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection. (This does not exempt mishandling of the data in pattern preparation from being a cause for mask rejection.)

8.92 CD_SAME_TONE_SET — (text) Identifies a <cd_set> or <cd_group> for critical dimension analysis. Data field must match data field of START_CD in the <cd_group> or START_CD_SET in the <cd_set>. The CD_TONE_CLEAR of all groups referenced must all be explicitly “T” or must all be explicitly “F.”

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.93 CD_SAME_TONE_TOLERANCE — (numeric) ( P [ , M ] ) Maximum acceptable difference between the mean of all measured critical dimensions in the first CD_SAME_TONE_SET following START_CD_SAME_TONE and the second CD_SAME_TONE_SET following START_CD_SAME_TONE. As these CDs are of the same tone, the difference is computed by subtracting the mean of all the CD measurements of the second CD_SAME_TONE_SET from the mean of all the CD measurements of the first CD_SAME_TONE_SET. If only one data value (P) appears in the data field, the tolerance is considered symmetrical (+/−) about zero. If two data values ( P [ , M ] ) appear, then the first is the maximum positive value and the second is the maximum negative value (and should be entered as a negative number). The comma and second half of the argument are optional in the syntax ( P [ , M ] ) where P = the positive and M = the negative value for non-symmetric tolerances; if only P is specified, the positive and negative tolerances are assumed to be symmetric.

8.94 CD_SAME_TONE_REFERENCE_ONLY — (Boolean) If T, indicates that the CD_SAME_TONE_TOLERANCE is to be measured and the data transmitted to the customer (if requested by SHIP_CD_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection. (This does not exempt mishandling of the data in pattern preparation from being a cause for mask rejection.)

8.95 CD_SITE_ID — (text) Unique identifier of each critical dimension location within MASK_SET_ID to identify individual cd locations when using <mask_results>. If the same coordinates apply to locations on different masks within the mask set, they may have the same CD_SITE_ID, but it is not mandatory. If CD_SITE_ID is used with a CD_LOCATION within a <pattern_options>, it will be associated with as many mask locations as the cell has instances. (See MEASURED_CD_SITE_ID for more information.)

8.96 CD_STD — (text) [NBS | NIST | ROGER_SHERMAN | CUSTOMER | MASKSHOP | VLSI_STD | ... ] reference standard to be used to correlate critical dimension measurements. (This is one method of satisfying the “measured feature width…correlation” described in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY, the other being CD_CORRELATION_ID.)

8.97 CD_TARGET — (numeric) Desired final size of critical dimension feature on mask (see Related Information 1 at the end of this standard). (This corresponds to “targeted feature width” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.98 CD_THREE_SIGMA — (numeric) Maximum acceptable 3-sigma deviation of all measured critical dimensions to the mean of all measured critical dimensions (see Related Information 1 at the end of this standard). (This is one method of satisfying the “feature width uniformity…critereon” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.99 CD_TOLERANCE — (numeric) ( P [ , M ] ) Maximum acceptable deviation of the mean of all measured critical dimensions to the CD_TARGET (see Related Information 1 at the end of this standard) . If the mean CD is larger than the target, then the value will be positive; if the mean CD is smaller than the target, then the value will be negative. If only one data value (P) appears in the data field, the tolerance is considered +/− symmetrically about CD_TARGET. If two data values ( P [ , M ] ) appear, then the first is the maximum amount by which mean is allowed larger than CD_TARGET, and the second is the maximum amount by which mean is allowed smaller than CD_TARGET. The comma and second half of the argument are optional in the syntax ( P [ , M ] ) where P = the positive and M = the negative value for non-symmetric tolerances; if only P is specified, the positive and negative tolerances are assumed to be symmetric. If M is entered, it should appear as a negative number (see Related Information 1 at the end of this standard). (This corresponds to “feature mean-to-target” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.100 CD_TONE_CLEAR — (Boolean) If T, the critical dimension feature on mask is clear. (This corresponds to “tone of feature” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.101 CD_VERTICAL_ID — (text) CD_SITE_ID of CD_VERTICAL_ID.

8.102 CD_VERTICAL_LOCATION — (numeric) (x,y) Location of critical dimension feature. The CD_ORIENTATION of the feature must be VERTICAL. If CD_VERTICAL_LOCATION appears in <mask_options>, then the (x,y) coordinates are relative to the nominal center of the mask (chrome side up). If CD_VERTICAL_LOCATION appears in <pattern_options>, then the (x,y) coordinates are relative to the center of the pattern or cell, before mirroring or scaling. If CD_VERTICAL_LOCATION appears in <mask_results>, then

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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the (x,y) coordinates are relative to the nominal center of the mask (chrome side up), even if the original CD_VERTICAL_LOCATION was in <pattern_options>.

8.103 CD_VERTICAL_MORPHOGRAPHY — (text) CD_MORPHOGRAPHY of the individual CD_VERTICAL_ID feature.

8.104 CD_VERTICAL_TONE_CLEAR — (Boolean) CD_TONE_CLEAR of the individual CD_VERTICAL_ID feature. If T, critical dimension feature on mask is clear.

8.105 CD_X_GROUP — (text) Identifies a <cd_group> for use in comparing horizontally scanned critical dimensions to a vertically scanned critical dimensions. Data field must match data field of a START_CD in a <cd_group>. The <cd_group> must contain CD_ORIENTATION with data value HORIZONTAL.

8.106 CD_Y_GROUP — (text) Identifies a <cd_group> for use in comparing horizontally scanned critical dimensions to a vertically scanned critical dimensions. Data field must match data field of a START_CD in a <cd_group>. The <cd_group> must contain CD_ORIENTATION with data value VERTICAL.

8.107 CD_XY_DEVIATION — (numeric) Maximum deviation, on a site-by-site basis, of a horizontally scanned critical dimension to a vertically scanned critical dimension within a <cd_xy_definition>. The two critical dimensions at each <cd_xy_site> site must be the same size in the pattern data and the same tone on the mask (see Related Information 1 at the end of this standard). (This corresponds to “X-Y deviation uniformity” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.108 CD_XY_REFERENCE_ONLY — (Boolean) If T, indicates that the <cd_xy_definition> is to be measured and the data transmitted to the customer (if requested by SHIP_CD_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection. (This does not exempt mishandling of the data in pattern preparation from being a cause for mask rejection.)

8.109 CD_XY_TOLERANCE — (numeric) Maximum acceptable deviation of the mean of all measured horizontally scanned critical dimensions to the mean of all measured vertically scanned critical dimensions within a {<cd_xy_site>} and/or between the sites in {CD_X_GROUP} and the sites in {CD_Y_GROUP}. Critical dimensions at all sites must be the same size in the pattern data and the same tone on the mask (see Related Information 1 at the end of this standard). (This corresponds to “mean X-Y deviation” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.110 CELL_ID — (text) Name of the cell which follows; must be used in all references within this MASK_SET_ID to this cell definition.

8.111 CELL_INSTANCE — (text) Identifies CELL_ID to be placed by the following location information.

8.112 CELL_REGISTR_MARK — (numeric) (x,y) Location of registration reference mark in <mask_order> data, relative to center of the cell (before mirroring or scaling). When CELL_REGISTR_MARK precedes REGISTR_MARK_SEPARATION, it indicates the origin of the registration mark array being defined.

8.113 CENTRALITY — (numeric) (x,y,rotation) Maximum misplacement in millimeters and, optionally, microradians of all patterns as a group, relative to the nominal center of the mask.

8.114 CHECKSUM — (integer) For <mask_order>, an ASCII 16 bit crc checksum encompassing all records from START_ORDER through END_ORDER, inclusive. For <mask_results>, an ASCII 16 bit crc checksum encompassing all records from START_MASK_RESULTS through END_MASK_RESULTS, inclusive. The checksum is strongly recommended for the BNF version of both <mask_order> and <mask_results> files to discourage manual editing of the data. Computing a checksum for an XML file becomes ambiguous so CHECKSUM should be excluded from XML versions of both <mask_order> and <mask_results> files (see COMPUTING THE CHECKSUM, § 9).

8.115 CHIP_EXPORT_NUMBER — (text) (agency,number) Identifies the applicable export control entity (agency) and the export control number (number, which can be any printable/displayable text) to allow for export control of chips built using the associated pattern or pattern group.

8.116 CLEAR_INTERNAL_WINDOW — (numeric) (x1,y1,x2,y2) Area to have all digitized data removed within the window described by (x1,y1,x2,y2), relative to the coordinate space of DATA_SOURCE_FILE. The extents of the output pattern file will be the same as DATA_SOURCE_FILE.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.117 COATING_DATE_TIME — (date) The date and time that the coating was applied by the mask vendor.

8.118 COATING_EQUIP_USED — (text) The model identification of the equipment used by the mask vendor to apply the coating.

8.119 COATING_COMPOSITION — (text) The name used to identify the composition of the coating, for example IP3500, MoSi, AR3, etc., as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.120 COATING_GRADE — (text) Supplier grade of MASK_COATING applied to the substrate to build the photomask. Text to be agreed by customer/vendor to suit the specific requirement.

8.121 COATING_LOT_NUMBER — (text) The lot number supplied by the mask blank vendor for a particular coating such as the photoresist. Also known as “Resist Lot” or “Bake Lot.”

8.122 COATING_MASK_VENDOR_APPLIED — (Boolean) If T, the coating was applied by the mask vendor.

8.123 COATING_OPTICAL_DENSITY — (numeric) The optical density of the given coating as measured by the mask blank vendor if MASK_VENDOR_APPLIED = F, or as measured by the mask vendor if MASK_VENDOR_APPLIED = T. This should meet the specification of MINIMUM_COATING_OPTICAL_DENSITY if it was supplied in <mask_order>.

8.124 COATING_PHASE — (numeric) The angle in degrees that light is shifted by the given coating as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.125 COATING_REFLECTANCE — (numeric) For a given coating, the ratio of the reflected flux to the incident flux expressed as a percent, as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.126 COATING_THICKNESS — (numeric) The thickness of the coating in Angstroms as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.127 COATING_TRANSMITTANCE — (numeric) The ratio of the radiant power transmitted by the coating to the incident radiant power expressed as a percent, as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.128 COATING_TYPE — (text) [CHROME | RESIST | ATTENUATOR] The name used to identify the category of coating being described.

8.129 COATING_WAVELENGTH — (numeric) The wavelength of light in nanometers with which the given coating is intended to be used as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or mask vendor if MASK_VENDOR_APPLIED = T.

8.130 COMPACT_LABEL — (text) Identification of customer-supplied label to use on shipping compact.

8.131 CONTAMINANT — (text) [NH4+ | SO4- | Cl- | PO4- | K+ | Na+ | Ca2+ | NO3- | ORGANIC | … ] The contaminant of concern on the mask.

8.132 CONTAMINATION_LEVEL — (numeric) The maximum allowed concentration in ppm of CONTAMINANT on the mask.

8.133 CONTAMINATION_METHOD — (text) The method to be used in measuring CONTAMINANT on the mask.

8.134 CUSTOMER — (text) The name of the company placing the order.

8.135 CUSTOMER_MASK_SET_NAME — (text) An alternative to MASK_SET_NAME for use by the customer. Whereas MASK_SET_NAME may be the official or traceable name for a mask set, CUSTOMER_MASK_SET_NAME may be an informal or project-related name for the set.

8.136 CUSTOMER_LAYER_NAME — (text) Customer name of mask layer by design or technology (e.g., poly, contact, etc.). This layer name may correspond to a particular MASK_NAME or MASK_ID, but, since it reflects the wafer fab process or the design technology rather than the specific design, it does not usually change to accommodate mask revisions within a mask set.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.137 CUSTOMER_SPEC — (text) Customer’s designation for a specific mask manufacturing specification. CUSTOMER_SPEC may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords.

8.138 CUSTOMER_SPEC_REVISION — (text) Customer designation of the revision of CUSTOMER_SPEC to be used. This must be explicit and may not default to “latest” or “last used.” “None” is acceptable if no revision identification applies to the specification. Both CUSTOMER_SPEC and CUSTOMER_SPEC_REVISION are required if either appears at any level in the hierarchy.

8.139 DARK_INTERNAL_WINDOW — (numeric) (x1,y1,x2,y2) Area to completely digitize within the window described by (x1,y1,x2,y2), relative to the coordinate space of DATA_SOURCE_FILE. The extents of the output pattern file will be the same as the DATA_SOURCE_FILE.

8.140 DATA_CHECKSUM — (integer) To be used to verify integrity of transmitted data.

8.141 DATA_CHECKSUM_TYPE — (text) Algorithm used to generate DATA_CHECKSUM.

8.142 DATA_COMPRESSION — (text) [ZIP | ZOO | GZIP | Z | NONE | BINHEX] Compression algorithm used for transmitted data.

8.143 DATA_CONSOLIDATION — (text) [BACKUP | TAR | GNUTAR | ZIP | NONE] Consolidation method used for transmitted data.

8.144 DATA_DENSITY — (text) [800BPI | 1600BPI | 6250BPI | HIGH | LOW] 800BPI, 1600BPI or 6250BPI are for 9_TRACK_TAPE DATA_MEDIUM; HIGH or LOW are for 4MM_DAT or 8MM_DAT DATA_MEDIUM) Magnetic tape density.

8.145 DATA_ENCRYPTION — (text) [PGP | NETWIZARD | USER | HARDWARE | NONE] Encryption algorithm used for transmitted data.

8.146 DATA_FILE_NAME — (text) Name of a pattern file to be received in DATA MEDIUM. This keyword is required if the file received requires processing to create DATA_PATTERN_NAME for reference by PATTERN_NAME in <pattern_group>. If no processing is required, then this keyword is optional as it would be redundant. Note that this file might be contained within a file that has been compressed, consolidated and/or encrypted. (See TRANSFER_FILE_NAME.)

8.147 DATA_FILE_NUMBER — (integer) For GDS-II, OASIS, OASIS_MASK, Mann or Electromask data, this is the file number on the physical medium.

8.148 DATA_FILE_SIZE — (integer) Size of the file in bytes.8.149 DATA_FORMAT — (text) [MEBES | RDOS | VAX | GDS-II | OASIS | OASIS_MASK | CIF | DXF | APPLICON | MANN_3000 | MANN_3600 | ELECTROMASK | DOS | UNIX | APPLE | TAR | ... ] MEBES = ETEC format, RDOS = RDOS dump, VAX = VAX backup, GDS-II = GDS-II stream, OASIS = Specification for Open Artwork System Interchange Standard, CIF = Cal Tech Intermediate Format, DXF = Autocad output. Physical medium format.

8.150 DATA_FUNCTION_PURPOSE — (text) [OPC | PSM | OPC/PSM | DRC | MRC | LVS | LOGICAL | FRACTURE | OTHER | ... ] Description of software function to be performed.

8.151 DATA_ID — (text) The required identifying “name” for a physical volume of data. The name must match the label visible on the outside of the volume and must be unique among all physical volume names sent by a customer to a vendor.

8.152 DATA_JOB_NAME — (text) Name of the mask writing control file to be expected in DATA MEDIUM.

8.153 DATA_LAYER_ID — (text) Within DATA_TOP_CELL, a numeric pair of layer number and layer datatype separated by a semicolon and multiple sets of layers/datatypes are separated by a comma. If no datatype is specified for a layer number, then all data datatypes are assumed to be included for that layer. The syntax for the data field is (Layer1;Datatype1[,Layer2;Datatype2,…]).

8.154 DATA_LOCATION — (text) Site where the data file may be found.

8.155 DATA_MEDIUM — (text) [9_TRACK_TAPE | 4MM_DAT | 8MM_DAT | 1/4_INCH_CARTRIDGE | MODEM | FLOPPY | EMAIL | VPN | FTP | RCP | CDR | CDRW | HARDDRIVE | ZIPDRIVE | JAZZDRIVE |

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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FLOPPY100MB | DERIVED] Data transfer medium used for delivering pattern files, fracture files, job files and measure files. DERIVED indicates files which are the result of <data_manipulation> operations contained within the <mask_order>.

8.156 DATA_PATTERN_NAME — (text) The name of a pattern file, either received from the customer or generated by <data_manipulation>. If the pattern received from the customer is in a DATA_MEDIUM with a non-numbered file format (or is DERIVED), then DATA_FILE_NUMBER is not required. If the pattern received from the customer is a numbered file in a data volume, this is the pattern name to be applied to the file specified by the succeeding DATA_FILE_NUMBER. If the pattern is in a non-hierarchical format and requires no other derivation, then DATA_PATTERN_NAME is the name of the pattern file as received. If the file contains a hierarchical pattern (such as GDS-II or OASIS), <data_manipulation> will be required to extract/derive the specific DATA_PATTERN_NAME using DATA_TOP_CELL and/or DATA_LAYER_ID as required. DATA_PATTERN_NAME in <pattern_data> may be used name new patterns created with <data_manipulation> using previously received or derived patterns by referring to their DATA_PATTERN_NAME with DATA_SOURCE_FILE. DATA_PATTERN_NAME may identify a pattern to be written on the mask if referenced by PATTERN_NAME in <pattern_definitions>.

8.157 DATA_PATTERN_WINDOW — (numeric) (x1,y1,x2,y2) Establishes the extents of the pattern file in the coordinate space as received in DATA_SOURCE_FILE. (x1,y1) identifies the lower-left corner; (x2,y2) identifies the upper-right corner.

8.158 DATA_SCALE_FACTOR — (numeric) Factor to be used in magnifying or demagnifying both the geometries and the overall pattern file extents of the current data source.

8.159 DATA_SOURCE_FILE — (text) A file provided by the customer to be used in a Boolean fracturing operation, or file resulting from a <data_manipulation> operation. It must match a START_DATA_MANIPULATION, a DATA_PATTERN_NAME or a STD_PATTERN_NAME defined elsewhere in the <mask_order>.

8.160 DATA_TOP_CELL — (text) Top cell or structure of the design.

8.161 DATABASE_AREA — (numeric) (x1,y1,x2,y2) Unscaled, unmirrored coordinates of the window for database inspection, lower left and upper right corners, relative to the center and coordinate system of the pattern or cell or, if a <mask_option>, relative to the nominal center of the mask (chrome side up), after scaling and mirroring.

8.162 DATABASE_FILE_NAME — (text) Name of database file to use for database inspection.

8.163 DATABASE_INSPECTION — (Boolean) If T, database inspection is required.

8.164 DATABASE_JOB_LEVEL — (numeric) Mask level of customer-supplied job file to use for database inspection.

8.165 DATABASE_JOB_NAME — (text) Customer-supplied mask inspection control file to use for database inspection. Should be omitted if customer does not supply job file.

8.166 DATABASE_LAYER — (text) Within DATABASE_TOP_CELL, a numeric pair of layer number and layer datatype separated by a semicolon and multiple sets of layers/datatypes separated by a comma. If no datatype is specified for a layer number, then all data datatypes are assumed to be included for that layer. To be used if DATABASE_SOURCE is GDS-II, OASIS or OASIS_MASK. The syntax for the data field is (Layer1;Datatype1[,Layer2;Datatype2,…]).

8.167 DATABASE_SOURCE — (text) [MEBES | PG | GDS-II | OASIS | OASIS_MASK | KLARIS | UNDERIVED | ... ] Data source to be used when database inspection is required. KLARIS indicates that KLARIS data was supplied by the customer. UNDERIVED indicates the customer-supplied data prior to vendor-performed data manipulation is to be used to produce the inspection data. GDS-II or OASIS indicates that the GDS-II or OASIS data is being supplied for database inspection, in addition to the customer-supplied MEBES or PG data to be used to write the mask.

8.168 DATABASE_TOP_CELL — (text) Top cell to be used if DATABASE_SOURCE is GDS-II, OASIS or OASIS_MASK.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.169 DATABASE_UNIT — (numeric) Grid size to be used for fracturing DATABASE_SOURCE into inspection data, as required by some inspection systems.

8.170 DATABASE_WITH_JOB — (Boolean) If T, database inspection must use job file (DATABASE_JOB_NAME and DATABASE_JOB_LEVEL if supplied by customer) to consolidate pattern files.

8.171 DEFECT_COUNT — (integer) Maximum allowable number of defects within the INSPECTION_AREA.

8.172 DEFECT_COUNT_REP — (integer) Maximum number of repeating defects within the INSPECTION_AREA.

8.173 DEFECT_DENSITY — (numeric) Maximum allowable number of defects per square centimeter within the INSPECTION_AREA.

8.174 DEFECT_EQUIP_REQD — (text) Identification of acceptable equipment for defect inspection.

8.175 DEFECT_EQUIP_USED — (text) Defect inspection equipment used.

8.176 DEFECT_INSP_DATE — (date) Date defect inspection is performed.

8.177 DEFECT_INSP_MODE_REQD — (text) Operating mode for DEFECT_EQUIP_REQD.

8.178 DEFECT_INSP_MODE_USED — (text) DEFECT_EQUIP_USED operating mode.

8.179 DEFECT_INSP_PIXEL_SIZE_REQD — (text) Pixel size used by DEFECT_EQUIP_REQD. Note that if the value is not numeric, the applicability may be tool-specific.

8.180 DEFECT_INSP_PIXEL_SIZE_USED — (text) Pixel size used by DEFECT_EQUIP_USED.

8.181 DEFECT_INSP_SENSITIVITY_REQD — (text) Sensitivity to be used by DEFECT_EQUIP_REQD. (See Related Information 9 for suggested data field values.)

8.182 DEFECT_INSP_SENSITIVITY_USED — (text) Sensitivity used by DEFECT_EQUIP_USED. (See Related Information 9 for suggested data field values.)

8.183 DEFECT_QUALITY_ID — (text) Customer’s for a collection of defect quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. This may not be used in combination with QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.184 DEFECT_SETUP_FILE_NAME_REQD — (text) Name of setup file for DEFECT_EQUIP_REQD.

8.185 DEFECT_SETUP_FILE_NAME_USED — (text) Name of setup file for DEFECT_EQUIP_USED.

8.186 DEFECT_SIZE — (numeric) Maximum dimension of smallest unacceptable defect — all types.

8.187 DEFECT_SIZE_CL — (numeric) Maximum dimension of smallest unacceptable clear defect.

8.188 DEFECT_SIZE_CL_ADJ — (numeric) Maximum dimension of smallest unacceptable clear, non-repeating edge defect.

8.189 DEFECT_SIZE_CL_ADJ_REP — (numeric) Maximum dimension of smallest unacceptable clear, repeating edge defect.

8.190 DEFECT_SIZE_CL_ISO — (numeric) Maximum dimension of smallest unacceptable clear, repeating isolated defect.

8.191 DEFECT_SIZE_CL_ISO_REP — (numeric) Maximum dimension of smallest unacceptable clear, non-repeating isolated defect.

8.192 DEFECT_SIZE_DK — (numeric) Maximum dimension of smallest unacceptable dark defect.

8.193 DEFECT_SIZE_DK_ADJ — (numeric) Maximum dimension of smallest unacceptable dark, non-repeating edge defect.

8.194 DEFECT_SIZE_DK_ADJ_REP — (numeric) Maximum dimension of smallest unacceptable dark, repeating edge defect.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

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8.195 DEFECT_SIZE_DK_ISO — (numeric) Maximum dimension of smallest unacceptable dark, non-repeating isolated defect.

8.196 DEFECT_SIZE_DK_ISO_REP — (numeric) Maximum dimension of smallest unacceptable dark, repeating isolated defect.

8.197 DEFECT_TYPE — (text) [PINHOLE | EDGE | PINDOT | CD | SEMI_TRANS | MASSIVE | CLIPPED | PATTERN | REFL_PATTERN | PAT_PINHOLE | REFL_PINHOLE | CORNER | LINE_END | BASIC | ISO | MID_SIZE | ... ] Setup parameter for defect inspection. (See Related Information 9 for suggested machine settings.)

8.198 DEFECT_TYPE_P22 — (text) Type of defect according to SEMI P22.

8.199 DEFECTIVE_DIE_COUNT — (integer) Maximum allowable number of die with defects within the INSPECTION_AREA.

8.200 DEFECTIVE_DIE_COUNT_REP — (integer) Maximum number of repeating defective die within the INSPECTION_AREA.

8.201 DEFECTIVE_DIE_DENSITY — (numeric) Maximum allowable number of die with defects per square centimeter within the INSPECTION_AREA.

8.202 DELIVERABLE_MASK — (Boolean) If F, the mask is to be held internally by the mask shop for the production of other deliverable masks. For a MASK_ID with MULTIWRITE, only the final write and process step MASK_ID within the multiwrite group may have DELIVERABLE_MASK = T.

8.203 DELIVERY_PRIORITY — (text) Text, to be agreed between the customer and supplier, describing urgency for delivery (e.g., rush, standard, slow).

8.204 DESIGN_RULE — (numeric) The nominal minimum dimension of wafer geometries.

8.205 DEVICE_NAME — (text) Name used by a customer to cross-reference MASK_SET_ID to customer’s internal tracking system for IC designs. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.206 DEVICE_REVISION — (text) Name used by a customer to cross-reference MASK_SET_ID to customer’s internal tracking system for IC design revisions. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.207 DIE_TO_DIE_INSPECTION — (Boolean) If T, die-to-die inspection is required.

8.208 DIE_TO_DIE_MEASUREMENTS — (Boolean) If T, indicates that the defect inspection performed was die-to-die. If F, indicates defect inspection performed was die-to-database.

8.209 DIGITIZED_DATA_DARK — (Boolean) If T, the image of digitized data is to be opaque on the mask. If F, the image of digitized data is to be clear.

8.210 DROPOUT — (integer) (x,y) Row and column of pattern or cell placement which is to be omitted in the array. These array coordinates are rectangular (even if the actual written array is non-rectangular), with the origin at the lower left of the array (chrome side up before mirroring).

8.211 DUE_DATE_TIME_COMMITTED — (date) The date and time for delivery (at the customer) committed by vendor. In <mask_order> it should only be used with the explicit agreement of the mask supplier.

8.212 DUE_DATE_TIME_REQUESTED — (date) The date and time requested for delivery (at the customer).

8.213 DXF_ANGLE — (integer) To be used if DATA_FORMAT is DXF.

8.214 DXF_UNIT — (integer) To be used if DATA_FORMAT is DXF.

8.215 EDGE_ROUGHNESS — (numeric) The maximum value of edge roughness, based on physical measurements.

8.216 ELAPSED_TIME — (numeric) Hours between masking steps in the wafer fab. Used in conjunction with LAYER_PRIORITY, provides scheduled due dates based on the delivery of each previous mask. No mask may have both ELAPSED_TIME and DUE_DATE_REQUESTED. See LAYER_PRIORITY.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

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8.217 ELAPSED_TIME_COMMITTED — (numeric) Hours for delivery (at customer) committed by vendor.

8.218 ELAPSED_WRITE_TIME — (numeric) The total time in minutes that the given lithography operation took to write the mask.

8.219 EMAIL_ADDRESS — (text) Internet address.

8.220 END_AERIAL_IMAGE_DATA — (text) Must match data field of START_AERIAL_IMAGE_DATA.

8.221 END_BARCODE — (text) Must match data field of START_BARCODE.

8.222 END_BILLING_INFORMATION — (text) Indicates the end of the <billing_information> section. Must match data field of START_BILLING_INFORMATION.

8.223 END_CD — (text) Data field must match data field of START_CD.

8.224 END_CD_CLEAR_DARK — (text) Data field must match data field of START_CD_CLEAR_DARK.

8.225 END_CD_CLEAR_DARK_RESULTS — (text) Data field must match data field of START_CD_CLEAR_DARK_RESULTS.

8.226 END_CD_GROUP_MEASUREMENTS — (text) Must match data field of START_CD_GROUP_MEASUREMENTS.

8.227 END_CD_MEASUREMENT — (text) Data field must match data field of START_CD_MEASUREMENT.

8.228 END_CD_SAME_TONE — (text) Data field must match data field of START_CD_SAME_TONE.

8.229 END_CD_SAME_TONE_RESULTS — (text) Data field must match data field of START_CD_SAME_TONE_RESULTS.

8.230 END_CD_SET — (text) Data field must match data field of START_CD_SET.

8.231 END_CD_SET_RESULTS — (text) Data field must match data field of START_CD_SET_RESULTS.

8.232 END_CD_XY_DEFINITION — (text) Data field must match data field of START_CD_XY_DEFINITION.

8.233 END_CD_XY_RESULTS — (text) Data field must match data field of START_CD_XY_RESULTS.

8.234 END_CD_XY_SITE — (text) Data field must match data field of START_CD_XY_SITE.

8.235 END_CELL — (text) Must match data field of CELL_ID for which data is complete.

8.236 END_CELL_INSTANCE — (text) Must match data field of CELL_INSTANCE.

8.237 END_CELL_INSTANCE_OPTIONS — (text) Must match data field of CELL_INSTANCE for which pattern options are complete.

8.238 END_CELL_OPTIONS — (text) Must match data field of CELL_ID for which options are complete.

8.239 END_CLOSURE_MEASUREMENTS — (text) Must match START_CLOSURE_MEASUREMENTS data field.

8.240 END_COATING — (text) Indicates the end of the <coating> section. Must match START_COATING data field.

8.241 END_DATA_FRACTURE — (text) Must match START_DATA_FRACTURE data field.

8.242 END_DATA_FUNCTION — (text) Must match START_DATA_FUNCTION data field.

8.243 END_DATA_MANIPULATION — (text) Must match data field of START_DATA_MANIPULATION.

8.244 END_DATA_MEDIUM — (text) Must match data field of DATA_MEDIUM for which data is complete.

8.245 END_DATA_PATTERN_NAME — (text) Must match data field of DATA_PATTERN_NAME.

8.246 END_DATA_SOURCE_FILE — (text) Must match DATA_SOURCE_FILE data field.

8.247 END_DEFECT_DEFINITION — (text) Must match data field of START_DEFECT_DEFINITION.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

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8.248 END_DEFECT_MEASUREMENTS — (text) Must match data field of START_DEFECT_MEASUREMENTS.

8.249 END_DEFECT_SITE — (text) Must match data field of START_DEFECT_SITE.

8.250 END_ETCH_DEPTH_MEASUREMENTS — (text) Must match START_ETCH_DEPTH_MEASUREMENTS data field.

8.251 END_EUV_BLANK_TYPE — (text) Must match data field of START_EUV_BLANK_TYPE.

8.252 END_FTP_HOST — (text) Must match data field of FTP_HOST_NAME.

8.253 END_LITHO_INFORMATION — (text) Data field must match data field of START_LITHO_INFORMATION.

8.254 END_MASK — (integer) Must match data field of MASK_ID for which data is complete.

8.255 END_MASK_GROUP — (text) Must match data field of MASK_GROUP_ID for which data is complete.

8.256 END_MASK_GROUP_OPTIONS — (text) Must match data field of MASK_GROUP_ID for which options are complete.

8.257 END_MASK_RESULTS — (text) Must match START_MASK_RESULTS data field.

8.258 END_MASK_RESULTS_OPTIONS — (text) Data field must match data field of START_MASK_RESULTS_OPTIONS.

8.259 END_MASK_SET — (text) Must match data field of MASK_SET_ID for which data is complete.

8.260 END_MASK_SET_OPTIONS — (text) Must match data field of MASK_SET_ID for which options are complete.

8.261 END_MATERIALS_USED — (text) Data field must match data field of START_MATERIALS_USED.

8.262 END_MEASURED_ETCH_DEPTH_SITE — (text) Must match data field of MEASURED_ETCH_DEPTH_MARK_SITE_ID.

8.263 END_MEASURED_PHASE_ANGLE_SITE — (text) Must match data field of MEASURED_PHASE_ANGLE_MARK_SITE_ID.

8.264 END_MEASURED_REGISTR_MARK — (text) Must match data field of MEASURED_REGISTR_MARK_ID.

8.265 END_MEASURED_TRANSMISSION_SITE — (text) Must match data field of MEASURED_TRANSMISSION_MARK_SITE_ID.

8.266 END_OPC — (text) Must match data field of START_OPC.

8.267 END_ORDER — (text) Must match data field of START_ORDER for which data is complete.

8.268 END_PATTERN_DEFINITION — (text) Must match data field of LEVEL_ID for which data is complete.

8.269 END_PATTERN_GROUP — (text) Must match data field of PATTERN_GROUP_ID for which data is complete.

8.270 END_PATTERN_GROUP_INSTANCE — (text) Must match data field of PATTERN_GROUP_INSTANCE.

8.271 END_PATTERN_GROUP_OPTIONS — (text) Must match data field of PATTERN_GROUP_ID for which options are complete.

8.272 END_PATTERN_GROUP_RESULTS — (text) Data field must match data field of START_PATTERN_GROUP_RESULTS.

8.273 END_PATTERN_OPTIONS — (text) Must match data field of START_PATTERN_OPTIONS.

8.274 END_PHASE_ANGLE_MEASUREMENTS — (text) Must match data field of START_PHASE_ANGLE_MEASUREMENTS.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.275 END_PHASE_SHIFT — (text) Must match START_PHASE_SHIFT data field.

8.276 END_PHASE_SHIFT_MEASUREMENTS — (text) Must match data field of START_PHASE_SHIFT_MEASUREMENTS.

8.277 END_PLACEMENT — (text) Must match data field of START_PLACEMENT.

8.278 END_REGISTR — (text) Must match data field of START_REGISTR.

8.279 END_REGISTR_MEASUREMENTS — (text) Must match data field of START_REGISTR_MEASUREMENTS.

8.280 END_REPAIR_DEFINITION — (text) Must match data field of START_REPAIR_DEFINITION.

8.281 END_SEM_PHOTO — (text) Must match START_SEM_PHOTO data field.

8.282 END_SHIP_PLOT — (text) Must match data field of START_SHIP_PLOT.

8.283 END_SHIP_TO — (text) Must match data field of START_SHIP_TO.

8.284 END_SHIPPABLE_DATA — (text) Must match data field of START_SHIPPABLE_DATA.

8.285 END_SUBSTRATE — (text) Must match data field of START_SUBSTRATE.

8.286 END_SURFACE_DEFINITION — (text) Must match data field of START_SURFACE_DEFINITION.

8.287 END_SURFACE_INSP_MEASUREMENTS — (text) Must match data field of START_SURFACE_INSP_MEASUREMENTS.

8.288 END_TITLE — (integer) Indicates end of keywords for a specific title. Must match data field of START_TITLE for which data is complete.

8.289 END_TRANSMISSION_MEASUREMENTS — (text) Must match data field of START_TRANSMISSION_MEASUREMENTS.

8.290 END_WAFER_EXPOSURE_DATA — (text) Must match data field of START_WAFER_EXPOSURE_DATA.

8.291 END_VENDOR_INFO — (text) Must match data field of START_VENDOR_INFO.

8.292 ENGINEERING_ADDRESS — (text) Address for delivery of shippable engineering data.

8.293 ENGINEERING_CONTACT — (text) Name of person to contact for technical questions.

8.294 ENGINEERING_EMAIL — (text) Internet address for ENGINEERING_CONTACT.

8.295 ENGINEERING_FAX — (text) Phone number for facsimile machine of ENGINEERING_CONTACT.

8.296 ENGINEERING_PHONE — (text) Phone number for ENGINEERING_CONTACT.

8.297 EQUIP_SITE_REQD — (text) Identification of qualified manufacturing site, to be agreed between customer and vendor, for preceding required equipment. For a given MASK_ID, EQUIP_SITE_REQD may not be used in combination with MFG_SITE_REQD.

8.298 EQUIP_SITE_USED — (text) Identification of mask manufacturing location of equipment used.

8.299 ESTIMATED_ARRIVAL — (date) The date and time when the vendor predicts MASK_ID will be delivered to the customer, based on the MILESTONE most recently completed.

8.300 ESTIMATED_ARRIVALS — (Boolean) If T, the vendor is requested to use <mask_results> to supply a prediction of the delivery date and time when MASK_ID will be delivered to the customer, based on the MILESTONE most recently completed. ESTIMATED_ARRIVAL will be transmitted each time <mask_results> is required by either MILESTONES or PERIODIC_UPDATES. If neither have been requested, then ESTIMATED_ARRIVAL should be transmitted daily.

8.301 ETCH_DEPTH_EQUIP_REQD — (text) Etch depth measurement equipment required by customer.

8.302 ETCH_DEPTH_EQUIP_USED — (text) Etch depth measurement equipment used.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.303 ETCH_DEPTH_ERROR — (numeric) Maximum allowable deviation (in angstroms) of any etch depth measurement from ETCH_DEPTH_TARGET.

8.304 ETCH_DEPTH_MARK_DRAWING — (text) The uniquely identified (for each customer) document which shows the etching depth measurement mark structure itself, and may show the place(s) within the etching depth measurement mark which are to be measured.

8.305 ETCH_DEPTH_MARK_FEATURE — (text) Description of the feature to be used for phase etching depth measurement.

8.306 ETCH_DEPTH_MARK_LOCATION — (numeric) (x,y) Location of etching depth measurement mark relative to the nominal center of the mask (chrome side up), or the center of the pattern if under <pattern_options>.

8.307 ETCH_DEPTH_MARK_LOCATION_DRAWING — (text) The uniquely identified (for each customer) document which shows the location(s) of the etching depth measurement mark structure.

8.308 ETCH_DEPTH_MEASUREMENT_DATE — (date) Etch depth measurement date.

8.309 ETCH_DEPTH_MEASUREMENT_FILE_NAME — (text) Name of data file containing results of etch depth measurement.

8.310 ETCH_DEPTH_MODE_REQD — (text) Operating mode required by customer for ETCH_DEPTH_EQUIP_USED.

8.311 ETCH_DEPTH_MODE_USED — (text) Operating mode for ETCH_DEPTH_EQUIP_USED.

8.312 ETCH_DEPTH_RANGE — (numeric) Maximum acceptable variation (in angstroms) of all etch depth measurements, relative to each other.

8.313 ETCH_DEPTH_REFERENCE_ONLY — (Boolean) If T, indicates that the etch depth feature is to be measured and the data transmitted to the customer (if requested by SHIP_PHASE_SHIFT_MEASUREMENTS), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.314 ETCH_DEPTH_SITE_ID — (text) Unique identification of each etch depth measurement location within MASK_SET_ID to identify individual locations when using <mask_results>. If the same coordinates apply to locations on different masks within the mask set, they may have the same ETCH_DEPTH_SITE_ID, but it is not mandatory.

8.315 ETCH_DEPTH_TARGET — (numeric) Desired mean etch depth in angstroms.

8.316 ETCH_DEPTH_TOLERANCE — (numeric) Maximum acceptable deviation (in angstroms) of the mean of all measured critical dimensions to the ETCH_DEPTH_TARGET.

8.317 EUV_ABSORBER_COMPOSITION — (text) Composition of the absorber stack of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.

8.318 EUV_ABSORBER_OPTICAL_PROPERTIES — (numeric) Percentage of absorber reflectivity as defined in Table 11 of SEMI P38.

8.319 EUV_BLANK_RESISTANCE — (numeric) Electrical resistance (in Ohms) measured between the surface of the absorber stack and the backside of the mask blank.

8.320 EUV_BLANK_TYPE — (integer) Type of EUV mask blank as defined in Table 1 of SEMI P38.

8.321 EUV_CAPPING_COMPOSITION — (text) Composition of capping layers on the multilayer stack of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.

8.322 EUV_EXPANSION_COEFF — (text) Class of coefficient of thermal expansion for EUV mask blank as defined in Table 3 of SEMI P37.

8.323 EUV_FLATNESS_BACK — (text) Class of flatness required for back side of EUV mask within flatness quality area as per Figure 3 and Table 4 of SEMI P37.

8.324 EUV_FLATNESS_FRONT — (text) Class of flatness required for front side of EUV mask within flatness quality area as per Figure 3 and Table 4 of SEMI P37.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.325 EUV_MEAN_PEAK_REFLECTIVITY — (text) Class for percentage reflectivity of the EUV multilayer stack, as per Table 5 of SEMI P38.

8.326 EUV_MMR_WAVELENGTH — (numeric) Wavelength in nanometers of the mean median reflected of the multilayer stack of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.

8.327 EUV_MULTILAYER_COMPOSITION — (text) Material composition of the multilayers of an EUV mask, to be agreed on between customer and supplier, as per SEMI P38.

8.328 EUV_PEAK_REFLECTIVITY_UNIFORMITY — (text) Class of reflectivity uniformity required per Table 6 of SEMI P38.

8.329 EWT_CEILING — (numeric) The maximum monetary amount that can be added to PRICE as an excess write time charge for the mask. If the charge calculated with EWT_RATE exceeds EWT_CEILING, then EWT_CEILING is used as the excess write time charge.

8.330 EWT_RATE — (numeric) The monetary amount per minute to be added to PRICE for write time exceeding the EWT_THRESHOLD time. The monetary unit is defined in PRICE_UNITS.

8.331 EWT_THRESHOLD — (numeric) The number of minutes that a mask can write before incurring an Excess Write Time (EWT) charge.

8.332 EXTERNAL_WINDOW — (numeric) (x1,y1,x2,y2) Area to have all digitized data removed outside the window described by (x1,y1,x2,y2), relative to the coordinate space of DATA_SOURCE_FILE. The extents of the pattern file are thus defined by the window.

8.333 FAB_TECHNOLOGY — (text) Customer’s designation for the fabrication unit’s wafer manufacturing process.

8.334 FIGURE_COUNT — (integer) Total number of geometries which are expected in the pattern file. If this is incorrect, the mask will not be written until it is corrected.

8.335 FILE_DATE_TIME — (date) Date and time of transmission of mask order. Format will be as in § 6.19.

8.336 FILE_IDENTIFIER — (text) (location,value) Identifies “location” within the referenced file of a unique identification key and the “value” of that key. The value must be unique among files created by the customer and is suggested to be of the form “filename_YYYY-MM-DD_HH:MM:SSZ” where “filename” is the actual name of the file and the date/time is as described in section.

8.337 FINAL_AUDIT_DATE_TIME — (date) The date and time of the finalquality audit prior to shipping the mask to the customer.

8.338 FINAL_QC_AUDITOR — (text) Mask supplier identification of final Quality Control auditor.

8.339 FRACTURE_FILE — (text) File name of fracture instructions provided by the customer with the mask order.

8.340 FRACTURE_FILE_FORMAT — (text) [CATS | K2 | … ] Format of FRACTURE_FILE.

8.341 FRACTURING_SCALE — (numeric) For optical data (Mann or Electromask) only, this is the scale factor to use in fracturing the data to E-beam format.

8.342 FTP_DIRECTORY — (text) Name of target directory for FTP data.

8.343 FTP_HOST_NAME — (text) Domain of the FTP host, either in the form n.n.n.n where n is an integer from0–255, or in an equivalent text name if such is supported by the FTP site.

8.344 FTP_LOGIN — (text) The login name for an FTP account. If an anonymous FTP is used, the data field will be “anonymous”.

8.345 FTP_MODE — (text) [ASCII | BINARY | AUTO] Data encoding type for FTP data. If absent, default is BINARY.

8.346 FTP_PASSWORD — (text) Password for FTP account.

8.347 GOOD_FIELDS — (text) Specifies the 1X reticle fields which must pass inspection criteria and is applied to the cells immediately instanced by the preceding CELL_ID. Fields are referenced by numbers assigned from left to

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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right according to their position on the mask, chrome side up. For example, for a mask with 5 fields, the fields would be: 1 2 3 4 5. The required good fields are specified by any logical combination of field numbers, “AND”, “OR”, and parentheses. In the above example, “(1 OR 2) AND (3 OR 4) AND 5” would require that either 1 or 2 be good, and either 3 or 4 be good, and that 5 be good. No logical precedence is assumed; precedence is defined only by parentheses. This keyword applies only to 1X reticles.

8.348 GUIDES_REQD — (text) [STANDARD | WIDE | BOTH] Applies to 1X reticles only.

8.349 INPUT_FILE_FORMAT — (text) Format of INPUT_FILE_NAME.

8.350 INPUT_FILE_NAME — (text) Name identifying the input file for RUNSET_NAME. If this keyword appears in the <mask_order>, it must be explicitly referenced in a RUNSET_NAME and/or a PARAMETER_FILE_NAME.

8.351 INSP_DATABASE_DATA_FORMAT — (text) Description of format for SHIP_INSP_DATABASE_DATA.

8.352 INSPECT_ALL_SITES — (Boolean) If T, all placements of patterns under this <cell_instance> or <pattern_instance> require inspection, regardless of the number of inspection tool setups necessary to do so.

8.353 INSPECT_THROUGH_PELLICLE — (Boolean) If T, the mask must be inspected through the pellicle and the <defect_definition> and <database_inspection> keywords to be used must follow the INSPECT_THROUGH_PELLICLE keyword. Unpelliclized inspection may be separately defined and would precede the INSPECT_THROUGH_PELLICLE keyword.

8.354 INSPECTION_AREA — (numeric) (x1,y1,x2,y2) Unscaled coordinates of window for defect inspection, lower left and upper right corners, relative to the nominal center of mask, pattern or cell (chrome side up for masks, unmirrored for patterns or cells).

8.355 INSPECTION_AREA_EXCLUDE — (numeric) (x1, y1, x2, y2) Unscaled coordinates of window to be excluded from defect inspection. This is commonly referred to as DNIR (Do Not Inspect Region), (see INSPECTION_AREA).

8.356 INSPECTION_BORDER — (numeric) ( w [ , h ] ) The minimum width (after any scaling) in millimeters of an opaque border outside of the pattern region that must be inspected and meet defect requirements. If a single value w is given, the width of the border is the same on all sides. If both w (width) and h (height) are supplied, w is the width in the horizontal dimension and the h is the height in the vertical dimension.

8.357 INSPECTION_REF_LOCATION — (numeric) (x,y) Location of reference mark for defect inspection, relative to the nominal center of the substrate (chrome side up).

8.358 JOB_FORMAT — (text) [MEBES | EEBES | ATEQ | ... ] Format of preceding JOB_NAME.

8.359 JOB_LEVEL — (numeric) Level of preceding JOB_NAME to be used to make mask.

8.360 JOB_NAME — (text) Name of mask writing control file (job file) to be used to make mask(s).

8.361 JOB_ONLY_APPROVAL_REQD — (Boolean) If T, explicit approval of the mask writing control file must be given by the customer before the mask is to be written or further processed.

8.362 JOB_ONLY_APPROVED — (date) Date approval was granted by customer for JOB_ONLY_APPROVAL_REQD.

8.363 JOB_WITH_PATTERNS_APPROVAL_REQD — (Boolean) If T, explicit approval of the mask writing control file and all referenced pattern files must be given by the customer before the mask is to be written or further processed.

8.364 JOB_WITH_PATTERNS_APPROVED — (date) Date approval was granted by customer for JOB_WITH_PATTERNS_APPROVAL_REQD.

8.365 LAYER_PRIORITY — (numeric) Sequence number in which masks are needed. Together with ELAPSED_TIME determines the mask delivery schedule. The first mask (LAYER_PRIORITY=1) is due within its ELAPSED_TIME from the time it is ordered or released; the second mask is due within its ELAPSED_TIME from when the first mask was due, or from when the first mask was delivered, whichever is later; and so on.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.366 LEVEL_ID — (text) Indicator of which masks within the mask set will include this pattern. When a MASK_ID in a MASK_GROUP (which references this PATTERN_GROUP_ID) matches this LEVEL_ID, this pattern will appear on the mask. Allowable values are integers and the letter “A”. When LEVEL_ID is “A”, the pattern will appear on all masks which reference the pattern group. A given LEVEL_ID value may appear only once in any pattern group. Appearance of “A” as a LEVEL_ID value precludes any other patterns from the pattern group.

8.367 LINE_ITEM_NUMBER — (integer) Line item number relative to PO_NUMBER.

8.368 LITHO_EQUIP_REQD — (text) [EBEAM | OPTICAL | LASER] Acceptable equipment for writing product mask(s).

8.369 LITHO_EQUIP_USED — (text) Type of equipment used for writing product mask(s). See LITHO_EQUIP_REQD.

8.370 LITHO_MODE_REQD — (text) [SPP | MPP | 4PASS | 8PASS | 1000UM | ... ] Acceptable recipe for LITHO_EQUIP_REQD.

8.371 LITHO_MODE_USED — (text) The writing methodology used by the lithography tool.

8.372 LITHO_MODEL_REQD — (text) [ALTA_3000 | ALTA_3100 | ALTA_3500 | ALTA_3700 | ALTA_3900 | ALTA_4300 | CORE_2000 | CORE_2100 | CORE_2500 | CORE_2564 | EBM_3500 | EBM_4000 | EBM5000 | EBM6000 | HL_800 | HL_900 | HL_950 | HL_7000 | JBX_3030 | JBX3040 | JBX_7000 | JBX_9000 | LRS_55 | LRS_800 | MANN_3000 | MANN_3600 | MANN_3696 | MEBES III | MEBES IV | MEBES_4000 | MEBES_4500 | MEBES_4700 | MEBES_5000 | MEBES_5500 | MEBES_EXARA | MM_101 | MP_508 | OMEGA_6600 | SIGMA_7100 | SIGMA_7300 | TAMARACK_142 | TAMARACK_155 | TOSHIBA_4700 | TRE_220 | ULTRABEAM_V2000 | ZBA_21 | ZBA_23H | ZBA_31 | ZBA_31H+ | ZBA_320 | ZBA_340 | ... ] Model of acceptable mask writing equipment.

8.373 LITHO_MODEL_USED — (text) The model name of the lithography tool used to perform the lithography operation. See LITHO_MODEL_REQD.

8.374 LOCATION — (numeric) (x,y) Location of the center of the initial pattern or cell, relative to center of the preceding CELL_ID (before mirroring or scaling).

8.375 LOCATION_SPEC — (text) Identification of customer-supplied specification for pattern or cell placement.

8.376 LOG_FILE_NAME — (text) Name identifying the log output file for RUNSET_NAME. If this keyword appears in the <mask_order>, it must be explicitly referenced in a RUNSET_NAME and/or a PARAMETER_FILE_NAME.

8.377 MACHINE_SERIAL_NUMBER — (text) The serial number of the lithography tool used to perform the lithography operation.

8.378 MAILING_ADDRESS — (text) Postal address.

8.379 MASK_BLANK_ID — (text) Unique identification of blank substrate.

8.380 MASK_COATING — (text) [HIGH_REFLECTIVE_CHROME | MEDIUM_REFLECTIVE_CHROME | LOW_REFLECTIVE_CHROME | SEE_THROUGH_CHROME | IRON_OXIDE | CHROME_OXIDE | EMULSION | … ]. The material which comprises the opaque or semi-transmissive mask coating (see SEMI P2).

8.381 MASK_EXPORT_NUMBER — (text) (agency,number) Identifies the applicable export control entity (agency) and the export control number (number, which can be any printable/displayable text) to allow for export control of masks.

8.382 MASK_GROUP_ID — (text) Name of the mask group which follows; must be used in all references within this MASK_SET_ID to this mask group.

8.383 MASK_ID — (text) Unique identifier of each mask within mask set. All patterns referenced by the MASK_GROUP_ID’s PLACEMENT_TOP_CELL whose LEVEL_ID’s match this MASK_ID will appear on the mask. When LEVEL_ID is “A”, the pattern will appear on all masks whose PLACEMENT_TOP_CELL references the pattern group.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.384 MASK_NAME — (text) Name used by customer for mask, to be used to cross-reference MASK_ID to customer’s internal tracking system. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.385 MASK_NAME_VERSION — (text) Name used by customer for versions of the mask, to be used to cross-reference MASK_ID to customer’s internal tracking system. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.386 MASK_REGISTR_MARK — (numeric) (x,y) Location of registration mark in <mask_order>, relative to the nominal center of substrate (chrome side up). When MASK_REGISTR_MARK precedes REGISTR_MARK_SEPARATION, it indicates the origin of the registration mark array being defined.

8.387 MASK_REGISTR_MARK_LOCATION — (numeric) (x,y) Expected location of individual registration mark, relative to nominal center of substrate (chrome side up), and should mimic the MASK_REGISTR_MARK value in <mask_order>. This is the target location for the mark in <mask_results> to be associated with the actual location MEASURED_REGISTR_MARK_LOCATION.

8.388 MASK_ROTATION — (integer) [0 | 90 | 180 | 270] Degrees to rotate the entire set of mask data (patterns, titles, barcodes, etc.) counterclockwise (assuming a chrome-up orientation).

8.389 MASK_SERIAL_NUMBER — (text) The serial number title written on the mask during lithography—usually numeric, but text if agreed by customer and vendor.

8.390 MASK_SET_ID — (text) The “name” of the mask set, often the device name or number. This must be used in all future references to this mask set and must be unique among mask sets ordered by the customer.

8.391 MASK_SET_NAME — (text) Name used by customer for mask set, to be used to cross-reference MASK_SET_ID to customer’s internal tracking system. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.392 MASK_SET_VERSION — (text) Name used by customer for versions of the mask set, to be used to cross-reference MASK_SET_ID to customer’s internal tracking system. This is primarily for the customer’s use only, but should be recorded by the vendor and reported back in <mask_results>.

8.393 MASK_SHIPPED_DATE_TIME — (date) The date and time the mask left the mask shop for delivery to the customer.

8.394 MAX_MASKS_IN_PACKAGE — (integer) Maximum number of masks to be shipped inside PACKAGE.

8.395 MEASURE_FILE_FORMAT — (text) [MF2 | MF3 | MTX | IMP | ... ].

8.396 MEASURE_FILE_NAME — (text) Name of file to be used for registration mark locations. When used in <data>, it is the name of the file being supplied. When used in <mask_options> or in <pattern_options>, MEASURE_FILE_NAME follows either MASK_REGISTR_MARK or CELL_REGISTR_MARK where the mark locates the origin of the measure file.

8.397 MEASURED_REGISTR_ANISOTROPIC_SCALE — (numeric) REGISTR_ANISOTROPIC_SCALE as measured by the vendor. The measured difference will always be reported as positive.

8.398 MEASURED_BINARY_TRANSMITTANCE — (numeric) MINIMUM_BINARY_TRANSMITTANCE as measured by the mask supplier or the mask blank supplier.

8.399 MEASURED_CD — (numeric) The critical dimension measurement at the CD_LOCATION, as measured by the vendor.

8.400 MEASURED_CD_CLEAR_DARK_TOLERANCE — (numeric) CD_CLEAR_DARK_TOLERANCE of the mask as measured by the vendor.

8.401 MEASURED_CD_CLEAR_SET_MEAN — (numeric) Average of all measured CD features in CD_CLEAR_SET.

8.402 MEASURED_CD_CLEAR_SET_TOLERANCE — (numeric) The difference between the mean of all measurements in CD_CLEAR_SET and the CD_TARGET as measured by the vendor. If the mean CD is larger than the target, then the value will be positive; if the mean CD is smaller than the target, then the value will be negative.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.403 MEASURED_CD_DARK_SET_MEAN — (numeric) Average of all measured CD features in CD_DARK_SET.

8.404 MEASURED_CD_DARK_SET_TOLERANCE — (numeric) The difference between the mean of all measurements in CD_DARK_SET and the CD_TARGET as measured by the vendor. If the mean CD is larger than the target, then the value will be positive; if the mean CD is smaller than the target, then the value will be negative.

8.405 MEASURED_CD_DEVIATION_FROM_MEAN — (numeric) (n, m) For all measurements in the associated <measured_cd_results> section, the difference (n) between the maximum measurement and the mean, and the difference (m) between the minimum measurement and the mean. “n” will always be positive; “m” will always be negative.

8.406 MEASURED_CD_DEVIATION_FROM_TARGET — (numeric) (n, m) For all measurements in the associated <measured_cd_results> section, the difference (n) between the maximum measurement and the target, and the difference (m) between the minimum measurement and the target. “n” will always be positive; “m” will always be negative. (This corresponds to “measured maximum feature width deviation from target” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY. When used in combination with START_CD_SET comprised of multiple START_CD groups with differing CD_TARGET, this can also satisfy the “measured feature linearity error” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY. Furthermore, when used in combination with START_CD_SET comprised of multiple START_CD groups with differing CD_TARGET, CD_FEATURE, CD_ORIENTATION and/or CD_PITCH, this can also satisfy the “feature linearity error” and/or “feature inter-proximity error” in SEMI P43.)

8.407 MEASURED_CD_FILE_NAME — (text) Name of data file containing results of CD measurement.

8.408 MEASURED_CD_LOCATION — (numeric) (x,y) The actual location, relative to the nominal center of the mask, of the critical dimension as measured by the vendor.

8.409 MEASURED_CD_MAX — (numeric) For the associated <cd_group> or <cd_set>, the maximum of all measurements.

8.410 MEASURED_CD_MEAN — (numeric) For the associated <cd_group> or <cd_set>, the mean of all measurements.

8.411 MEASURED_CD_MIN — (numeric) For the associated <cd_group> or <cd_set>, the minimum of all measurements.

8.412 MEASURED_CD_RANGE — (numeric) CD_RANGE of the mask as measured by the vendor. For the associated <cd_group> or <cd_set>, this is the difference between the maximum measurement and the minimum measurement.

8.413 MEASURED_CD_SAME_TONE_SET_MEAN — (numeric) Average of all measured CD features in CD_SAME_TONE_SET. This keyword will always appear in pairs with the first instance being the mean of the first CD_SAME_TONE_SET in the bias measurement collection and the second instance being the mean of the second CD_SAME_TONE_SET in the <cd_same_tone_definition> collection.

8.414 MEASURED_CD_SAME_TONE_TOLERANCE — (numeric) CD_SAME_TONE_TOLERANCE of the mask as measured by the vendor.

8.415 MEASURED_CD_SITE_ID — (text) Must match CD_SITE_ID in <mask_order> for site being measured. If the customer assigned no CD_SITE_ID for the required location (e.g., only CD_LOCATION_DRAWING was used), the vendor will assign a MEASURED_CD_SITE_ID for each measurement location so that it is unique within the MASK_SET_ID. If CD_SITE_ID was used as a <pattern_options> in <mask_order> for a pattern with multiple instances, then the vendor will add a suffix to CD_SITE_ID for each instance so that each MEASURED_CD_SITE_ID in <mask_results> will be unique.

8.416 MEASURED_CD_THREE_SIGMA — (numeric) CD_THREE_SIGMA of the mask as measured by the vendor. For the associated <cd_group> or <cd_set>, this is the product of 3 times the standard deviation of all measurements.

8.417 MEASURED_CD_TOLERANCE — (numeric) CD_TOLERANCE of the mask as measured by the vendor. For the associated <cd_group> or <cd_set>, this is the difference between the mean of all included measurements

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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and the CD_TARGET. (This corresponds to “measured feature mean-to-target” and “measured CD mean-to-target” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.418 MEASURED_CD_XY_DEVIATION — (numeric) CD_XY_DEVIATION of the mask as measured by the vendor. This is the maximum difference between any horizontally scanned and vertically scanned measurement at a <cd_xy_site> among all sites within the <cd_xy_definition>. The MEASURED_VERTICAL_CD should always be subtracted from the MEASURED_HORIZONTAL_CD. (This corresponds to “measured mean X-Y deviation uniformity” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.419 MEASURED_CD_XY_MORPHOGRAPHY — (text) The CD_MORPHOGRAPHY of all of the <cd_xy_site> CD features if they were all specified in <mask_order> and if they were all of the same morphography type. The data value would be “unspecified” if some sites were not specified, or “mixed” if not all sites were the same.

8.420 MEASURED_CD_XY_TOLERANCE — (numeric) CD_XY_TOLERANCE of the mask as measured by the vendor. This is the difference between the mean of all horizontally scanned critical dimension measurements to the mean of all vertically scanned critical dimension measurements within the <cd_xy_definition>. The mean of the vertically scanned critical dimensions should always be subtracted from the mean of the horizontally scanned critical dimensions. (This corresponds to “measured mean X-Y deviation” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.421 MEASURED_CD_XY_TONE_CLEAR — (Boolean) The CD_TONE_CLEAR of all of the <cd_xy_site> CD features. They must all be the same as per the requirement of CD_XY_TOLERANCE and CD_XY_DEVIATION. If T, the critical dimension feature on mask is clear.

8.422 MEASURED_CENTRALITY — (numeric) CENTRALITY as measured by the vendor.

8.423 MEASURED_CLOSURE_LOCATION — (text) Description of the location where MEASURED_REGISTR_CLOSURE was measured. This may be descriptive (e.g., “upper left”) or coordinate-based, as agreed by the vendor and the customer.

8.424 MEASURED_CLOSURE_READING — (numeric) (x,y) REGISTR_CLOSURE as measured by the vendor in both axes at MEASURED_CLOSURE_LOCATION.

8.425 MEASURED_CONTAMINATION_LEVEL — (numeric) CONTAMINATION_LEVEL in ppm of CONTAMINANT as measured by the mask supplier.

8.426 MEASURED_CONTAMINATION_METHOD — (text) Measurement method used by the mask supplier for MEASURED_CONTAMINATION_LEVEL.

8.427 MEASURED_DEFECT_COUNT — (integer) DEFECT_COUNT as measured by the vendor.

8.428 MEASURED_DEFECT_COUNT_REP — (integer) DEFECT_COUNT_REP as measured by the vendor.

8.429 MEASURED_DEFECT_COUNT_WITHIN_SPEC — (integer) Number of defects detected during inspection which were smaller than the specification, excluding false detections.

8.430 MEASURED_DEFECT_DENSITY — (numeric) DEFECT_DENSITY as measured by the vendor.

8.431 MEASURED_DEFECT_FILE_NAME — (text) Name of data file containing results of defect inspection.

8.432 MEASURED_DEFECT_LOCATION — (numeric) (x,y) Coordinates of nominal center of measured defect, relative to the nominal center of the mask (chrome side up). If INSPECTION_REF_LOCATION is supplied, it is used to calibrate the coordinate space of the physical mask, but the measured location is still relative to the nominal center of the mask (chrome side up).

8.433 MEASURED_DEFECT_SIZE — (numeric) DEFECT_SIZE, as measured by the vendor. Note that the defect size to be reported is for measurement made after repair.

8.434 MEASURED_DEFECTIVE_DIE_COUNT — (integer) DEFECTIVE_DIE_COUNT as measured by the vendor.

8.435 MEASURED_DEFECTIVE_DIE_COUNT_REP — (integer) DEFECTIVE_DIE_COUNT_REP as measured by the vendor.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.436 MEASURED_DEFECTIVE_DIE_DENSITY — (numeric) DEFECTIVE_DIE_DENSITY as measured by the vendor.

8.437 MEASURED_ETCH_DEPTH — (numeric) Phase shift etch depth as measured at a single site.

8.438 MEASURED_ETCH_DEPTH_AVERAGE — (numeric) Mean of all customer-specified etch depth measurement sites.

8.439 MEASURED_ETCH_DEPTH_ERROR — (numeric) ETCH_DEPTH_ERROR as measured by the vendor.

8.440 MEASURED_ETCH_DEPTH_MARK_LOCATION — (numeric) (x,y) ETCH_DEPTH_MARK_LOCATION as measured by the vendor.

8.441 MEASURED_ETCH_DEPTH_MARK_SITE_ID — (text) Must match ETCH_DEPTH_MARK_SITE_ID in <mask_order> for site being measured. If the customer assigned no ETCH_DEPTH_MARK_SITE_ID for the required location (e.g., only ETCH_DEPTH_MARK_LOCATION_DRAWING was used), the vendor will assign a MEASURED_ETCH_DEPTH_MARK_SITE_ID for each measurement location so that it is unique within the MASK_SET_ID.

8.442 MEASURED_ETCH_DEPTH_RANGE — (numeric) ETCH_DEPTH_RANGE as measured by the vendor.

8.443 MEASURED_ETCH_DEPTH_TOLERANCE — (numeric) ETCH_DEPTH_TOLERANCE as measured by the vendor. If the mean etch depth is greater than the target, then reported value will be positive; if the mean etch depth is less than the target, then reported value will be negative.

8.444 MEASURED_HORIZONTAL_CD — (numeric) Measured value of horizontal critical dimension.

8.445 MEASURED_INSPECTION_AREA — (numeric) (x1,y1,x2,y2) Window used by mask supplier for defect inspection, relative to the nominal center of mask (chrome side up).

8.446 MEASURED_INSPECTION_AREA_EXCLUDE — (numeric) (x1,y1,x2,y2) Window excluded from defect inspection, relative to the nominal center of mask (chrome side up).

8.447 MEASURED_PERCENT_CLEAR — (numeric) PERCENT_CLEAR as computed by the vendor. As a <mask_option>, the calculation should encompass all the area within the scribe pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW) and should take into account overlapping patterns on the mask. As a <pattern_option> for a CELL_ID, the calculation should encompass all the area within the cell’s pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW) and should take into account overlapping patterns on the mask.

8.448 MEASURED_PERCENT_DEFECTIVE_DIE — (numeric) PERCENT_DEFECTIVE_DIE as measured by the vendor.

8.449 MEASURED_PHASE_ANGLE — (numeric) Phase angle as measured at a single site.

8.450 MEASURED_PHASE_ANGLE_AVERAGE — (numeric) Mean of all customer-specified phase angle measurement sites.

8.451 MEASURED_PHASE_ANGLE_ERROR — (numeric) PHASE_ANGLE_ERROR as measured by the vendor.

8.452 MEASURED_PHASE_ANGLE_MARK_LOCATION — (numeric) (x,y) PHASE_ANGLE_MARK_LOCATION as measured by the vendor.

8.453 MEASURED_PHASE_ANGLE_MARK_SITE_ID — (text) Must match PHASE_ANGLE_SITE_ID in <mask_order> for site being measured. If the customer assigned no PHASE_ANGLE_SITE_ID for the required location (e.g., only PHASE_ANGLE_MARK_LOCATION_DRAWING was used), the vendor will assign a MEASURED_PHASE_ANGLE_MARK_SITE_ID for each measurement location so that it is unique within the MASK_SET_ID.

8.454 MEASURED_PHASE_ANGLE_RANGE — (numeric) PHASE_ANGLE_RANGE as measured by the vendor.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.455 MEASURED_PHASE_ANGLE_TOLERANCE — (numeric) PHASE_ANGLE_TOLERANCE as measured by the vendor. If the mean phase angle is greater than the target, then reported value will be positive; if the mean phase angle is less than the target, then reported value will be negative.

8.456 MEASURED_REGISTR_CLOSURE — (numeric) (x,y) REGISTR_CLOSURE as measured by the vendor in both axes.

8.457 MEASURED_REGISTR_ERROR — (numeric) REGISTR_ERROR as measured by the vendor. This is the maximum registration deviation (positive or negative in either x or y) of any measured registration mark.

8.458 MEASURED_REGISTR_FILE_NAME — (text) Name of data file containing results of registration measurement.

8.459 MEASURED_REGISTR_MARK_ERROR — (numeric) (x,y) Registration error of an individual mark.

8.460 MEASURED_REGISTR_MARK_ID — (text) Must match REGISTR_MARK_ID in <mask_order> for site being measured. If the customer assigned no REGISTR_MARK_ID for the required location (e.g., only MEASURE_FILE_NAME was used), the vendor will assign a MEASURED_REGISTR_MARK_ID for each measurement location so that it is unique within the MASK_SET_ID. If REGISTR_MARK_ID was used as a <pattern_options> in <mask_order> for a pattern with multiple instances, then the vendor will add a suffix to REGISTR_MARK_ID for each instance so that each MEASURED_REGISTR_MARK_ID in <mask_results> will be unique. If REGISTR_MARK_ID was used with REGISTR_MARK_SEPARATION and REGISTR_MARK_COUNT in <mask_order>, then the vendor will add a suffix to REGISTR_MARK_ID for each instance so that each MEASURED_REGISTR_MARK_ID in <mask_results> will be unique.

8.461 MEASURED_REGISTR_MARK_LOCATION — (numeric) (x,y) Location of individual registration mark, relative to nominal center of substrate (chrome side up), as measured by the vendor. This is the location of the mark as measured by the vendor.

8.462 MEASURED_REGISTR_MARK_RESIDUAL — (numeric) (x,y) Registration error of an individual mark after removing scale and orthogonality.

8.463 MEASURED_REGISTR_MINIMUM — (numeric) (x,y) Measured minimum error of all registration measurements in both x and y. Note that the location of the minimum in x is probably not at the same location as the minimum in y.

8.464 MEASURED_REGISTR_MAXIMUM — (numeric) (x,y) Measured maximum error of all registration measurements in both x and y. Note that the location of the maximum in x is probably not at the same location as the maximum in y.

8.465 MEASURED_REGISTR_ORTHO — (numeric) REGISTR_ORTHO as measured by the vendor.

8.466 MEASURED_REGISTR_RELATIVE — (numeric) REGISTR_RELATIVE as measured by the vendor.

8.467 MEASURED_REGISTR_RESIDUAL — (numeric) (x,y) REGISTR_RESIDUAL as measured by the vendor.

8.468 MEASURED_REGISTR_RESIDUAL_THREE_SIGMA — (numeric) (x,y) REGISTR_RESIDUAL_THREE_SIGMA as measured by the vendor.

8.469 MEASURED_REGISTR_SCALE — (numeric) (x,y) REGISTR_SCALE as measured by the vendor.

8.470 MEASURED_REGISTR_THREE_SIGMA — (numeric) (x,y) REGISTR_THREE_SIGMA as measured by the vendor.

8.471 MEASURED_REGISTR_TOLERANCE — (numeric) (x,y) The mean measured registration error in both x and y. Deviations for which the measured location is to the right or above the reference grid or reference mask are considered positive; measured locations to the left or below the reference grid or reference mask are considered negative.

8.472 MEASURED_TRANSMISSION — (numeric) Phase shift transmission as measured at a single site.

8.473 MEASURED_TRANSMISSION_AVERAGE — (numeric) Mean of all customer-specified transmission measurement sites.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.474 MEASURED_TRANSMISSION_ERROR — (numeric) TRANSMISSION_ERROR as measured by the vendor.

8.475 MEASURED_TRANSMISSION_MARK_LOCATION — (numeric) (x,y) TRANSMISSION_MARK_LOCATION as measured by the vendor.

8.476 MEASURED_TRANSMISSION_MARK_SITE_ID — (text) Must match TRANSMISSION_MARK_SITE_ID in <mask_order> for site being measured. If the customer assigned no TRANSMISSION_MARK_SITE_ID for the required location (e.g., only TRANSMISSION_MARK_LOCATION_DRAWING was used), the vendor will assign a MEASURED_TRANSMISSION_MARK_SITE_ID for each measurement location so that it is unique within the MASK_SET_ID.

8.477 MEASURED_TRANSMISSION_RANGE — (numeric) TRANSMISSION_RANGE as measured by the vendor.

8.478 MEASURED_TRANSMISSION_TOLERANCE — (numeric) TRANSMISSION_TOLERANCE as measured by the vendor. If the mean transmission is greater than the target, then reported value will be positive; if the mean transmission is less than the target, then reported value will be negative.

8.479 MEASURED_VERTICAL_CD — (numeric) Measured value of vertical critical dimension.

8.480 MFG_BIAS_PREAPPLIED — (numeric) Amount (in microns, prior to scaling) of sizing pre-applied by the customer to support mask processing of CD_DATA to achieve CD_TARGET. A negative MFG_BIAS_PREAPPLIED indicates that the digitized geometry has been made smaller. If used as a <mask_option>, it is to be assumed that any <standard_pattern> has NOT been pre-biased.

8.481 MFG_SITE_REQD — (text) Identification of qualified manufacturing sites, to be agreed between customer and vendor. For a given MASK_ID, MFG_SITE_REQD may not be used in combination with EQUIP_SITE_REQD.

8.482 MFG_SITE_USED — (text) Identification of manufacturing site used, to be agreed between customer and vendor.

8.483 MILESTONE — (text) [ORDER_RECEIVED | ORDER_ACCEPTED | DATA_PREPARED | MASK_WRITTEN | CDS_MEASURED | REGISTR_MEASURED | DEFECTS_REPAIRED | PELLICLES_APPLIED | POST_PELLICLE_INSPECTION | SHIPPED | DELIVERED | ON_HOLD | OFF_HOLD] notifies the customer that the MASK_ID has passed the indicated processing step, or is on hold.

8.484 MILESTONES — (Boolean) If T, the vendor is requested to use <mask_results> (see § 7.5) to notify the customer each time the mask completes a significant processing step. Within this standard, these significant steps are limited to those defined under MILESTONE. MILESTONES may not be used in combination with PERIODIC_UPDATES for the same MASK_ID.

8.485 MIN_CORNER_TO_CORNER_GAP — (numeric) Smallest (scaled) corner-to-corner spacing of any features included in any customer-supplied pattern data on the mask.

8.486 MIN_MASK_FEATURE_SIZE — (numeric) Smallest (scaled) feature included in any customer-supplied pattern data on the mask.

8.487 MINIMUM_BINARY_TRANSMITTANCE — (numeric) (x,y) The minimum optical transmittance of the clear area of the patterned mask, where x is the transmittance and y is the nominal wavelength at which the transmittance is measured.

8.488 MINIMUM_COATING_OPTICAL_DENSITY — (numeric) In the opaque portion of the mask, the minimum optical density of a given coating as specified by the mask blank vendor if MASK_VENDOR_APPLIED = F, or the mask vendor if MASK_VENDOR_APPLIED = T. Optical density equals the log to the base 10 of the reciprocal of the transmittance.

8.489 MINIMUM_FEATURE_LOCATION — (numeric) (x,y) Location of a minimally sized feature within the pattern file, relative to the center of the pattern, unscaled and unmirrored.

8.490 MINIMUM_FEATURE_SIZE — (numeric) Smallest (unscaled) feature included in pattern data, excluding OPC data which is identified under OPC_MINIMUM_FEATURE_SIZE.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.491 MIRROR — (text) [HORIZONTAL | VERTICAL] Axis around which to invert the data image.

8.492 MIRROR_MASK — (Boolean) If T, all patterns and titles must be mirrored about the vertical axis, to be applied in addition to all other positioning information.

8.493 MIRROR_PATTERN — (Boolean) If T, the pattern file (or cell) is to be mirrored about its vertical axis. If used in conjunction with MIRROR_MASK, the result will be unmirrored pattern data while all other data will be mirrored.

8.494 MIRROR_TITLE — (Boolean) If T, TITLE_TEXT is to be mirrored about the vertical axis. If used in conjunction with MIRROR_MASK, result will be an unmirrored title with all other data mirrored (chrome side up).

8.495 MULTI_LAYER_FIELD — (text) If present, identifies the pattern or cell which comprises a separately exposable patterned area on the mask so the field can be identified for such purposes as which field is to be used for which patterning step of wafer manufacturing, or reporting such measurements as MEASURED_PERCENT_CLEAR. The data value may be any identifying string the customer chooses.

8.496 MULTI_LAYER_MASK — (text) If present, indicates that the mask has separately exposable patterned areas on the mask. The data value could be the number of fields which are separately exposable, or it could be any identifying string the customer chooses. It should be noted that multi-product reticles are not to be identified with the MULTI_LAYER_MASK keyword unless the separate products are contained in separately exposable patterned areas on the mask. Nevertheless, individual products on a multi-product reticle could have MULTI_LAYER_FIELD associated with an individual pattern, pattern_group or cell to facilitate identification of which field contains which product, or reporting such measurements as MEASURED_PERCENT_CLEAR for each product.

8.497 MULTIWRITE — (integer) (x,y) If present as a mask option, then the MASK_ID represents only one writing operation for a mask which requires multiple write and process cycles (defined within the <mask_group>) before the final mask is completed. All MASK_IDs used to make the final mask must have MULTIWRITE as a <mask_option> and must designate the same integer group number (x). Such a final mask will be built with a specified integer sequence (y) of MASK_IDs. Sequence numbers may never be less than 1 nor more than the number of write and process cycles specified in the order, except that zero may be used where the sequence is arbitrary. A sequence number within a group may not be repeated (except zero).

8.498 NUMBER_OF_CDS — (integer) The number of CD locations to be measured. If sufficient specific sites are not explicitly identified by the customer, the vendor is free to select additional similar sites. (This corresponds to “number of measurement points” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.499 OPC_MINIMUM_FEATURE_SIZE — (numeric) For the OPC_TYPE being described, the size of the smallest (unscaled) OPC feature in the pattern data.

8.500 OPC_MINIMUM_GAP — (numeric) For the OPC_TYPE being described, the size of the smallest (unscaled) gap in the pattern data between OPC features of the same type.

8.501 OPC_PATTERN_MODIFIABLE — (Boolean) If F, the pattern may not be modified (biased) by the mask shop for printability or CD linearity improvement. In this case, the need for such biasing must have been anticipated by the customer. The default value is T.

8.502 OPC_PATTERN_SEPARATE — (Boolean) If T, then the pattern being described is only the OPC portion of what will be written on the mask. Depending upon the write tool methodology, the pattern may need to be merged off-line with other patterns. This may allow mask shop biasing for printability or CD linearity unless precluded by OPC_PATTERN_MODIFIABLE = F.

8.503 OPC_TYPE — (text) [CLEAR_SERIF | CLEAR_HAMMERHEAD | CLEAR_ASSIST_BAR | OPAQUE_SERIF | OPAQUE_HAMMERHEAD | OPAQUE_ASSIST_BAR | JOG | PILLAR | HOLE] Note that linewidth biasing is not included as an OPC type.

8.504 OPERATOR — (text) Mask supplier identification of employee who completed the photomask requirements for the given operation.

8.505 OPERATOR_NAME — (text) Name of the person entering the mask order or entering the mask results.

8.506 OPTICAL_MASK_ID — (integer) For optical stepping or contact printing, the “pattern” is to be obtained by using a reticle or mask built as this MASK_ID within MASK_SET_ID.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.507 OPTICAL_MASK_SET_ID — (text) For optical stepping or contact printing, the “pattern” is to be obtained by using a reticle or mask within this MASK_SET_ID.

8.508 OPTICAL_MASK_TITLE — (text) For optical stepping or contact printing, identifying title on reticle or mask. To be used in place of OPTICAL_MASK_SET_ID and OPTICAL_MASK_ID when the reticle or mask was built without available <mask_order> data.

8.509 ORDER_ID — (text) Printable text of the customer’s internal order identification to provide correlation with pre-existing order tracking systems. This is for customer cross-referencing only, but should be recorded by the vendor and reported back in <mask_results>.

8.510 PACKAGE — (text) Identification of brand and model of acceptable compact to be used for delivering masks.

8.511 PACKAGE_USED — (text) The compact vendor’s part number of the compact in which the mask was shipped and any additional compacts supplied.

8.512 PARAMETER_FILE_NAME — (text) Name of parameter file required by RUNSET_NAME. Note that multiple run_set_name entries under a SOFTWARE_NAME means that multiple runs with the same software are required.

8.513 PARAMETER_FILE_REVISION — (text) Revision identification of PARAMETER_FILE_NAME.

8.514 PATTERN_ADDRESS_SIZE — (numeric) Address unit of the (unscaled) pattern file. If this is incorrect, the mask will not be written until it is corrected. For data manipulation operations, this is the address to use in final fracturing to produce a pattern file for exposure.

8.515 PATTERN_APPROVAL_REQD — (text) Name of the pattern to be approved before the mask(s) may be written.

8.516 PATTERN_APPROVED — (date) Date approval was granted by customer for PATTERN_APPROVAL_REQD.

8.517 PATTERN_CHARACTER_SET — (text) [ASCII | EBCDIC] ASCII is assumed unless otherwise specified.

8.518 PATTERN_EXPORT_NUMBER — (text) (agency,number) Identifies the applicable export control entity (agency) and the export control number (number, which can be any printable/displayable text) to allow for export control of pattern data.

8.519 PATTERN_FIGURE_OVERLAP — (Boolean) If T, overlapping geometries within the pattern file are allowed. If F, such overlapping geometries should be considered an error and the mask should not be written until the error is resolved.

8.520 PATTERN_FILE_OVERLAP — (text) [ ERROR | MERGE ] If pattern files are found to overlap one another, a mask layout error should be assumed unless the value of this parameter is MERGE, in which case a logical OR should be applied before or during writing. The default value is ERROR, in which case the mask should not be written until the error is resolved.

8.521 PATTERN_FORMAT — (text) [ALF | APPLICON | AUTOCAD | CATS_CFLT | CATS_CREF | CIF | DERIVED | EEBES | ELECTROMASK | FALCON | GDS-II | HITACHI_700 | HITACHI_800 | JEOL_51 | JEOL_52 | KLARIS | MANN_3000 | MANN_3600 | MEBES_I | MEBES_II | MEBES_EXTENDED | MEBES_RETICLE | MEBES_MODE_5 | OASIS | OASIS_MASK | ORBOT | ULTRABEAM | VSB11 | ZBA | ... ] Format of preceding pattern file. For <data_manipulation> results, if multiple PATTERN_FORMATS are listed, they are in declining order of preference. For BOOLEAN operations, DERIVED indicates DATA_SOURCE_FILE was the result of a previous <data_manipulation> process.

8.522 PATTERN_FUNCTION — (text) [FRAME | DEVICE | FIDUCIAL | BARCODE | TEST | … ] This keyword is for reference purposes only, with no action or requirement implied for the mask supplier. It will serve merely to provide a functional name for customer convenience.

8.523 PATTERN_GENERATION_AREA — (numeric) (x1,y1,x2,y2) Window in which to generate a digitized rectangle for use in BOOLEAN operations, relative to the coordinate space of DATA_SOURCE_FILE.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.524 PATTERN_GROUP_ID — (text) Name of the pattern group which follows; must be used in all references within this MASK_SET_ID to this pattern group.

8.525 PATTERN_GROUP_INSTANCE — (text) Identifies PATTERN_GROUP_ID to be placed by the following location information.

8.526 PATTERN_NAME — (text) Pattern file name. The file may be received intact (as either DATA_SOURCE_FILE or STD_PATTERN_NAME), or may be derived through data manipulation.

8.527 PATTERN_PLOT_APPR_REQD — (Boolean) If T, customer approval of the pattern plot is required before mask making is authorized.

8.528 PATTERN_PLOT_NORMAL_TONE — (Boolean) If T, digitized data will be dark.

8.529 PATTERN_UNITS — (text) [METRIC | ENGLISH] Units of preceding pattern file. If METRIC, then microns are assumed; if ENGLISH, then mils are assumed.

8.530 PATTERN_VISUAL_ID — (text) Description of the feature within the pattern file which must be visually confirmed as present before the mask may be written. If the feature is not present, the mask order should go on hold.

8.531 PERCENT_CLEAR — (numeric) Percentage of the patterned area which will become transparent after the mask is processed. As a mask option it includes all the area within the scribe pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW). As a pattern option it includes the area within the individual pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW).

8.532 PERCENT_CLEAR_REQUESTED — (Boolean) If T, the vendor is requested to calculate, using available CAD tools, the percentage of the patterned area on the mask which will become transparent after the mask is processed, and transmit this value to the customer. The calculation should encompass all the area within the scribe pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW) and should take into account overlapping patterns on the mask. As a pattern option it includes the area within the individual pattern limits (or as explicitly defined by PERCENT_CLEAR_WINDOW).

8.533 PERCENT_CLEAR_WINDOW — (numeric) (x1,y1,x2,y2) Window coordinates over which PERCENT_CLEAR or MEASURED_PERCENT_CLEAR has been calculated, or the PERCENT_CLEAR_REQUESTED is to be calculated, relative to the nominal center of the mask.

8.534 PERCENT_DEFECTIVE_DIE — (numeric) Maximum percentage of defective die among those required by the customer to meet defect criteria.

8.535 PERIODIC_UPDATE — (text) Notifies the customer that MASK_ID has passed the indicated processing step, or is on hold.

8.536 PERIODIC_UPDATES — (integer) If non-zero, the vendor is requested to use <mask_results> (see § 7.5) to notify the customer on a periodic basis which significant processing step was last completed for MASK_ID. The value of the data field indicates the number of hours between updates. Within this standard, these significant steps are limited to those defined under MILESTONE. PERIODIC_UPDATES may not be used in combination with MILESTONES for the same MASK_ID.

8.537 PHASE_ANGLE_EQUIP_REQD — (text) Phase angle measurement equipment required by customer.

8.538 PHASE_ANGLE_EQUIP_USED — (text) Phase angle measurement equipment used.

8.539 PHASE_ANGLE_ERROR — (numeric) Maximum acceptable deviation (in degrees) of any phase shift measurement from the PHASE_ANGLE_TARGET.

8.540 PHASE_ANGLE_MARK_DRAWING — (text) The uniquely identified (for each customer) document which shows the phase angle mark structure itself, and may show the place(s) within the phase angle mark which are to be measured.

8.541 PHASE_ANGLE_MARK_FEATURE — (text) Description of the feature to be used for phase angle measurement.

8.542 PHASE_ANGLE_MARK_LOCATION — (numeric) (x,y) Location of phase angle mark relative to the nominal center of the mask (chrome side up), or the center of the pattern if under <pattern_options>.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.543 PHASE_ANGLE_MARK_LOCATION_DRAWING — (text) The uniquely identified (for each customer) document which shows the location(s) of the phase angle mark structure.

8.544 PHASE_ANGLE_MEASUREMENT_DATE — (date) Phase angle measurement date.

8.545 PHASE_ANGLE_MEASUREMENT_FILE_NAME — (text) Name of data file containing results of phase angle measurement.

8.546 PHASE_ANGLE_MODE_REQD — (text) Operating mode required by customer for PHASE_ANGLE_EQUIP_USED.

8.547 PHASE_ANGLE_MODE_USED — (text) Operating mode used on PHASE_ANGLE_EQUIP_USED.

8.548 PHASE_ANGLE_RANGE — (numeric) Maximum acceptable variation (in degrees) of phase shift measurements, relative to each other.

8.549 PHASE_ANGLE_REFERENCE_ONLY — (Boolean) If T, indicates that the phase angle feature is to be measured and the data transmitted to the customer (if requested by SHIP_PHASE_SHIFT_MEASUREMENTS), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.550 PHASE_ANGLE_SITE_ID — (text) Unique identifier of each phase angle measurement location within MASK_SET_ID to identify individual locations when using <mask_results>. If the same coordinates apply to locations on different masks within the mask set, they may have the same PHASE_ANGLE_SITE_ID, but it is not mandatory.

8.551 PHASE_ANGLE_TARGET — (numeric) The required phase shift in degrees at the specified PSM_WAVELENGTH.

8.552 PHASE_ANGLE_TOLERANCE — (numeric) The maximum acceptable deviation of the mean of all phase shift measurements (in degrees) to the PHASE_ANGLE_TARGET.

8.553 PHASE_SHIFT_QUALITY_ID — (text) Customer’s label for a collection of phase shift quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. This may not be used in combination with QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.554 PLACEMENT_TOP_CELL — (text) Name of CELL_ID which defines all pattern placements for this MASK_GROUP_ID. This referenced cell is centered on the mask.

8.555 PLOT_FORMAT — (text) [GIF | JPG | PNG | FAX | PAPER] Medium for delivery of plot.

8.556 PLOT_SCALE — (numeric) Scale of plot or map.

8.557 PLOT_TYPE — (text) [JOB_DATA | ARRAY | PATTERN | BARCODE] Requires delivery of the plot to the customer. JOB_DATA requires delivering a plot of the entire patterned area of the mask, including the image of the pattern file data. ARRAY requires an array map to be sent showing only an outline of each pattern and not showing the image content of any pattern. PATTERN requires delivering a plot of the pattern at the scale and tone indicated. BARCODE requires delivering a plot of the pattern created by <barcode_data>. PATTERN is the only value permitted under <pattern_options>. The other types are permitted only under <shippable_data>.

8.558 PO_NUMBER — (text) Purchase order number.

8.559 POLARIZATION — (text) [HORIZONTAL | VERTICAL] If present, this type of polarization indicated must be used when aerial image measurements are being taken.

8.560 POST_PELL_INSPECTION_DATE_AND_TIME — (date) Date and time of the final qualifying inspection run after applying the pellicle.

8.561 POST_PELL_INSPECTION_ID — (text) Identification (or serial number) assigned by the inspection tool for the final qualifying inspection run after applying the pellicle.

8.562 PRE_PELL_INSPECTION_DATE_AND_TIME — (date) Date and time of the final qualifying inspection run prior to applying the pellicle.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.563 PRE_PELL_INSPECTION_ID — (text) Identification (or serial number) assigned by the inspection tool for the final qualifying inspection run prior to applying the pellicle.

8.564 PRICE — (numeric) Price (excluding freight and taxes) for preceding item (e.g., mask, pellicle, plot, database inspection).

8.565 PRICE_UNITS — (text) 3-character alphabetic currency code as listed in ISO 4217. Monetary unit used in all references to PRICE with the <mask_set>. The default is USD, but explicit inclusion of PRICE_UNITS in the order file is encouraged.

8.566 PROCESS — (text) Name of the special process to be used in making the masks.

8.567 PROCESS_ETCHING_TYPE — (text) [DRY | WET] Etching process to be used in making the masks.

8.568 PRODUCT_AS_DUPLICATE — (text) [CHECKPLATE | BACKUP | COPY] CHECKPLATE indicates the product mask is to be used for checkplate approval prior to making other product masks. BACKUP means the mask is to be written and processed as a redundant copy for another mask as insurance that a good mask can be delivered on schedule. COPY indicates the mask is being built as a redundant copy, but both masks are to be delivered.

8.569 PRODUCT_IMAGING_TYPE — (text) [BINARY | AAPSM | EAPSM | COMPLIMENTARY COMPLEMENTARY | BINARY_TRIM | CHROMELESS | CHROMELESS_PSM | EUV | STENCIL | SCREEN]. Note that CHROMELESS applies to imprint masks or other etched quartz masks, and CHROMELESS_PSM applies to phase shift masks with an open quartz edge.

8.570 PRODUCT_MAGNIFICATION — (text) [10X | 5X | 4X | 2.5X | 2X | 1.25X | 1X | 0.8X | ... ] Factor by which the exposure tool will reduce the image on the photomask (reticle) to form the image on the wafer.

8.571 PRODUCT_TYPE — (text) [1X_FULL_FIELD | 1X_STD_FIELD_RETICLE | 1X_WIDE_FIELD_RETICLE | RETICLE | CONTACT | SUBMASTER | CHECKPLATE | PROBE_PLATE].

8.572 PSM_WAVELENGTH — (numeric) Wavelength in nanometers to be used for <phase_shift> measurements. This keyword may appear in addition to AIM_WAVELENGTH for a single MASK_ID, though the values of the two should usually be the same.

8.573 PTC_FIXED — (numeric) The additional charge for the mask shipping within the time defined in the corresponding PTC_HOURS. The value is expressed as a fixed monetary amount and is mutually exclusive with PTC_RATE.

8.574 PTC_HOURS — (numeric) The number of hours from a given mask’s start date time (as negotiated between the customer and vendor) within which the mask must be shipped to qualify for the Premium Time Charge (PTC) specified in either PTC_RATE or PTC_FIXED. Multiple instances allow configuration of different charge rates for different levels of performance, for example: 100% for 12 hr turn, 75% for 18 hr turn, 50% for 24 hr turn.

8.575 PTC_RATE — (numeric) The additional charge for the mask shipping within the time defined in the corresponding PTC_HOURS. The value represents the percentage of the total mask price (excluding EWT_THRESHOLD hours) and is mutually exclusive with PTC_FIXED.

8.576 QS9000 — (Boolean) If T, requires QS9000 control. Customer and vendor should agree on the methods and control details before using this item.

8.577 QUALITY_GROUP_ID — (text) Customer’s label for a collection of mask quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.578 QUANTITY — (integer) Number of array plots and pattern plots. May also apply to masks only when PRODUCT_TYPE is CONTACT.

8.579 QUOTE_NUMBER — (text) Vendor’s quotation number to be referenced in billing documents.

8.580 REGISTR_ALGORITHM_TYPE — (text) [ONE-POINT | TWO-POINT | MULTI-POINT] Specifies the method for analyzing registration reference marks. For ONE-POINT or TWO-POINT analysis, REGISTR_ALGORITHM_COORDINATES is required and must contain two ordered pair coordinates. For

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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MULTI-POINT analysis, REGISTR_ALGORITHM_COORDINATES is optional but, if present, must contain three or more ordered pair coordinates.

8.581 REGISTR_ALGORITHM_COORDINATES — (numeric) (x1,y1,x2,y2, … ) For ONE-POINT analysis, (x1,y1) is the fixed point and (x2,y2) is used for angular orientation only. For TWO-POINT analysis, (x1,y1) and (x2,y2) are both used for angular orientation and the fixed reference point is midway between the two. For MULTI-POINT analysis, if REGISTR_ALGORITHM_COORDINATES is absent, then MULTI-POINT is the fit of all measured points resulting in zero mean error in x and zero mean error in y. For MULTI-POINT analysis, if REGISTR_ALGORITHM_COORDINATES is present, it must contain three or more ordered pair coordinates, and MULTI-POINT is the fit of all the specific points resulting in zero mean error in x and zero mean error in y for those points. All of these coordinate points are relative to the nominal center of the mask. Note that a comma is required between the analysis method and the first coordinate pair.

8.582 REGISTR_ALGORITHM_USED — (text) [ONE-POINT | TWO-POINT | MULTI-POINT] The method used for analyzing registration reference marks in the registration measurements.

8.583 REGISTR_ANISOTROPIC_SCALE — (numeric) Maximum acceptable difference in scale error between the two axes of REGISTR_SCALE in parts per million, relative to the REGISTR_STD_GRID or REGISTR_REF_METHOD_REQD. This is an absolute value (i.e., always positive).

8.584 REGISTR_ANISOTROPIC_SCALE_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_ANISOTROPIC_SCALE is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.585 REGISTR_CLOSURE — (numeric) Maximum allowable positional error between patterns written at the beginning of writing the mask and the end of writing the mask, to be measured in both x and y axes.

8.586 REGISTR_CLOSURE_BEGIN — (text) Identifies the CELL_ID or PATTERN_GROUP_ID to be used at the beginning of writing the mask for REGISTR_CLOSURE measurement.

8.587 REGISTR_CLOSURE_END — (text) Identifies the CELL_ID or PATTERN_GROUP_ID to be used at the end of writing the mask for REGISTR_CLOSURE measurement.

8.588 REGISTR_CLOSURE_EQUIP_REQD — (text) Identification of acceptable equipment for closure measurement.

8.589 REGISTR_CLOSURE_EQUIP_USED — (text) Closure measurement equipment used.

8.590 REGISTR_CLOSURE_REFERENCE_ONLY — (Boolean) If T, indicates that the closure measurements are to be measured and the data transmitted to the customer (if requested by SHIP_CLOSURE_DATA), but that deviations in its measured value due to mask manufacturing would NOT be cause for mask rejection.

8.591 REGISTR_COMPENSATION_TEMPERATURE — (numeric) Temperature in Celsius of the mask at the time registration measurement data is to be collected.

8.592 REGISTR_EQUIP_REQD — (text) Identification of acceptable equipment for measuring REGISTR_ERROR and REGISTR_ORTHO.

8.593 REGISTR_EQUIP_USED — (text) Registration measurement equipment used.

8.594 REGISTR_ERROR — (numeric) Maximum allowable registration error, relative to the REGISTR_REF_MASK_ID or the reference grid of REGISTR_EQUIP_REQD. The mask must be rejected if the deviation in either x or y of any measured registration mark exceeds REGISTR_ERROR.

8.595 REGISTR_ERROR_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_ERROR is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.596 REGISTR_MARK_COUNT — (integer) (x,y) For a rectangular array of registration marks, the number of rows (x) and columns (y). The registration mark array defined by REGISTR_MARK_SEPARATION and REGISTR_MARK_COUNT must be preceded by REGISTR_MARK_ID to establish the origin of the array.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.597 REGISTR_MARK_DRAWING — (text) The uniquely identified (for each customer) document which shows the registration mark structure itself, and may show the place(s) within the registration mark which are to be measured.

8.598 REGISTR_MARK_FEATURE — (text) Description of the feature to be used for registration measurement.

8.599 REGISTR_MARK_ID — (text) Unique identifier of each registration mark location within MASK_SET_ID to identify individual registration measurements when using <mask_results>. If the same coordinates apply to locations on different masks within the mask set, they may have the same REGISTR_MARK_ID, but it is not mandatory. REGISTR_MARK_ID may only be used immediately preceding either MASK_REGISTR_MARK or CELL_REGISTR_MARK. If REGISTR_MARK_ID is used with a MASK_REGISTR_MARK, it will be associated with as many mask locations as are defined by REGISTR_MARK_SEPARATION and REGISTR_MARK_COUNT. If REGISTR_MARK_ID is used with a CELL_REGISTR_MARK, it will be associated with as many mask locations as are defined by REGISTR_MARK_SEPARATION and REGISTR_MARK_COUNT, multiplied by the number of cell instances. (See MEASURED_REGISTR_MARK_ID for more information on naming of the individual sites for measurement reporting in <mask_results>.)

8.600 REGISTR_MARK_LOCATION_DRAWING — (text) The uniquely identified (for each customer) document which shows the location(s) of the registration mark structure.

8.601 REGISTR_MARK_SEPARATION — (numeric) (x,y) For an array of registration marks, the spacing between successive marks in the horizontal (x) and vertical (y) directions. The registration mark array defined by REGISTR_MARK_SEPARATION and REGISTR_MARK_COUNT must be preceded by REGISTR_MARK_ID to establish the origin of the array.

8.602 REGISTR_MEASUREMENT_DATE — (date) Date registration measurement was performed.

8.603 REGISTR_ORTHO — (numeric) Maximum allowable non-orthogonality, in micro-radians, relative to the REGISTR_REF_MASK_ID or the reference grid of REGISTR_EQUIP_REQD.

8.604 REGISTR_ORTHO_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_ORTHO is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.605 REGISTR_QUALITY_ID — (text) Customer’s label for a collection of registration quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. This may not be used in combination with QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.606 REGISTR_REF_MASK_ID — (integer) MASK_ID of the reference mask for determining REGISTR_ERROR and REGISTR_ORTHO. If multiple masks are identified, the reference grid should be based on the mean of the measurements of the group of masks.

8.607 REGISTR_REF_MASK_NAME — (text) To be used in place of REGISTR_REF_MASK_ID only to refer to those mask sets which were built outside the SEMI order standard and have no MASK_ID.

8.608 REGISTR_REF_MASK_SET_ID — (text) MASK_SET_ID for the mask set containing REGISTR_REF_MASK_ID for determining REGISTR_ERROR and REGISTR_ORTHO.

8.609 REGISTR_REF_MASK_SET_NAME — (text) To be used in place of REGISTR_REF_MASK_SET_ID only to refer to those mask sets which were built outside the SEMI order standard and have no MASK_SET_ID.

8.610 REGISTR_REF_MASK_SET_VERSION — (text) To be used in addition to REGISTR_REF_MASK_SET_NAME only to refer to those mask sets which were built outside the SEMI order standard and have no MASK_SET_ID.

8.611 REGISTR_REF_METHOD_REQD — (text) [REGISTR_EQUIP_GRID | REGISTR_REF_MASK | ... ] Description of the method and/or reference marks to use for measuring REGISTR_ERROR and REGISTR_ORTHO (e.g., using a previously established reference, or the REGISTR_EQUIP_REQD grid). The default value is REGISTR_EQUIP_GRID.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.612 REGISTR_REF_METHOD_USED — (text) Description of the method and/or reference marks used by the vendor for measuring REGISTR_ERROR and REGISTR_ORTHO.

8.613 REGISTR_RELATIVE — (text) If present, indicates that the START_REGISTR collection in which REGISTR_RELATIVE is contained is to be measured relative to another START_REGISTR collection, rather than to the grid of the registration measurement tool. The data field of REGISTR_RELATIVE must match the data field of START_REGISTR of the collection to which it is to be compared.

8.614 REGISTR_RELATIVE_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_RELATIVE is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.615 REGISTR_RESIDUAL — (numeric) (x,y) The maximum acceptable deviation in both axes (in microns) of all registration measurements relative to the REGISTR_STD_GRID, with REGISTR_SCALE and REGISTR_ORTHO removed. The mask must be rejected if the residual deviation in either x or y of any measured registration mark exceeds REGISTR_RESIDUAL.

8.616 REGISTR_RESIDUAL_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_RESIDUAL is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.617 REGISTR_RESIDUAL_THREE_SIGMA — (numeric) (x,y) The maximum acceptable 3 sigma deviation in both axes (in microns) of all registration measurements, with REGISTR_SCALE and REGISTR_ORTHO removed. The mask must be rejected if the residual 3 sigma deviation in either x or y exceeds REGISTR_RESIDUAL.

8.618 REGISTR_RESIDUAL_THREE_SIGMA_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_RESIDUAL_THREE_SIGMA is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.619 REGISTR_SCALE — (numeric) (x,y) Maximum acceptable scale error in each axis in parts per million, relative to the REGISTR_STD_GRID or REGISTR_REF_METHOD_REQD.

8.620 REGISTR_SCALE_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_SCALE is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.621 REGISTR_STD_GRID — (text) [NIST | PTB | ... ] Reference standard to be used to correlate registration measurement. This keyword is not allowed in conjunction with REGISTR_REF_METHOD_REQD on the same mask.

8.622 REGISTR_STD_GRID_USED — (text) [NIST | PTB | ... ] The reference standard used to correlate the registration measurements.

8.623 REGISTR_THREE_SIGMA — (numeric) (x,y) The maximum acceptable 3 sigma deviation in both axes (in microns) of all registration measurements. Both the 3 sigma deviation in x and the 3 sigma deviation in y must be less than REGISTR_THREE_SIGMA for the mask to be acceptable.

8.624 REGISTR_THREE_SIGMA_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_THREE_SIGMA is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.625 REGISTR_TOLERANCE — (numeric) Maximum acceptable deviation of the mean registration error of all measured registration marks, in both axes, relative to the REGISTR_REF_MASK_ID or the reference grid of REGISTR_EQUIP_REQD. Both the mean in x and the mean in y must be less than REGISTR_TOLERANCE for the mask to be acceptable.

8.626 REGISTR_TOLERANCE_REFERENCE_ONLY — (Boolean) If T, indicates that REGISTR_TOLERANCE is to be measured and the data transmitted to the customer (if requested by SHIP_REGISTR_DATA), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.627 RELEASE_NUMBER — (text) Release number under BLANKET PO NUMBER.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.628 REPAIR_EQUIP_REQD — (text) Identification of acceptable equipment for repairing mask defects.

8.629 REPAIR_EQUIP_USED — (text) Identification of equipment used for repairing mask defects.

8.630 REPAIRS_AUTHORIZED — (Boolean) If F, customer approval is required before mask repairs can be made. The default value is T.

8.631 RESIST_THICKNESS — (numeric) Resist thickness in Angstroms.

8.632 RESIST_TYPE — (text) [POSITIVE | NEGATIVE] This data item is needed for <mask_order> only if overlapping patterns are required. (Overlapping patterns sometimes require the use of “blanking rectangles” to prevent exposure of areas which are to be exposed by another pattern.)

8.633 RESULT_FILE_NAME — (text) Name identifying the result output file for RUNSET_NAME. If this keyword appears in the <mask_order>, it must be explicitly referenced in a RUNSET_NAME and/or a PARAMETER_FILE_NAME.

8.634 RETROFIT_JOB_LEVEL — (numeric) Level in RETROFIT_JOB_NAME to which new mask(s) must retrofit.

8.635 RETROFIT_JOB_NAME — (text) Name of mask writing control file (job file) to which mask(s) must retrofit.

8.636 RETROFIT_MASK_ID — (integer) MASK_ID in RETROFIT_MASK_SET_ID to which new mask(s) must retrofit.

8.637 RETROFIT_MASK_NAME — (text) To be used in place of RETROFIT_MASK_ID only for retrofit to those mask sets which were built outside the SEMI order standard and have no MASK_SET_ID.

8.638 RETROFIT_MASK_SET_ID — (text) MASK_SET_ID of mask set to which new mask(s) must retrofit.

8.639 RETROFIT_MASK_SET_NAME — (text) To be used in place of RETROFIT_MASK_SET_ID only for retrofit to those mask sets which were built outside the SEMI order standard and have no MASK_SET_ID.

8.640 RETROFIT_MASK_SET_VERSION — (text) To be used in addition to RETROFIT_MASK_SET_NAME only for retrofit to those mask sets which were built outside the order standard and have no MASK_SET_ID.

8.641 REVIEW_REQD — (text) If present, indicates that a review will be required but that it need not be completed prior to building and/or shipping the masks. The data field describes the items to be reviewed.

8.642 ROTATE_TITLE — (integer) [0 | 90 | 180 | 270] Title is to be rotated clockwise the indicated number of degrees, prior to any mirroring. Note that this rotation direction is the opposite of both ROTATION (in SEMI P10) and TITLEROT in MEBES jobdecks.

8.643 ROTATE_TITLE_CHARACTERS — (integer) [0 | 90 | 180 | 270] Characters within the title are to be rotated clockwise the indicated number of degrees, prior to any mirroring.

8.644 ROTATION — (integer) [0 | 90 | 180 | 270] Angle in degrees at which an image is rotated counter-clockwise about its center, prior to mirroring.

8.645 RUNSET_NAME — (text) Name of instruction file (such as .cinc files or DRC run sets). Note that multiple RUNSET_NAME entries under a SOFTWARE_NAME means that multiple runs with the same software are required.

8.646 RUNSET_REVISION — (text) Revision identification of the RUNSET_NAME.

8.647 SCALE_FACTOR — (numeric) Magnification or demagnification factor to be multiplied with the PATTERN_ADDRESS_SIZE to get the effective address to be used to write the pattern file. Data value must be positive. 1.0 is assumed unless specified otherwise. SCALE_FACTOR alters both the size of individual geometries and the size of the pattern file or cell.

SCALE_FACTOR does not affect cell or pattern position information for a cell or pattern instance applied to a <pattern_group>, <pattern_instance> and/or <pattern_definition> does not affect the placement of the patterns within a cell; if SCALE_FACTOR is applied to both a <pattern_group> and a subsidiary <pattern_definition>,

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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the effect on geometry sizes would be cumulative; if SCALE_FACTOR is applied to both a <pattern_instance> and a subsidiary <pattern_group>, the effect on geometry sizes would also be cumulative.

SCALE_FACTOR applied to a <cell_definition> would affect the placement of all <cell_instance> and <pattern_instance> within the cell, as well as having a hierarchically cumulative effect on the geometry sizes of all patterns subsidiary to those instances.

SCALE_FACTOR applied to a <cell_instance> would affect the placement of all <cell_instance> and <pattern_instance> subsidiary to the referenced CELL_INSTANCE, as well as having a hierarchically cumulative effect on the geometry sizes of all patterns subsidiary to those instances.

If SCALE_FACTOR is applied to both a <cell_definition> and a subsidiary <cell_instance> and/or <pattern_instance>, the effect would also be cumulative.

8.648 SCRATCH_INSP_AREA — (numeric) (x1,y1,x2,y2) Unscaled coordinates of window for scratch inspection, lower left and upper right corners, relative to nominal center of mask (chrome side up).

8.649 SCRATCH_INSP_EXCLUDE — (numeric) (x1,y1,x2,y2) Unscaled coordinates of window to be excluded from defect inspection, relative to nominal center of mask (chrome side up), (see SCRATCH_INSP_AREA).

8.650 SCRATCH_SIZE_BACK — (numeric) Maximum dimension of smallest unacceptable scratch on glass side of mask.

8.651 SCRATCH_SIZE_FRONT — (numeric) Maximum dimension of smallest unacceptable scratch on patterned side of mask.

8.652 SCRIBE_INSIDE_CORNERS — (numeric) (x1,y1,x2,y2) The inner limits of the SCRIBE_TONE frame to be built for the dropout by the vendor. It consists of two pairs of coordinates: the lower-left and upper-right and these are relative to the DROPOUT window center.

8.653 SCRIBE_OUTSIDE_CORNERS — (numeric) (x1,y1,x2,y2) The outer limits of the SCRIBE_TONE frame to be built for the dropout by the vendor. It consists of two pairs of coordinates: the lower-left and upper-right and these are relative to the DROPOUT window center.

8.654 SCRIBE_TONE — (text) [CLEAR | DARK] Border surrounding DROPOUT on mask is to be either clear or dark.

8.655 SECURITY_CLASS — (text) [QML | SECRET | TOP_SECRET | CCI | COMSEC | SECURE | ITAR] Security classification of mask set or individual mask.

8.656 SEM_PHOTO_LOCATION — (numeric) (x,y) Location of SEM photographing location relative to the nominal center of the mask (chrome side up).

8.657 SEM_PHOTO_MATRIX_FILENAME — (text) Name of file to be used for SEM photograph locations. It is not to be used in conjunction with SEM_PHOTO_LOCATION within the same START_SEM_PHOTO to END_SEM_PHOTO set.

8.658 SEM_PHOTO_ROTATION — (numeric) Angle in degrees at which a SEM Photo Image output is rotated about the z-axis of the mask. Angles are to be counter-clockwise with zero degrees as the regular orientation of the mask as written.

8.659 SEM_PHOTO_SCALE — (numeric) Scale of the SEM photograph image.

8.660 SEM_PHOTO_SITE_ID — (text) Unique identifier of each SEM photographing location within MASK_SET_ID to identify individual SEM photo locations when using <mask_data>. If the same coordinates apply to locations on different masks within the mask set, they may have the same SEM_PHOTO_SITE_ID, but it is not mandatory.

8.661 SEM_PHOTO_TILT — (numeric) Angle in degrees at which a SEM Photo Image output is tipped away from normal to the x/y plane of the mask.

8.662 SEMI_REVISION — (text) [P10-0709xxxx] Revision identification of the SEMI standard according to which the transmitted P10 data file was constructed. This revision is P10-0709xxxx. Note that in <mask_results>

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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SEMI_REVISION represents the construction of the <mask_results> file, not the construction of the <mask_order> file which caused the mask to be ordered.

8.663 SEND_FINAL_AUDIT_DATE_TIME — (Boolean) If T, requires delivery of FINAL_AUDIT_DATE_TIME to the customer.

8.664 SEND_MASK_SHIPPED_DATE_TIME — (Boolean) If T, requires delivery of MASK_SHIPPED_DATE_TIME to the customer.

8.665 SERIAL_NUMBER — (Boolean) If T, a mask serial number must be included on the mask.

8.666 SERVICE_TYPE — (text) [REPELLICLIZE | REINSPECT | CLEAN] Operation to be performed by mask supplier.

8.667 SEVERITY_CRITERION_REQD — (text) [PASS | WARN | FAIL] Setup parameter required for inspection.

8.668 SEVERITY_CRITERION_USED — (text) [PASS | WARN | FAIL] Setup parameter used for inspection.

8.669 SHIP_AIM_DATA — (Boolean) If T, requires delivery of <wafer_exposure_information>, <aerial_image_info> and any output of the final inspection using the aerial imaging measurement tool.

8.670 SHIP_ARRAY_REGISTR_MAP — (Boolean) If T, requires delivery of the registration map of the entire array to the customer.

8.671 SHIP_CD_DATA — (Boolean) If T, requires delivery of all critical dimension measurements, criteria and evaluation data to the customer for all CD criteria specified.

8.672 SHIP_CD_PRINTOUT — (Boolean) If T, requires delivery to the customer of the printout from the CD measurement tool.

8.673 SHIP_CD_UNIFORMITY_MAP — (Boolean) If T, requires delivery to the customer of the uniformity map from the CD uniformity measurement tool.

8.674 SHIP_CENTRALITY_DATA — (Boolean) If T, requires delivery of the centrality measurement to the customer.

8.675 SHIP_CENTRALITY_MAP — (Boolean) If T, requires delivery of the centrality map to the customer.

8.676 SHIP_CERTIFICATE_OF_CONFORMANCE — (Boolean) If T, requires delivery of a certificate of conformance to the customer.

8.677 SHIP_CLOSURE_DATA — (Boolean) If T, requires delivery of closure measurement data to the customer.

8.678 SHIP_CUSTOMER_QUALITY_FORM — (text) If present, the data field specifies the form required by the customer to document the quality of the mask.

8.679 SHIP_DEFECT_DATA — (Boolean) If T, requires delivery of defect inspection criteria and evaluation data to the customer for all defect criteria specified. This should be final inspection data unless SHIP_THRU_PELLICLE_DATA is specified, in which case it should be for final inspection prior to pelliclizing.

8.680 SHIP_DIE_FIT_MAP — (Boolean) If T, requires delivery of a die fit map to the customer.

8.681 SHIP_FIELD_FIT_MAP — (Boolean) If T, requires delivery of a field fit map to the customer.

8.682 SHIP_FINAL_POSTPELL_DIE_DB_MSK_MAP — (Boolean) If T, requires delivery of the final run, post-pellicle die to database defect inspection map for the entire patterned area to be sent to customer.

8.683 SHIP_FINAL_POSTPELL_DIE_DB_PTN_MAP — (Boolean) If T, requires delivery of the final run, post-pellicle die to database defect inspection map for the single pattern to be sent to customer.

8.684 SHIP_FINAL_POSTPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the final run, post-pellicle die to die defect inspection map for the entire mask to be sent to customer.

8.685 SHIP_FINAL_PREPELL_DIE_DB_MSK_MAP — (Boolean) If T, requires delivery of the final run, pre-pellicle die to database defect inspection map for the entire patterned area to be sent to customer.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.686 SHIP_FINAL_PREPELL_DIE_DB_PTN_MAP — (Boolean) If T, requires delivery of the final run, pre-pellicle die to database defect inspection map for the single pattern to be sent to customer.

8.687 SHIP_FINAL_PREPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the final run, pre-pellicle die to die defect inspection map for the entire mask to be sent to customer.

8.688 SHIP_FINAL_ROT_POSTPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the final run, post-pellicle rotated die to die defect inspection map for the entire mask to be sent to customer.

8.689 SHIP_FINAL_ROT_PREPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the final run, pre-pellicle rotated die to die defect inspection map for the entire mask to be sent to customer.

8.690 SHIP_FIRST_POSTPELL_DIE_DB_MSK_MAP —(Boolean) If T, requires delivery of the first run, post-pellicle die to database defect inspection map for the entire patterned area to be sent to customer.

8.691 SHIP_FIRST_POSTPELL_DIE_DB_PTN_MAP — (Boolean) If T, requires delivery of the first run, post-pellicle die to database defect inspection map for the single pattern to be sent to customer.

8.692 SHIP_FIRST_POSTPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the first run, post-pellicle die to die defect inspection map for the entire mask to be sent to customer.

8.693 SHIP_FIRST_PREPELL_DIE_DB_MSK_MAP — (Boolean) If T, requires delivery of the first run, pre-pellicle die to database defect inspection map for the entire patterned area to be sent to customer.

8.694 SHIP_FIRST_PREPELL_DIE_DB_PTN_MAP — (Boolean) If T, requires delivery of the first run, pre-pellicle die to database defect inspection map for the single pattern to be sent to customer.

8.695 SHIP_FIRST_PREPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the first run, pre-pellicle die to die defect inspection map for the entire mask to be sent to customer.

8.696 SHIP_FIRST_ROT_POSTPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the first run, post-pellicle rotated die to die defect inspection map for the entire mask to be sent to customer.

8.697 SHIP_FIRST_ROT_PREPELL_DIE_DIE_MAP — (Boolean) If T, requires delivery of the first run, pre-pellicle rotated die to die defect inspection map for the entire mask to be sent to customer.

8.698 SHIP_INSP_DATABASE_DATA — (Boolean) If T, requires delivery of die-to-database inspection data to the customer.

8.699 SHIP_MANUAL_INSPECTION_FORM — (Boolean) If T, requires delivering to the customer a copy of the manual inspection form.

8.700 SHIP_MEASURE_FILE_REGISTR_MAP — (Boolean) If T, requires delivering to the customer the measure file registration map.

8.701 SHIP_PHASE_SHIFT_MEASUREMENTS — (Boolean) If T, <phase_shift_measurements> must be sent to the customer.

8.702 SHIP_PHASE_SHIFT_REPORT — (Boolean) If T, requires delivering to the customer a report of the phase shift characteristics of the mask.

8.703 SHIP_REGISTR_DATA — (Boolean) If T, requires delivery of all registration measurements, criteria and evaluation data to the customer for all registration criteria specified.

8.704 SHIP_REPAIR_DATA — (Boolean) If T, requires delivery of repair data to the customer.

8.705 SHIP_SEM_PHOTOS — (Boolean) If T, requires delivery of SEM photos to the customer.

8.706 SHIP_SPECIAL_REQUEST — (text) If present, the data field specifies the special request of the customer.

8.707 SHIP_STARLIGHT_MAP — (Boolean) If T, requires delivery of a defect map from the Starlight to the customer.

8.708 SHIP_SURF_INSP_GLASS_SIDE_MAP — (Boolean) If T, the final, post-pellicle, surface inspection map of the glass side of the mask must be sent to the customer.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.709 SHIP_SURF_INSP_MEASUREMENTS — (Boolean) If T, <surface_insp_measurements> must be sent to the customer.

8.710 SHIP_SURF_INSP_PATTERN_SIDE_MAP — (Boolean) If T, the final, post-pellicle, surface inspection map of the patterned side of the mask must be sent to the customer.

8.711 SHIP_SURF_INSP_PELL_TOP_MAP — (Boolean) If T, the final, post-pellicle, surface inspection map of the pellicle on the patterned side of the mask must be sent to the customer.

8.712 SHIP_SURF_INSP_PELL_BOTTOM_MAP — (Boolean) If T, the final, post-pellicle, surface inspection map of the pellicle on the glass side of the mask must be sent to the customer.

8.713 SHIP_SURF_INSPECTION_MAP — (Boolean) If T, the final, post-pellicle, surface inspection map(s) must be sent to the customer.

8.714 SHIP_TO_FAX — (text) Phone number for facsimile machine of recipient for <shippable_data> item.

8.715 SHIP_THRU_PELLICLE_DATA — (Boolean) If T, requires delivery of through-pellicle defect inspection criteria and evaluation data to the customer for all defect criteria specified. This should be final inspection data.

8.716 SHIP_TRAVELER — (Boolean) If T, requires delivery of mask traveler document to the customer.

8.717 SHIPPING_ADDRESS — (text) Address for delivery of masks.

8.718 SHIPPING_CONTACT — (text) Name of person to receive masks.

8.719 SHIPPING_EMAIL — (text) Internet address for SHIPPING_CONTACT.

8.720 SHIPPING_FAX — (text) Phone number for facsimile machine of SHIPPING_CONTACT.

8.721 SHIPPING_METHOD — (text) Transportation method for masks, including special arrangements for off-hours and weekends.

8.722 SHIPPING_METHOD_USED — (text) Transportation method used to deliver masks.

8.723 SHIPPING_PHONE — (text) Phone number for SHIPPING_CONTRACT.

8.724 SIZING — (numeric) The amount to increase or decrease the width and height of all geometry within a pattern while fracturing. The data value is in microns and can be negative, indicating a decrease. Note that this results in a “one-sided” change in feature size.

8.725 SIZING_BORDER_RULE — (text) [FIT | INSIDE | OUTSIDE | ... ] Describes methodology for applying SIZING at the borders of the output file and the effect on the final dimensions of the output file.

8.726 SIZING_RULE — (text) [SQUARE | PARAGON | EXTEND | OCTAGON | ... ] Describes methodology for applying SIZING around corners.

8.727 SO_NUMBER — (text) Sales order number.

8.728 SOFTWARE_NAME — (text) Name of the software program, not the brand (e.g., MaskRigger or MaskWeaver, not MaskTools). If, for a given START_DATA_FUNCTION, multiple SOFTWARE_NAME names appear, then they are alternative software tools to achieve the desired outcome.

8.729 SOFTWARE_REVISION — (text) Revision identification, per software vendor’s nomenclature. Following the specified revision identification, the phrase “OR HIGHER” may be appended.

8.730 START_AERIAL_IMAGE_DATA — (text) Name of <aerial_image_data> collection.

8.731 START_BARCODE — (text) Name of barcode.

8.732 START_BILLING_INFORMATION — (text) Name of <billing_information>.

8.733 START_CD — (text) Indicates beginning of <cd_group>. Data field identifies the collection to establish which collections are hierarchically affected by another. The appearance of a <cd_definition> at a lower level in the hierarchy supercedes the entire <cd_definition> at a higher level in the hierarchy if and only if it has the same START_CD data field.

8.734 START_CD_CLEAR_DARK — (text) Name of <cd_clear_dark_definition>.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.735 START_CD_CLEAR_DARK_RESULTS — (text) Name of <cd_clear_dark_results>.

8.736 START_CD_GROUP_MEASUREMENTS — (text) Name of <cd_group_measurements>. Should match START_CD in <mask_order> if P10 was used to order the mask.”

8.737 START_CD_SAME_TONE — (text) Name of <cd_same_tone_definition>.

8.738 START_CD_SAME_TONE_RESULTS — (text) Name of <cd_same_tone_results>.

8.739 START_CD_MEASUREMENT — (text) Name of <cd_measurement>.

8.740 START_CD_SET — (text) Indicates beginning of <cd_set>. Data field identifies the collection to establish which collections are hierarchically affected by another. The appearance of a <cd_set> at a lower level in the hierarchy supercedes the entire <cd_set> at a higher level in the hierarchy if and only if it has the same START_CD data field. (When comprised of START_CD groups with differing CD_PITCH this can satisfy the “interval of pitches” in SEMI P43, PHOTOMASK QUALIFICATION TERMINOLOGY.)

8.741 START_CD_SET_RESULTS — (text) Name of <cd_set_results>. Should match START_CD_SET in <mask_order> if P10 was used to order the mask.”

8.742 START_CD_XY_DEFINITION — (text) Name of <cd_xy_definition>.

8.743 START_CD_XY_RESULTS — (text) Name of <cd_xy_results>.

8.744 START_CD_XY_SITE — (text) Identifying name of <cd_xy_site> for reference in <mask_results>.

8.745 START_CLOSURE_MEASUREMENTS — (text) Name of <closure_measurements>.

8.746 START_COATING — (text) Name of <coating>.

8.747 START_DATA_FRACTURE — (text) Name of <data_fracture> collection.

8.748 START_DATA_FUNCTION — (text) Name of <data_function> collection.

8.749 START_DATA_MANIPULATION — (text) Name of group of sequential BOOLEAN and/or <data_fracture> operations. The output pattern data from the first operation is the input pattern data for the next operation and so on. The data field must be a unique identifier within <mask_order> as the results of one <data_manipulation> may be referenced by another.

8.750 START_DEFECT_DEFINITION — (text) Name of <defect_definition> collection.

8.751 START_DEFECT_MEASUREMENTS — (text) Name of <defect_measurements> collection.

8.752 START_DEFECT_SITE — (text) Name of <defect_measurement_site> collection.

8.753 START_ETCH_DEPTH_MEASUREMENTS — (text) Indicates the beginning of etch depth measurements within <phase_shift_measurements>.

8.754 START_EUV_BLANK_TYPE — (text) Indicates the beginning of specification for EUV blanks.

8.755 START_LITHO_INFORMATION — (text) Name of <litho_information>.

8.756 START_MASK_RESULTS — (text) Indicates the beginning of the file from the vendor to the customer containing actual mask results data. Should match the data field of the START_ORDER to which it is responding AND the data field of END_MASK_RESULTS.

8.757 START_MASK_RESULTS_OPTIONS — (text) Name of <mask_results_options>.

8.758 START_MATERIALS_USED — (text) Name of <materials_used>.

8.759 START_MEASURED_REGISTR_MARK — (text) Name of <measured_registr_mark>.

8.760 START_OPC — (text) Name of <opc_definition> collection.

8.761 START_ORDER — (text) Indicates the beginning of order entry data file from the customer to the vendor. Should indicate the name(s) of the mask sets included.

8.762 START_PATTERN_GROUP_RESULTS — (text) Name of <pattern_group_results>.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.763 START_PATTERN_OPTIONS — (text) Name of <pattern_options> collection.

8.764 START_PHASE_ANGLE_MEASUREMENTS — (text) Indicates the beginning of phase angle measurements within <phase_shift_measurements>.

8.765 START_PHASE_SHIFT — (text) Name of <phase_shift> collection.

8.766 START_PHASE_SHIFT_MEASUREMENTS — (text) Name of <phase_shift_measurements> collection.

8.767 START_PLACEMENT — (text) Name of <placement> collection.

8.768 START_REGISTR — (text) Indicates beginning of <registration> collection. Defines separation between multiple <registration>s. Data field identifies the collection to establish which collections are hierarchically superceded by another; also for reference by REGISTR_RELATIVE.

8.769 START_REGISTR_MEASUREMENTS — (text) Name of <registr_measurements> collection.

8.770 START_REPAIR_DEFINITION — (text) Name of <repair_definition> collection.

8.771 START_SEM_PHOTO — (text) Name of <sem_photo> collection.

8.772 START_SHIP_PLOT — (text) Indicates beginning of <ship_plot> collection. Data field identifies the collection to establish which collections are hierarchically affected by another. The appearance of a <ship_plot> with the same START_SHIP_PLOT data field at a lower level in the hierarchy (see § 6) supersedes the <ship_plot> at a higher level in the hierarchy.

8.773 START_SHIP_TO — (text) Name of <ship_to> collection.

8.774 START_SHIPPABLE_DATA — (text) Name of <shippable_data> collection.

8.775 START_SUBSTRATE — (text) Name of <substrate> collection.

8.776 START_SURFACE_DEFINITION — (text) Name of <surface_definition> collection.

8.777 START_SURFACE_INSP_MEASUREMENTS — (text) Name of <surface_insp_measurements> collection. Must match START_SURFACE_DEFINITION of corresponding <surface_definition> collection.

8.778 START_TITLE — (integer) Indicates the beginning of <title_data> collection for a specific title. Data field identifies the collection to establish which title definitions are hierarchically affected by others.

8.779 START_TRANSMISSION_MEASUREMENTS — (text) Indicates the beginning of transmission measurements within <phase_shift_measurements>.

8.780 START_WAFER_EXPOSURE_DATA — (text) Name of <wafer_exposure_data> collection.

8.781 START_VENDOR_INFO — (text) Name of <vendor_info> collection.

8.782 STATUS — (text) [NEW | OLD | CHANGE | CANCEL | HOLD | STOP | RESTART | RETURNED | PROTESTED | QUOTE_ONLY] Present status of mask(s); NEW = new mask which has not been ordered before. OLD = previously ordered mask whose data is included for reference only. CHANGE = previously ordered mask whose data is included because the order data has been changed since the last transmission (but note that this does NOT “RESTART” a mask whose previous status was “STOP” or “HOLD”). CANCEL = previously ordered mask whose order is being cancelled. HOLD = enter a new mask but do not release it to production until customer authorization. STOP = previously ordered mask which is put on hold until further notice. RESTART = changes a previous STATUS of STOP from being on hold to being released for production. RETURNED = a previously delivered mask which has been rejected by the customer and is being returned to the vendor. A data entry transmittal which includes a RETURNED mask should also include a NEW mask if replacement is to be initiated. PRICE of the returned mask should be the negative of the original price in order to track credit. The NEW mask should also contain PRICE and a new schedule. PROTESTED = a RETURNED mask whose rejection is protested by the mask vendor. If a NEW mask accompanied the RETURNED mask to initiate replacement, the NEW mask should also have PROTESTED status. QUOTE_ONLY = the order is not to be manufactured, but is only to be used by the vendor for quoting price and delivery.

8.783 STD_PATTERN_NAME — (text) Name of a standard pattern, on file at the vendor, previously supplied or authorized by the customer. It may be used as input to <data_manipulation> if referenced by

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DATA_SOURCE_FILE to generate a new (different) DATA_PATTERN_NAME, or it may be used to identify a pattern to be written on the mask if referenced by PATTERN_NAME in <pattern_definitions>.

8.784 STEPPING_COUNT — (integer) (x,y) Count of successive pattern or cell placements.

8.785 STEPPING_DISTANCE — (numeric) (x,y) Spacing between successive pattern or cell placements.

8.786 STRIPE_HEIGHT — (integer) Stripe height in address units of pattern file.

8.787 SUMMARY_FILE_NAME — (text) Name identifying the summary output file for RUNSET_NAME. If this keyword appears in the <mask_order>, it must be explicitly referenced in a RUNSET_NAME and/or a PARAMETER_FILE_NAME.

8.788 SURF_DEFECT_TYPE — (text) [CONTAM_ON_CLEAR | DIM_CLEAR | ON_EDGE | UNKOWN | PINHOLE | BRIGHT_CHROME | CONTAM_ON_CHROME | DIM_CHROME | ON_CLEAR | BRIGHT | ON_CHROME | ON_ATT | DIM_ATT | ATT_PINHOLE | ... ] Setup parameter for surface inspection.

8.789 SURF_INSP_AREA — (numeric) (x1,y1,x2,y2) Unscaled coordinates of window for surface inspection, lower left and upper right corners, relative to the nominal center of mask, pattern or cell (chrome side up for masks, unmirrored for patterns or cells).

8.790 SURF_INSP_EQUIP_REQD — (text) Identification of acceptable equipment for defect inspection.

8.791 SURF_INSP_EQUIP_USED — (text) Surface inspection equipment used.

8.792 SURF_INSP_GLASS_SIDE — (numeric) If present, specifies the maximum dimension of the smallest unacceptable particle on the glass side of the mask. This keyword is generally intended for non-pelliclized masks.

8.793 SURF_INSP_METHOD — (text) [LASER | VISUAL | PIXEL | MICROSCOPE] Methodology for detecting surface particles.

8.794 SURF_INSP_MODE_REQD — (text) Operating mode required for SURF_INSP_EQUIP_REQD.

8.795 SURF_INSP_MODE_USED — (text) SURF_INSP_EQUIP_USED operating mode.

8.796 SURF_INSP_PATTERN_SIDE — (numeric) Specifies the maximum dimension of the smallest unacceptable particle on the patterned side of the mask. This keyword is generally intended for non-pelliclized masks.

8.797 SURF_INSP_PELL_BOTTOM — (numeric) Specifies the maximum dimension of the smallest unacceptable particle on the pellicle on the glass side of the mask on either surface of the pellicle membrane or on the glass surface under the pellicle.

8.798 SURF_INSP_PELL_TOP — (numeric) If present, specifies the maximum dimension of the smallest unacceptable particle on the pellicle on the patterned side of the mask on either surface of the pellicle membrane.

8.799 SURF_INSP_PELL_TOP_INSIDE_MEMBRANE — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned side of the mask on the inside surface of the pellicle membrane.

8.800 SURF_INSP_PELL_TOP_INSIDE_ON_FRAME — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned side of the mask on the inside surface of the pellicle frame.

8.801 SURF_INSP_PELL_TOP_ON_CLEAR_PATTERN — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned surface of the mask under the pellicle, but on the clear pattern of the mask.

8.802 SURF_INSP_PELL_TOP_ON_OPAQUE_PATTERN — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned surface of the mask under the pellicle, but on the opaque pattern of the mask.

8.803 SURF_INSP_PELL_TOP_OUTSIDE_FRAME — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned surface of the mask outside the pellicle frame.

8.804 SURF_INSP_PELL_TOP_OUTSIDE_MEMBRANE — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned side of the mask on the outside surface of the pellicle membrane.

8.805 SURF_INSP_PELL_TOP_OUTSIDE_ON_FRAME — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned side of the mask on the outside surface of the pellicle frame.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.806 SURF_INSP_PELL_TOP_OUTSIDE_ON_OPAQUE — (numeric) Maximum dimension of the smallest unacceptable particle on the patterned surface of the mask outside the pellicle frame, but on the opaque surface of the mask.

8.807 SURF_INSP_PIXEL_SIZE_REQD — (text) Pixel size to use for surface inspection. Note that if the value is not numeric, the applicability may be tool-specific.

8.808 SURF_INSP_PIXEL_SIZE_USED — (numeric) Pixel size used by SURF_INSP_EQUIP_USED.

8.809 SURF_INSP_SENSITIVITY_REQD — (text) Sensitivity to be used by SURF_INSP_EQUIP_REQD. (See Related Information 9 for suggested data field values.)

8.810 SURF_INSP_SENSITIVITY_USED — (text) Sensitivity used by SURF_INSP_EQUIP_USED. (See Related Information 9 for suggested data field values.)

8.811 SURF_INSP_SETUP_FILE_NAME_REQD — (text) Name of setup file for SURF_INSP_EQUIP_REQD.

8.812 SURF_INSP_SETUP_FILE_NAME_USED — (text) Name of setup file for SURF_INSP_EQUIP_USED.

8.813 SURFACE_INSPECTION — (numeric) If present, requires surface inspection and specifies the maximum dimension of the smallest unacceptable surface particles.

8.814 SURFACE_QUALITY_ID — (text) Customer’s label for a collection of surface quality specifications, to be used only in addition to explicit quality requirement keywords. This may be used in the data structure in addition to, but not in place of, explicit quality requirement keywords. This may not be used in combination with QUALITY_GROUP_ID. Customer and vendor should document the meaning of this quality grade before using it in SEMI P10.

8.815 SURROUNDING_HEIGHT — (numeric) Height of clear or dark border around pattern on mask.

8.816 SURROUNDING_TONE — (text) [CLEAR | DARK] Border surrounding pattern on mask is to be either clear or dark.

8.817 SURROUNDING_WIDTH — (numeric) Width of clear or dark border around pattern on mask.

8.818 THROUGH_PELLICLE_DEFECTS — (text) Data field must match data field of START_DEFECT_MEASUREMENTS for following <defect_measurements> when delivering defect data measured with pellicle applied.

8.819 TITLE_CHARACTER_SPACING — (numeric) Spacing in microns between title characters. Note this is not the center-to-center spacing of the characters, but the intra-character spacing.

8.820 TITLE_FONT — (text) Name of the font use in writing TITLE_TEXT, to be previously agreed between customer and vendor.

8.821 TITLE_HEIGHT — (numeric) Height in microns of title characters.

8.822 TITLE_JUSTIFICATION — (text) [L | R] Left or right justification within the writable field, before mirroring and before rotation.

8.823 TITLE_LOCATION — (numeric) (x,y) Location of the lower left corner of TITLE_TEXT in the associated <title_data> (before mirroring or rotation), relative to nominal center of mask (chrome side up).

8.824 TITLE_MAG — (numeric) Numeric magnification to the standard font size for the mask writer in writing TITLE_TEXT. This item should not be used in conjunction with TITLE_HEIGHT for the same MASK_SET_ID.

8.825 TITLE_TEXT — (text) Contents of human-readable text on the mask.

8.826 TITLE_TYPE — (text) [MASK | DEVICE | LAYER | DATE_TIME | SOFTWARE | SERIAL_NUMBER | AUXILIARY].

8.827 TITLE_WIDTH — (numeric) Maximum width in microns in available for text for a given title.

8.828 TOP_CELL — (text) Top cell or structure of INPUT_FILE_NAME in <data_function>.

8.829 TOP_PELLICLE_CENTRALITY_ERROR — (numeric) (x,y,rotation) Maximum misplacement in micro-meters and microradians of pellicle mounting, relative to the nominal center of the mask.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.830 TOP_PELLICLE_TYPE — (text) Brand and model of acceptable pellicle for the patterned side of the mask. If multiple pellicles are listed, they are prioritized with the most preferred first and least preferred last.

8.831 TOP_PELLICLE_USED — (text) The pellicle vendor’s part number of the pellicle applied to the patterned surface of the mask.

8.832 TRANSFER_FILE_NAME — (text) Name of a file to be received in DATA MEDIUM. This keyword is required if the file received requires processing to reverse compression, consolidation and/or encryption.

8.833 TRANSMISSION_DEFECT_CLEAR — (numeric) Maximum allowable percent transmission of light through a clear defect.

8.834 TRANSMISSION_DEFECT_DARK — (numeric) Maximum allowable percent blocking of light through a dark defect.

8.835 TRANSMISSION_EQUIP_REQD — (text) Transmission measurement equipment required by customer.

8.836 TRANSMISSION_EQUIP_USED — (text) Transmission measurement equipment used.

8.837 TRANSMISSION_ERROR — (numeric) For phase shift masks, the maximum acceptable deviation of any percent transmission measurement from the TRANSMISSION_TARGET.

8.838 TRANSMISSION_MARK_DRAWING — (text) The uniquely identified (for each customer) document which shows the transmission mark structure itself, and may show the place(s) within the transmission mark which are to be measured.

8.839 TRANSMISSION_MARK_FEATURE — (text) Description of the feature to be used for transmission measurement.

8.840 TRANSMISSION_MARK_LOCATION — (numeric) (x,y) Location of transmission mark location relative to the nominal center of the mask (chrome side up), or the center of the pattern if under <pattern_options>.

8.841 TRANSMISSION_MARK_LOCATION_DRAWING — (text) The uniquely identified (for each customer) document which shows the location(s) of the transmission mark structure.

8.842 TRANSMISSION_MARK_SITE_ID — (text) Unique identifier of each transmission measurement location within MASK_SET_ID to identify individual locations when using <mask_results>. If the same coordinates apply to locations on different masks within the mask set, they may have the same TRANSMISSION_MARK_SITE_ID, but it is not mandatory.

8.843 TRANSMISSION_MEASUREMENT_DATE — (date) Transmission measurement date.

8.844 TRANSMISSION_MEASUREMENT_FILE_NAME — (text) Name of data file containing results of trans-mission measurement.

8.845 TRANSMISSION_MODE_REQD — (text) Operating mode required by customer for TRANSMISSION_EQUIP_USED.

8.846 TRANSMISSION_MODE_USED — (text) Operating mode used on TRANSMISSION_EQUIP_USED operating mode.

8.847 TRANSMISSION_RANGE — (numeric) For phase shift masks, the maximum acceptable variation of all percent transmission measurements, relative to each other.

8.848 TRANSMISSION_REFERENCE_ONLY — (Boolean) If T, indicates that the transmission feature is to be measured and the data transmitted to the customer (if requested by SHIP_PHASE_SHIFT_MEASUREMENTS), but that deviations in its measured value due to mask processing would NOT be cause for mask rejection.

8.849 TRANSMISSION_TARGET — (numeric) For phase shift masks, the required percent transmission of light at the specified PSM_WAVELENGTH compared to quartz.

8.850 TRANSMISSION_TOLERANCE — (numeric) For phase shift masks, the maximum acceptable deviation of the mean of all percent transmission measurements to the TRANSMISSION_TARGET.

8.851 UNSCALED_PATTERN_SIZE — (numeric) (x,y) Unscaled size of the pattern file. If this is incorrect, the mask will not be written until it is corrected.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.852 USER_UNIT — (numeric) To be used for fracturing DATABASE_SOURCE into inspection data, as required by some inspection systems.

8.853 UT1X_UNCUT — (Boolean) If T, indicates that the reticle is to be delivered uncut (i.e., 5 inch square) size. If F, or if the keyword is absent, the reticle is to be delivered in the 3 × 5 inch size.

8.854 VENDOR — (text) The name of the company from which the masks are ordered.

8.855 VENDOR_ADDRESS — (text) Address for VENDOR_CONTACT.

8.856 VENDOR_CONTACT — (text) Name of person to contact regarding the mask.

8.857 VENDOR_EMAIL — (text) Internet address for VENDOR.

8.858 VENDOR_FAX — (text) Phone number for facsimile machine of VENDOR.

8.859 VENDOR_ORDER_ID — (text) The mask vendor’s order identification used to track the mask order in manufacturing.

8.860 VENDOR_PHONE — (text) Phone number for VENDOR_CONTACT.

8.861 VENDOR_REGISTRATION_MARK_ID — (text) Unique (within MASK_SET_ID) registration mark identifier assigned by the mask supplier to identify individual measurements when REGISTR_MARK_ID is not available or is not sufficiently specific (e.g., in the case of multiple instances of CELL_REGISTR_MARK).

8.862 VIRTUAL_ADDRESS — (Boolean) Designates whether “virtual addressing” option is to be used to write the pattern. If T, then the pattern will be written with a writing grid twice the nominal size of the pattern but in such a way that the overall dimensions of the pattern and its internal features are preserved. This option is used only by MEBES systems and is usually limited to writing grids no larger than 0.25 micron.

8.863 VISUAL_INSP_CRITERIA — (text) The part of the mask to inspect visually (e.g., “5 mm border”).

8.864 VISUAL_INSPECTION_OK — (Boolean) If T, the area of the preceding pattern may be inspected visually and/or automatically at the vendor’s option. VISUAL_INSPECTION_OK is not allowed if either VISUAL_INSPECTION_REQD or AUTO_INSPECTION_REQD is T (true).

8.865 VISUAL_INSPECTION_REQD — (Boolean) If T, visual, microscopic inspection of the mask for defects is required.

8.866 WAFER_EXPOSURE_ILLUMINATION — (text) [STANDARD | ANNULAR | DIPOLE | QUADRAPOLE | ... ] Illumination configuration of the scanner, stepper or aligner on which the mask is to be used. If ANNULAR, then both WAFER_EXPOSURE_SIGMA_INNER and WAFER_EXPOSURE_SIGMA_OUTER are required. If not ANNULAR, then only WAFER_EXPOSURE_SIGMA is required.

8.867 WAFER_EXPOSURE_NUMERICAL_APERTURE — (numeric) Numerical aperture in nanometers of the scanner, stepper or aligner on which the mask is to be used.

8.868 WAFER_EXPOSURE_SIGMA — (numeric) Partial coherence of the scanner, stepper or aligner on which the mask is to be used. (This is a unitless parameter.)

8.869 WAFER_EXPOSURE_SIGMA_INNER — (numeric) Inner partial coherence of the scanner, stepper or aligner on which the mask is to be used. (This is a unitless parameter.)

8.870 WAFER_EXPOSURE_SIGMA_OUTER — (numeric) Outer partial coherence of the scanner, stepper or aligner on which the mask is to be used. (This is a unitless parameter.)

8.871 WAFER_EXPOSURE_TOOL — (text) Brand and model of the scanner, stepper or aligner on which the mask is to be used.

8.872 WAFER_EXPOSURE_WAVELENGTH — (numeric) Wavelength in nanometers to be used for imaging the mask pattern on the wafer. This keyword may appear in addition to PSM_WAVELENGTH for a single MASK_ID, though the values of the two should usually be the same. AIM_WAVELENGTH would also usually match WAFER_EXPOSURE_WAVELEGHTH, but is provided as a separate parameter in the case that aerial image measurement needs to be done at a different wavelength.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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8.873 WAFER_FAB — (text) Identification of the customer’s wafer fab at which the mask(s) are intended to be used.

8.874 WAIVER — (text) The uniquely identified (for each customer) document which describes specifications which may be ignored by the vendor.

8.875 WAIVER_OVERRIDE — (text) The uniquely identified (for each customer) document which describes specifications which usually may be ignored by the vendor, but in this case may NOT be ignored by the vendor. This keyword cancels the effect of the waiver only within the scope of its application in <mask_order>.

8.876 WEB_ADDRESS — (text) URL address.

8.877 WRITE_DATE_TIME — (date) Date and time at which mask exposure began on the lithography tool.

8.878 end_dictionary — Delimiter denoting end of dictionary for automatic translation to XML format.

9 Computing the Checksum9.1 The cyclic checksum is computed as follows:

9.1.1 Initialize the 16 bit checksum value to zero. Consider all the records in the data file from START_ORDER through END_ORDER, inclusive. Consider each ASCII character up to and including the “new_line” character. Convert each character to its ASCII numeric equivalent (e.g., space is 32 decimal, “A” is 65 decimal, etc.). Use the value 10 decimal for the new_line function regardless of its internal representation (e.g., CR LF). Use only the 7 bit ASCII representation for each character (i.e., ignore the high order bit in an 8 bit byte).

9.1.2 XOR each of the characters from each of the records in sequence, from the first character in the START_ORDER record to the new_line character in the END_ORDER record. Before each character is XORed with the checksum, circularly rotate the previous value of the accumulated 16 bit checksum one bit to the left.

9.1.3 After all of the above characters have been accumulated into the checksum, convert it as an unsigned 16 bit integer into the ASCII representation of its decimal value. This ASCII string is the data field following the CHECKSUM keyword, the last record in the mask order structure.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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CD_TOLERANCE — Maximum acceptable deviation of the mean of all measured critical dimensions to the CD_TARGET.

CD_RANGE — Maximum acceptable variation of all measured critical dimensions of same nominal size, same tone and same orientation, relative to each other.

CD_DEVIATION_FROM_MEAN — Maximum acceptable deviation of any of the customer-required CD measurements from the mean of those measurements.

Mean Target

Measurement distribution

DRAFTDocument Number:

Date: 5/9/23

RELATED INFORMATION 1 CRITICAL DIMENSION KEYWORDSNOTICE: This related information is not an official part of SEMI P10 and was derived from the North American Microlithography Committee. This related information was approved for publication by full letter ballot procedures on April 22, 2004.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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CD_DEVIATION_FROM_TARGET — Maximum acceptable deviation of any of the customer-required CD measurements from the CD_TARGET.

If only one data value (p) appears in the data field, the tolerance is considered +/− symmetrically about CD_TARGET.

If two data values ( p [,m] ) appear, then the first is the maximum amount by which deviation is allowed larger than CD_TARGET, and the second is the maximum amount by which deviation is allowed smaller than CD_TARGET. The comma and second half of the argument are optional in the syntax (p[,m]) where p = the plus and m = the minus value for non-symmetric tolerances; if only p is specified, the plus and minus values are assumed to be symmetric.

p p

m p

CD_THREE_SIGMA — Maximum acceptable 3-sigma deviation of all measured critical dimensions to the the mean of all measured critical dimensions.

CD_XY_DEVIATION — Maximum deviation, on a site-by-site basis, of a horizontal critical dimension to a vertical critical dimension. The two critical dimensions at each site must be the same size in the pattern data.

CD_XY_TOLERANCE — Maximum acceptable deviation of the mean of all measured horizontal critical dimensions to the mean of all measured vertical mask critical dimensions. Critical dimensions at all sites must be the same size in the pattern data.

Distribution of x vs y

Horizontal Vertical

DRAFTDocument Number:

Date: 5/9/23

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 2 SEMI PHOTOMASK ORDER DATA FILE EXAMPLENOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

EXAMPLE: A pair of 4 die 5 reticles with separate scribe, barcode, and rms alignment marks. Critical dimensions are defined as pattern options.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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START_ORDER MS999SEMI_REVISION P10-0704 !<mask_order>CUSTOMER COMPANY NAMEVENDOR ULTIMATE MASK COMPANYFILE_DATE_TIME 13-APR-1992, 13:00:00ZMASK_SET_ID 9999 !<mask_set>BILLING_CONTACT Jean Doe, Accounts Payable !<mask_set_options>BILLING_ADDRESS Company NameBILLING_ADDRESS Street AddressBILLING_ADDRESS City, State ZIPBILLING_PHONE 4085551212PRICE_UNITS USDSHIPPING_CONTACT Joe Doe, Wafer FabSHIPPING_ADDRESS Company NameSHIPPING_ADDRESS Street AddressSHIPPING_ADDRESS City, State ZIPSHIP_CD_DATA TSTART_SHIP_TO CDEMAIL_ADDRESS [email protected]_SHIP_TO CDSHIP_CD_DATA TSTART_SHIP_TO CD DataEMAIL_ADDRESS [email protected]_SHIP_TO CD DataDATA_MEDIUM 9 TRACK_TAPEDATA_ID DEVICE 9999DATA_FORMAT MEBESDATA_DENSITY 1600BPIDATA_PATTERN_NAME VT9999X-1A-26PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_NAME VT9999X-1A-10PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_NAME SC9999X-1A-26PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_NAME SC9999X-1A-10PATTERN_FORMAT MEBES_RETICLEEND_DATA_MEDIUM 9 TRACK_TAPESTD_PATTERN_NAME GCARMSB-OX-AAPATTERN_FORMAT MEBES_RETICLEEND_MASK_SET_OPTIONS 9999!MASK_GROUP_ID 5X !<mask_group>BLANKET_PO_NUMBER 101055CRELEASE_NUMBER 42MILESTONES TPRODUCT_TYPE RETICLEPRODUCT_MAGNIFICATION 5XPRODUCT_IMAGING_TYPE BINARY

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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START_TITLE 1TITLE_TYPE DEVICETITLE_LOCATION 12500,58500END_TITLE 1START_TITLE 2TITLE_TYPE MASKTITLE_LOCATION 12500,56500END_TITLE 2START_BARCODE ABARCODE_TYPE GCABARCODE_LOCATION −50000,57500END_BARCODE AMIRROR_MASK TSTART_SUBSTRATE S1BLANK_SIZE 5/90BLANK_TYPE ULTEBLANK_FLATNESS 2MASK_COATING LOW_REFLECTANCE_CHROMERESIST_TYPE POSITIVEEND_SUBSTRATE S1START_REGISTR RG1REGISTR_ERROR 0.25REGISTR_REF_MASK_ID 2END_REGISTR RG1START_CD SPECIFICATIONCD_TOLERANCE 0.25CD_RANGE 0.3END_CD SPECIFICATIONSTART_DEFECT_DEFINITION CDEFECT_SIZE 2.0DEFECT_COUNT 0INSPECTION_AREA −30000,−35000,30000,35000END_DEFECT CPACKAGE H60-51-63A09END_MASK_GROUP_OPTIONS 5X!PLACEMENT_TOP_CELL C1!MASK_ID 1 !<mask_definition>DELIVERABLE_MASK TLINE_ITEM_NUMBER 1STATUS NEWDUE_DATE_TIME_REQUESTED 1992-04-20, 14:00ZPRICE 2000START_TITLE 2TITLE_TEXT DIFFUSIONEND_TITLE 2START_BARCODE A

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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BARCODE_TEXT 9999-26END_BARCODE AMIN_MASK_FEATURE_SIZE 10END_MASK 1!MASK_ID 2 !<mask_definition>DELIVERABLE_MASK TLINE_ITEM_NUMBER 2STATUS NEWDUE_DATE_TIME_REQUESTED 1992-04-21, 14:00ZPRICE 2000PRICE_UNITS USDSTART_TITLE 2TITLE_TEXT POLYEND_TITLE 2START_BARCODE ABARCODE_TEXT 9999-10END_BARCODE AMIN_MASK_FEATURE_SIZE 10END_MASK 2!CELL_ID C1 !<cell_definition>END_CELL_OPTIONS C1CELL_INSTANCE C2 !MAIN ARRAYEND_CELL_INSTANCE_OPTIONS C2START_PLACEMENT P2LOCATION 0,0END_PLACEMENT P2END_CELL_INSTANCE C2PATTERN_GROUP_INSTANCE PG3 !RMS ALIGNMENT KEYSSTART_PLACEMENT PG3LOCATION 0,−57500LOCATION −11000,57500END_PLACEMENT PG3END_CELL C1 !END TOP CELL DEFINITION!CELL_ID C2 !MAIN ARRAY DEFINITIONEND_CELL_OPTIONS C2PATTERN_GROUP_INSTANCE PG1 !PRIMARY DIESTART_PLACEMENT PG1LOCATION −15000,−17500STEPPING_DISTANCE 30000,35000STEPPING_COUNT 2,2END_PLACEMENT PG1END_PATTERN_GROUP_INSTANCE PG1PATTERN_GROUP_INSTANCE PG2 !SCRIBE LINESTART_PLACEMENT PG2LOCATION 0,0

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PLACEMENT PG2END_PATTERN_GROUP_INSTANCE PG2END_CELL C2!PATTERN_GROUP_ID PG1 !PRIMARY PATTERN GROUPSTART_PATTERN_OPTIONS PTN1PATTERN_ADDRESS_SIZE 0.5SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 25000,30000END_PATTERN_OPTIONS PTN1END_PATTERN_GROUP_OPTIONS PG1LEVEL_ID 1PATTERN_NAME VT9999X-1A-26START_PATTERN_OPTIONS PTN1.26DIGITIZED_DATA_DARK TEND_PATTERN_OPTIONS PTN1.26END_PATTERN_DEFINITION 1LEVEL_ID 2PATTERN_NAME VT9999X-1A-10START_PATTERN_OPTIONS PTN1.10DIGITIZED_DATA_DARK FEND_PATTERN_OPTIONS PTN1.10END_PATTERN_DEFINITION 2END_PATTERN_GROUP PG1!PATTERN_GROUP_ID PG2 !SCRIBE PATTERN GROUPSTART_PATTERN_OPTIONS PTN2PATTERN_ADDRESS_SIZE 0.5SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 65000,75000START_CD CD_SITES_1CD_SITE_ID CD_1CD_LOCATION −40000,0END_CD CD_SITE_1START_CD CD_SITE_2CD_SITE_ID CD_2CD_LOCATION 0,−40000END_CD CD_SITE_2START_CD CD_SITE_3CD_SITE_ID CD_3CD_LOCATION 0,40000END_CD CD_SITE_3START_CD CD_SITE_4CD_SITE_ID CD_4CD_LOCATION 0,0END_CD CD_SITE_4

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PATTERN_OPTIONS PTN2END_PATTERN_GROUP_OPTIONS PG2LEVEL_ID 1PATTERN_NAME SC9999X-1A-26START_PATTERN_OPTIONS PO.26DIGITIZED_DATA_DARK TSTART_CD DIMENSIONCD_DATA 10CD_DIGITIZED TCD_TARGET 10END_CD DIMENSIONEND_PATTERN_OPTIONS PO.26END_PATTERN_DEFINITION 1LEVEL_ID 2PATTERN_NAME SC9999X-1A-10START_PATTERN_OPTIONS PO.10DIGITIZED_DATA_DARK FSTART_CD DIMENSIONCD_DATA 10CD_DIGITIZED TCD_TARGET 10.5END_CD DIMENSIONEND_PATTERN_OPTIONS PO.10END_PATTERN_DEFINITION 2END_PATTERN_GROUP PG2 !END SCRIBE GROUP!PATTERN_GROUP_ID PG3 !RMS ALIGNMENT MARKSTART_PATTERN_OPTIONS PTN3PATTERN_ADDRESS_SIZE 0.5SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 2000,2000START_DEFECT_DEFINITION DD.1INSPECTION_AREA −3000,−3000,3000,3000END_DEFECT_DEFINITION DD.1END_PATTERN_OPTIONS PTN3END_PATTERN_GROUP_OPTIONS PG3LEVEL_ID APATTERN_NAME GCARMSB-OX-AASTART_PATTERN_OPTIONS PTN3.AADIGITIZED_DATA_DARK FEND_PATTERN_OPTIONS PTN3.AAEND_PATTERN_DEFINITION AEND_PATTERN_GROUP PG3 !END ALIGNMENT MARK!END_MASK_GROUP 5XEND_MASK_SET 9999END_ORDER MS9999

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Date: 5/9/23

CHECKSUM computed checksum

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 3 SEMI PHOTOMASK ORDER DATA FILE EXAMPLE EMPLOYING MULTIPLE WRITE AND PROCESS STEPS FOR A SINGLE MASKNOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

EXAMPLE: One 4 die phase shift reticle requiring two write and process steps.

START_ORDER MS999SEMI_REVISION P10-0704 !<mask_order>CUSTOMER COMPANY NAMEVENDOR ULTIMATE MASK COMPANYFILE_DATE_TIME 06-JUL-2000, 01:06:00MASK_SET_ID 9999 !<mask_set>END_MASK_SET_OPTIONS 9999!MASK_GROUP_ID PSM !<mask_group>START_TITLE 1TITLE_TEXT DEVICE 9999TITLE_TYPE DEVICETITLE_LOCATION 12500,58500END_TITLE 1START_TITLE 2TITLE_TEXT PHASE SHIFT POLYTITLE_TYPE MASKTITLE_LOCATION 12500,56500END_TITLE 2MIRROR_MASK TPRODUCT_TYPE RETICLEPRODUCT_MAGNIFICATION 5XPRODUCT_IMAGING_TYPE EAPSMBLANK_SIZE 6/250BLANK_TYPE ULTEBLANK_FLATNESS 1MASK_COATING MOSIRESIST_TYPE POSITIVESTART_CD SPECIFICATIONCD_TOLERANCE 0.05CD_RANGE 0.06END_CD SPECIFICATIONEND_MASK_GROUP_OPTIONS 5X!PLACEMENT_TOP_CELL C1!MASK_ID 1 !First write and process stepDELIVERABLE_MASK FMULTIWRITE (1,1)

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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START_PHASE_SHIFT 1PSM_WAVELENGTH 248TRANSMISSION_TARGET 6TRANSMISSION_TOLERANCE 0.4TRANSMISSION_RANGE 0.8PHASE_ANGLE_TARGET 180PHASE_ANGLE_TOLERANCE 4PHASE_ANGLE_RANGE 8END_PHASE_SHIFT 1START_REGISTR 1REGISTR_ERROR 0.10END_REGISTR 1MIN_MASK_FEATURE_SIZE 0.8END_MASK 1!MASK_ID 2 !Second write and process step DELIVERABLE_MASK TMULTIWRITE (1,2)START_PHASE_SHIFT 2PSM_WAVELENGTH 248TRANSMISSION_TARGET 6TRANSMISSION_TOLERANCE 0.4TRANSMISSION_RANGE 0.8PHASE_ANGLE_TARGET 180PHASE_ANGLE_TOLERANCE 4PHASE_ANGLE_RANGE 8END_PHASE_SHIFT 2TOP_PELLICLE_TYPE CA627P-7043LMIN_MASK_FEATURE_SIZE 0.8START_DEFECT_DEFINITION CDEFECT_SIZE 0.3DEFECT_COUNT 0INSPECTION_AREA −30000,−35000,30000,35000END_DEFECT CEND_MASK 2!CELL_ID C1 !<cell_definition>END_CELL_OPTIONS C1CELL_INSTANCE C2 !MAIN ARRAYEND_CELL_INSTANCE C2LOCATION 0,0PATTERN_GROUP_INSTANCE PG3 !RMS ALIGNMENT KEYSLOCATION 0,−57500LOCATION −11000,57500END_CELL C1 !END TOP CELL DEFINITION!CELL_ID C2 !MAIN ARRAY DEFINITIONEND_CELL_OPTIONS C2

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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PATTERN_GROUP_INSTANCE PG1 !PRIMARY DIELOCATION −15000,−17500STEPPING_DISTANCE 30000,35000STEPPING_COUNT 2,2PATTERN_GROUP_INSTANCE PG2 !SCRIBE LINELOCATION 0,0END_CELL C2!PATTERN_GROUP_ID PG1 !PRIMARY PATTERN GROUPPATTERN_ADDRESS_SIZE 0.05SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 25000,30000END_PATTERN_GROUP_OPTIONS PG1LEVEL_ID 1PATTERN_NAME VT9999X-1A-26DIGITIZED_DATA_DARK TEND_PATTERN_DEFINITION 1LEVEL_ID 2PATTERN_NAME VT9999X-1A-10DIGITIZED_DATA_DARK FEND_PATTERN_DEFINITION 2END_PATTERN_GROUP PG1!PATTERN_GROUP_ID PG2 !SCRIBE PATTERN GROUPPATTERN_ADDRESS_SIZE 0.05SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 65000,75000START_CD CD_SITESCD_SITE_ID CD_1CD_LOCATION −40000,0CD_SITE_ID CD_2CD_LOCATION 0,−40000CD_SITE_ID CD_3CD_LOCATION 0,40000CD_SITE_ID CD_4CD_LOCATION 0,0END_CD CD_SITESEND_PATTERN_GROUP_OPTIONS PG2LEVEL_ID 1PATTERN_NAME SC9999X-1A-26DIGITIZED_DATA_DARK TSTART_CD DIMENSIONCD_DATA 0.8CD_DIGITIZED TCD_TARGET 0.8END_CD DIMENSION

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PATTERN_DEFINITION 1LEVEL_ID 2PATTERN_NAME SC9999X-1A-10DIGITIZED_DATA_DARK FSTART_CD DIMENSIONCD_DATA 0.8CD_DIGITIZED TCD_TARGET 0.8END_CD DIMENSIONEND_PATTERN_DEFINITION 2END_PATTERN_GROUP PG2 !END SCRIBE GROUP!PATTERN_GROUP_ID PG3 !RMS ALIGNMENT MARKPATTERN_ADDRESS_SIZE 0.5SCALE_FACTOR 1.0STRIPE_HEIGHT 1024UNSCALED_PATTERN_SIZE 2000,2000INSPECTION_AREA −3000,−3000,3000,3000END_PATTERN_GROUP_OPTIONS PG3LEVEL_ID APATTERN_NAME GCARMSB-OX-AADIGITIZED_DATA_DARK FEND_PATTERN_DEFINITION AEND_PATTERN_GROUP PG3 !END ALIGNMENT MARK!END_MASK_GROUP PSMEND_MASK_SET 9999END_ORDER MS9999CHECKSUM computed checksum

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 4 SEMI PHOTOMASK MASK RESULTS DATA FILE EXAMPLENOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

EXAMPLE: The actual mask CD data sent by the vendor to the customer for a 4 die 5 reticle with SHIP_CD_DATA set to TRUE (for reference, see Related Information 2, for MASK_ID = 1).

START_MASK_RESULTS MS999SEMI_REVISION P10-0704 !<mask_order>CUSTOMER COMPANY NAMEVENDOR ULTIMATE MASK COMPANYFILE_DATE_TIME 13-APR-1992, 13:00:00MASK_SET_ID 9999 !<mask_set>MASK_GROUP_ID 5XMASK_ID 1TITLE_TEXT DEVICE 9999TITLE_TEXT DIFFUSIONSTART_CD_GROUP_MEASUREMENTS SPECIFICATIONCD_TARGET 10CD_TOLERANCE 0.25CD_RANGE 0.3START_CD_MEASUREMENT CD_1CD_SITE_ID CD_1CD_LOCATION −40000,0MEASURED_CD_SITE_ID CD_1MEASURED_CD_LOCATION −40000.1,0.08MEASURED_CD 9.95END_CD_MEASUREMENT CD_1START_CD_MEASUREMENT CD_2CD_SITE_ID CD_2CD_LOCATION 0,−40000MEASURED_CD_SITE_ID CD_2MEASURED_CD_LOCATION −0.07,−40000.11MEASURED_CD 10.01END_CD_MEASUREMENT CD_2START_CD_MEASUREMENT CD_3CD_SITE_ID CD_3CD_LOCATION 0,40000MEASURED_CD_LOCATION 0.03,39999.95MEASURED_CD 9.98END_CD_MEASUREMENT CD_3START_CD_MEASUREMENT CD_4CD_SITE_ID CD_4CD_LOCATION 0,0MEASURED_CD_SITE_ID CD_4MEASURED_CD_LOCATION 0.01,-0.04

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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MEASURED_CD 10.07END_CD_MEASUREMENT CD_4END_CD_GROUP_MEASUREMENTS SPECIFICATIONEND_MASK 1END_MASK_GROUP 5XEND_MASK_SET 9999END_ORDER MS9999CHECKSUM computed checksum

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 5 SEMI PHOTOMASK ORDER EXAMPLE FOR 5X RETICLESNOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

! Sample of 5X reticle order corresponding to recent practices

!START_ORDER O555555SEMI_REVISION P10-0704CUSTOMER CUSTOMER NAMEVENDOR ACME PHOTOMASKSFILE_DATE_TIME 14-Oct-2002, 10:39:26!MASK_SET_ID S55555!BUSINESS_CONTACT ORDER FROM CONTACT NAMEBUSINESS_ADDRESS ORDER FROM ADDRESS LINE1 !Use as few or as BUSINESS_ADDRESS ORDER FROM ADDRESS LINE2 !many lines asBUSINESS_ADDRESS ORDER FROM ADDRESS LINE3 !needed - min=1BUSINESS_PHONE 555-555-5555BUSINESS_FAX 555-555-5555BUSINESS_EMAIL BUSINESS EMAIL ADDRESS!BILLING_CONTACT BILL CONTACT NAMEBILLING_ADDRESS BILL ADDRESS LINE1 !Use as few or asBILLING_ADDRESS BILL ADDRESS LINE2 !many lines asBILLING_ADDRESS BILL ADDRESS LINE3 !needed - min=1BILLING_PHONE 555-555-5555BILLING_FAX 555-555-5555BILLING_EMAIL BILL EMAIL ADDRESS!DESIGN_RULE 0.35PRICE_UNITS USD!ENGINEERING_CONTACT ENGR CONTACT NAMEENGINEERING_ADDRESS ENGR ADDRESS LINE1 !Use as few or asENGINEERING_ADDRESS ENGR ADDRESS LINE2 !many lines asENGINEERING_ADDRESS ENGR ADDRESS LINE3 !needed - min=1ENGINEERING_PHONE 555-555-5555ENGINEERING_FAX 555-555-5555ENGINEERING_EMAIL ENGR EMAIL ADDRESS!SHIPPING_CONTACT SHIP CONTACT NAMESHIPPING_ADDRESS SHIP ADDRESS LINE1SHIPPING_ADDRESS SHIP ADDRESS LINE2SHIPPING_PHONE 555-555-5555SHIPPING_FAX 555-555-5555SHIPPING_EMAIL EMAIL ADDRESS!!SHIPPING_METHOD COURIER NAMESHIPPING_METHOD TERMS!REPAIRS_AUTHORIZED T!START_SHIPPABLE_DATA S1SHIP_CD_DATA TSTART_SHIP_TO S1CD ! <different shipto address>

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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MAILING_ADDRESS 123 SOMEWHERE ELSE ST.MAILING_ADDRESS A CITYMAILING_ADDRESS THE STATE, THE ZIPMAILING_ADDRESS COUNTRYEND_SHIP_TO S1CDSHIP_DEFECT_DATA TSHIP_THRU_PELLICLE_DATA TSHIP_INSP_DATABASE_DATA FSHIP_REPAIR_DATA TSHIP_REGISTR_DATA TEND_SHIPPABLE_DATA S1!!DATA_MEDIUM FTPDATA_FILE_SIZE 12121212DATA_PATTERN_NAME FILESNAME.01PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_WINDOW 0.0,0.0,34555.500,10987.500END_DATA_PATTERN_NAME FILESNAME.01END_DATA_MEDIUM FTP!DATA_MEDIUM FTPDATA_FILE_SIZE 12171212DATA_PATTERN_NAME FILESNAME.02PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_WINDOW 0.0,0.0,34555.500,10987.500END_DATA_PATTERN_NAME FILESNAME.02END_DATA_MEDIUM FTP!DATA_MEDIUM FTPDATA_FILE_SIZE 13101056DATA_PATTERN_NAME FILESNAME.03PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_WINDOW 0.0,0.0,34555.500,10987.500END_DATA_PATTERN_NAME FILESNAME.03END_DATA_MEDIUM FTP!! MET2ALLDATA_MEDIUM FTPDATA_FILE_SIZE 13101058DATA_PATTERN_NAME FILESNAME.04PATTERN_FORMAT MEBES_RETICLEDATA_PATTERN_WINDOW 0.0, 0.0,34555.500,10987.500END_DATA_PATTERN_NAME FILESNAME.04END_DATA_MEDIUM FTP!MASK_SET_NAME DEVICE NAMEORDER_ID ORDER ID NUMBER!END_MASK_SET_OPTIONS S55555!MASK_GROUP_ID G5555PO_NUMBER P.O. NUMBER!PRODUCT_TYPE RETICLEPRODUCT_MAGNIFICATION 5XPRODUCT_IMAGING_TYPE BINARY!END_MASK_GROUP_OPTIONS G5555!PLACEMENT_TOP_CELL TC!

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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MASK_ID M111MASK_NAME CONTACT 1DELIVERABLE_MASK TSTATUS NEWDUE_DATE_TIME_REQUESTED 24-Oct-2002, 10:39:26LAYER_PRIORITY 1PRICE 15000LITHO_EQUIP_REQD EBEAMJOB_NAME JOBDECK NAMEJOB_LEVEL 1!START_TITLE 1TITLE_TEXT TITLE TEXTTITLE_TYPE MASKTITLE_JUSTIFICATION LTITLE_LOCATION 13400,8650ROTATE_TITLE 90END_TITLE 1!START_TITLE 2TITLE_TEXT DEVICE NAMETITLE_TYPE DEVICETITLE_JUSTIFICATION LTITLE_LOCATION 14400,8050ROTATE_TITLE 90END_TITLE 2!START_TITLE 3TITLE_TEXT CUSTOMER PROPRIETARYTITLE_TYPE AUXILIARYTITLE_JUSTIFICATION LTITLE_LOCATION 14700,2000ROTATE_TITLE 90END_TITLE 3!START_BARCODE 1BARCODE_TYPE ASMBARCODE_TEXT BARCODE TEXTBARCODE_LOCATION 63000,55000BARCODE_ROTATION 0END_BARCODE 1!START_BARCODE 2BARCODE_TYPE CANON BARCODE_TEXT BARCODE TEXTBARCODE_LOCATION −62222,−22000BARCODE_ROTATION 0END_BARCODE 2!MIRROR_MASK TBLANK_SIZE 6/250BLANK_TYPE ULTEBLANK_FLATNESS 2MASK_COATING LOW_REFLECTIVE_CHROMERESIST_TYPE POSITIVE!TOP_PELLICLE_TYPE PELLICLE PART NUMBER1 !First choiceTOP_PELLICLE_TYPE PELLICLE PART NUMBER2 !Second choice!START_REGISTR 1REGISTR_ERROR 10REGISTR_REF_METHOD_REQD PTB

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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REGISTR_ALGORITHIM MULTI-POINTMASK_REGISTR_MARK 0,0MEASURE_FILE_NAME MEASURE FILENAMEEND_REGISTR 1!MIN_MASK_FEATURE_SIZE 15!START_DEFECT_DEFINITION 1VISUAL_INSPECTION_REQD FAUTO_INSPECTION_REQD TDEFECT_SIZE 0.75DEFECT_COUNT 0!INSPECTION_AREA −54388,−54388,53994,56053DATABASE_INSPECTION TEND_DEFECT_DEFINITION 1!!SURF_INSP_METHOD LASERSURF_INSP_PELL_TOP 1.0SURF_INSP_PELL_BOTTOM 1.0SURF_INSP_GLASS_SIDE 2.0SURF_INSP_PATTERN_SIDE 0.75!!INSPECT_THROUGH_PELLICLE T!START_DEFECT_DEFINITION 2DIE_TO_DIE_INSPECTION TDEFECT_SIZE 1.50DEFECT_COUNT 0DATABASE_INSPECTION TEND_DEFECT_DEFINITION 2!QUALITY_GROUP_ID Q1PACKAGE COMPACT PART NUMBER!END_MASK M111!!MASK_ID M222MASK_NAME METAL 1DELIVERABLE_MASK TSTATUS NEWDUE_DATE_TIME_REQUESTED 26-Oct-2002, 10:39:26LAYER_PRIORITY 1PRICE 10000LITHO_EQUIP_REQD EBEAMJOB_NAME JOBDECK NAMEJOB_LEVEL 1!START_TITLE 1TITLE_TEXT TITLE TEXTTITLE_TYPE MASKTITLE_JUSTIFICATION LTITLE_LOCATION 13400,86500ROTATE_TITLE 90END_TITLE 1!START_TITLE 2TITLE_TEXT DEVICE NAMETITLE_TYPE DEVICE

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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TITLE_JUSTIFICATION LTITLE_LOCATION 14400,80500ROTATE_TITLE 90END_TITLE 2!START_TITLE 3TITLE_TEXT CUSTOMER PROPRIETARYTITLE_TYPE AUXILIARYTITLE_JUSTIFICATION LTITLE_LOCATION 14700,20000ROTATE_TITLE 90END_TITLE 3!START_BARCODE 1BARCODE_TYPE ASMBARCODE_TEXT BARCODE TEXTBARCODE_LOCATION 63000,32000BARCODE_ROTATION 0END_BARCODE 1!START_BARCODE 2BARCODE_TYPE CANONBARCODE_TEXT BARCODE TEXTBARCODE_LOCATION −62222,−22000BARCODE_ROTATION 0END_BARCODE 2!MIRROR_MASK TBLANK_SIZE 6/250BLANK_TYPE ULTEBLANK_FLATNESS 2.0MASK_COATING LOW_REFLECTIVE_CHROMERESIST_TYPE POSITIVE!TOP_PELLICLE_TYPE PELLICLE PART NUMBER1TOP_PELLICLE_TYPE PELLICLE PART NUMBER2!START_REGISTR 1REGISTR_ERROR 10REGISTR_REF_METHOD_REQD PTBREGISTR_ALGORITHIM MULTI-POINTMASK_REGISTR_MARK 0,0MEASURE_FILE_NAME MEASURE FILENAMEEND_REGISTR 1!MIN_MASK_FEATURE_SIZE 0.25!START_DEFECT_DEFINITION 1VISUAL_INSPECTION_REQD FAUTO_INSPECTION_REQD TDEFECT_SIZE 0.85DEFECT_COUNT 0!INSPECTION_AREA −59388,−57388,51994,53053DATABASE_INSPECTION TEND_DEFECT_DEFINITION 1!!SURF_INSP_METHOD LASERSURF_INSP_PELL_TOP 1.0SURF_INSP_PELL_BOTTOM 1.0SURF_INSP_GLASS_SIDE 2.0

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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SURF_INSP_PATTERN_SIDE 0.75!!INSPECT_THROUGH_PELLICLE T!START_DEFECT_DEFINITION 2DIE_TO_DIE_INSPECTION TDEFECT_SIZE 1.50DEFECT_COUNT 0DATABASE_INSPECTION TEND_DEFECT_DEFINITION 2!QUALITY_GROUP_ID Q1PACKAGE COMPACT PART NUMBER!END_MASK M222!!CELL_ID TCEND_CELL_OPTIONS TC !PATTERN_GROUP_INSTANCE PRIMARYSTART_PLACEMENT 1LOCATION 0.000,0.000STEPPING_DISTANCE 0,0STEPPING_COUNT 1,1END_PLACEMENT 1END_PATTERN_GROUP_INSTANCE PRIMARY !PATTERN_GROUP_INSTANCE CLEAR_BOXSTART_PLACEMENT CBP1LOCATION 33000,−33000STEPPING_DISTANCE 0,0STEPPING_COUNT 1,1END_PLACEMENT CBP1!START_PLACEMENT CBP2LOCATION −33000,33000STEPPING_DISTANCE 0,0END_PLACEMENT CBP2STEPPING_COUNT 1,1END_PATTERN_GROUP_INSTANCE CLEAR_BOX !PATTERN_GROUP_INSTANCE FIDSTART_PLACEMENT FP1LOCATION 60000,60000STEPPING_DISTANCE 0,0STEPPING_COUNT 1,1END_PLACEMENT FP1END_PATTERN_GROUP_INSTANCE FID!END_CELL TC!!PATTERN_GROUP_ID PRIMARYEND_PATTERN_GROUP_OPTIONS PRIMARY!LEVEL_ID M111PATTERN_NAME FILESNAME.01START_PATTERN_OPTIONS 1PPOPATTERN_ADDRESS_SIZE 0.25DIGITIZED_DATA_DARK F

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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!START_CD 1CD_DATA 1.250CD_DIGITIZED TCD_TONE_CLEAR TCD_TARGET 1.300CD_ORIENTATION HORIZONTALCD_REFERENCE_ONLY FCD_TOLERANCE 0.12CD_RANGE 0.12NUMBER_OF_CDS 4CD_LOCATION −53448.100,−43783.375CD_LOCATION −53448.100,55576.625CD_LOCATION −49070.125,−53343.000CD_LOCATION −49070.125,47017.000CD_FEATURE TUNING FORKEND_CD 1END_PATTERN_OPTIONS 1PPOEND_PATTERN_DEFINITION M111!LEVEL_ID M222PATTERN_NAME FILESNAME.02START_PATTERN_OPTIONS 2PPOPATTERN_ADDRESS_SIZE 0.25DIGITIZED_DATA_DARK T!START_CD 1CD_DATA 2.25CD_DIGITIZED TCD_TONE_CLEAR TCD_TARGET 2.30CD_ORIENTATION HORIZONTALCD_REFERENCE_ONLY FCD_TOLERANCE 0.12CD_RANGE 0.12NUMBER_OF_CDS 4CD_LOCATION −33448.100,−53783.375CD_LOCATION −33448.100,45576.625CD_LOCATION −39070.125,−13343.000CD_LOCATION −39070.125,27017.000CD_FEATURE L BAREND_CD 1END_PATTERN_OPTIONS 2PPOEND_PATTERN_DEFINITION M222!END_PATTERN_GROUP PRIMARY!!PATTERN_GROUP_ID CLEAR_BOX ! Only for Mask M111END_PATTERN_GROUP_OPTIONS CLEAR_BOX!LEVEL_ID M111PATTERN_NAME FILESNAME.03START_PATTERN_OPTIONS 1CPOPATTERN_ADDRESS_SIZE 0.25DIGITIZED_DATA_DARK FEND_PATTERN_OPTIONS 1CPOEND_PATTERN_DEFINITION M111!END_PATTERN_GROUP CLEAR_BOX!PATTERN_GROUP_ID FID

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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PATTERN_ADDRESS_SIZE 0.25END_PATTERN_GROUP_OPTIONS FID!LEVEL_ID M111PATTERN_NAME FILESNAME.04START_PATTERN_OPTIONS 1CPODIGITIZED_DATA_DARK FEND_PATTERN_OPTIONS 1CPOEND_PATTERN_DEFINITION M111!LEVEL_ID M222PATTERN_NAME FILESNAME.04START_PATTERN_OPTIONS 2CPODIGITIZED_DATA_DARK TEND_PATTERN_OPTIONS 2CPOEND_PATTERN_DEFINITION M222!END_PATTERN_GROUP FID!!END_MASK_GROUP G5555END_MASK_SET S55555END_ORDER O555555CHECKSUM 118

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 6 SEMI PHOTOMASK ORDER EXAMPLE FOR UT1X RETICLESNOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

NOTE: Indentation is for clarity only and is not required.

!START_ORDER ORDER11111 SEMI_REVISION P10-0704 CUSTOMER AAA CUSTOMER VENDOR ANY VENDOR FILE_DATE_TIME 01-Jan-2002, 12:00 OPERATOR_NAME AN OPERATOR ! MASK_SET_ID ABC123 BILLING_CONTACT CONTACT NAME BILLING_ADDRESS BILLING ADDRESS LINE 1 BILLING_ADDRESS BILLING ADDRESS LINE 2 PRICE_UNITS USD SHIPPING_CONTACT CONTACT NAME SHIPPING_ADDRESS SHIPPING ADDRESS LINE 1 SHIPPING_ADDRESS SHIPPING ADDRESS LINE 2 SHIPPING_ADDRESS SHIPPING ADDRESS LINE 3 ! DATA_MEDIUM FTP DATA_PATTERN_NAME FILENAME01.1$ PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME01.1$ DATA_PATTERN_NAME FILENAME01.2$ PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME01.2$ DATA_PATTERN_NAME FILENAME02.1$ PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME02.1$ DATA_PATTERN_NAME FILENAME03.50 PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME03.50 DATA_PATTERN_NAME FILENAME04.50 PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME04.50 DATA_PATTERN_NAME FILENAME05.S$ PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME05.S$ DATA_PATTERN_NAME FILENAME06.25 PATTERN_FORMAT MEBES_RETICLE END_DATA_PATTERN_NAME FILENAME06.25 END_DATA_MEDIUM FTP

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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! MASK_SET_NAME ABC123 MASK_SET_VERSION ABC123 ! END_MASK_SET_OPTIONS ABC123 ! MASK_GROUP_ID UT1X_GROUP_1 END_MASK_GROUP_OPTIONS UT1X_GROUP_1 ! PLACEMENT_TOP_CELL UT_1X_TOP_CELL ! !-----------MASKS------------------------- MASK_ID 100001 MASK_NAME NAME100001 DELIVERABLE_MASK T PO_NUMBER 123456789 RELEASE_NUMBER 987654 STATUS NEW DUE_DATE_TIME_REQUESTED 01-Jan-2002, 10:44 PRICE 1111.0 REPAIRS_AUTHORIZED T ! START_SHIPPABLE_DATA 1 SHIP_CD_PRINTOUT T SHIP_DEFECT_DATA T SHIP_REGISTR_DATA T END_SHIPPABLE_DATA 1 ! PRODUCT_TYPE 1X_STD_FIELD_RETICLE PRODUCT_MAGNIFICATION 1X PRODUCT_IMAGING_TYPE BINARY QUANTITY 1 WAFER_EXPOSURE_TOOL ULTRATECH JOB_NAME j1000001.jb JOB_LEVEL 1 ! START_TITLE TITLE_1 TITLE_TEXT ABC123 TITLE_TYPE DEVICE TITLE_JUSTIFICATION L TITLE_LOCATION −33000.0,−1000.0 MIRROR_TITLE F ROTATE_TITLE 0 ROTATE_TITLE_CHARACTERS 0 END_TITLE TITLE_1 ! START_TITLE TITLE_2 TITLE_TEXT NAME100001

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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TITLE_TYPE MASK TITLE_JUSTIFICATION L TITLE_LOCATION −22000.0,1000.0 MIRROR_TITLE F ROTATE_TITLE 0 ROTATE_TITLE_CHARACTERS 0 END_TITLE TITLE_2 !( MIRROR_MASK T BLANK_SIZE 5/90 BLANK_TYPE ULTE BLANK_FLATNESS 2 MASK_COATING LOW_REFLECTIVE_CHROME UT1X_UNCUT T TOP_PELLICLE_TYPE Pellicle Part Number GUIDES_REQD STANDARD ! START_DEFECT_DEFINITION UT1X_1 GOOD_FIELDS (1 AND 2) END_DEFECT_DEFINITION UT1X_1 ! START_DEFECT_DEFINITION PREPELL_DIE2DIE_1 AUTO_INSPECTION_REQD T DIE_TO_DIE_INSPECTION T DEFECT_SIZE_CL 1.0 DEFECT_SIZE_DK 1.0 DEFECT_COUNT 0 END_DEFECT_DEFINITION PREPELL_DIE2DIE_1 ! QUALITY_GROUP_ID ABC123 PACKAGE Package Part Number END_MASK 1000001 !------------------------------------------ ! ! The TOP_CELL’s role in the SEMI P10 Standard is to provide a means to list and locate all of the ! Patterns on the Mask. Within the TOP_CELL Cell ID section (below) both Patterns and other Cells ! can be listed. The value for the Top Cell is given by the PLACEMENT_TOP_CELL keyword in the ! MASK_GROUP section above. ! ! This example lays out each component of the Mask using the “CELL_INSTANCE” keyword. ! Each Ultratech Field is represented by a “FLD_x” designation for a Cell Instance, where “x” is ! the field number. The general idea is to designate a cell for each Field separately and to let ! the MASK_PATTERNS cell hold the remaining data. In this example the FLD_1 cell contains Field 1, ! the FLD_2 cell holds Field 2, and the MASK_PATTERNS cell holds Barcode, BOJ, EOJ, Fiducial, ! and Logo data. Other types of Patterns could also be included in the MASK_PATTERNS cell. ! ! !----------CELLS--------------------------

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CELL_ID UT_1X_TOP_CELL !-- refers to PLACEMENT_TOP_CELL END_CELL_OPTIONS UT_1X_TOP_CELL ! CELL_INSTANCE FLD_1 !--Field 1 cell within TOP_CELL END_CELL_INSTANCE_OPTIONS FLD_1 START_PLACEMENT F1 LOCATION −32000.0,28000.0 END_PLACEMENT F1 END_CELL_INSTANCE FLD_1 ! CELL_INSTANCE FLD_2 !--Field 2 cell within TOP_CELL END_CELL_INSTANCE_OPTIONS FLD_2 START_PLACEMENT F2 LOCATION 25500.0,28500.0 END_PLACEMENT F2 END_CELL_INSTANCE FLD_2 ! CELL_INSTANCE MASK_PATTERNS !--Other data cell with TOP_CELL END_CELL_INSTANCE_OPTIONS MASK_PATTERNS END_CELL_INSTANCE MASK_PATTERNS END_CELL UT_1X_TOP_CELL ! ! ! Each CELL_ID below lists the components in that cell, using the PATTERN_GROUP_INSTANCE keyword, ! along with placement data. ! ! Field 1 CELL_ID FLD_1 !--This refers to CELL_INSTANCE FLD_1 END_CELL_OPTIONS FLD_1 ! PATTERN_GROUP_INSTANCE FLD_1_PG START_PLACEMENT FDPN1 LOCATION −20000.0,20000.0 STEPPING_DISTANCE 10000.0,0.0 STEPPING_COUNT 2,1 END_PLACEMENT FDP_1 END_PATTERN_GROUP_INSTANCE FLD_1_PG END_CELL FLD_1 ! ! Field 2 CELL_ID FLD_2 !--This refers to CELL_INSTANCE FLD_2 END_CELL_OPTIONS FLD_2 ! PATTERN_GROUP_INSTANCE FLD_2_PG START_PLACEMENT FDP_2 LOCATION 50000.0,20000.0 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PLACEMENT FDP_2 END_PATTERN_GROUP_INSTANCE FLD_2_PG END_CELL FLD_2 ! CELL_ID MASK_PATTERNS !--This refers to CELL_INSTANCE !

MASK_PATTERNS END_CELL_OPTIONS MASK_PATTERNS ! PATTERN_GROUP_INSTANCE BARCODES START_PLACEMENT BC_1 LOCATION 85500.000,113350.000 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1 END_PLACEMENT BC_1 END_PATTERN_GROUP_INSTANCE BARCODES ! PATTERN_GROUP_INSTANCE BOJ START_PLACEMENT BJ_1 LOCATION 119000,88000 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1 END_PLACEMENT BJ_1 START_PLACEMENT BJ_2 LOCATION 9700,37000 STEPPING_DISTANCE 0 0 STEPPING_COUNT 1,1 END_PLACEMENT BJ_2 END_PATTERN_GROUP_INSTANCE BOJ ! PATTERN_GROUP_INSTANCE EOJ START_PLACEMENT EJ_1 LOCATION 119000,88000 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1 END_PLACEMENT EJ_1 START_PLACEMENT EJ_2 LOCATION 9800,3800 STEPPING_DISTANCE 0,0 STEPPING_COUNT 1,1 END_PLACEMENT EJ_2 END_PATTERN_GROUP_INSTANCE EOJ ! PATTERN_GROUP_INSTANCE FIDUCIAL START_PLACEMENT FD_1 LOCATION 63500,63500 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1 END_PLACEMENT FD_1

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PATTERN_GROUP_INSTANCE FIDUCIAL ! PATTERN_GROUP_INSTANCE LOGO START_PLACEMENT LG_1 LOCATION 10000,7500 STEPPING_DISTANCE 0.0,0.0 STEPPING_COUNT 1,1 END_PLACEMENT LG_1 END_PATTERN_GROUP_INSTANCE LOGO ! END_CELL MASK_PATTERNS !------------------------------------------ ! ! The PATTERN_GROUP_ID section relates patterns to specific groups of Masks. The LEVEL_ID ! value MUST agree with a specific MASK_ID value. When multiple Masks are ordered, there ! will be multiple LEVEL_ID sections within each PATTERN_GROUP_ID section. ! ! The PATTERN_NAME values should agree with those listed in the DATA_MEDIUM section. ! !----------PATTERN_GROUPS----------------- ! Field 1 PATTERN_GROUP_ID FLD_1_PG !refers to PATTERN_GROUP_INSTANCE FLD_1_PG END_PATTERN_GROUP_OPTIONS FLD_1_PG ! LEVEL_ID 1000001 PATTERN_NAME FILENAME01.1$ START_PATTERN_OPTIONS FLD_1_1 PATTERN_ADDRESS_SIZE 0.25 SCALE_FACTOR 1.0 DIGITIZED_DATA_DARK T UNSCALED_PATTERN_SIZE 15000.0,15000.0 MIRROR_PATTERN F END_PATTERN_OPTIONS FLD_1_1 END_PATTERN_DEFINITION 1000001 END_PATTERN_GROUP FLD_1_PG ! ! Field 2 PATTERN_GROUP_ID FLD_2_PG !refers to PATTERN_GROUP_INSTANCE FLD_2_PG END_PATTERN_GROUP_OPTIONS FLD_2_PG ! LEVEL_ID 100001 PATTERN_NAME FILENAME01.2$ START_PATTERN_OPTIONS FLD2_2 PATTERN_ADDRESS_SIZE 0.25 SCALE_FACTOR 1.0 DIGITIZED_DATA_DARK F UNSCALED_PATTERN_SIZE 15000.0,15000.0 MIRROR_PATTERN F

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PATTERN_OPTIONS FLD2_2 END_PATTERN_DEFINITION 1000001 END_PATTERN_GROUP FLD_2_PG ! ! BARCODE Component PATTERN_GROUP_ID BARCODES END_PATTERN_GROUP_OPTIONS BARCODES ! LEVEL_ID 1000001 PATTERN_NAME FILENAME02.1$ START_PATTERN_OPTIONS BC1 PATTERN_ADDRESS_SIZE 0.25 DIGITIZED_DATA_DARK F END_PATTERN_OPTIONS BC1 END_PATTERN_DEFINITION 1000001 ! END_PATTERN_GROUP BARCODES ! ! BOJ Component PATTERN_GROUP_ID BOJ END_PATTERN_GROUP_OPTIONS BOJ ! LEVEL_ID 1000001 PATTERN_NAME FILENAME03.50 START_PATTERN_OPTIONS BJ1 PATTERN_ADDRESS_SIZE 0.25 DIGITIZED_DATA_DARK F END_PATTERN_OPTIONS BJ1 END_PATTERN_DEFINITION 1000001 ! END_PATTERN_GROUP BOJ ! ! EOJ Component PATTERN_GROUP_ID EOJ END_PATTERN_GROUP_OPTIONS EOJ ! LEVEL_ID 1000001 PATTERN_NAME FILENAME04.50 START_PATTERN_OPTIONS EJ1 PATTERN_ADDRESS_SIZE 0.25 DIGITIZED_DATA_DARK F END_PATTERN_OPTIONS EJ1 END_PATTERN_DEFINITION 1000001 ! END_PATTERN_GROUP EOJ ! ! Fiducial Component PATTERN_GROUP_ID FID

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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END_PATTERN_GROUP_OPTIONS FID ! LEVEL_ID 1000001 PATTERN_NAME FILENAME05.S$ START_PATTERN_OPTIONS FL1 PATTERN_ADDRESS_SIZE 0.25 DIGITIZED_DATA_DARK F END_PATTERN_OPTIONS FL1 END_PATTERN_DEFINITION 1000001 ! END_PATTERN_GROUP FID ! ! LOGO Component PATTERN_GROUP_ID LOGO END_PATTERN_GROUP_OPTIONS LOGO ! LEVEL_ID 1000001 PATTERN_NAME FILENAME06.25 START_PATTERN_OPTIONS LO1 PATTERN_ADDRESS_SIZE 0.25 DIGITIZED_DATA_DARK F END_PATTERN_OPTIONS LO1 END_PATTERN_DEFINITION 1000001 ! END_PATTERN_GROUP LOGO !------------------------------------------ ! END_MASK_GROUP UT1X_GROUP_1 ! END_MASK_SET ABC123!END_ORDER ORDER1111CHECKSUM 0

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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RELATED INFORMATION 7 EXAMPLE OF A COMPLEX BOOLEAN FUNCTIONNOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

R7-1 The following is an excerpt of a SEMI P10 file which demonstrates how the <data_manipulation> capability may be applied. To help in interpreting the example, note that the logical function (exclusive of windowing, fracturing, scaling and sizing) is:

METAL1 = (((GDS1;0 − GDS2;0) × (GDS3;0 − GDS4;0)) + GDS6;0) × GDS5-7 × GDS17-19;8-9

DATA_PATTERN_NAME METAL-1 PATTERN_FORMAT MEBES!---------------------------------------------------------------------------------------- START_DATA_MANIPULATION 1 BOOLEAN MINUS! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 1;0DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 2;0DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! END_DATA_MANIPULATION 1! START_DATA_MANIPULATION 2 BOOLEAN MINUS! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 3;0DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 4;0

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! END_DATA_MANIPULATION 2!-------------------------------------------------------------------------------------------------------------- START_DATA_MANIPULATION 3 BOOLEAN AND !Note:The input to manipulation 3 is the output from ! manipulations #1 and #2. Discrete names of temporary files !are not required, just a reference to a previous manipulation. !This represents the output from both 1 and 2 ! (1-2) and (3-4) with the logical operation of anding them ! together ((1-2)*(3-4)). DATA_SOURCE_FILE 1

DATA_FORMAT DATA_MANIPULATION END_DATA_SOURCE_FILE 1! DATA_SOURCE_FILE 2

DATA_FORMAT DATA_MANIPULATION END_DATA_SOURCE_FILE 2 END_DATA_MANIPULATION 3!-------------------------------------------------------------------------------------------------------------- START_DATA_MANIPULATION 4 BOOLEAN OR! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 6;0DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! DATA_SOURCE_FILE 3

DATA_FORMAT DATA_MANIPULATION END_DATA_SOURCE_FILE 3! END_DATA_MANIPULATION 4!------------------------------------------------------------------------------------------------------------- START_DATA_MANIPULATION 5 BOOLEAN AND! DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 5–7DATA_PATTERN_WINDOW 012600,−13000,−12600,13000START_DATA_FRACTURE 1 PATTERN_ADDRESS_SIZE 0.05

END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds!DATA_SOURCE_FILE source1.gds

DATA_FORMAT GDSIIDATA_TOP_CELL gds_top_cellDATA_LAYER_ID 17-19;8-9DATA_PATTERN_WINDOW 112600,−13000,−112600,13000START_DATA_FRACTURE 1

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PATTERN_ADDRESS_SIZE 0.05 END_DATA_FRACTURE 1 END_DATA_SOURCE_FILE source1.gds! DATA_SOURCE_FILE 4

DATA_FORMAT DATA_MANIPULATION END_DATA_SOURCE_FILE 4!! Note: The final sizing, output address size, and data scale are shown below.! START_DATA_FRACTURE 2

PATTERN_ADDRESS_SIZE 0.05 DATA_SCALE_FACTOR 5 END_DATA_FRACTURE 2!START_DATA_FRACTURE 3 SIZING 0.25

SIZING_RULE TWOSIDED SIZING_BORDER_RULE PARAGONEND_DATA_FRACTURE 3! END_DATA_MANIPULATION 5!-------------------------------------------------------------------------------------------------------------END_DATA_PATTERN_NAME METAL-1

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

RELATED INFORMATION 8 EXAMPLE OF A DATA FUNCTIONNOTICE: The information contained in this related information is not an official part of SEMI P10, and it is not intended to modify or supersede the official standard. Rather, this example is offered as an aid to visualizing possible output from software which might implement the standard.

R8-1 The following is an excerpt of a SEMI P10 file which demonstrates how the <data_function> capability might be applied.

START_DATA_FUNCTION CPL DATA_FUNCTION_PURPOSE CPL Mask Synthesis for Poly-Gate Layer SOFTWARE_NAME MaskWeaver SOFTWARE_REVISION 1.2 RUNSET_NAME cpl090.mw RUNSET_REVISION 1.4 DATA_LOCATION /n/raidhost/r5/mwlib/ PARAMETER_FILE_NAME cpl090.par PARAMETER_FILE_REVISION 2.2 INPUT_FILE_NAME qtiac90_1.5.gds INPUT_FILE_FORMAT gds TOP_CELL MASTER DATA_LOCATION /n/raidhost/r8/tapeouts/qtiac90_1.5/ RESULT_FILE_NAME qtiac90_1.5_cpl.o32 SUMMARY_FILE_NAME qtiac90_1.5_cpl.sum LOG_FILE_NAME qtiac_90_1.5_cpl.logEND_DATA_FUNCTION CPL

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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DRAFTDocument Number:

Date: 5/9/23

RELATED INFORMATION 9 DEFECT AND SURFACE INSPECTION MACHINE SETTINGSNOTICE: This related information is not an official part of SEMI P10 and was derived from the work of the global Micropatterning Committee. This related information was approved for publication by full letter ballot procedures on April 25, 2007.

Keywords Machine Model Data Field Values

DEFECT_INSP_SENSITIVITY_REQDDEFECT_INSP_SENSITIVITY_USEDDEFECT_TYPE

KLA5XX DDB_HiRes1DDB_HiRes1_CornerDDB_HiRes1_LineendDDB_HiRes1_ThinLineOpaqueDDB_HiRes1_ThinLineOpaque.WidthDDB_HiRes1_ThinLineOpaqueDDB_HiRes1_ThinLineOpaque.WidthDDB_HiRes2DDB_Litho1DDB_Litho1.ADDB_Litho1.BDDB_Litho1.CDDB_Litho1.DDDB_Litho2DDB_Litho2_OverDDB_Litho2_Over.AssistDDB_Litho2_UnderDDB_Litho2_Under.AssistDDB_Litho2_Under.WidthDDB_Litho2_OverDDB_Litho2_Over.AssistDDB_Litho2_UnderDDB_Litho2_Under.AssistDDB_Litho2_AssistDDB_Litho2_Assist.WidthPlate_TypePSC_Center_RegionPSC_Center_Region_Size_PixelsDDB_Litho2_FilterSizeDD_HiRes1DD_HiRes2DD_Litho1.ADD_Litho1.BDD_Litho1.CDD_Litho1.DDD_Litho2DD_Litho2_FilterSize

KLA3XX PINHOLEEDGEPINDOTCDSEMI_TRANS

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Date: 5/9/23

Keywords Machine Model Data Field Values

KLASLFXX MASSIVECLIPPEDPATTERNREFL_PATTERNPAT_PINHOLEREFL_PINHOLECORNERLINE_END

Keywords Machine Model Data Field Values

DEFECT_INSP_SENSITIVITY_REQDDEFECT_INSP_SENSITIVITY_USEDDEFECT_TYPE

LM7000 MpRpXcMe1Me2Me3McMiHMiDRtMvRvRRvRd

LM7000B Xp3Xp2Xp1XcXc1Xd2Xv1Xv3

Keywords Machine Model Data Field Values

SURF_INSP_SENSITIVITY_REQDSURF_INSP_SENSITIVITY_USEDDEFECT_TYPE

BLUE CONTAM_ON_CLEARDIM_CLEARON_EDGEUNKNOWNPINHOLEBRIGHT_CHROMECONTAM_ON_CHROMEDIM_CHROME

SL3UV ON_CLEARDIM_CLEARON_EDGEPINHOLEBRIGHTON_CHROMEDIM_CHROME

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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DRAFTDocument Number:

Date: 5/9/23

Keywords Machine Model Data Field Values

ON_ATTDIM_ATTATT_PINHOLE

SLFXX ON_CLEARDIM_CLEARON_ATTDIM_ATTON_EDGEPINHOLEATT_PINHOLEBRIGHTON_CHROMEDIM_CHROME

SL2 SL_HiRes3SL_HiRes3.LineendCorner

SL_HiRes3.ThinlineOpaqueSL_HiRes3.ThinlineOpaque.WidthSL_HiRes3.ThinlineClearSL_HiRes3.ThinlineClear.WidthSL_HiRes3.OnEdgeSL_HiRes3.OnClearSL_HiRes3.OnOpaqueSL_HiRes4SL_HiRes4.OnEdgeSL_HiRes4.OnClearSL_HiRes4.OnOpaqueSL_Litho3SL_Litho3.ASL_Litho3.BSL_Litho3.CExtreme_LinewidthRTE10_EnableRTE10_SensitivityCHD_Sensitivity

NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice.

By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility.

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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