Failure Assessment Software for Circuit Card Assemblies0:\presentations\rams99.ppt • 50...

$: Failure Assessment Software for Circuit Card Assemblies0:\presentations\rams99.ppt • 50 microcircuits • 7 connectors • 22 inductors • 44 semiconductors • 241 capacitors •$
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt

Failure Assessment Software forCircuit Card Assemblies

Michael Osterman CALCE Electronic Products and Systems Center

College Park

Thomas Stadterman U.S. Army Material Systems Analysis Activity

Aberdeen Proving Grounds


•Assess design using the calcePWAsoftware

•Perform accelerated testing.•Suggest design changes to improve

reliability.

Objectives

ARC-210 Radio

Demonstrate reliability improvement using the physic of failure(PoF) process for Tri-Service Radio


Physics-of-Failure:

• Founded on the fact that failure mechanismsare governed by fundamental mechanical,electrical, thermal, and chemical processes

• By understanding the physics behind thefailure mechanisms, potential problems inexisting and emerging technologies can beidentified and solved before they occur


Temperature, vibration,shock, moisture, EMI

“Stress” Analysis

Solder joint, board,passivation,

die metallization

Failure Analysis

Sensitivity Analysis

Solder fatigue, conductive filament formation, board corrosion, wire fatigue, passivation cracking,

metallization/bond pad corrosion.

Manufacturability AnalysisSurface mount placement, solderability ,popcorning, laminate formation, etching, plating, board warpage, reflow simulation,print simulation

Evaluate product failure due to variationsin environmental and architectural parameters

Storage, transport,assembly, and usage

EnvironmentsIntegratorse.g., AlliedSignal

Honeywell

DeviceManufacturers

e.g., Intel, AMD National Semiconductor

Databases

Researcherse.g., CALCE EPRC

Devices

Stakeholders

ProcessSoldering, laminating,

plating, etching

Failure ModelsWearout, overstress

TestLaboratories

e.g., Bell Technologies,Lucent Technologies

Inputs AnalysisProduct

ProductionProcess

Architecture

OperationalParameters

HAST, ESS, and othersTests

Packages

ASICs, memory,FPGA, processors

LifeCycle Profile

Global LocalBGA, MCM,

Chip scale packageComponentPackagers

e.g., Amkor-ANAM White Microelectronics

MaterialsPWB, solders, adhesives

Distributed Development Process for Assemblies

Performance AnalysisCross-talk, time delay, failed circuit identification,

EM compatibility, radiation resistance

Failure Identification

Outputs

AcceleratedQualification

DefectIdentification

Health Management

Solutions

ScreeningConditions

Design Tradeoffs

Product andSupply Chain

Evaluation

“Risk MitigationSolutions”

StressManagement

Userse.g., Boeing

Regulatorse.g., FAA

Vendorse.g., Alpha MetalsCorning

Assemblierse.g., Hadco, Celestica


Reports and documentationToolbox

Architecture & environmentmodeling

Thermal analysisVibration analysis

Failure assessment& sensitivity analysis

calcePWA Software


Schematic Capture

Schematic Capture

Failure IdentificationFailure Sensitivity

Failure Quantification

Part &MaterialSelection

Placement

Routing ProductionGeneration ofArtwork

Global AnalysisTemperature,Vibration

Shock,and EMI

Structural AnalysisModeling

Acceptable Design

Unacceptable Design

Environment and Usage ProfileCircuit SimulationCircuit

Simulation Partitioning

calcePWA Software in the Design Process

Local StressLead, Solder, PTH,

Trace, and Laminate

Reliability Assessment

calcePWA


• 50 microcircuits• 7 connectors• 22 inductors• 44 semiconductors• 241 capacitors• 222 resistors

Circuit Card Assembly Models

RT 1556 Control Module• Consists of 3 CCA’s with 6 layer PWB’s• Ceramic and plastic microcircuits• SMT and PTH technology• Commercial and military components• Approx. Cost $5k/module

Aluminum Backplane

Board 1

Board 2

Board 3

Frame

AluminumBackplane


Components

• Microcircuits

• Connectors

• Inductors

• Semi-conductors

• Capacitors

• Resistors

• Others

285

22

2

6

30

78

145

2

Component Placement for Board 3


• Natural Frequency > 500 Hz• Maximum curvature at board center

Vibration Analysis

First Mode ShapeBoundary Conditions

Displacement


Thermal Analysis

• Low power dissipation • Temperature only slightly higher than boundary temperature

Boundary Conditions

Component Substrate Temperature

Layer 1 Temperature


Failure Assessment

Analysis Results:• 20 pin Leadless Chip Carrier (LCC) was weak in design• Estimated time-to-failure during accelerated life test cycle• Estimated life under operating conditions - 6.5 years

Load conditions:Temperature cycles∆T = 145°CRandom vibration loadPSD = 0.04 G2/Hz


Testing Results

117

121

123

124

125

131

132

151

202

206

0 500 1000 1500 2000

LCC Failure Model prediction

Module Timeline 20 Year life

20 Y

ear L

ife

Mod

el P

redi

ctio

n

Test conditions:Temperature cycling: -50 to 95°C, dwell, 2 hours per cycleVibration: 0.04 G2/Hz, 6.10 Grms, 10 hours

Test

Mod

ules


• Developed Log Case Study for Potential Improvements

• Module Level - 5,000 units fielded - 20 years field life

O & S Cost Savings for DoD:PoF returns up to $27M insustainment cost avoidance

Results of Study


Comanche• Commonality w/ AF F-22• Used same PoF tools as AMSAA• Commercial ICs Inserted

$50MSavings

JSTARS Ground Station• PoF Analysis on circuit cards• Recommended commercial

processor circuit card

$1.2MSavings

IncreasedReliability

Bradley Fire Support Vehicle• PoF Analysis on 15 circuit cards• Identified potential problems

Tri-Service Radio• PoF Analysis on circuit cards• Accelerated life testing• Benefit: Increased reliability

$27M Savings

Low Cost PoF Analysis Using CALCE Software Provides Considerable ROILow Cost PoF Analysis Using CALCE Software Provides Considerable ROI

Electronics Physics-of-Failure ImpactsElectronics Physics-of-Failure Impacts


Mine Plow System•Integrated PoF approach to design,testing, & O&S cost reduction

Striker•BFIST electronics in HMMWV environment•Analyze for shock/vibration

Current Electronics Physics-of-Failure ProjectsCurrent Electronics Physics-of-Failure Projects

Laptop Computer•PoF Analysis oncircuit cards

•High ROI fromreliabilityimprovements

Missile System


TailoredTests & Screens

TailoredTailoredTests & Tests & ScreensScreens

Life CycleCost

Reduction

Life CycleLife CycleCostCost

ReductionReduction

ModernizationThroughSpares

ModernizationModernizationThroughThroughSparesSpares

CommercialTechnology

Insertion

CommercialCommercialTechnologyTechnology

InsertionInsertion

PoF Process RequiresGeometric informationMaterial information

Environment and usage information

PoF Process ProvidesDetermination of stress levelsIdentification and ranking

of potential problems

PoF Process RequiresGeometric informationMaterial information

Environment and usage information

PoF Process ProvidesDetermination of stress levelsIdentification and ranking

of potential problems

Over $80M Saved or Avoided

by using CalcePWA

Over $80M Saved or Avoided

by using CalcePWA

SummarySummary

Failure Assessment Software for Circuit Card Assemblies0:\presentations\rams99.ppt • 50...

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