CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Failure Assessment Software forCircuit Card Assemblies
Michael Osterman CALCE Electronic Products and Systems Center
College Park
Thomas Stadterman U.S. Army Material Systems Analysis Activity
Aberdeen Proving Grounds
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
•Assess design using the calcePWAsoftware
•Perform accelerated testing.•Suggest design changes to improve
reliability.
Objectives
ARC-210 Radio
Demonstrate reliability improvement using the physic of failure(PoF) process for Tri-Service Radio
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Physics-of-Failure:
• Founded on the fact that failure mechanismsare governed by fundamental mechanical,electrical, thermal, and chemical processes
• By understanding the physics behind thefailure mechanisms, potential problems inexisting and emerging technologies can beidentified and solved before they occur
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Temperature, vibration,shock, moisture, EMI
“Stress” Analysis
Solder joint, board,passivation,
die metallization
Failure Analysis
Sensitivity Analysis
Solder fatigue, conductive filament formation, board corrosion, wire fatigue, passivation cracking,
metallization/bond pad corrosion.
Manufacturability AnalysisSurface mount placement, solderability ,popcorning, laminate formation, etching, plating, board warpage, reflow simulation,print simulation
Evaluate product failure due to variationsin environmental and architectural parameters
Storage, transport,assembly, and usage
EnvironmentsIntegratorse.g., AlliedSignal
Honeywell
DeviceManufacturers
e.g., Intel, AMD National Semiconductor
Databases
Researcherse.g., CALCE EPRC
Devices
Stakeholders
ProcessSoldering, laminating,
plating, etching
Failure ModelsWearout, overstress
TestLaboratories
e.g., Bell Technologies,Lucent Technologies
Inputs AnalysisProduct
ProductionProcess
Architecture
OperationalParameters
HAST, ESS, and othersTests
Packages
ASICs, memory,FPGA, processors
LifeCycle Profile
Global LocalBGA, MCM,
Chip scale packageComponentPackagers
e.g., Amkor-ANAM White Microelectronics
MaterialsPWB, solders, adhesives
Distributed Development Process for Assemblies
Performance AnalysisCross-talk, time delay, failed circuit identification,
EM compatibility, radiation resistance
Failure Identification
Outputs
AcceleratedQualification
DefectIdentification
Health Management
Solutions
ScreeningConditions
Design Tradeoffs
Product andSupply Chain
Evaluation
“Risk MitigationSolutions”
StressManagement
Userse.g., Boeing
Regulatorse.g., FAA
Vendorse.g., Alpha MetalsCorning
Assemblierse.g., Hadco, Celestica
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Reports and documentationToolbox
Architecture & environmentmodeling
Thermal analysisVibration analysis
Failure assessment& sensitivity analysis
calcePWA Software
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Schematic Capture
Schematic Capture
Failure IdentificationFailure Sensitivity
Failure Quantification
Part &MaterialSelection
Placement
Routing ProductionGeneration ofArtwork
Global AnalysisTemperature,Vibration
Shock,and EMI
Structural AnalysisModeling
Acceptable Design
Unacceptable Design
Environment and Usage ProfileCircuit SimulationCircuit
Simulation Partitioning
calcePWA Software in the Design Process
Local StressLead, Solder, PTH,
Trace, and Laminate
Reliability Assessment
calcePWA
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
• 50 microcircuits• 7 connectors• 22 inductors• 44 semiconductors• 241 capacitors• 222 resistors
Circuit Card Assembly Models
RT 1556 Control Module• Consists of 3 CCA’s with 6 layer PWB’s• Ceramic and plastic microcircuits• SMT and PTH technology• Commercial and military components• Approx. Cost $5k/module
Aluminum Backplane
Board 1
Board 2
Board 3
Frame
AluminumBackplane
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Components
• Microcircuits
• Connectors
• Inductors
• Semi-conductors
• Capacitors
• Resistors
• Others
285
22
2
6
30
78
145
2
Component Placement for Board 3
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
• Natural Frequency > 500 Hz• Maximum curvature at board center
Vibration Analysis
First Mode ShapeBoundary Conditions
Displacement
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Thermal Analysis
• Low power dissipation • Temperature only slightly higher than boundary temperature
Boundary Conditions
Component Substrate Temperature
Layer 1 Temperature
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Failure Assessment
Analysis Results:• 20 pin Leadless Chip Carrier (LCC) was weak in design• Estimated time-to-failure during accelerated life test cycle• Estimated life under operating conditions - 6.5 years
Load conditions:Temperature cycles∆T = 145°CRandom vibration loadPSD = 0.04 G2/Hz
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Testing Results
117
121
123
124
125
131
132
151
202
206
0 500 1000 1500 2000
LCC Failure Model prediction
Module Timeline 20 Year life
20 Y
ear L
ife
Mod
el P
redi
ctio
n
Test conditions:Temperature cycling: -50 to 95°C, dwell, 2 hours per cycleVibration: 0.04 G2/Hz, 6.10 Grms, 10 hours
Test
Mod
ules
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
• Developed Log Case Study for Potential Improvements
• Module Level - 5,000 units fielded - 20 years field life
O & S Cost Savings for DoD:PoF returns up to $27M insustainment cost avoidance
Results of Study
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Comanche• Commonality w/ AF F-22• Used same PoF tools as AMSAA• Commercial ICs Inserted
$50MSavings
JSTARS Ground Station• PoF Analysis on circuit cards• Recommended commercial
processor circuit card
$1.2MSavings
IncreasedReliability
Bradley Fire Support Vehicle• PoF Analysis on 15 circuit cards• Identified potential problems
Tri-Service Radio• PoF Analysis on circuit cards• Accelerated life testing• Benefit: Increased reliability
$27M Savings
Low Cost PoF Analysis Using CALCE Software Provides Considerable ROILow Cost PoF Analysis Using CALCE Software Provides Considerable ROI
Electronics Physics-of-Failure ImpactsElectronics Physics-of-Failure Impacts
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
Mine Plow System•Integrated PoF approach to design,testing, & O&S cost reduction
Striker•BFIST electronics in HMMWV environment•Analyze for shock/vibration
Current Electronics Physics-of-Failure ProjectsCurrent Electronics Physics-of-Failure Projects
Laptop Computer•PoF Analysis oncircuit cards
•High ROI fromreliabilityimprovements
Missile System
CALCE Electronic Products and Systems Center U.S. Army Material Systems Analysis Activity0:\presentations\rams99.ppt
TailoredTests & Screens
TailoredTailoredTests & Tests & ScreensScreens
Life CycleCost
Reduction
Life CycleLife CycleCostCost
ReductionReduction
ModernizationThroughSpares
ModernizationModernizationThroughThroughSparesSpares
CommercialTechnology
Insertion
CommercialCommercialTechnologyTechnology
InsertionInsertion
PoF Process RequiresGeometric informationMaterial information
Environment and usage information
PoF Process ProvidesDetermination of stress levelsIdentification and ranking
of potential problems
PoF Process RequiresGeometric informationMaterial information
Environment and usage information
PoF Process ProvidesDetermination of stress levelsIdentification and ranking
of potential problems
Over $80M Saved or Avoided
by using CalcePWA
Over $80M Saved or Avoided
by using CalcePWA
SummarySummary
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