Electromagnetic compatibility of Integrated · PDF fileElectromagnetic compatibility of...

19/01/2017

1 January 17

Electromagnetic compatibility of Integrated Circuits

Jan. 2017

www.etienne-sicard.fr > Teaching > EMC of ICs

Etienne SICARDINSA/DGEIUniversity of Toulouse31077 Toulouse - [email protected]

Alexandre BOYERINSA/DGEI – LAAS-CNRSUniversity of Toulouse31077 Toulouse - [email protected]

2 January 17

Objectives

Through lectures (6 H) Understand parasitic emission mechanisms Introduce parasitic emission reduction strategies Give an overview of emission and susceptibility measure ment

standards Power Decoupling Network modelling Basis of conducted and radiated emission modelling Basis of immunity modelling Understand the role of decoupling at printed-circui t-board level Acquire basic knowledge of design for improved EMC at PCB and IC

level

Through practical training (12 H) Illustrate basic concepts through simulation IC modeling case study

Evaluation based on report

19/01/2017

3 January 17

Planning

Day 1 Morning:

– Context : E. Sicard– Basic concepts: E. Sicard

Afternoon

– Practical training with IC-EMC : E. Sicard

Day 2 Morning:

– Measurement methods & Guidelines : A. Boyer Afternoon

– Practical training with IC-EMC: E. Sicard

Day 3 Case study: BCI modeling : A. boyer

References

4 January 17

Books

www.springeronline.com www.ic-emc.org

Freeware

www.emccompo.org

Workshops

Standards www.iec.ch

• IEC 61967, 2001, Integrated Circuits Emissions

• IEC 62132, 2003, Integrated circuits Immunity

• IEC 62433, 2008, Integrated Circuit Model

July 2017, St Petersburg, Russia

19/01/2017

1. EMC of ICsAn overview

Outlines

Electronic Market Growth Electromagnetic interference What is EMC EMC at IC level Origin of parasitic emission Trends towards higher emission Origin on susceptibility Emission issues Susceptibility issues Standardization issues Conclusion

6 January 17

19/01/2017

Electronic Market Growth

7 January 17

83 86 89 92 95 98 01 04

-10%

0

10%

Adapted from Electronique International Mai 21, 2009 Year

07

20% PC in companies

Audio CD

Defense

Companies

10

30%

13 16

Individuals

Society

PC at home

Internet

GSM

MP3

DVD

Flat screens

AutomotiveLocal Energy

Security

Medical

Telecom crash

Bank crash

HDTV

3G

4G

IoT

ADAS

3%2015

Recession Recession

3%2014

4%2017

Market Growth

Electronic Market Growth

Vision 2020 Increasing

disposable income,

expanding urban population,

growing internet penetration and

availability of strong distribution network

8 January 17

0 10% 20%-10%

Share of system sales

2020 vs 2015

Smartphones

Game consoles Medical

Internet of

Things

Laptop

Tablets

Servers

Growth

100B$

19/01/2017

Mobile Business

http://www.ericsson.com/ericsson-mobility-report

We are here

7.8 billion

2G

3G

4G

Internet of Things

19/01/2017

Automatic Drive

TOWARDS AUTOMATIC DRIVE

2020 : Injury-free driving 2030: Accident-free driving ? 2040: Autonomous driving?

12

EMI ISSUES IN WIRELESS DEVICES

Numerous interference cases reported over the ISM band 2400 – 2483.5 MHz.

From Cisco, « 20 Myths of WiFi Interference », White Paper, 2008:

• “Interference contributes to 50 % of the problems on the customer’s Wi-Fi network. “

• “In a recent survey of 300 of their customers, a major Wi-Fi tools provider reported that “troubleshooting interference won ‘top honors’ as the biggest challenge in managing a Wi-Fi network.””

• “67 percent of all residential Wi-Fi problems are linked to interfering devices, such as cordless phones, baby monitors, and microwave ovens.”

• “At 8m, a microwave oven degrades data throughput by 64%.”

Electromagnetic Interference

19/01/2017


13 January 17

“Pacemakers can mistakenly detect electromagnetic interference (EMI) from smartphones as a cardiac signal, causing them to briefly stop working. This leads to a pause in the cardiac rhythm of the pacing dependent patient and may result in syncope.” Dr. Lennerz

“For implantable cardioverter defibrillators (ICDs) the external signal mimics a life threatening ventricular tachyarrhythmia, leading the ICD to deliver a painful shock” Dr. Lennerz

EMI ISSUES IN MEDICAL DEVICES Interference Technology –

June 2015

http://www.interferencetechnology.com


14

EMI ISSUES IN MEDICAL DEVICES

Electromagnetic radiation from portable suction devices could interfere with some defibrillators, rendering them inoperable in a medical emergency.

Philips HeartStart MRx defibrillators are known to fail without warning during battery power operation if subjected to high electromagnetic interference (EMI).

Laerdal LSU 4000 portable suction units emitted EMI with field strengths up to 180 V/m, put the defibrillators at risk for malfunction.

Interference Technology –

March 2014

19/01/2017


15

EMI ISSUES IN AUTOMOTIVE


March 2014

The National Highway Traffic Safety Administration (NHTSA) said in documents filed on June 2 that it had opened a query into a 2012 recall for 744,822 Jeep Liberty SUVs [..] the air bag squib filter circuitry inside the vehicle’s Occupant Restraint Control (ORC) module is susceptible to degradation. ORC degradation can result in an inadvertent air bag deployment (IABD) while the vehicle is in operation, potentially leading to injuries such as burns, cuts and bruises…

http://www.interferencetechnology.com

ADAS - Advanced Driver Assistance Systems

Autonomous driving in 2030

Much more sensors, cameras, embedded calculators & security

EMI ISSUES IN AUTOMOTIVE


19/01/2017


17

EMI ISSUES IN AVIATION

FAA said Wi-Fi systems may interfere with the Honeywell phase 3 display units aboard 157 Boeing airplanes in use by various U.S. airlines. These display units are critical for flight safety, providing crewmembers with information such as airspeed, altitude, heading, and pitch and roll [..] the issue was discovered two years ago during testing to certify a Wi-Fi system for use on Boeing 737 Next Generation.


January 2013


18

EMI ISSUES IN AVIATION

News

Wind Turbines Could Cause EMI; Pose Danger to Vermont Airspace

11/24/2015

“According to a Notice of Presumed Hazard posted on the FAA’s website, the 499-foot-tall wind turbines proposed for Rocky Ridge in Swanton would have ‘an adverse physical or electromagnetic interference effect upon navigable airspace or air navigation facilities’” Vermont Watchdog.org reported.

“The blades of the turbines would degrade radar used by Boston Center to regulate air traffic across New England states, New York and part of Pennsylvania,” Vermont Watchdog.org added.

19/01/2017

What is EMC

19

« The ability of a component, equipment or system to operate satisfyingly in a given electromagnetic environment, without introducing any harmful electromagnetic disturbances to all systems placed in this environment. »

Essential constraint to ensure functional safety of electronic or electrical applications

Guarantee the simultaneous operation of every electrical or electronic equipment in a given electromagnetic environment

Reduce both the parasitic electromagnetic emission and the sensitivity or susceptibility to electromagnetic interferences.

DEFINITION

EMC at IC level

20 January 17

100 mm10 mm

ZOOM AT DEVICES

19/01/2017

21 January 17

Integrated Circuits…

© Intel Xeon1 µm

100 nm

1 V100 µA

10µm1mm

EMC at IC level

22 January 17

WHY EMC OF IC ?

• Until mid 90’s, IC designers had no consideration about EMC problems in their design..

• Starting 1996, automotive customers started to select ICs on EMC criteria

• Starting 2005, mobile industry required EMC in System in package

• Massive 3D integration will require careful EMC design

19/01/2017

Technology

Complexity

Packaging

2004

130nm

Embedded

blocks

2007

90nm

250M

Core DSPs

10 Mb Mem

2010

45nm

500M

Dual coreDual DSP

RFGraphic Process.

100 Mb MemSensors

2013

28nm

2G

Quad CoreQuad DSP

3D Image ProcCrypto processor

Reconf FPGA, Multi RF

1 Gb MemoriesMulti-sensors

7G

Mobile generation 3G 3G+ 4G

5nm

150 G

2020

?

5G

EMC at IC Level

14nm

2016

4G+

Today

Octa CoreMulti DSP

3D 4K Image ProcCrypto, sensor,

position processorAgregated RF

2 Gb Memories

15G

EMC at IC level

24 January 17

Technology 1st year of produc.

External Supply (V)

Internal supply (V)

Max. Current (A)

Gate density (K/mm2)

SRAM area (µm2)

Gate current (mA)

Gate capa (fF)

Typ gate delay (ps)

0.8 µm 1990 5 5 <1 15 80.0 0.9 40 180

0.5 µm 1993 5 5 3 28 40.0 0.75 30 130

0.35 µm 1995 5 3.3 12 50 20.0 0.6 25 100

0.25 µm 1997 5 2.5 30 90 10.0 0.4 20 75

0.18 µm 1999 3.3 1.8 50 160 5.0 0.3 15 50

0.12 µm 2001 2.5 1.2 150 240 2.4 0.2 10 35

90 nm 2004 2.5 1.0 186 480 1.4 0.1 7 25

65 nm 2006 2.5 1.0 236 900 0.6 0.07 5 22

45 nm 2008 1.8 1.0 283 2 000 0.35 0.05 3 18

32 nm 2010 1.8 0.9 290 3 500 0.20 0.04 3 14

28 nm 2012 1.5 0.9 300 4 800 0.15 0.03 2 10

20 nm 2014 1.2 0.8 300 8 000 0.10 0.02 1.5 8

14 nm 2016 1.2 0.8 350 15 000 0.07 0.015 1.0 6

10 nm 2018 1.0 0.6 350 30 000 0.03 0.011 0.8 4

7 nm 2020 1.0 0.5 350 50 000 0.02 0.008 0.6 3

INCREASED COMPLEXITY

Adapted from M. Ramdani E. Sicard, “The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future”, IEEE Trans. EMC, VOL. 51, N. 1, Feb. 2009

19/01/2017

8bit µP : 10 KT

16 bit µP = 100 KT

32 bit µP :1MT

Dual core µP+ cache = 100MT

8-core µP = 2 GT

TOWARDS 100 GIGA DEVICES

2020

100,000,000,000

EMC at IC Level

50% 20%

55%35%

EMC at IC Level

IMPORTANCE OF MEMORY

19/01/2017

EMC at IC level

27 January 17

Emission of EM wavesSusceptibility to EM waves

TWO MAIN CONCEPTS

Personnal entrainments

Safety systems

interferences

Hardware faultSoftware failureFunction Loss

Components

EquipementsCarbon airplane

Boards

Radar

28 January 17

Susceptibility

Chip

Chip

EmissionPCB

PCB System

Components

Components

System

Integrated circuits are the origin of parasitic emission and susceptibility to RF disturbances in electronic systems

Noisy IC

Sensitive IC

Interferences

THE ROLE OF ICS AS PERTURBATION SOURCE AND VICTIM

Radiation

Coupling

EMC at IC Level

19/01/2017

29 January 17

VDD

VSS

Output capa

Vin

Origin of Parasitic Emission

BASIC MECHANISMS FOR CURRENT SWITCHING

IDD

ISS

Switching current

Voltage Time

Time

Question: waveform, amplitude?CMOS inverter exemple


30 January 17

Basic > interconnects > GateSwitching.sch

CMOS INVERTER IN IC-EMC

Switching current

Voltage Time

Time

Waveforms strongly depend on load

19/01/2017

31 January 17


STRONGER SWITCHING CURRENT:

50ps

i(t)

Time

Switching gatesInternal

switching current

Vdd

Vss

i(t)

Main transient current sources: Clock-driven blocks, synchronized logic Memory read/write/refresh I/O switching

Very large

Simultaneous

Switching Current

i(t)

Time


32 January 17

EXAMPLE: EVALUATION OF SWITCHING CURRENT

• ____ VDD, ___ technology• ____ mA / gate in ____ ps•____ % is gate• ____ gates in ____ Bit Micro => ____ A• ____ % switching activity => ____ A• ____ % current peak spread (non synchronous switching) •____ in ____ ps

____

Current (A)

____ ns

time

Vdd

Vss

i(t)Current / gate

Current (A)

____ ns

time

Current / Ic

____

19/01/2017


33 January 17

Vss

Vdd

Wires act as antennas

V(t)

Time


34 January 17

WIRES+CURRENT = NOISE

DSPIC33F noise measurement with active probe on X10

Activation of the core by a 40 MHz internal PLL

Synchronous ADDR0..15 bus switching 0x0000, 0xFFFF

DSPIC_VDD_VofT.tran

19/01/2017


35 January 17

WIRES RADIATE

Emission issues

36 January 17

Stronger di/dtStronger di/dt

Increase parasitic noiseIncrease parasitic noise

Time

New process

VoltOld process

WHY TECHNOLOGY SCALE DOWN MAKES THINGS WORSE ?

• Current level keepsalmost constant but:

• Faster currentswitching

• Current level keepsalmost constant but:

• Faster currentswitching

Time

Current

di/dt

New processOld process

19/01/2017

Susceptibility Issues

37 January 17

DECREASED NOISE MARGIN IN ICS

5.0

3.3

2.5

1.8

0.35µ 0.18µ 90n 65n

Technology

1.0

Supply (V)

1.2

45n

I/O supply

Core supply

32n 20n 14n130n

3.3 V inside, 5V outside

1V inside, 1.2V

outside

10n 7n

____

noise margin

____

noise margin

Thunderstorm impact

UNINTENTIONAL ELECTROMAGNETIC SOURCES

TV UHF

Radars

2-4G BS

1W

Frequency

1MW

1KW

1GW Weather Radar

3 MHz 30 MHz 300 MHz 3 GHz 30 GHz 300 GHz

Power

1mW

HF VHF UHF SHF xHF THF

3G

TV VHF

2G4G

• Fields radiated

by electronic devices

• Continuous waves &

pulsed waves

25m 25mm0.25m 2.5mm2.5m λλ/4 (ideal antenna)0.25mm


19/01/2017

39 January 17

EMC Level

(dB)

-40

-30

-20

-10

0

10

20

30

40

50

1 10 100 1000

Sum of

perturbations

Susceptibility

levelHigh risk of

interference

Safe

interference

margin

Unsafe margin

Frequency (MHz)


SYSTEM-ON-CHIP, 3D STACKING: DANGER

Conclusion

EMI reported in all kinds of devices IC involved in many EMI problems IC technology evolution towards

higher complexity On-chip switching currents in the

10-100 A range ICs are good antennas in the GHz

range Increased switching noise Increased emission issues Reduced noise margins System-on-chips, systems-in-

package rise new EMC issues

40 January 17

19/01/2017

2. EMC Basics concepts

42 January 17

1. Basic Principles

2. Specific Units

3. Radiating element

4. Emission Spectrum

5. Susceptibility Spectrum

6. Notion of margin

7. Impedance

8. Conclusion

Summary

19/01/2017

Basic principles

43 January 17

Radiated mode

The VDD supply propagates parasits

The EM wave propagates through the air

CONDUCTED AND RADIATED EMI

Conducted mode

Power Integrity (PI) Electromagnetic Interference (EMI)

44 January 17

Electrical domain Electromagnetic domain

Voltage V (Volt)

Current I (Amp)

Impedance Z (Ohm)

Z=V/I

P=I2 x R (watts)

Specific Units

THE “EMC” WAY OF THINKING

19/01/2017

Specific units

45 January 17

Time domain measurement

Volt

Time

AMPLITUDE IN DB VS. FREQUENCY IN LOG

Oscilloscope

Frequency measurement

Fourier transform

Freq (Log)

dB

Spectrum analyser

Distinguish contributions of small harmonics

Cover very large bandwidth

Specific units

46 January 17

Voltage Units

Wide dynamic range of signals in EMC → use of dB (decibel)

0.1

10

1

100

0.01

Volt dBV

0.001

0.001

0.1

0.01

1

0.0001

MilliVolt

dBµV

0.00001

EMISSION AND SUSCEPTIBILITY LEVEL UNITS

For example dBV, dBA :

( )( )AdBA

VdBV

log20

log20

×=×=

Extensive use of dBµV

( ) 120log201

log20 +×=

×= V

µV

VVdBµV

19/01/2017

47 January 17

The most common power unit is the “dBm” (dB milli-Watt)

Power Units

1 mV = ___ dBµV

1 W = ___ dBm

Exercise: Specific units

Specific units

EMISSION AND SUSCEPTIBILITY LEVEL UNITS

( ) 30log101

log10 +×=

×= W

WdBmW P

mW

PP

1 W

1 MW

1 KW

Power(Watt)

1 mW

Power

(dBm)

1 µW

1 nW

IC-EMC: 0dbm in 50 Ω

Tools > dB/Unit converter

Radiating elements

48

RADIATED EMISSION

Y

Z

O

φ

θ R

X

Eθ

Hφ

Er

Io

rjor e

r

j

r

hIE β

ββθ

πηβ −

−=

3322

2 1cos

42

r

rjo er

j

r

j

r

hIE β

θ βββθ

πηβ −

−+=

3322

2 1sin

4

r

rjo er

jr

hIH β

ϕ ββθ

πβ −+= )

1

²²

1(sin

4

2r

0rrrr

=== θϕ HHE r

h

Elementary “Hertz” current dipole.

Short wire with a length << λ , crossedby a sinusoidal current with a constant amplitude Io

19/01/2017

Radiating elements

49 January 17

NEAR FIELD/FAR FIELD

πλβ2

1 <<⇒<< RRπλβ2

1 >>⇒>> RR

Close to the antenna Far from the antenna

πλ2lim =itR

Non radiating field (non TEM wave)

E and H decreases rapidly in 1/r³

Radiating field (TEM wave)

E and H decreases in 1/r

Near-field region

Far-field region

100 MHz : Rlimit =____

50 January 17

Specification

example for an IC

emission

Parasitic emission (dBµV)

-10

0

10

20

30

40

50

60

70

80

1 10 100 1000

Frequency (MHz)

Measured

emission

EMC compatible

Emission spectrum

EMISSION LEVEL VS. CUSTOMER SPECIFICATION

IC-EMC: load

Emission > d60 > d60_vde.tab

IC-EMC: load

Getting started > mpc > mpc_vde.tab

19/01/2017

51 January 17

dBµV

0

20

40

60

80

100

10 100 1000

FM GSMRF

Supplier A

Supplier B

EMC compliant

Not EMC compliant

Frequency(MHz)

Customer's specified

limit

Emission spectrum

LOW PARASITIC EMISSION IS A KEY COMMERCIAL ARGUMENTEmission

Susceptibility spectrum

52 January 17

Immunity level (dBmA)

-40

-30

-20

-10

0

10

20

30

40

50

1 10 100 1000

Specification for

board immunityCurrent injection limit

Measured

immunity

A very low energy

produces a fault

Frequency (MHz)

IMMUNITY LEVEL HAS TO BE HIGHER THAN CUSTOMER SPECIFICATION

19/01/2017

Notion of margin

53 January 17

WHY A MARGIN ?

Domain Lifetime Margin

Aeronautics

Automotive

Consumer

Parasitic emission (dBµV)Nominal Level

Design Objective

• To ensure low parasitic emission ICs supplier has to adopt margins

• Margin depends on the application domain

Notion of margin

54 January 17

INFLUENT PARAMETERS ON IC EMC

The temperature of a circuit has a direct impact on the switching time of internal devices. When temperature increases, the high frequency content of the emission spectrum tends to be reduced.

K. P. Slattery et al., “Modeling the radiated emissions

from microprocessors and other VLSI devices”, IEEE

Symp. on EMC, 2000.

The variability between components induce a dispersion of emission and susceptibility level. Radiated emission in TEM cell of a 16 bit microcontroller PIC18F2480. Measurement of 12 samples and extraction of emission level dispersion.

H. Huang and A. Boyer (LAAS-CNRS)

Std deviation = 1.7 dB

19/01/2017

Notion of margin

55 January 17

Ioff/Ion MOS 32-nm

PhD A. C. Ndoye, INSA, 2010

Immunity vs. ageing (LTOL)

INFLUENT PARAMETERS ON IC EMC

MOS device characteristics fluctuate by +/- 30 %

Ageing may significantly alter EMC performances

56 January 17

R,L,C VS. FREQUENCY

Impedance profile of:

Impedance

• 1 Ω resistor• z11-1Ohm_0603.z• 0603 = 1.6 x 0.8 mm

Schematic diagram:

19/01/2017

57 January 17

R,L,C VS. FREQUENCY

Impedance

• 1 nF capacitor • z11-C1nF_0603.z


Schematic diagram:

58 January 17

R,L,C VS. FREQUENCY

Impedance

• Inductance 47 µH (Zin_L47u.s50)


Schematic diagram:

19/01/2017

59 January 17

R,L,C VS. FREQUENCY

Impedance

• Ferrite• Zin_FerriteBLM18HK102

SN1.s50


Schematic diagram:

Characteristic impedance

60 January 17

CONDUCTOR IMPEDANCE OR CHARACTERISTIC IMPEDANCE Z0:

Coaxial line Microstrip line

• From the electromagnetic point of view:

H

EZ =0 Link to conductor geometry and material properties

ωω

jCG

jLRZ

++=0

C

LZ ≈0

losslessconductor

• From the electric point of view :

Equivalent electrical schematic

19/01/2017


61 January 17

IMPEDANCE MATCHING

Adapted:Not adapted:

time

Voltage

time

Voltage

Why impedance matching is fundamental ?

IC-EMC

Impedance>

impedance_mismatch.sch


62 January 17

Small conductor Large conductor

What is the optimum characteristic impedance for a coaxial cable ?

CHARACTERISTIC IMPEDANCE Z0:

• Maximum power : Z0 = ___Ω

• Minimum loss: Z0 = ___ Ω

Small conductor

Large conductor

Power handling

Bending

weight

Low loss

Small capacitance

Small inductance

Low Impedance

Or ?

Ideal values:

• EMC cable (compromise between power and loss) : Z0 = ___ Ω

• TV cable : Z0 = ___ Ω

• Base station cable : Z0 = ___ Ω

Cable examples:

19/01/2017


63 January 17

50 OHM ADAPTED SYSTEMS

Tem cell

Spectrum analyzer

Waveform generator

Amplifier

Tools > Interconnect parameters

64 January 17

• Specific units used in EMC have been detailed

• The current dipole is the base for radiated emissio n

• The Emission Spectrum has been described

• Susceptibility Threshold, margins have been discuss ed

• The notion of impedance has been introduced

• Characteristic impedance of cables lead to specific values

• Discrete components used in the experimental board have

been modeled up to 1 GHz

Conclusion

19/01/2017

EMC measurements of electronic components

66

Summary

1. Context - EMC certification

2. Illustration of electromagnetic emission produced by

electronic devices

3. Illustration of susceptibility to electromagnetic

disturbances of electronic devices

4. Some EMC measurement tests

5. Conclusion

January 17

19/01/2017

67

Context - The EMC certification

January 17

RED 2014/53/UE : for radio equipments

CEM 2014/30/UE : electromagnetic compatibility of electronic products

BT 2014/35/UE : electric safety for electronic products (0 to 1000 volt AC and 1500 DC)

RoHS 2011/65/UE : limitation of six hazardous substances (e.g. lead)

DEEE 2012/19/UE : management of electric and electronic equipment waste

European Directives for electronic products

68

The European directive 2014/30/UE (2016) requires that all « electrical apparatus » placed on the European market :

Do not produce electromagnetic interferences able to disturb radio or telecom equipments , and the normal operation of all equipments

Have a sufficient immunity level to electromagnetic interferences to prevent any degradation of the normal operation.

CE mark

All manufacturers of « electrical apparatus » must certify that the directive is supposed respected by delivering a declaration of conformity and placing a CE mark on the product.

Using harmonized standards adapted to the product to verify the supposition of conformity is recommended

January 17


EMC European Directive

19/01/2017

69

The European directive 2014/53/UE (2016) Equipment which is applied to all radio equipments emitting on the band 0 Hz– 3000 GHz replace the EMC directive. .

RED requires that radio equipments placed on the European market: :

Comply to safety constraints given by the Low Voltage directive (2014/35/UE) (e.g. the limit of EM exposure for persons) and the EMC constraints given by the EMC directive 2014/30/UE.

Radio equipments use spectral resources dedicated for terrestrial and spatial communications without generating any interferences.

RED mark:

Required for all equipments under the

RED directive

Warning signal for class 2 equipments (special

recommandations)

January 17


RED European Directive

70 January 17

• United States Federal Communications Commission (FCC)

• Canada: Industrie Canada (IC)

• Japan : Voluntary Control Council for Interference by Information Technology Equipment (VCCI)

• China : China Compulsory Product Certification (CCC)

• Australia – New-Zeland : Australian Communications Authority (ACA)

• Taïwan : Bureau of Standards, Metrology and Inspection (BSMI) and National Communications Commission (NCC)

• Russia : GOST (State Committee for Quality Control and Standardization ...

Regulatory approchs of EMC in every countries.

Non harmonized regulation between countries, except if Mutual Recognition Agreements (MRA) exists.


Outside European Union ?

19/01/2017

71


Define terms, units, general conditions

Define measurement methods (equipments, configuration, set-up)

Propose calibration procedures

Give suggested/mandatory limits

Guidelines for test reports

Appropriate for all products ? For all environments ? For all operating configurations ?

Do standards change with time ?

January 17

Role of EMC standards

Commercial harmonized standard (non exhaustive list !)

Basic standard(general and fundamental rules)

EN 61000-4-x

(IEC61000-4-x)

EMC – Testing and measurement techniques

Generic standard(for equipments in a specific environment)

EN 61000-6-3 (IEC61000-6-3)

Generic Emission Standard, for residential, commercial and light industrial environment

EN 61000-6-1 (IEC61000-6-1)

Generic Immunity Standard, for residential, commercial and industrial environment

Product

standard(for a specific product family)

EN 55022(CISPR22)

Information technology equipment (ITE)

EN 55014(CISPR14)

Household appliances, electric tools and similar apparatus

EN 55012

(CISPR12)

Vehicles, boats and internal combustion engines

EN 330220 (ETSI 330 220)

Electromagnetic compatibility and radio spectrum matters (ERM); Short Range Devices (SRD); Radio equipment to be used in the 25 MHz to 1 000 MHz frequency range with power levels ranging up to 500 mW;

EN 330330(ETSI 300330-1)

Electromagnetic compatibility and radio spectrum matters (ERM); Short Range devices (SRD); Radio equipment to be used in the frequency range 9 KHz to 25 MHz and inductive loop systems in the frequency range 9 KHz to 30 MHz

72 January 17


19/01/2017

73

Automotive, military, aerospace and railway industries have developed their own EMC standards.

Applications Standard references

Automotive ISO 7637, ISO 11452, CISPR 25, SAE J1113

Aerospace DO-160, ED-14

Military MIL-STD-461D, MIL-STD-462D, MIL-STD-461E

Railway EN 50121

Commercial harmonized standard (non exhaustive list !)

January 17


74 January 17

Case study 1

Are the following product subject to the EMC European directive ?


WiFi dongle (ISM band)

Server motherboard

Passive antenna passive for RFID application

Wireless audio headset

19/01/2017

75 January 17

Case study 2

You want to place on the European

market a notebook.

Are you under the European EMC

directive 2014/30/UE ?

If yes, which EMC standard(s) should

you follow ? What tests should you

conduct for the EMC certification ?


76 January 17

Application of EN55022 : “Information technology equipment – Radio disturbance characteristics – Limits and methods of measurement” and EN55024 : « Information technology equipment – Immunity characteristics – Limits and methods of measurement » :

Any equipment dedicated to processing, storage, display, control of data and telecommunication messages, equipped with one or more ports, and supplied under less than 600 V.

Except equipments or modules dedicated only to radio emission or reception.

Case study 2


19/01/2017

77 January 17

Case study 2 Suggested emission tests:

Suggested immunity tests:


Conducted emission 150 KHz – 30 MHz on power supply mains

150 KHz – 30 MHz on telecommunication ports

Radiated emission 30 MHz – 6 GHz @ 3 or 10 m

ESD +/- 4 KV contact, +/- 8 KV air

EFT / burst 5/50 ns, 1 KV, 5 KHz repetition

Conducted immunity 150 KHz – 80 MHz, 3 V rms

Radiated immunity 80 – 1000 MHz, 3 V/m, modulation AM 1 KHz 80%

Surge 1 KV 1.2/50 µs pulse on power

Voltage dips and interruptions

40 % variations of the power supply, repeated 5×

78

Case study 3

You are a semiconductor manufacturers and you want to sell your

integrated circuits in the European market. Your ICs are dedicated to

automotive applications.

Which EMC standard(s) should you follow ? What tests should you

conduct for the EMC certification ?

January 17


19/01/2017

79

Case study 3

If your integrated circuits can not operate by themselves, you don’t

need EMC certification.

However, your customers will certainly push you to guarantee the low

emission and susceptibility of your devices, require measurements,

models, support….

Examples of standards providing EMC measurement for ICs:

• IEC 61967: Integrated Circuits, Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz

• IEC 62132: Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz

• ISO11452: Road vehicles - Electrical disturbances by narrowband electromagnetic energy - Component test methods

• ISO 7637 or IEC61000-4-2/4/5 for ESD, pulse, surge testing.

January 17


80

Illustration of electromagnetic emission produced by electronic

devices

EMC measurements of components

January 17

19/01/2017

81

Electromagnetic emission of electronic devices

Emblematic EMC equipment – Spectrum Analyser (EMI receiver)

Frequency adjustment : Start, stop , center

Amplitude adjustment : Level reference, dynamic.

Emission measurement requires high sensitivity and resolution

Emission measurement standards often recommend spectrum analyser adjustment

RBW – frequency resolution, noise floor

reduction

VBW – smooth display

50 Ohm input

X= frequency

Y= power (dBm, dBµV)

January 17

82


Principle: based on super heterodyne receiver

( ) ( )tttt lorflorflorf ωωωωωω −++=× cos2

1cos

2

1coscos

IN

fFrf

LO

fFlo

Input signal

Local oscillator

Output signalOUT

fFif Frf+Flo

ωif

MixerIF filter

OUT

fFif

IF filter

A

No

RBWP = ½.A²+No.RBW

Detected power:

January 17


19/01/2017

83

Attenuator

DC blocking

Low pass filter

Gain IF

IF filter

Analog filter

Gain log

Video filter

Mixers

Local oscillator

Reference oscillator

Frequency sweep

Display

Envelope detector

Building blocks and adjustable elements:

Input signal

RBW VBW

DetectorAttenuation

Fstart / Fstop

Fcenter / SpanPoint number


January 17


84

What are the main adjustments ?

What are their effects on measurement result ?



19/01/2017

85

Example: effect of RBW and VBW.

Measurement of 100 MHz sinus.

Amplitude = 90 dBµV Amplitude = 20 dBµV

Sweep time :

RBW = 100 KHz 2.5 ms

RBW = 10 KHz 100 ms

Sweep time :

VBW = 30 KHz 100 ms

VBW = 1 KHz 980 ms

January 17



86

Example: Influence of detector type (peak vs. quasi-peak vs. average).

Measurement of radiated emission of a microcontroller.

January 17



19/01/2017

87

Case study 4 – Electromagnetic emission from a class-D amplifier


January 17

MAX9768 – 10 W mono class D speaker amplifier, EN55022 class B compliant.

Applications: low power portable application (notebook computer, Multimedia monitor, GPS navigation system…)

www.maxim.com

January 17

88

t

tGND

VDD

T

Tsw

PWM signal

Amplified audio signal

Audio input signal

January 17



Class D amplifier principle (half-bridge):

+

-

Triangle waveform oscillator

Audio sourceGND

VDD

GND

Output filter

PWM signalAmplified

audio signal

( ) ( )T

tTVtout SW

DD=

Speaker

19/01/2017

89 January 17



Measure and compare the currents circulating on wires OUT+ and OUT- of the speaker cable.

Are they perfectly symmetrical ?

Class D

GND

GND

GND

8 Ω SpeakerI+

I-

90



Differential vs. common mode currents.

Common mode appears when the return current path is not perfectly defined.

Interco 1

Interco 2

I1

I2

1

2

Id

Id

1

2

Ic

Ic

Decomposition in 2

distinct propagation

modes

Differential

mode

Common

mode

21

21

2

III

III

C

D

+=

−=

DC

DC

II

I

II

I

−=

+=

2

2

2

1

If I1 ≠ I2

January 17

19/01/2017

January 1791



Differential vs. common mode radiation (at a distance r in far-field).

I1

I2

d

L << λ

DD Ir

fdLE

214

max

..10.316.1 −=

CC Ir

fLE

.10.257.1 6

max

−=

Limit EN55022 class A

L=1 m, d=2 mm, r = 3 m, IDM = 20 mA, ICM = 200 µA

Evaluate radiation produced by the cable output of the class-D

amplifier.

92 January 17



Evaluate the differential and common-mode radiation at 3 m produced by the speaker cable.

Does it comply with EN55022 class B standard ?

19/01/2017

93 January 17

Case study 5 – Electromagnetic emission from a microcontroller

Osc

illa

tor

PLL

Digital Core

I/O

Vdd Dig

Vdd osc

Ext. Loads

Integrated

circuit

Icore(t)

Iosc(t)

Memory

Analog

IMem(t)

Vdd A

IA(t)

Vdd IO

IIO(t)

PCB lines

IIO(t)

Transient current produced by IC activity leads to conducted and radiated emission.


January 17


Magnetic field around a wire:


Hy

Hz

x

y

z

y

VmeasTangential probe

Vertical probe

y

Vmeas

I

H

Scan axis

( ) ∫∫=surfaceprobe

probe dSHdt

dtV .0µ

Link between the magnetic field and probe voltage:

( ) ∫∫=surfaceprobe

probe dSHjV .0ωµω

19/01/2017

95


January 17


The microcontroller Freescale MPC5604B has the following configuration:

CPU running at 40 MHz

Internal clock produced by an on-chip PLL running at 80 MHz, synchronized by a 8 MHz quartz oscillator

13 I/O switching at 200 kHz

With a near-field probe, locate the main source of electromagnetic emission created by the microcontroller.

Do they really contribute to far-field radiated emission?

96


January 17


Pin-out of microcontroller Freescale MPC5604B:



VDDHV/VSSHV (I/O supply)

VDDHV_ADC/VSSHV_ADC (ADC supply)

External quartz

VDDLV/VSSLV (Core + PLL supply)

19/01/2017

97


January 17


Reactive near-field region

Printed circuit board

Components

rFar-field region

Radiated near-

field region

Strong localized E and H field Complex relation between E and H E and H 1/r3 or 1/r²

Plane wave |E/H| = 377 Ω E and H 1/r

Near-field vs. far-field emission

98


January 17

Case study 6 – Radiated emission from a digital line

Simple radiated emission model for a PCB microstrip line:

R

t

Htan

Ground plane

P

I

I

h

Image current

h

( )

( ) λπ

ππ

<<<<<<+

≈

++−=

RandhRththRR

hIH

htR

I

R

IH

,,,2

222

tan

tan

=

<<=

otherwisehfIr

E

LIhLfrc

E

,2

,2

0max

2

0

0max

µ

λπµ

Magnetic-field emission in near-field

Worst-case electromagnetic emission in far-field:

19/01/2017

99


January 17

Case study 6 – Radiated emission from a digital line

Consider the following PCB digital line between two CMOS inverters:

Microstrip line (w = 1 mm, h = 1.6 mm, L = 10 cm)

Inverter AHCT04 Inverter AHCT04

Magnetic-field probe (Loop radius = 2 mm)

At three different frequency between 10 and 1000 MHz, estimate the current which circulated along the microstrip line.

Estimate the far-field emission at 3 meter.

Does the radiated emission comply with EN55022 limit?

10 MHz

100 January 17

Case study 7 – Reduction of EM emission from a class-D amplifier


How could you reduce the conducted/radiated emission from the class-D amplifier ?

19/01/2017

101 January 17

Case study 7 – Reduction of EM emission by SSFM


Frequency modulation : Frequency modulation spreads the spectrum of a signal

Example : sinus clock at Fc = 100 MHz vs modulated sinus clock:

( )

( ) ( )tmdttS

tF

dfttS

MCFM

MM

CFM

ωω

ωω

coscos

coscos

+=

+=

Spread spectrum over B

Reduction of narrow band RF energy

Carrier frequency Fc = 100 MHz

Modulation frequency FM = 1 MHz

Frequency excursion dF = +/- 5 MHz

Modulation index md = 5

Carson rule: ( )12 +××= mdFB M

102 January 17



Spread Spectrum Frequency modulation (SSFM) principle:

Clock in

Tc

Modulantt

Clock out

Tc+/-dt

Frequency Modulated clock

Freq. modulation ∆F

Unmodulated clock

Modulated clock

dP

B

TMod

+/- dt

Carson rule applies also (for fundamental frequency):

( )12 mod +××= mdFB

Unmodulated clock (carrier)

What is the amplitude reduction?

19/01/2017

103 January 17



Emission level improvement depends on:

Parameters of the modulation (md and Fm)

The modulant waveform (to make the spectrum as flat as possible)

Receiver bandwidth RBW

( )

≈RBW

BdBdP log10

P

f

unmodulated

SSFM

B

P

fB

RBW

dP

Measured SSFM signal

P

fB

RBWMeasured

SSFM signal

EMI receiver

104 January 17



Two output modulations:

Classic PWM mode

Filterless modulation mode

Three operating modes:

Fixed frequency (300 or 360 kHz)

SSFM (Fc = 300 kHz, df = +/- 7.5 kHz)

External clock (1 to 1.6 MHz)

Class-D amplifier MAX9768 internal features for emission management :

19/01/2017

105 January 17



Observe the effect of the internal SSFM on the fundamental frequency of the common-mode noise which propagates along the speaker cable. Use a narrow RBW.

Observe the effect of the internal SSFM on the spectrum of the common-mode noise which propagates along the speaker cable. Use a large RBW.

EN55022 recommends the following RBW:

• 9 kHz from 150 kHz to 30 MHz

• 120 kHz from 30 MHz to 1 GHz

Quantify the effect of the internal SSFM on the conducted emission spectrum?

106

Illustration of susceptibility to electromagnetic disturbances (RFI) of

electronic devices


January 17

19/01/2017

107

Susceptibility of electronic devices to RFI

January 17

Effect of IC malfunction due to EM disturbance

Striking of berth by Coastal Inspiration, 20th dec 2011, Nanaimo, British Columbia, Canada.

A problem of an amplifier, due to EM disturbances, leads to a failure in speed reduction command.

108

Susceptibility of electronic devices to RFI

January 17

Case study 8 – Susceptibility of a bandgap reference voltage

LTC1798: 2.5 V micropower bandgap voltage reference

100 nF 100 nF

2.5 V +/- 4 mV2.7 V to 12 V LTC1798

RFI Effect on the output voltage ?

Couple an harmonic conducted disturbance to the input of the bandgap reference.

Observe the effect on the output voltage, for frequencies ranging from 1 to 100 MHz.

19/01/2017

109

Some EMC measurement tests


January 17

110

Emission measurement set-up

January 17

Device under test

Coupling deviceCoupling network

Antennas

Waveguide

Acquisition system

Spectrum analyser

EMI receiver

Emission – General measurement set-up

Radiated or conducted coupling

50Ω adapted cable

Control -Acquisition

Result de-embedding

Post-processing

19/01/2017

111

Typical conducted emission test for electronic/electrical products

EUT

Load

Line Impedance Stabilized Network(LISN)

Current clamp

Power supply harness

Load harness

EMI receiver

Frequency range = 150 kHz – 30/150 MHz

Ground plane

January 17


112

Conducted emission test with Line Impedance Stabilizer Network

(LISN)


EUT

Ground, earth

AC mains /

Battery

AC or DC power supply

cable

Phase or ‘+’ conductor

Phase or ‘-’ conductor

VRF1

VRF2

IRF1

IRF2

EUT

Ground, earth

AC mains / Battery

AC or DC power supply cableVRF1

VRF2

IRF1

IRF2

LISN

50 Ω measurement receiver

Typical conducted emission test for electronic/electrical products

19/01/2017

113

Device under testWide band

(calibrated) antenna

Power supply, DUT control

EMI receiver or spectrum analyzer)

Absorbents

R = 3 ou 10 m

1 m1 m

1 m

ALSE = Faraday cage (with absorbents: semi-

anechoic chamber)

(Siepel)

EN55022


Typical radiated emission test for electronic/electrical products Frequency range = 30 MHz/80 MHz – 1 GHz and more

E field EMI receiver

Rs =50 Ω

Optional pre-amplifier

Low loss 50 Ω cable

Bilog antenna

(or log-periodic, biconical, dipole…)

Vemi

If far field and free space conditions ensured:

( ) ( ) ( ) ( )dBLossdBGainmdBAFmdBµVEdBµVVemi −+−= )/(/AF = Antenna factor (from

calibration)

The E field varies in 1/r with the distance r (the radiated power in 1/r²) possible extrapolation of field intensity.

114 January 17

Voltage Vemi or Power Pemi

( ) ( ) ( )Ω=−= 50107 Semiemi RwithdBµVVdBmP


Typical radiated emission test for electronic/electrical products

( ) ( )

+=

2

112 log.20

R

RRERE

19/01/2017

115

IC Conducted emission - IEC 61967-4 –1 ohm / 150 ohms method

January 17

Conducted emission is produced by RF current induced by IC activity.

The current induced voltage bounces along power distribution network and radiated emission.

The « 1 ohm » method aims at measuring the RF current flowing from circuit Vss pin(s) to the ground reference.

215049

50 RFRFA

IIV ≈

++=

IC ground

ICPCB

IC

Decoupling

RF currentVdd

Peripheral ground

EMI receiver

1 Ω

49 ΩIRF

VA

Parasitic inductor

Parasitic coupling between ground

planes

IC transient

current


116

dsPIC33F: measurement in time domain and frequency of the voltage across the 1 Ω probe proportional to the IC current.

January 17


IC Conducted emission - IEC 61967-4 –1 ohm / 150 ohms method

19/01/2017

117

Susceptibility measurements – General measurement set-up

January 17

Coupling deviceCoupling network

Antennas

Waveguide

Radiated or conducted coupling

Disturbance generation

Harmonic signal

Transients

Burst

50Ω adapted cable

Injected level Extraction

Result de-embedding

Port-processing

0

5

10

15

20

25

30

35

1 10 100 1000

Fo

rwa

rd p

ow

er

(dB

m)

Frequency (MHz)

Power limit

Device under test

Susceptibility measurement set-up

118

Time

Voltage

RMS voltage 21

2

2mVV A

RMS +=

a) Unmodulated sinus

Amplitude VAAmplitude VA

( )mVA +1

Time

Voltage

( )mVA −1

b) AM modulated sinus

c) Human Body Model ESD at 4 KV (IEC61000-4-2)

d) Electrical fast transient in burst –Level 4 on power port (IEC 61000-4-4)

Time

Discharge current

Time

Voltage

AI P 15=

nstr 8.0= ns30

A8

A4

ns60

Time

VoltageBurst period 300 ms

Burst duration 0.75 or 15 ms

KVVP 4=Repetition rate 5 or 100 KHz

nstr 5= nstr 50=

2A

RMS

VV =

Typical signals for susceptibility tests:

Susceptibility measurements – General measurement set-up


January 17

19/01/2017

119

Susceptibility measurements –Test procedure for harmonic disturbance

Start

F = Fmin

P = Pmin

Increase P

Wait dwell time

Failure or P = Pmax ?

Save F and PF = Fmax ?

End

Increase FWithout RFI

With RFI Failure

Detection mask

January 17


120

Device under testWide band

(calibrated) antenna

Power supply, DUT control

Absorbents

R = 3 ou 10 m

1 m1 m

1 m

ALSE (with absorbents: semi-

anechoic chamber)

(Siepel)

Power amplifier ( > 100 W)

Signal synthesizer

Field monitoring

Typical max. RI level:

Commercial product: 3 – 10 V/m

Automotive (ISO-11452-2): 25 – 200 V/m

Military (MIL-STD461E): 20 – 200 V/m

Aeronautics (DO160-D): 8 – 800 V/m

January 17


Typical radiated susceptibility test for electronic/electrical products Frequency range = 30 MHz/80 MHz – 1 GHz and more

19/01/2017

121

Injection clamp

Induced RF current

Bus, cable

Microcontroler

DUT

Failure ?

Measurement clamp

Directional coupler

Signal synthesizer

RF disturbance

LoadLISN

Induced current measurement

Interface

circuit

Faraday cage

Usually, the max. current is between 50 mA and 300 mA.

Power amplifier

January 17


Typical conducted susceptibility test for electronic/electrical products Bulk Current Injection: 150 kHz – 400 MHz

Case study 9 - Does EMC certification cancel the interference risks?

Example: radiated emission limits defined by different EMC standards

122 January 17

Conclusion

19/01/2017

123 January 17

A radio receiver operating at 868 MHz has a receiving sensitivity of -90 dBm. Its radio

input is 50 Ω-matched and is terminated by an antenna with an antenna factor of 10

dB/m. The radio receiver is placed 2 metres from some noisy electronic equipment with a

CE marking, compliant with standard EN 55022 – class B (refer to Figure 7- 8 for the

radiated emission limit defined by EN 55022).

The radiated emission test for the noisy equipment is performed in an ALSE. A receiving

antenna with a gain of 23 dB/m is placed 3 metres in front of the noisy equipment. The

antenna is connected to an EMI receiver by cables and a 30 dB preamplifier. The total

cable loss is equal to 2 dB. The maximum level measured by the EMI receiver at 868

MHz is 40 dBµV.

Conclusion


124 January 17

1. What is the maximum electric field radiated by the noisy electronic equipment at a distance of 1 metre?

2. According to the details given about the noisy equipment’s radiated emission test, compute the electric field at

868 MHz at a distance of 3 metres. Does the equipment comply with the limit defined by EN 55022?

3. Compute the electric field produced by the noisy equipment illuminating the radio receiver at 868 MHz.

4. Compute the voltage and power induced at the radio receiver input.

5. Draw a conclusion about the interference between the noisy equipment and the radio receiver. Do you think

that compliance with EN 55022 is a guarantee against interference?

Conclusion


19/01/2017

125 January 17

Conclusion

Evaluation of emission/susceptibility problems of circuits

Circuit Emission issues

Susceptibilityissues

Justification

Driver chip for a TFT LCD monitor

LDO linear voltage regulator

Boost converter

IEEE 802.15.4 Zigbee transceiverchip

FPGA supporting numerous high speed interfaces

LIN bus driver for automotive application

Electromagnetic compatibility of Integrated · PDF fileElectromagnetic compatibility of...

Documents

Transcript of Electromagnetic compatibility of Integrated · PDF fileElectromagnetic compatibility of...