1 AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Etienne SICARD...

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1 AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Etienne SICARD INSA/DGEI University of Toulouse 31077 Toulouse - France [email protected] Alexandre BOYER INSA/DGEI University of Toulouse 31077 Toulouse - France Alexandre.boyer@insa- toulouse.fr

Transcript of 1 AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Etienne SICARD...

Page 1: 1 AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Etienne SICARD INSA/DGEI University of Toulouse 31077 Toulouse - France.

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AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

Etienne SICARDINSA/DGEIUniversity of Toulouse31077 Toulouse - [email protected]

Alexandre BOYERINSA/DGEIUniversity of Toulouse31077 Toulouse - [email protected]

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1. CONTEXT

2. EDUCATIONAL NEEDS

3. STANDARDS

4. WHAT IS IC-EMC

5. EXAMPLE

6. EVALUATION

7. CONCLUSION

SUMMARY

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Emission of EM wavesSusceptibility to EM waves

EMC – ONE ACRONYM, TWO CONCEPTS

Personnal

Safety systems

interferences

Hardware faultSoftware failureFunction Loss

Components

EquipementsCarbon airplane

Boards

Radar

CONTEXT

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2002

Technology

Complexity

Packaging

180nm

50M

Core1 A

Core1 A

2004

130nm

100M

Core+ DSP3 A

Core+ DSP3 A

2008

45nm

500M

Multicore, DSPs, FPGA, RF multiband

MemoriesSensor30 A

Multicore, DSPs, FPGA, RF multiband

MemoriesSensor30 A

Embedded blocks transient current

2006

90nm

250M

Core DSPseMem10 A

Core DSPseMem10 A

TRENDS – INCREASED PARASITIC EMISSION

CONTEXT

2010

32nm

1G

Multicore, Multi DSP Reconf

FPGA, Multi RF

Memories Sensors100 A

Multicore, Multi DSP Reconf

FPGA, Multi RF

Memories Sensors100 A

Increased complexity, IOs number, operating frequencies, transient current

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5.0

3.3

2.5

1.8

0.5µ 0.35µ 0.18µ 90nm 65nm

Technology

0.7

Less voltage margin

Supply (V)

1.2

45nm

I/O supply

Core supply

150 mV margin

CONTEXT

TRENDS - INCREASED SUSCEPTIBILITY

32nm

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EMCIssues

PACKAGES AS ANTENNAS

CONTEXT

Package dimensions are close to lambda/4 at GHz range

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DESIGN

Architectural Design

Design EntryDesign Architect

FABRICATION

EMC compliant

EMC SimulationsCompliance ?

GO

NO GO

Design Guidelines

Tools

TrainingThis work

EMC VALIDATED BEFORE FABRICATION

CONTEXT

What IC designers and EMC experts are dreaming of…

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EDUCATIONNAL NEEDS

A nightmare?

EMC TRAINING AT IC LEVEL – HOW TO START?

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EDUCATIONNAL NEEDS

A nightmare?

EMC TRAINING AT IC LEVEL – HOW TO START?

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EDUCATIONNAL NEEDS

• Illustrate technology scale down

– Complexity

– Current switching

– Impact on EMC

• Illustrate package role and complexity

• Simulate simple models with simple simulator (SPICE-like)

• Post-process in Freq. domain for Spectrum comparison

• “see” E, H fields from currents and voltage

• Investigate “what if” with students

3D real-time view in Microwind

IBIS 3D viewer in Microwind

THINGS WE NEED TO DO

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EDUCATIONNAL NEEDS

• Give key facts about technology impact on EMC

• Introduce standard measurement methods

• Simulate first order effects using standard model approaches

• Give the basics of

– emission prediction– immunity simulation

• Give simple design rules for improved design

• Address both

– Undergraduate, graduate students– Engineers in companies

• Leave plenty of space for exercises and real-case problem solving

• Fit the course in a one or two days format (cost, duration)

OUR PROPOSAL – KEY FACTS

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EDUCATIONNAL NEEDS

• Overview (EMC-IC for managers)

• Basic concepts

• Measurement methods

• Guidelines for improved EMC

• Case study

• EMC models

• Chip-chip coupling

OUR PROPOSAL – COURSE OUTLINES

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STANDARDS

International Standards IEC 61967

EMISSION MEASUREMENT METHODS

IEC 61967-2

(TEM : 1GHz)

IEC 61967-3/6

(Near field scan, 5GHz)

IEC 61967-4

(1/150 ohm, 1 GHz)

IEC 61967-5

(WBFC, 1 GHz)

IEC 61967-7

(Mode Stirred Chamber: 18 GHz)

IEC 61967-2

(GTEM 18 GHz)

Most usual radiated method

Most usual conducted method www.iec.ch

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STANDARDS

IMMUNITY MEASUREMENT METHODS

International Standards IEC 62 132

IEC 62132-3(Bulk Current Injection : 1 GHz)

IEC 62132-4(Direct Power Inj 1GHz)

IEC 62132-2 (TEM/GTEM)

IEC 62132-5 (WBFC 1 GHz)

New proposal: (LIHA : 10 GHz)

Still research:(NFS 10 GHz)

Most usual conducted method

Most usual radiated method www.iec.ch

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STANDARDS

International Standard IEC 62 433

MODEL APPROACHES

1. ICEM-CE - Conducted RF emission

2. ICEM-RE - Radiated RF emission

4. ICIM-CI - Conducted RF immunity

4. ICIM-RI - Radiated RF immunity

www.iec.ch

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A schematic editor to enter macro-models

An interface to WinSpice analog simulator

A post-processor to compare simulated with

measured spectrum

An Electromagnetic solver to simulate radiated field

Freeware, online, 250 pp documentation, 15 case

studies

WHAT IS IC-EMC

IC-EMC - A TOOL FOR EMC PREDICTION

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IC, package and PCB model

Basic symbols

SCHEMATIC EDITOR

WHAT IS IC-EMC

Main analysisSpectrum

analysis Impedance

simulation

Near-field simulatio

n

Immunity simulation

IBIS interface

Key tools

Smith Chart

SPICE compatible

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Core Model

Package Model

Probe Model

Test board Model

Analog Time Domain Simulation

Fourier Transform

Compare dBµV vs. Frequency

Fourier Transform

Time-domain measure

Frequency measurements

Emission prediction approach

SimulationSimulationMeasurementsMeasurements

EXAMPLE

CONDUCTED EMISSION

IEC 62 433

IEC 61 967

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Emission spectrum analysis

EXAMPLE

CONDUCTED EMISSION

Core Model

Probe Model

Analog Time-Domain Simulation

Fourier Transform

Conversion to Win-SPICE

dB vs Freq (log)conversion

Package Model

Test board Model

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EXAMPLE

Emission spectrum analysis

CONDUCTED EMISSION

Compare dBµV vs. Frequency

Frequency measurements

What if?• Effect of decoupling• Effect of package

supply pairs• Effect of current

reduction• …

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Since 2002, more than 20 sessions involving 300 students and engineers have been organized

– ISEN France

– ENSME France

– On-Semiconductors

– NOKIA

– APEMC Beijing

One-day or two-days format.

The majority of students said

– They understood the mechanisms of parasitic emission and susceptibility

– They felt confident in their ability to handle EMC at IC level

EVALUATION

AUDIENCE

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EVALUATION

# Question

1 I appreciated the contents of the training.

2 The level of the training is in accordance with my expectations.

3 The balance between theory and practice was acceptable

4 The contents was adapted to life-long learning.

5 I appreciated the documents given in the training.

6 I appreciated the way the training was taught

7 The contents is clearly related to my work/studies.

8 I may use the contents directly in my activities

9 The lecturer followed the initial planning

10 Overall I was satisfied with the quality of this course.

QUESTIONS

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EVALUATION

Answers to questionnaire

0%

10%

20%

30%

40%

50%

60%

70%

1 2 3 4 5 6 7 8 9 10

Evaluation item #

% r

esp

on

se

Strongly agree Agree Neutral Disagree Strongly disagree

RESULTS

7. The contents is clearly related to my work/studies.

8. I may use the contents directly in my activities

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An environment for EMC prediction at IC level and trainings has been

developed

The tool is free and is based on measurement and model standards

Trainings help students and engineers to understand the

mechanisms of parasitic emission and susceptibility

As little theory as possible

As much practice and examples as possible

Positive feedback from trainees concerning the tool usage for the

illustration of EMC concepts (80 – 90 % satisfaction rate)

CONCLUSION

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• E. Sicard, A. Boyer, “IC-EMC v.2 User's Manual” ISBN 978-2-87649-056-7, July 2009, 320 pages, INSA Editor

• C. Dupoux, S. Akue Boulingui, E. Sicard, S. Baffreau, N. Bouvier, "Measurement and Simulation of Electromagnetic Interference in 3G Mobile Components“, EMC Compo 2009, November 2009, Toulouse, France.

• S. Akue Boulingui, C. Dupoux, S. Baffreau, E. Sicard, N. Bouvier, B. Vrignon, "An Innovative Methodology for Evaluating Multi-Chip EMC in Advanced 3G Mobile Platforms", IEEE Symposium on EMC, 2009, Austin, USA.

• S. Bendhia, M. Ramdani, E. Sicard, Electromagnetic Compatibility of Integrated Circuits, book published by Springer, USA, 2006, 0-387-26600-3

REFERENCES

The tool, manual and course slides are online at

www.ic-emc.org

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THANK YOU FOR YOUR ATTENTION