Consumer Electronics: from chip to system€¦ · NMI Techworks 6 -6-2018 Consumer Electronics:...

NMI Techworks 6-6-2018

Consumer Electronics: from chip to system

June 6th 2018 – APC, University of Warwick, UK

Kees Revenberg – Co-founder/MD


CONTENT

Introduction

Consumer Electronics Definition Trends and concequences

Chip manufacturing & Test flow Manufacturing flow Chip specific test procedures and standards

System manufacturing & Test flow Manufacturing flow System specific test procedures and standards

Interaction between Chip and System functions

Failure Analysis from system to chip Summary

© MASER Engineering 2


INTRODUCTION

MASER Engineering is an Independent Service Provider, founded in 1993 and privately held by Hans Kemper and Kees Revenberg

25 years experience in test and analysis of semiconductors, electronic components and electronic systems

2,900 m² office & laboratory at Capitool 56, Enschede, The Netherlands

Staff 49 employees (42 FTE), half with PhD/MSc/BSc degree

Quality system certification and Accreditation ISO-9001:2008 certification by Lloyds ISO-17025:2005 accreditation according to scope L388 www.rva.nl

Customer project communication (CMIDS) MIDS internal track and trace system Secure customer interface for project tracking Download function for large result files and images (cmids.maser.nl)


http://www.rva.nl/


INTRODUCTION Failure Analysis

Non Destructive Analysis Fault Localization Sample Preparation Imaging and Analysis First Silicon Circuit Edit

Reliability Test ESD/LU Test Accelerated Life Test Climate and Corrosion Test Temperature Cycling and Shock Mechanical Vibration and Shock



Consumer Electronics


Definition by WikipediaConsumer electronics or home electronics are equipment intended for everyday use, typically in private homes.

Consumer electronics include devices used for entertainment (flat screen TVs, DVD players, video games, remote control cars, etc.), communications (telephones, cell phones, e-mail-capable laptops, etc.) and home-office activities (e.g., desktop computers, printers, paper shredders, etc.)

Trends and consequencesSmart home, outdoor sports and personal medical devices

Mobility becomes an electronic gadget with wheels or propeller

Long list of topics at the 2019 Consumer Electronics Show in Las Vegas

Consumer Electronics Market to hit $1,500bn by 2024: GMI, Inc.


Consumer Electronics Advertising, Entertainment & Content

Gaming Marketing & Advertising Music Virtual Reality & Augmented Reality

Automotive Self-Driving Cars Vehicle Technology

Health & Wellness Accessibility Digital Health Fitness & Wearables Sleep Technology

Sports eSports Sports Technology

Home & Family Home Entertainment Family & Lifestyle Smart Home

Internet of Things (IoT) Smart Cities

Product Design & Manufacturing 3D Printing Design, Sourcing & Packaging Sustainability

Robotics & Machine Intelligence Artificial Intelligence Drones Robotics

Topics CES Las Vegas 2019



CE IC design and manufacturing


IC design with DFT circuits included and partial simulation

Embedded software and Test program development

First silicon debug and prototype assembly IC release

Qualification lot manufacturing IC qualification

Production release IC endurance and monitoring

Due to high quantities of CE applications, yield is important

The device technology is at edge, both chip and package

Application environment and expected life is getting more complex

CE IC’s are exposed to more stringent test procedures


Chip Manufacturing & Test flow


Manufacturing flow Nowadays >400 steps Semi nodes >7nm Metal layers >10 Complex WL packaging

Process monitoring Materials & Chemicals Automatic Inspection In-line Xsie and TEM Monitoring circuit test

Wafer test

Assembly Singulation and packaging WL packaging and stacking

Final product test


Chip Qualification programs


Chip specific test procedures and standards Automotive industry AEC-

Q100 to AEC-Q200 Industry standardization

organizations like JEDEC JEDEC-47

Application specific and Customer specific ESA-SCC or MIL-STD 883

ESDA + JEDEC


CE chip life test setup


High end CE application processors high pin count + high power

Dynamic Vector driver based on ATE program conversion

Individual temperature control by socket heating/cooling

Individual function monitoring including PS currents


CE system design and manufacturing


System design with application mission study and FME(C)A

Embedded software and Test program development

First prototype assembly HALT design evaluation

Qualification lot manufacturing system qualification

Safety tests and legislation release (CE marking)

Production release endurance and HASS monitoring

Due to high quantities of CE applications, yield is important

Application environment and expected life is getting more complex

CE systems are exposed to more stringent test procedures


HALT: Product Margins definition

Stress

ProductSpecs

UpperDestruct

Limit

LowerDestruct

Limit

Destruct MarginDestruct Margin

UpperOperating

Limit

LowerOperating

Limit

MarginOperating

MarginOperating


HALT: Product Margin Aging

ProductSpecs

UpperDestruct

Limit

LowerDestruct

Limit

UpperOperating

Limit

LowerOperating

Limit

Stress


-120

-70

-20

30

80

130

180

0 100 200 300 400 500 600 700

Time (minutes)

Tem

pera

ture

(°C

)

0

10

20

30

40

50

60

Vibr

atio

n (G

rms)

Temperature

Vibration

HALT: process overview


HALT essential: Preparation meeting HALT can only be successful after proper preparation At what stage of design process HALT to be performed Preparation meeting with Design, Test and HALT engineer

System description Sample size definition, based on cost and availability Functional and Parametric E-test definition Mechanical / Thermal construction assessment Mechanical fixture design directive Parts list scan for destruct limits Initial HALT limits estimation Spare parts and repair guideline Onsite and Standby crew definition during HALT sequence testing HALT planning and quotation


HALT: systems under stress Multiple small units for redundant behavior study

Larger systems in partly open position


HALT DEFECT EXAMPLES Electrical detectable

Visual detectable

Hardware and Embedded Software


Interaction between Chip & System


Rapid growth in handheld / portable CE Systems

Consumers do drop them or misuse them

RMA procedures do not get all defects returned for review

Interconnection issues due to dense assembly and lead-free solder

EXAMPLE

Board Level Reliability Test for Consumers that drop their Electronics


FAILURE ANALYSIS


Failure Analysis flow in the electronics industry

Non Destructive Analysis

Report

Fault localization

Sample preparation

Microscopic Imaging

Material Analysis

EMMI OBIRCH Thermograph Laser NIR I/V Probing Volt contrast EBIC/EBAC Nano-probing Contact AFM other

Laser decap Chemical decap Plasma decap Mechanical Xsie Planar polish Plasma etching FIB Slice+View TEM lamella other

Stereo Optical HP Optical Interferometer W-SEM FEG-SEM FEG-sTEM Dual Beam Ion Beam other

SEM/EDX sTEM/EDX FTIR Chemical SIMS XPS/ETCA Scanning Auger µ XRF XRD other

E-test – OPTICAL – 2D/3D XRAY – SAM – LIT - EOTPR


CE IC & system test tool examples



SUMMARY


Consumer Electronics is a major part of the electronics market

Fast development cycles, high-end technology and large volume

High yield is essential in both IC and system level production

Preventive test method on IC level DFT and system level HALT

More system aspects enter the System in Package IC world

CE applications are still a strong growing potential

Thank you for your attention!

Contact NL: [email protected] – T: +31 53 480 26 80 – www.maser.nl

Contact UK: [email protected] – T: +44 1367 25 22 65

and keep consuming electronics

mailto:[email protected]

http://www.maser.nl/

mailto:[email protected]

Consumer Electronics: from chip to system€¦ · NMI Techworks 6 -6-2018 Consumer Electronics:...

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