Boost PFC preregulator Design

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    Reference DesignSLUA269 - July 2002

    1

    UCC3819 250-W Power Factor Corrected (PFC) BoostFollower Preregulator Design

    Michael OLoughlin System Power

    ABSTRACT

    This paper reviews the benefits of a boost follower topology and the design of a 250-W PFCboost follower preregulator.

    Contents

    1 Introduction 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    2 Power Stage Design 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 VAI Output Sensing Circuit with Clamp 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    4 Slower Voltage Loop Small Signal Transient Response at High Line 11. . . . . . . . . . . . . . . . . . . .

    5 Reference Design Performance Curves 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    6 References 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    1 Introduction

    Conventionally PFC off-line power converters are designed with two power stages. The firststage is typically a boost converter. This is because the boost converter topology has continuous

    input current that can be shaped through the use of a multiplier and average current modecontrol to achieve near-unity power factor (PF). However the boost converter requires a higheroutput voltage than the input and requires a second converter to step this voltage down to auseable level.

    The boost converter is traditionally designed to have a fixed output voltage greater than themaximum peak line voltage. However, the boost voltage does not have to be well regulated orfixed because the step down converter can be designed to handle the variations in voltage. Aslong as the boost voltage is above the peak input voltage the converter will regulate properly.There are actually some benefits that can be gained by having the boost voltage vary withvariations in peak line voltage (i.e. boost follower preregulator). One is reduced inductor size andthe other is lower switch loss at low line operation. This paper reviews the benefits of a boost

    follower topology and the design of a 250-W PFC boost follower preregulator.

    NOTE: The reference design was generated using typical parameters rather than worst-casevalues. Please refer to the table in Figure 1 and Figure 2 for design specifications andcomponent placement. Refer to Table 1 for all variable definitions.

    Trademarks are the property of their respective owners.

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    2 UCC3819 250-W Power Factor Corrected (PFC) Boost Follower Preregulator Design

    VOUTVLINE

    85 VACTO

    265 VAC

    UDG02075

    +

    PFC

    CONTROLLER

    PWM

    CONTROLLER

    STAGE 1 STAGE 2

    Figure 1. Functional Block Diagram

    Table 1. Design Specifications

    PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

    VIN Input offset voltage 85 265 VRMS

    fIN Input frequency 60 Hz

    VIN = 85 VRMS 195 205 215VOUT dc Output voltage VIN = 265 VRMS 370 390 410

    V

    POUT Output power 0 250 W

    VRIPPLE Output voltage ripple VIN = 85 VRMS 3%

    Efficiency POUT = 250 W 93%

    VIN = 85 VRMS, POUT = 250 W 5%THD Total harmonic distortion

    VIN = 265 VRMS, POUT = 250 W 7%

    fOSC Operating frequency 100 kHz

    tHOLDUP Hold-up time 16.7 ms

    VOVP Overvoltage protection threshold voltage VOUT = 400 V 409 416 422 V

    PLIM Power limit VIN = 85 VRMS 275 360 385 W

    ILIM Peak current limit 5.335 5.500 5.665 A

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    +

    +

    Figure 2. Reference Design Schematic

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    Table 2. Variable Definitions

    VARIABLE DEFINITIONS

    CDIODE Boost diode capacitance

    COSS FET Drain to source capacitance

    GVEA

    Gain of the voltage amplifier

    D Duty cycle

    fS PWM switching frequency

    GPID Control to output gain of the current loop at the desired crossover frequency

    GPID (f) Control to output gain of the current loop

    GPS(f) Voltage loop control to output gain

    IMO_MAX(high_line) Peak IMO current at high-line input

    IRMS_DIODE Boost diode current

    IRMS_FET RMS current in the FET

    IRMS_L RMS inductor current

    Osc_Amplitude Typical oscillator ramp amplitude

    PSEMI Power dissipated by a semiconductor device

    PCON_FET Conduction losses in the FET

    PCOND_DIODE Diode conduction losses

    PCOSS Power dissipated by the FETs drain to source capacitance

    PDIODE Total loss in the boost diode

    PDIODE_CAP Loss due to boost diode capacitance

    PDIODE_TR Boost diode transition loss

    PFET_TR FET transition losses

    PGATE Power dissipated by the FET gate

    POUT Maximum output power

    PQ1 Total FET losses

    QGATE FET gate charge

    RDS(on) On resistance of the FET

    RCS Thermal impedance case to sink

    RJC Thermal impedance junction to case

    RSA Thermal impedance sink to air

    TA Ambient temperature

    tHOLDUP Boost capacitor holdup time

    TJ(max) Maximum semiconductor temperature

    tF FET fall time

    tR FET rise time

    tRR Reverse recover time for a boost diode

    TS(f) Voltage loop frequency response

    VAI(max) Maximum voltage amplifier referenceVAI(min) Minimum voltage amplifier reference voltage

    VCLAMP Voltage reference clamp to ensure the boost voltage is not exceeded

    VEA(max) Maximum voltage amplifier output.

    VEA(min) Minimum voltage amplifier output

    VGATE Gate drive voltage

    VDROP Amount of voltage the boost capacitor is allowed to drop during holdup.

    VIN(max) Maximum RMS input voltage

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    VARIABLE DEFINITIONS

    VIN(min) Minimum RMS input voltage

    VOUT(max) Maximum dc output voltage

    VOUT(min) Minimum dc output voltage

    VPP Output peak-to-peak ripple voltage

    VREF_TL431 Reference voltage of the TL431

    I Change in boost inductor ripple current

    Efficiency

    %THD Percentage of allowable total harmonic distortion

    2 Power Stage Design

    2.1 Inductor Selection

    The boost inductor is selected based on the maximum allowed ripple current at maximum dutycycle at the peak of minimum line voltage. The following equations can be used to calculate the

    required inductor for the power stage with ripple current that is 20% of the peak input current.The calculated inductance for this design was roughly 570 H. In traditional application theboost voltage (VOUT(min)) would be fixed at roughly 390 V. For the same power levels and inputconditions for the traditional boost converter would require and inductance of roughly 1 mH. Tomake the design process easier the inductor was designed by Cooper Electronics.

    DI +POUT 2

    0.2VIN (min)

    D + 1*VOUT (min)* VIN (min) 2

    VOUT (min)

    L1 + VIN (min) 2 D

    DI fS

    2.2 Boost Switch Selection (D1) and Boost Diode Selection (Q1)

    To properly select D1 and Q1 a power budget is generally set for these devices to maintain thedesired efficiency goal. Equations (4), (5), and (6) are used to estimate power loss in theswitching devices. To meet the power budget for this design an IRFP450 HEX FET andHFA08TB60 fast recovery diode from International Rectifier were chosen for this design to meetthe power constraints.

    To calculate the loss in Q1:

    IRMS_FET +POUT

    VIN (min) 2 2*

    16 VIN(min) 2

    3 p VOUT(min) IRMS_L + POUTVOUT (min)

    PGATE + QGATE VGATE fS

    PCOSS +12

    COSS VOUT(min)2

    fS

    (1)

    (2)

    (3)

    (4)

    (5)

    (6)

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    PCOND_FET + RDS(on) IRMS_FET2

    PFET_TR +12

    VOUT(min) IRMS_L 0.9 tR ) tF fS

    PQ1 +

    PGATE)

    PCOSS)

    PCOND_FET)

    PFET_TR

    To calculate the loss in D1:

    IRMS_DIODE +POUT

    VOUT (min)

    16 VOUT(min)

    3 p VIN(min) 2

    PCOND_DIODE + VF IRMS_DIODE

    PDIODE_CAP +CDIODE

    2 VOUT(min)

    2

    fS

    PDIODE_TR +

    1

    2V

    OUT(min)IRMS_DIODE

    tRR

    fS

    PDIODE + PCOND_DIODE) PDIODE_CAP) PCOND_TR

    2.3 Benefits of the Boost Follower Topology on the Power Stage at Low-Line

    The more traditional PFC preregulator topology has a fixed output voltage that is greater thanthe peak line voltage. The fixed boost voltage for a universal input is typically set at 390 V. Theboost follower is designed so that the output voltage is greater than the peak input voltage. Forthis design the output tracks the input from 206 V to 390 V. From the equations for transitionloss and capacitance loss for the boost switch (Q1), it can be observed that these losses shouldbe less at lower line voltages for the boost follower topology as compared to the traditional

    preregulator. The calculated losses for Q1 and D1 in the traditional topology were approximately25 W and the calculated losses for switch and diode for the boost follower was approximately17.4 W. The boost follower topology should be at least 3% more efficient at low line than thetraditional topology. When compared to that of a traditional converter with the same powerlevels, the finished converters low-line efficiency is approximately 5% more efficient. (SeeFigure 3.)

    (7)

    (8)

    (9)

    (10)

    (11)

    (12)

    (13)

    (14)

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    EFFICIENCYvs

    OUTPUT POWER

    Figure 3.

    Efficiency

    (%)

    POUT Output Power W25 50 75 100 125 150 175 200 225 250

    82

    84

    86

    88

    96

    90

    92

    94

    98

    100

    85 VRMSof Boost-Follower PFC

    85 VRMSof Traditional PFC

    2.4 Heat Sinks

    Equation (15) calculates the minimum required thermal impedances of the heat sinks (RSA)required for this design. The heat sinks are designed to ensure that the junction tempature staysbelow 75% of the rated maximum. The heat sinks require a fan capable of forcing 40C air at150 LFPM. The heat sink required for Q1 using the traditional topology required an AVVID heatsink part number 53002 that is approximately 4.125 cubic inches. The heat sink for the boost

    follower topology required an AVVID heat sink part number 531202 of approximately 1.38 cubicinches which is about 66% smaller than the heat sink used in the traditional design.

    RqSA +TJ(max)* TA * PSEMI RqCS)RqJC

    PSEMI

    2.5 Holdup Capacitor Selection

    Equation (16) is used to estimate the size of the hold-up capacitor and the maximum allowableRMS current through the boost capacitor. The hold-up capacitor was designed for 16.7 ms of

    holdup time (tHOLDUP) allowing the output 85 V of drop (VDROP). For this design the calculatedminimum hold-up capacitance was approximately 330 F requiring roughly 1.7 A of RMS currentat low-line operation. This minimum calculated capacitance value is roughly double of what isrequired in the traditional design. This is one of the negative aspects of using a boost followertopology.

    C12 w 2 POUTtHOLDUP

    VOUT(min)2

    * VOUT(min)* VDROP2

    (15)

    (16)

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    IRMS_C12 +POUT

    VOUT (min)

    16 VOUT(min)

    3 p VIN(min) 2 * 1

    2.6 Multiplier Setup

    The multiplier is used to shape the input current waveform and must be set up correctly to getproper PFC. Equations (18) and (19) are used to set up the multiplier.

    R13)R21 +VIN(max) 2

    500 mA

    R6 + 1.4 VVIN(min)

    R13)R212 0.9

    Three voltage signals in this circuit, having a 120-Hz ripple component, contribute to input

    current total harmonic distortion (THD). The voltage feedforward (VFF) of the multiplier is onethat contribute to THD. To meet the design goal of less than 5% THD, each signal is allowed tocontribute only 1.5% allowable 120-Hz distortion (%THD). To meet the current THDrequirements, C6 is set to attenuate the 120-Hz voltage ripple present on the VFF input of themultiplier to 1.5% (%THD) of the VFF pins voltage range.

    C6 + 12 p%THD

    66% 120 HzR6

    2.7 Peak Current Limit

    The UCC3819 has a peak current limit comparator that can be set up with a voltage divider

    using the VREF pin of the PWM controller. R14, R12 and R11 are selected to have the peaklimit comparator trip at 110% of the maximum output power to protect Q1. This comparator limitsonly the current through the switch and not the current drawn by the output.

    (17)

    (18)

    (19)

    (20)

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    2.8 Power Limiting

    Resistor R9 is selected to achieve soft power limiting at maximum output power[1].

    R9 +

    POUT 2

    hVIN(max) R14

    IMO_MAX(high_line) , R9+ R10

    2.9 Current Amplifier

    Equations (22) and (23) are used to compensate the current loop with a desired crossoverfrequency at 1/10 of the switching frequency. Resistor R8 and capacitor C9 form a zero at thedesired crossover frequency that gives an added 45 degrees of phase margin for circuit stability.Capacitor C8 and and resistor R8 form a high-frequency pole to attenuate any high-frequencynoise that may be present in the system.

    GPID +VOUT(max) R14

    2 p fS10 L1 Osc_AmplitudeR8 + 1

    GPID, C9 + 1

    2 p fS10R8

    , C8 + 1

    2 p fS2 R8

    3 VAI Input Sensing Circuit with Clamp

    The UCC3819 PWM controller allows the user to set the reference voltage (VAI) externally. It isthis feature that allows the designer to use an integrated PWM controller with a boost follower

    topology. With a few external components, a circuit can be constructed that sets VAI proportionalto the input voltage. This reference voltage is then used to make the output voltage track theinput voltage. Figure 4 shows the external components that are required to generate the VAIvoltage.

    (21)

    (22)

    (23)

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    VCC

    VREC

    1

    2

    3

    4

    8

    7

    6

    5

    U2

    OP07

    C19

    33 pF

    C18

    C160.01 F

    C174.7 F

    R3322.1 k

    R32499 k

    R31499 k

    R34432

    VFF

    R353.3 k

    R362 k

    UDG02076

    1 F

    D13TLV431CLP

    Figure 4. VAI Output Sensing Schematic

    R31, R32, R33 and C17 form a voltage divider with a single-pole filter that is used to monitor theline voltage. R35, R36, and D13 form a VAI clamp to ensure the boost voltage does not exceedthe design specification of 390 V. Equations (24) and (25) can be used to select the propercomponents for the circuit.

    VAI(min) +VAI(max)

    2

    R33 +

    VAI(min) (R31)R32)

    VIN(min) 0.9* VAI(min)

    The VAI signal includes a 120-Hz component that can contribute to THD. Capacitor C17 isselected to keep its contribution to less than 1.5% THD.

    C17 + 1

    2 pVAI(max)%THD

    VIN(max) 2 66%

    120 Hz R33

    Setting up the clamp voltage requires that the divider to the VSENSE pin be set up first.

    R3 +V

    AI(min)(R19

    )R2)

    VOUT(min)* VAI(min)

    VCLAMP +VOUT(max)R3

    R19)R29)R3

    R35 +VCLAMP* VREF_TL431R36

    VREF_TL431

    (24)

    (25)

    (26)

    (27)

    (28)

    (29)

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    3.1 Voltage Amplifier

    The voltage amplifier is compensated to attenuate the 120-Hz boost-ripple voltage (VPP) in orderto reduce its contribution to THD.

    VPP +

    POUTh

    p 120 HzC12 VOUT(min)

    GVEA +%THD VEA(max)* VEA(min)

    VPP 100

    C8 + 12 p 120 HzGVEAR9

    fC +POUT

    VEA(max)* VEA(min) VOUT(min) 2 pC12 1

    2 pR9C8R8 + 1

    2 p fS10C8

    4 Slower Voltage Loop Small Signal Transient Response at High Line

    Another drawback to using a boost follower topology is the small signal transient response isslower at lower line voltages. Equations (35) through (38) model the voltage loop frequencyresponse of both a boost follower and traditional PFC offline voltage regulator. These equationsdescribe the power stage gain (G

    PS(f)) as inversely proportional to output voltage. In the

    boost-follower topology the voltage loop is compensated when the boost voltage is at its lowestto ensure circuit stability. As the input voltage increases, VOUT increases, which decreases theoverall loop gain (TS(f)). As TS(f) decreases the loop crosses over at a lower fC, resulting inslower transient response. The traditional topology has a fixed output voltage and a fixed TS(f),which results in a fixed transient response, independent of line voltage.

    s(f) +j 2 p f

    GPS(f) +POUT

    VEA(max)* VEA(min) VOUT s(f)C12

    GEA(f) +(s(f)R8C9) 1

    )

    S(f)R9 (C9) C8) S(f)R8 C9C8C9)C8) 1Ts(f) +*GPS(f)GEA(f)

    Figures 5 and 6 show the measured voltage loop small-signal frequency response. The smallsignal transient response at low line is roughly twice as fast as it is at high line.

    (30)

    (31)

    (32)

    (33)

    (34)

    (35)

    (36)

    (37)

    (38)

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    50

    40

    30

    20

    10

    0

    10

    20

    30

    40

    50

    1 1060

    40

    20

    0

    40

    60

    80

    100

    120

    140

    20

    100

    G

    Gain

    (dB)

    f Frequency Hz

    Phase

    (_)

    Phase

    Gain

    Figure 5. Voltage Loop Low-Line Frequency Response at Maximum Load

    G

    Ga

    in

    (dB)

    f Frequency Hz

    Phase

    (_)

    1 1050

    40

    30

    20

    10

    0

    10

    20

    30

    40

    50

    10060

    40

    20

    0

    40

    60

    80

    100

    Phase

    Gain

    Figure 6. Voltage Loop High-Line Frequency Response at Maximum Load

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    5 Reference Design Performance Curves

    The following graphs show the performance of the reference design.

    TOTAL HARMONIC DISTORTION (THD)vs

    OUTPUT POWER

    Figure 7.

    THDTotalHarmonicDistortion

    (%)

    POUT Output Power W

    250

    1

    2

    3

    4

    5

    6

    7

    8

    9

    10

    50 75 100 125 150 175 200 225 250

    VRMS= 265

    VRMS= 120 VRMS= 85

    82

    84

    86

    88

    96

    90

    92

    94

    98

    100

    25 50 75 100 125 150 175 200 225 250

    Figure 8.

    EFFICIENCYvs

    OUTPUT POWER

    POUT Output Power W

    Efficiency

    (%)

    VRMS= 265VRMS= 85

    VRMS= 120

    POWER FACTORvs

    OUTPUT POWER

    Figure 9.

    PF

    PowerFactor

    (%)

    POUT Output Power W

    25 50 100 125 150 175 200 22575 25040

    50

    60

    70

    80

    90

    100

    VRMS= 265

    VRMS= 85

    VRMS= 120

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    LOW-LINE OPERATION

    Figure 10.

    t Time 5 ms / div

    VIN=85 VPOUT= 25 W

    Input Current(500 mA / div)

    Rectified Line Voltage(100 V / div)

    Figure 11.

    LOW-LINE OPERATION

    VIN=85 VPOUT= 250 W

    t Time 5 ms / div

    Input Current(5 A / div)

    Rectified Line Voltage(100 V / div)

    HIGH-LINE OPERATION

    Figure 12.

    t Time 5 ms / div

    VIN=265 VPOUT= 25 W

    Rectified Line Voltage(100 V / div)

    Input Current(200 mA / div)

    Figure 13.

    HIGH-LINE OPERATION

    VIN=265 VPOUT= 25 W

    t Time 5 ms / div

    Input Current(2 A / div)

    Rectified Line Voltage

    (100 V / div)

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    6 References1. Laszlo Balogh, UCC3854A/B and UCC3855A/B Provide Power Limiting With Sinusoidal Input

    Current, Texas Instruments Literature No. SLUA196.

    2. Lloyd Dixon, High Power Factor Switching Prergulator Design Optimization, Unitrode PowerSupply Design Seminar SEM700, 1990, Topic 7, Texas Instruments Literature No. SLUP093.

    3. POWER CONVERSION, September 1992 Proceedings, (LIST PUBLICATION HERE) p. 67

    4. Practical Considerations in Current Mode Power Supplies, Application Note, Texas InstrumentsLiterature No. SLUA110.

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