ATLAS SCT Barrel module wire-bonding scheme

Created:ATLAS Project Document No. Institute Document No.

Modified:

Page:

Rev. No.:

1 of 4

Prepared by: Checked by: Approved by:

Distribution List

ATL-xx-xx-xxxx

ATLAS SCT Barrel module wire-bonding scheme

13/10/2000

08/03/01 B

Project breakdown name

ATLAS SCT Barrel module wire-bonding scheme

abstract

T. Kohriki, Y. Unno, KEK Blockbold Blockbold

Blockbold

ATLAS Project Document No. Page:

Rev. No.:

History of Changes

Rev. No. Date Pages Description of changes

2 of 4

ATL-xx-xx-xxxxB

A 13/10/2000 All First versionB 08/03/2001 Figures Added the missing “cal3” pad


Rev. No.:

3 of 4

ATL-xx-xx-xxxxB

1 Introduction

The SCT Barrel module is made of:

1. Two pairs of ATLAS98 barrel sensors being glued on the top and the back sides of the cen-tre core plate where the centre core plate, baseboard, is functioning to conduct the heat of electronics and sensors to the cooling end and to provide electrical path of the high voltage to the backside of the sensors

2. Readout hybrid, one-piece construction of cable and readout electronics sections, being wrapping around the top and the back side sensors, glued at the cooling and far end exten-sions of the baseboard, which extensions are insulated with ceramics facings in order to isolate the HV in the baseboard

3. 12 readout LSI’s, ABCD3T, being mounted on the readout electronics sections of the hybrid; 6 chips on the top and the other 6 chips on the backside section

4. Pitch adaptors being mounted on the hybrid, in order to make wire bonds to be parallel, in front of the readout chips where the sensor side pitch is 80 µm and the chip side 48 µm to match the sensor strip and the LSI readout channel pitches, respectively.

This note is describing the wire bonding pattern in these electrical systems. Assembly steps ofthe module would be:

1. Assembling the hybrid

2. Assembling the hybrid into the sensor-baseboard assembly.

Wire bond pattern drawings will be given in this sequence; first of the hybrid and then of theconnection of the hybrid and the sensor-baseboard assembly.

2 Wire-bonding drawings

The hybrid wire bond pattern is given in 13 drawings:

1. Overall hybrid schematics

2. Vicinity of individual chips; 12 drawings for the chips, M00, S01, S02, S03, S04, and E05 of the top side and M08, S09, S10, S11, S12, and E13 of the back side. Bond patterns to the pitch adaptor are also included.

Following these drawings, the wire bond patterns between the hybrid and the sensor-baseboardassembly are given in 5 drawings:

3. Overall schematics of the sensor-baseboard and the hybrid

4. Vicinity of the four corners where the sensor bias connections are being made.

In the drawings, wire bonds are colour-classified as

Green: common to all chips

Red: specific pattern to the chips

Blue: HV connections.

Number of pads has multiple wires drawn in the drawings. These are actual number of wires tobe made. Repetition of wire bonds, e.g., individual channels of chips, is abbreviated.


Rev. No.:

4 of 4

ATL-xx-xx-xxxxB

3 Wire bond loop heights

In order to have a good pull strength, the wire bond loop height recommended is about 20~25%of the bonds distance. Table 1 gives an example of the barrel module built at KEK. In the table,the symbols shows

L: bonds distance

H: height difference of pads

h: loop height over the higher pad

ratio: h/L.

References

[1] Author(s), “Title”, reference id, date

Table 1 Wire bond loop heights of an example of KEK modules

Bond L [mm] H [mm] h [mm] Ratio (h/L)

Sensor-sensor long 4.0 0 0.94 24%

Sensor-sensor short 3.3 0 0.63 19%

Sensor-pitch adaptor long 2.9 1.2 0.78 27%

Sensor-pitch adaptor short 2.3 1.2 0.48 21%

Pitch adaptor-chip long 2.0 0.32 0.49 25%

Pitch adaptor-chip short 1.5 0.32 0.29 19%

Chip-hybrid 1.3 0.51 0.28 22%

ABCD3ABCD3C1 C2 C3 C4 C5 C6

C15 C16 C17 C18 C19 C20C51 (330 nF)

C52 (330 nF)

C71 (10nF, 630V)

C72 (10nF, 630V)

TM1

R36 (0k)

R33 (5k)

R34 (5k)

R35 (1k)

M00 S01 S02 S03 S04 E05

Pitchadaptor

C7

C21

C53 (330nF)

C54 (330nF)

C73 (10nF, 630V)

E05

C8 C9 C10 C11 C12 C13 C14

C22 C23 C24 C25 C26

C28

C55 (330nF)

C27C56

C57 (330nF)

C58

C74 (10nF, 630V) C75 (10nF, 630V)

TM2 R27 R28R29

R30 (100 ohm)

M08 S09 S10 S11 S12 E13

Pitch Adapter

ABCD3 ABCD3 ABCD3

ABCD3 ABCD3 ABCD3 ABCD3 ABCD3 ABCD3

Components of theABCD3T Cu/Polyimide Hybrid99.2.12 T.Kondo99.4.15, 99.5.1800.1.10, 00.1.25,00.2.9, 00.2.14,00.5.11, 00.8.2201.3.09

Refer the Circuit-diagram version (2000.7.12) or later for component numbers

C1~C28 : Murata GRM39X7R224K10C51~C58 : Murata GRM42-6X7R334K50C71~75 : Murata GHM1530X7R103K630

Temp. sensor

Temp. sensor

ABCD3M00

193

21.3

8.4 74.6

25.1

35.4

Scale x0.8

ABCD3S01

ABCD3S02

ABCD3S03

ABCD3S04

ABCD3E05

ABCD3M08

ABCD3S09

ABCD3S10

ABCD3S11

ABCD3S12

ABCD3E13

ATLAS-JAPAN48/80KEK990.2x2.7x63


11 21 31 41 51 61 71 81 91 101 111 121 131 141 151 161 171 181 191 201 211 221 231 241 251 261 271 281 291 301 311 321 331 341 351 361 371 381 391 401 411 421 431 441 451 461 471 481 491 501 511 521 531 541 551 561 571 581 591 601 611 621 631 641 651 661 671 681 691 701 711 721 731 741 751 761

A

A

B

D

C D

B

C

74.6

ID4SELECT

VDD

DGND

TM



11 21 31 41 51 61 71 81 91 101 111 121 131 141 151 161 171 181 191 201 211 221 231 241 251 261 271 281 291 301 311 321 331 341 351 361 371 381 391 401 411 421 431 441 451 461 471 481 491 501 511 521 531 541 551 561 571 581 591 601 611 621 631 641 651 661 671 681 691 701 711 721 731 741 751 761

1All

x2(x1/4) 2k1003/R1T.Kohriki@KEKA4-AT2k10-01- /13-R1

ORIGINAL SCALE TITLE DRAWING No.

K4 ABCD hybridDrawing of Bonding

08/03/011 Added missing "cal3" pad


ABCD3M00

Back bias padDet.ch.1

Det.ch.0Front bias pad

M00

ID4SELECT

VDD

2

1

x10 2k1003/R1T.Kohriki@KEKA4-AT2k10-01- /13-R1




ABCD3S01

S01

1

3x10 2k1003/R1T.Kohriki@KEKA4-AT2k10-01- /13-R1




ABCD3S02

S02

1





ABCD3S03

S03

1





ABCD3S04

S04

1






ABCD3E05

Back bias pad

Front bias padDet.ch.769

Det.ch.770

DGND

TM

1

E057x10 2k1003/R1

T.Kohriki@KEKA4-AT2k10-01- /13-R1




ABCD3M08

M08


Det.ch.1

Det.ch.0Front bias pad

1





S09

ABCD3S09

1





S10

ABCD3S10

1





S11

ABCD3S11

1





S12

ABCD3S12

1





E13

ABCD3E13


Front bias padDet.ch.769

Det.ch.770

1





- 20

mR

ad. F

ace

+ 2

0 m

Rad

. Fac

eA B

C D

C D

AB

1

2

3

4

All1

x1 2k1012/R1T.Kohriki@KEKA4-AT2k10-02- /5-R1


K4 ABCD moduleDrawing of Bonding


Detector

Bias-front


ABCD3M00

Back bias pad

x10Detail (1)

5

Detector

2 2k1012/R1T.Kohriki@KEKA4-AT2k10-02- /5-R1





Detector

Bias-frontBack bias pad

x10Detail (2)

Detector

5

ABCD3E05 1

32k1012/R1

T.Kohriki@KEKA4-AT2k10-02- /5-R1




Detector

Bias-front


x10Detail (3)

5

Detector

ABCD3M08






Detector

Bias-front

x10Detail (4)

Detector

5

ABCD3E13 1





ATLAS SCT Barrel module wire-bonding scheme

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