Advanced RF & Microwave Material
Transcript of Advanced RF & Microwave Material
April 2010
Advanced RF & Microwave Material
April 2010
High Performance RF and Digital High Performance RF and Digital ThermosetThermoset Electronic MaterialsElectronic Materials
3.6 3.6 3.6
3.2
3.8
3.5
3.2
3.6
3.5
2.93
3.13.23.33.43.53.63.73.83.9
N4000
-12N40
00-13
N4000
-13 EP
N4000
-13 SI
N4380
-13 R
FN43
50-13
RF
N8000
-Q
Dk
0.009 0.009 0.0090.008
0.0070.0065
0.006
0.005
0.004
00.0010.0020.0030.0040.0050.0060.0070.0080.009
0.01
N4000
-12N40
00-13
N4000
-13 EP
N4000
-13 SI
N4380
-13 R
FN43
50-13
RF
N8000
-Q
Df
Next Gen
High Speed/
Low Loss
Laminate
Mercury
wave 93
50
Lamina
te
Next Gen
High Speed/
Low Loss
Laminate
Mercury
wave 93
50
Lamina
te
Tested per IPC TM650-2.5.5.5 @ 10 GHz
April 2010
BenefitsRF microwave applications
Laminate and prepregs have a controlled Dk of 3.5 with a Df of .004 by stripline @ 10 GHz Impedance matching for better electrical performance
Range of core thicknesses .003”(.076mm) and up
Prepregs for multilayer lamination106, 1080 & 2116 prepregs available
Multiple panel size availabilityGlobal availability Global manufacturing with standard lead times
April 2010
Enhanced thermal/electrical performance Outstanding thermal performance (thermal conductivity .5W/mK & lead
free compatibility) Stable electrical performance:
– Over frequency (2 GHz – 43 GHz) – Elevated temperature (-40oC to 150oC)– Humidity (25% to 85% RH)
High Tg material (>200oC by DMA) Low CTE expansion 2.5% (50oC to 260oC)Alpha 1= 48 ppm/oC (50oC to Tg)Alpha 2 = 245 ppm/oC (Tg to 260oC)
Compatible with lead free processing (multiple 260oC reflows)
High peel strengths 7lbs/in(1.23 N/mm)Use RTF as standard copper for adhesion
Benefits
April 2010
Compatible with alternative oxide and ENIG/Immersion Tin platingchemistries
Excellent crack resistance for sequential lamination designs Fabrication
No special fabrication techniques required Standard entry material for drill Repoint drill bits permitted (1000 hits/drill) Standard hole wall preparation
– Does not require sodium etchant or plasma treatment
No special surface roughness requirement for solder mask adhesion Material capable for v-score singulation UL approval in process (provisional end of May) Meets and exceeds IPC 4103/11 electrical and mechanical
requirements
Benefits
April 2010
Mercurywave™ 9350 Comparison to 4103/11
A new slash sheet designation has been submitted for Mercurywave™ 9350
4103 /11 Mercurywave 9350 UnitsPeel Strength 1.oz FoilLow Profile Foil (sub 1 micron) N/A 5 Lbs/inStandard Foil
After Thermal Stress 3 7 Lbs/inAt 150C 3 7 Lbs/inAfter Process Solutions 3 8 Lbs/in
Volume Resistivity96/35/90 10^5 10^7 MΩ-cm24/125 10^4 10^6 MΩ-cm
Surface Resistivity96/35/90 10^3 10^5 MΩ24/125 10^2 10^6 MΩ
Moisture Absorption 0.25 0.15 %
Dielectric Breakdown 30 >50 kV
Permittivity 10 GHz 3.48 - 3.60 3.5Loss Tangent 10 GHz 0.006 0.004
Flexural StrengthLength Direction 310 606 N/mm^2Cross Direction 228 428 N/mm^2
Thermal Stress 10 s @ 288 C Pass Pass s
Electric Strength N/A 1500 V/mil
Flammability Average Burn Time 50 94-V0 sIndividual Burn Time 10 94-V0 s
CTEX/Y Axes N/A 10-14 ppm/CZ Axis N/A ά1 48 ppm/Cά2 245 ppm/C
April 2010
Thermal PropertiesThermal Properties
3-5 min.0 min.18 min.T300
Pressure Cooker (1 hr.)
>600 sec.
0.15%
>600 sec.
40 min.200 min.
360°C>200°C*
Mercurywave™9350
>600 sec.>470 sec.Solder Float
(4”x4” Cu Clad 288°Ctime to failure)
0.15%0.10%Moisture Gain
>600 sec.>600 sec.Solder Dip (288°C)
15 min.>10 min.T288
350°C350°CTd (TGA)> 30 min.
210°CN4350-13RF
> 60 min.T260
185°CTg (DSC)N4000-29Property
* Tg by DMA
April 2010
Dk vs Frequency
3.153.2
3.253.3
3.353.4
3.453.5
3.553.6
3.653.7
3.753.8
2 GHz 10 GHz 34 GHz 37 GHz 40 GHz 43 GHz
Frequency
Dk
Tested per IPC TM650-2.5.5.5 @ 10 GHzTested with Open Circular Cavity above 10 GHz
(Out of Plane Measurement)
April 2010
Df vs Frequency
0.0020
0.0025
0.0030
0.0035
0.0040
0.0045
0.0050
0.0055
0.0060
2 GHz 10 GHz 34 GHz 37 GHz 40 GHz 43 GHz
Frequency
Df
Tested per IPC TM650-2.5.5.5 @ 10 GHzTested with Open Circular Cavity above 10 GHz
(Out of Plane Measurement)
April 2010
Dk vs Temperature
3.20
3.30
3.40
3.50
3.60
3.70
3.80
-50 -25 0 25 50 75 100 125 150
Temperature °C
Dk
Tested per IPC TM650-2.5.5.5 @ 10 GHz
April 2010
Dk vs Humidity @ 25°C
3.4
3.5
3.6
3.7
25% 45% 65% 85%
Relative Humidity %
Dk
Tested per IPC TM650-2.5.5.5 @ 10 GHzSamples were equilibrated for 24hrs at each RH% before test
April 2010
Customer EvaluationCopper Foil Impact on Insertion Loss
130" Meanderline Trace Comparison (Insertion Loss)WiMax Antenna Application Operating at 3 GHz
-20-19-18-17-16-15-14-13-12-11-10-9-8-7-6-5-4-3-2-10
0 1 2 3 4 5 6
Frequency [GHz]
Inse
rtio
n Lo
ss [d
B]
Mercurywave 9350 RTF
Mercurywave 9350 DFF
1.2 dB improvement in insertion lossat 3 GHz using DFF copper
April 2010
Customer Evaluation8L .066” Signal Integrity Test Vehicle
Designed to evaluate a 3.5 Dk laminate
Output was looking at simulated vs measured insertion loss over frequency (simulated meet actual)
April 2010
Customer Evaluation12L TV .067” - .004” (2116), .006”(1080), .010” (1080) all are ½ oz copper with 1080 prepreg
The TV has approximately 15,000 holes split into 4 different pitch sizes
Technology
1 mm BGA, 10 mil holes
1 mm BGA, 12 mil holes
.8 mm BGA, 10 mil, holes
.8 mm BGA 12 mil holes
4 panels were reflowed at 6X, 8X, 10X 260C. All 12 panels were horizontally ground & visually inspected. No delamination was found after visual inspection.
April 2010
Customer EvaluationBoard is 9.5”X6” Signal Integrity TV8L .066” 1 & .5 oz copper innerlayers Laminate & prepreg consisted of all high RC 106 & 1080Aspect ratio is 3 to 1 (.022” holes)Test boards were reflowed a total of 15 times 6X260C + 6X270C + 3X300CNo delamination was seen after visual inspection or after cross section were takenThermal data after 15 reflow cyclesDMA (TgI/TgU) = 221°C/221oCTGA = 387°CT260 = >60 min no delaminationT288 = 13 minT300 = 7 min
April 2010
Customer EvaluationProduction board 13.5”X5.25” Hybrid Mercurywave™ 9350 /-6FC3X Sequential lamination design12L .105” .5 oz copper innerlayers Laminate & prepreg consisted of all 106 & 1080 glass1 mm pitch BGAAspect ratio is 6.5 to 1 (.016” holes)Six boards were reflowed at 6X245C No delamination was seen after visual inspection or after cross sections were takenThermal data after 6 passes through reflowDMA (TgI/TgU) = 193°C/193°CTGA = 375°CT260 = 2.2 min
April 2010
Lead Free PWB Conditioning PCBs need to function in a variety of
environmental conditions (temperature & humidity)
Different assembly house conditions in North America, Europe & Asia
Some OEMs require conditioning of laminate materials as part of the qualification process 65%RH/ 35°C conditioning for 2 weeks followed
by a 9x260°C reflow Application test
22L, .125” 3x sequential lamination with blind and buried laser vias
65%RH/35°C conditioning for 2 weeks followed by a 9x260°C reflow
No delamination was found after inspection, even after an additional 6x300°C reflow
April 2010
Via Fill CapabilityMercurywave™ 9350 has
excellent flow and fill characteristics
Can be used for both laser via and sub lamination designs
22L, .125” with .060” with .010” drilled holes Filled with 2X106 prepreg
April 2010
Current Product ApplicationWiMax Antenna
.030” double sided tested on N4350-13RF & Mercurywave™ 9350
Tri-band antenna deployed in Asia
April 2010
Potential Applications Base Station Equipment
Power Amplifiers Tower Mounted PA’s Filters, Combiners and Components
Automotive Radar Communications Road Tolling
Satellite Communications LNB’s/LNA’s GPS
Military Communication Guidance Systems Radar
Broadband Antennas WiFi/WiMax RFID Tags LAN’s
RF Applications Directional Couplers TXRX (Transmit/receive Boards) Up/Down Converters
April 2010
OEM & Fabricator Testing of Mercurywave™ 9350
April 2010
Thank You