19/11/2001

2001 ITRS

Factory Integration ITWG

Jeff Pettinato, Intel

29/11/2001

Agenda

1. Scope and Factory Drivers

2. Difficult Challenges

3. Need for Integrated Solutions

4. Key Technology Requirements

5. Solutions Being Driven by Technology Requirements

6. Summary

39/11/2001

Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes

Many International members have contributed to FI

Jim Ammenheuser (ISMT) Damon Genetti (Novellus) Kunio Oishi (Ebara)Bob Bachrach (AMAT) Randy Goodall (ISMT) Mikio Otani (Shinko)Eddy Bass (Intel) Dave Gross (AMD) Richard Oechsner (Fraunhofer)Dave Bloss (Intel) Larry Hannessy (IDC) Jeff Pettinato (Intel)Ray Bunkofske (IBM) Duane Howard (IBM) Dev Pillai (Intel)Chris Burkhart (Novellus) Michio Honma (NEC) Lisa Pivin (Intel)Al Chasey (ASU) Jim Irwin (Irwin Consulting) Joe Reiss (PRIA)Hugo Chang (Winbond) Mani Janakiram (Intel) Lance Rist (ISMT) Ivan Chou (Compaq) Carl Johnson (PRI) Claus Schneider (Fraunhofer)Eric Christianson (AMD) Melvin Jung (Intel) Doug Scott (PRIA)Blaine Crandell (TI) Giichi Inoue (Toshiba) Steve Seall (Intel)Klaus Eberhardt (M+W Zandar) Junji Iwasaki (Mitsubishi) Marlin Shopbell (AMD)Anne Eldar (Intel) Shoichi Kodama, (Toshiba) Court Skinner (SRC)John Ellis (SEMI-NA) Dave Miller (IBM) Arnold Steinman (ION Systems)Rick Filippuzzi (Asyst) Mitsui-san (Matsushita) Keisuke Tanimoto (Sharp)Len Foster (TI) Mori-san (Daifuku) Toshi Uchino (Trecenti)John Fowler (ASU) Rohan Nageswaran (Intel) Brad Van Eck (ISMT)Karl Gartland (IBM) Seiichi Nakazawa (F-RIC) Hiromi Yajima (Toshiba)Bruce Gehman (SEMI) John O’Reilly (ION Systems)

49/11/2001

2001 Factory Integration Scope IncludesWafer, Chip and Product Manufacturing

WaferMfg.

ChipMfg.

ProductMfg.

Dis

trib

uti

on

Si S

ub

str

ate

Mfg

.The Factory

• FEOL• BEOL

• Probe/Test• Singulation

• Packaging• Test

The Factory is driven by Cost and Productivity:Reduce factory capital and operating costs per functionEnable efficient high-volume production with operational models for

varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiencyQuickly enable process technology shrinks and wafer size changes

New in 2001

59/11/2001

Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas

ProcessEquipment

UI

Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers

Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers

Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment

AMHSEqpt

(side view)

DB

DocumentManagement

MES

MCS

Network or Bus

DSSStation

Controllers

APC Scheduling +Dispatching

DB

Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment

Factory Operations Policies and procedures used to

plan, monitor and control production

Direct factory labor

Test Manufacturing Prober, Handler, and Test

Equipment Manufacturing processes to test

wafers and chips

69/11/2001

New Elements/Focus in the 2001 Factory Integration Chapter

New Factory Operations metrics as key targets for other factory functional areas to solve in an integrated fashion

1) Factory Cycle time, 2) multiple lots per carrier and single wafer processing, 3) labor efficiency, 4) time to money

Focus on e-Factory capabilities to solve Production Equipment Overall Equipment Efficiency (OEE) through

Use of Internet, process control, rich data sources, and standards

Refinement of Direct transport solutions for 300mm

Expanded facilities section with revised technology requirement and potential solutions

New Test section to address equipment & manufacturing

Introduction of a Fab factory Cost Model based on 300mm, 20k wspw, high volume factory (key focus to extend in 2002)

Discussion on 450mm wafer size timing and Mfg Paradigms

79/11/2001

2001 Difficult Challenges

Managing Complexity Quickly and effectively integrating

rapid changes in semiconductor technologies and market conditions

Factory Optimization Productivity increases are not

keeping pace with needs

Flexibility, Extendibility, Scalability Ability to quickly convert to new

semiconductor technologies while reusing equipment, facilities, and skills

Post CMOS Manufacturing Uncertainty Inability to predict factory

requirements associated with post CMOS novel devices

450mm Wafer Size Conversion Timing and manufacturing

paradigm for this wafer size conversion

< 65nm after 2007> 65nm through 2007

89/11/2001

Integrated Solutions are Essential to Meet NeedsIntegrated Solutions

Agile Manufacturing- Equipment Engineering

Systems - EES

- Single wafer control

- e-Diagnostics

Process Control- Fault Detection &

Classification

- Run to Run & Wafer to Wafer control

- Integrated Metrology

- Machine to machine matching

Material Handling- Direct Transport AMHS

- AMHS to support Send-Ahead, gating monitors, and very hot lots

- Integrated Sorters, Stockers, Metrology

Integrated Factory

Technology Requirements

New disruptive process technologies

157nm litho

High K gate stack

Low k dielectrics

Copper processing

+Operational Productivity &

Business drivers Decreased Factory Cycle

Time (QTAT) and time to market

Improved Equipment OEE

Reduction in non-product (I.e. test) wafer usage

More efficient direct labor

Faster factory conversion at technology nodes

Goal = Meet Factory Challenges and

Technology Requirements

99/11/2001

Key Factory Operations, Production Equipment, and Facilities Technology Requirements

YEAR TECHNOLOGY NODE

WAFER DIAMETER

2001 130 NM

300 MM

2002 115 NM

300 MM

2003 100 NM

300 MM

2004 90 NM

300 MM

2005 80 NM

300 MM

2006 70 NM

300 MM

2007 65 NM

300 MM

2010 45 NM

300 MM

2013 32 NM

450 MM

2016 22 NM

450 MM Factory cycle time per mask layer (non-hot lot for High Volume High Mix) (days)

1.2 1.2 1.2 1.1 1.1 1.1 1 0.9 0.95 0.8

Wafer layers/day/head count

55 55 55 61 61 61 67 73 81 89

Lots per carrier (lot) Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Multiple Groundbreaking to first tool move-in (months)

9 9 9 8 8 8 7 6 5.5 5

First tool move-in to first full loop wafer out (months)

4 3.5 3.5 3 3 2.5 2.5 2 1.5 1

Bottleneck production equipment OEE 75% 78% 80% 82% 84% 87% 88% 90% 91% 92%

Average production equipment OEE 55% 58% 60% 63% 65% 67% 70% 72% 74% 75%

% capital equipment reused from previous node

Limited reuse

>90% >90% >90% >90% >90% >90% >70% Limited

reuse >70%

Production Equipment Install as a % of capital cost

10% 8% 8% 6% 6% 6% 6% 6% 8% 6%

Pro

du

ctio

nE

qu

ipm

ent

Fac

tory

Op

erat

ion

sF

acil

itie

s

109/11/2001

Key Material Handling, Factory Info and Control Systems, and Test Mfg Technology Requirements

YEAR TECHNOLOGY NODE

WAFER DIAMETER

2001 130 NM

300 MM

2002 115 NM

300 MM

2003 100 NM

300 MM

2004 90 NM

300 MM

2005 80 NM

300 MM

2006 70 NM

300 MM

2007 65 NM

300 MM

2010 45 NM

300 MM

2013 32 NM

450 MM

2016 22 NM

450 MM

# of AMHS transport system types in a factory

2 2 2 Some 1 and

some 2 1 1 1 1 1 1

System throughput (moves/hour) - Interbay transport

1200

1300

1400

1500

- Intrabay transport 170 180 190 200

1625 1750 1875 2000 2000 2000

MTBF for mission critical applications (months)

>6 >7 >8 >8 >9 >9 >10 >12 >12 >24

Time to create FICS interface Standard (months)

<12 <12 <6 <6 <6 <6 <6 <6 <6 4

Lead time for software to conform to standards

>18 <9 <9 <6 <6 <6 <6 <4 <4 <4

1st Article Test Equipment integration time improvement from previous year

0% 0% 30% 20% 20% 10% 10% 10% 10% 10%

Fac

tory

In

foA

nd

Co

ntr

ol

Mat

eria

lH

and

lin

gT

est

Mfg

119/11/2001

Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer (days)

a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control

Wafer Layers / Day / Headcount a) Fully automated material handling & data sys

Multiple lots per carrier a) Embedded controller standards

Groundbreaking to first tool move in

a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication

First tool move-in to first full loop out

a) Standard equipment interfaces to reduce integration time

Overall Equipment Efficiency (OEE)

a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement

Capital Reuse from one node to the next

a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts

Production Equipment Install & Qualification cost as a % of capital cost

a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

129/11/2001

Under FloorFull DirectTransport

Central Stocker(Large Capacity)(High Throughput) Upper Ceiling

OHT

Branch

Direct Transport Concepts for Tool to Tool Delivery – Production Need date is 2005

Concept #1: Integrated Overhead Hoist Transport (OHT) systems

Concept #2: Integrated Overhead Hoist Transport (OHT) systems

Conveyorizedtransport

Back

139/11/2001

Agile Manufacturing Means… Quick turn around [*faster cycle] time for production

Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers

Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume

Which can be Realized by… Internet technologies for B2B, Factory to Factory, Internal

factory connectivity and communications Supply Chain Management (SCM) Integrated Planning, Scheduling, and Real Time Dispatching

Flexible Material Handling and Data Automation Systems Single Wafer Control and Tracking

Multiple lots/single wafer control in equipment module (group)

149/11/2001

Carrier and Wafer Level Control Concepts for Rapid Material Movement and Processing

Process Tools

Process Tools

Sto

cker

s

OH

T L

oop

SorterMetro

MetroTools

Stocker robot interfaces directly with Sorters and Metro equip

Concept #1: Sorter and Metrology linked with Stockers

Back

Concept #2: Connected Equipment Front End Modules for Rapid Wafer processing and Inspection

Wafer Staging

Carrier Staging

EquipmentSupplier A

EquipmentSupplier B

EquipmentSupplier C

159/11/2001

Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer

a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control

Wafer Layers / Day / Headcount a) Fully automated material handling & data sys

Multiple lots per carrier a) Embedded controller standards

Groundbreaking to first tool move in

a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication

First tool move-in to first full loop out

a) Standard equipment interfaces to reduce integration time

Overall Equipment Efficiency (OEE)

a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement

Capital Reuse from one node to the next

a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts

Production Equipment Install & Qualification cost as a % of capital cost

a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

169/11/2001

Back

Factory Information and Control Systems

FactoryNetwork

SECS-IIGEMHSMS

Utilization trackingstandard

Enhanced parallelI/O standards

Carrier mgtstandard

Process Job,Control Jobstandards

Wafer level tracking &control standards

CarrierID standard

Mainstream Computer Communications stds

ManufacturingExecutionSystems

DecisionSupportSystems

Productionequipment

ProcessControlstandards

User Interfaces

OtherSystems

Standard for dataformats, data access, and inter applicationinterfaces

APC, Fault Detection & Classification,Integrated metrology,EES, e-Diagnostics

Equip Eng I/F

-> Standards Exist-> Standards Are Under Development-> Standards Are Needed

-> Standards Exist-> Standards Are Under Development-> Standards Are Needed

Utility, fluids,exhaust, drains hook-upstandards

Facilities Systems

Rear of productionequipment

Fab levels

Maximummove-in size stds

Sub-fab standards

Raised floorheight standards

Wall interfacestandards

RearU/I

Maxweightstandard

Standards for facilities systems safety counter-measures

Materials supplycontainer standards

Standards for installpedestals, jigs/fixturefor alignment

Work accessstandards to eliminateErgo issues

Cleanroom NoiseCriteria standards

Vibration stds

Global ConstructionCodes

Facility electrostaticlevels stds

Sub-fab level

Cleanroom heightstandards

CleanroomTemperature& RH ranges

Environment/stds

Ceiling level

Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity

Legend:

179/11/2001

Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality

Metric Potential Solution it is drivingHot-Lot and regular lot cycle time per mask layer

a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control

Wafer Layers / Day / Headcount a) Fully automated material handling & data sys

Multiple lots per carrier a) Embedded controller standards

Groundbreaking to first tool move in

a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication

First tool move-in to first full loop out

a) Standard equipment interfaces to reduce integration time

Capital Reuse from one node to the next

a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts

Production Equipment Install & Qualification cost as a % of capital cost

a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

Overall Equipment Efficiency (OEE)

a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement

189/11/2001

ITRS and Adv. Process Control

ITRS Process Control discussion is divided into 3 basic high level Capabilities

Fault Detection and Classification• ITRS Problem: Prevent scrap or equipment damage

Run to Run Control (lot to lot, and wafer to wafer)

• ITRS Problem: Optimize performance to processing spec

Integrated Metrology• ITRS Problem: Reduce module level TPT + AMHS

moves

Fault Detection and Classification

ProcessEquipment

Step N

UI

ProcessEquipment

Step N

UI

Fast FDCModule

Host SystemFDC Signal / Data

FDC Control

Outside of Tool• Host determines actions based on type of fault

• Host issues control command

Inside the Tool• FDC Models defined / configured

• FDC host signals configured• FDC actions may be configured

EESEESEE

Interface

• Historical and Summary data storage and analysis

• Detailed wafer and chamber data tracked

External FDCModule

GEMInterface

DetailedHistorical Data

Run to Run Control

MetrologyEquipment

UI

MetrologyEquipment

UI

ProcessEquipment

UI

MetrologyEquipment

UIUI

MetrologyEquipment

Step N-1Step N+1Step N

UI

Feedback Control - Use post metrology feedback data to adjust processing for the next lot

Feed Forward Control - Use preprocess metrology data to adjust processing for that lot

Ru

n t

o R

un

Co

ntr

ol

GE

MGE

M

GE

M

Recipe Adjustment

Control

Parameterized recipes required

Metrology data collected via EE interface

Host SystemEquip

ControllerEquip

ControllerEquip

Controller

Factory Network

EE

EE

EE

EEDatabase

EES

Recipe Adjustment Models and Calculations

Recipe Recommendations

Detailed wafer and chamber data required

Modular apps with open interfaces

EE Network

EE Data to be used by any authorized app

Integrated Metrology

IntegratedProcess andMetro Equip.

UI

GE

M

Parameterized recipes required

Host System

EquipController

Factory Network

EE

Metrology data and detailed wafer and

chamber data collected via EE interface

Integrated MetrologyModule (not Bolt on)

EE Network

Recipe and Model

Selection and Download via

GEM Interface

EESEES Integrated GEM Interface for Process

and Metrology

Integrated EE Interface for Process and

Metrology

1

2 3

Back

199/11/2001

ManufacturingExecution System - MES

Equipment/AMHS

Within a Factory (E-Factory)

Factory to Factory (E-Factory)

Company to Company (E-Commerce)

Factory A

Company A

Factory B

Company BSuppliers

Equipment Engineering

System

e-diagnosticscapability

Process or MetrologyEquipment

(side view)

ControlSystem

Station Controller

AMHSEqpt

(side view)

Material ControlSystem - MCS

Eth

erne

t

EESEES

e-Manufacturing Hierarchy for Connectivity

firewall

Semiconductor industry must continue to rapidly leverage mainstream technologies to reduce cost/complexity/integration time

209/11/2001

Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality

Metric Potential Solution it is driving

AMHS system throughput for interbay and intrabay

a) Fundamental capability that permits AMHS system to transport hot lots, gating send-aheads and hand carry

MTBF/MTTR for mission critical applications

a) Equipment Engineering Systems, b) E-Diagnostic and c) E-manufacturing capabilities

Time to create industry standards

a) Improved business processes to speed up standard cycle time, b) Use Internet for balloting/approval

Lead time for solutions to conform with standards

a) Supplier/IC Maker collaboration to develop standards and solutions in parallel, b) Automated test tools for systematic interface testing

1st Article Test Equipment integration time change from previous year

a) Standard interfaces for equipment control, b) Standards for test programs, c) Standard data formats for test results

219/11/2001

Summary of Key Potential Solutions

Material Handling using Direct Transport To improve factory cycle time and fab space efficiency

Agile Manufacturing Leveraging Internet capabilities E-Factory to delivery product more quickly (cycle time)

Equipment Engineering System (EES) including E-Diagnostics capabilities Improve Overall Equipment Efficiency, cycle time, & factory output

Advance Process Control (APC) Improve Overall Equipment Efficiency, cycle time, & factory output

Continued Need for Standards to reduce integration time, cost, and complexity Reduce integration time and complexity, enable pervasive

implementation of capabilities above at lower cost

229/11/2001

Some Key Messages1. Rapid changes in process technologies, business

requirements, market conditions, and accelerated ramps have made factories more complex and difficult to integrate

2. Future factories must be agile to meet rapid technology and business changes with cost effective solutions

3. Overall Equipment Efficiency must be drastically improved Equipment at each tech node must meet throughput and uptime metrics

Solutions to improve utilization must be developed and implemented

4. Standards have been effective in 300mm. Cycle time to create and deploy must be drastically reduced for the future

5. Integrated Solutions are essential to meet needs

6. e-Factory concepts are being developed to solve complexity, integration and OEE issues Leverages the internet and rich data sources to achieve pervasive process

control, fast lot cycle times, on-line equipment repair, and rapid lot delivery using factory wide scheduling and dispatching

239/11/2001

Backup Area

249/11/2001

Understanding & Managing Factory cost is a Key Focus for 2002+

(Fab Capital Cost Breakdown)

ProcessEquipment

UI

Material Handling Systems = 3% of Total Capital $81M for $2.7B factory Wafer and Reticle Carriers Carrier ID readers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Software & computers within the equipment

Production Equipment = 80% of Total Capital $2,160M for $2.7B factory Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots Load Ports Installation, but not qualification Software & computers within the equipment

Facilities = 15% of Total Capital $405M for $2.7B factory Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Support buildings (Café, office, parking) Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Includes site prep, but not land and off-site dev costs

AMHSEqpt

(side view)

AssumptionsTotal Capital Cost = $2.7BTotal Capacity = 40k wspm300mm wafer size130nm technology

DB

DocumentManagement

MES

MCS

Network or Bus

DSSStation

Controllers

APC Scheduling +Dispatching

DB

Factory Information & Control = 2% of Total Capital $54M for $2.7B factory Manufacturing execution systems Decision support systems Process Control systems Planning systems, Schedulers, Dispatching Material Control, document management systems Computers, databases, software outside equipment

Baseline Model from2001 Roadmap

259/11/2001

Factory Areas or Thrusts

FactoryOperations

MaterialHandling

Example: Manufacturing rules, production size, mix

Facilities

Examples: Building, cleanroom, utility systems, process fluid delivery

Examples: AMHS Transport, storage, ID Systems, interface standards

Factory Information and Control

SystemsExample: MES, Computers, Networks, AppsMCS, APC, etc

ProductionEquipment

Example: Equipment unit, real-time process control, interface standards, Embedded Control

Technology Requirements and Potential Solutions are expressed through these factory areas

ComplexityManagement

FactoryOptimization

Extendibility,Flexibility,Scalability

Dif

ficu

lt C

hal

len

ges

Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements

Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations

Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems

Factories Must be Better integrated to solve Difficult Challenges