2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process...

13
STS SEMICONDUCTOR 2007013265 Moon – jun young

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Transcript of 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process...

Page 1: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

STS SEMICON-DUCTOR

2007013265 Moon – jun young

Page 2: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

Index

Introduce product Semiconductor product manufacturing process

Wafer backgrindingWafer sawDie attachMoldMarkSorterVisualpacking

Page 3: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

Introduce product PKG(TSOP,SOP) Card(sdcard)

Page 4: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

wafer

The wafer is cut into pieces called dies.

http://www.youtube.com/watch?v=LWfCqpJzJYM&feature=related
Page 5: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process

Wafer backgrindingFor Uniform thickness of the wafer

Page 6: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing processWafer saw

○ cutting wafer for assemble the pieces of the wafers(die)

Page 7: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process Die attach

attach the die on die pad using epoxy

Page 8: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process Mold

the process that cover with device by plastic

Page 9: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process Mark

In order to distinguish it from other things, a kind of marker is engraved process

Page 10: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process Sorter

Page 11: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process Visual

Checking product

Page 12: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

manufacturing process

Packing & delivery

Page 13: 2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

Thank You


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