product overview - Mechatronic · • wafer flipping function • customized chuck • OCR reader...

product overview

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Highest Safety in Wafer TransferWafers are getting thinner with advances in manufacturing processes, making it necessary to place very thin and often strongly distorted wafers on inspection systems or other post-process stages. Wafer loaders from mechatronic can load ultra-thin wafers with a thinness of as little as 50μm (micron) and the highest levels of safety and reliability that exceed all of the demands of the semiconductor industry. mechatronic mWL series wafer loaders offer the capabilities that reduce wafer transfer time significantly compared with conventional equipment. Wafer loaders from mechatronic systemtechnik help companies to optimize yield.

Wafer Loader mWL 150/200t

The Wafer Loader mWL 150/200t is designed for fully automated loading and unloading of 150/200 mm (6”/8”) thin-wafers from cassettes onto a customized chuck. Adaptation to OEM tools according to customer requirements is possible.

The Wafer Loader mWL 200 is designed for fully automated loading and unloading of 200mm (8”) standard wafers and e.g. eWLB wafers from cassettes onto a customized chuck. Adaptation to OEM tools according to customer requirements is possible.

The Wafer Loader mWL 300 is designed for fully automated loading and unloading of 300 mm (12”) standard wafers and e.g. eWLB wafers from FOUPs/FOSBs onto a customized chuck. The adaptation to OEM tools according to customer requirements is possible.

Applications • loading / unloading on a chuck• wafer handling automation

(e.g. for process, inspection, metrology tools etc.)

• loading / unloading on a chuck• wafer handling automation




Features • optimized footprint• handling of warped wafers• chip side & back side handling• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• handling of warped wafers • Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• handling of warped wafers• standard FOUP or FOSB compliance• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• two Bernoulli vacuum end-effectors 6” and 8”• two top grip end-effectors 6” and 8”• two cassette stations with scanners• one pre-aligner for 6” and 8”• one end-effector change station• one transfer station• end-effector cleaner• GUI

• one single-arm robot• one end-effector• two cassette stations• one mapper• one pre-aligner for 6” and 8” • GUI

• one single-arm robot on linear track• one end-effector• two load ports incl. mapper• one pre-aligner for 8” and 12” • GUI

Configuration Options

• wafer flipping function• customized chuck• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

• one pre-aligner for 6” and 8” • customized chuck• table for e.g. Nikon microscope• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

• customized chuck• RFID reader for FOUP / FOSB ID• 200 mm (8”) conversion kit• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

mechatron ic systemtechn ik gmbh 3

mWL 200/300mWL 150/200

The Wafer Loader mWL 150/200t is designed for fully automated loading and unloading of 150/200 mm (6”/8”) thin-wafers from cassettes onto a customized chuck. Adaptation to OEM tools according to customer requirements is possible.

The Wafer Loader mWL 200 is designed for fully automated loading and unloading of 200mm (8”) standard wafers and e.g. eWLB wafers from cassettes onto a customized chuck. Adaptation to OEM tools according to customer requirements is possible.

The Wafer Loader mWL 300 is designed for fully automated loading and unloading of 300 mm (12”) standard wafers and e.g. eWLB wafers from FOUPs/FOSBs onto a customized chuck. The adaptation to OEM tools according to customer requirements is possible.

Applications • loading / unloading on a chuck• wafer handling automation






Features • optimized footprint• handling of warped wafers• chip side & back side handling• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• handling of warped wafers • Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• handling of warped wafers• standard FOUP or FOSB compliance• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• two Bernoulli vacuum end-effectors 6” and 8”• two top grip end-effectors 6” and 8”• two cassette stations with scanners• one pre-aligner for 6” and 8”• one end-effector change station• one transfer station• end-effector cleaner• GUI

• one single-arm robot• one end-effector• two cassette stations• one mapper• one pre-aligner for 6” and 8” • GUI

• one single-arm robot on linear track• one end-effector• two load ports incl. mapper• one pre-aligner for 8” and 12” • GUI


• wafer flipping function• customized chuck• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

• one pre-aligner for 6” and 8” • customized chuck• table for e.g. Nikon microscope• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

• customized chuck• RFID reader for FOUP / FOSB ID• 200 mm (8”) conversion kit• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)• ionizer

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Economic Inventory and Material Flow ManagementAutomated wafer transfer tools are critical to any wafer fabrication or material handling facility as they eliminate the manual handling of wafers and allow fab operators both to track each wafer throughout the manufacturing process and to completely eliminate any risk of damage and particle contamination. Wafer sorters are essential for economic inventory and material flow management in the modern semiconductor industry.

The mechatronic mWS series represents the latest generation of wafer sorters and sets new standards in safe handling of thin, ultra-thin or warped wafers. Consistent implementation of mechatronic´s modular design concept guarantees full compatibility with the widest variety of wafer carriers.

The mechatronic mWS series of wafer sorting systems can automatically sort, split, merge and transfer wafers from any plastic or metal, transport or process cassette to any other cassette in a multiple carrier station – regardless of the number of cassette slots.

Wafer Sorter mWS 150/200

The Wafer Sorter mWS 150/200 is designed for sorting 150/200 mm (6”/8”) wafers and can be equipped with up to six cassettes. The mWS 150/200 monitors all wafers in the cassette before and during the whole work process and verifies wafer and end-effector compatibility.

The Wafer Sorter mWS 200/300t is designed for sorting 200/300 mm (8”/12”) wafers and can be equipped with up to four cassettes or FOUPs (mixed loading possible). The mWS 200/300t handles wafers out of a cassette / FOUP onto a pre-aligner, forward onto a visual inspection unit and back into a cassette / FOUP

Applications • sorting• splitting• merging

• sorting• splitting• merging

Features • optimized footprint• highest product & operator safety• handling of warped wafers• handling of standard and TAIKO wafers• handling of thin and warped wafers• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• highest product & operator safety• high throughput (up to 201 wafers/h)• handling of standard and TAIKO wafers• handling of thin and warped wafers• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• Bernoulli vacuum end-effectors 6” and 8”• wafer flipping function• up to six cassette stations• two scanners• one pre-aligner• one end-effector change station• one end-effector cleaner• GUI

• one dual-arm robot on linear track• Bernoulli vacuum end-effectors for 8” and 12” • wafer flipping function• up to four load ports for 8” and 12”• up to four cassette adapter plates for 8”• one pre-aligner for 8” and 12”• GUI


• batch end-effectors 6” and 8”• RFID reader for cassette ID• green light visual inspection• OCR reader for wafer ID• ionizer• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)

• RFID reader for FOUP / cassette ID• green light visual inspection• OCR reader for wafer ID• camera for handling area monitoring• ionizer• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)


mWS 200/300t

The Wafer Sorter mWS 150/200 is designed for sorting 150/200 mm (6”/8”) wafers and can be equipped with up to six cassettes. The mWS 150/200 monitors all wafers in the cassette before and during the whole work process and verifies wafer and end-effector compatibility.

The Wafer Sorter mWS 200/300t is designed for sorting 200/300 mm (8”/12”) wafers and can be equipped with up to four cassettes or FOUPs (mixed loading possible). The mWS 200/300t handles wafers out of a cassette / FOUP onto a pre-aligner, forward onto a visual inspection unit and back into a cassette / FOUP

Applications • sorting• splitting• merging

• sorting• splitting• merging

Features • optimized footprint• highest product & operator safety• handling of warped wafers• handling of standard and TAIKO wafers• handling of thin and warped wafers• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

• optimized footprint• highest product & operator safety• high throughput (up to 201 wafers/h)• handling of standard and TAIKO wafers• handling of thin and warped wafers• Cleanroom class ISO class 5 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• Bernoulli vacuum end-effectors 6” and 8”• wafer flipping function• up to six cassette stations• two scanners• one pre-aligner• one end-effector change station• one end-effector cleaner• GUI

• one dual-arm robot on linear track• Bernoulli vacuum end-effectors for 8” and 12” • wafer flipping function• up to four load ports for 8” and 12”• up to four cassette adapter plates for 8”• one pre-aligner for 8” and 12”• GUI


• batch end-effectors 6” and 8”• RFID reader for cassette ID• green light visual inspection• OCR reader for wafer ID• ionizer• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)

• RFID reader for FOUP / cassette ID• green light visual inspection• OCR reader for wafer ID• camera for handling area monitoring• ionizer• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)

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Efficient Wafer LogisticsAutomated wafer transfer tools are critical to any wafer fabrication or material handling facility as they eliminate the manual handling of wafers and allow fab operators both to track each wafer througout the manufacturing process and to completely eliminate any risk of damage and particle contamination. Logistics and information management of the wafer is the key linkage in the complex and highly differentiated value-added processes in the semiconductor industry. Wafer packers are the backbone for this.

The mechatronic mPT series represents the latest generation of wafer packers and sets new standards in safe handling of thin, ultra-thin or warped wafers. Consistent implementation of mechatronic´s modular design concept guarantees full compatibility with the widest variety of wafer carriers including open cassettes, FOUPs, FOSBs and shipping boxes. Sophisticated sensor technology ensures the reliable detection of all different packing material types.

Wafer Packer mPT 150/200

The Packing Tool mPT 150/200 is designed for packing and unpacking of 150/200 mm (6”/8”) wafers by using contactless end-effectors.The mPT 150/200 can be equipped with a green light visual inspection optionally.

The Packing Tool mPT200/300 is designed for packing and unpacking of 200/300 mm (8”/12”) wafers by using Bernoulli vacuum end-effectors.

The Packing Tool mPT200/300f is designed for packing and unpacking of 200/300 mm (8”/12”) wafers on frames by using vacuum end-effectors.

Applications • packing • unpacking

• packing• unpacking


Features • optimized footprint• high throughput• handling of warped wafers• contactless wafer handling• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

• optimized footprint• high throughput• handling of wafer• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

• optimized footprint• high throughput• handling of frames• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• contactless end-effectors 6” and 8” • wafer flipping function• five stations for shipping boxes and packing material• one packing chuck unit• two cassette stations 6” / 8” with scanner• one pre-aligner• GUI

• two 6-axis robots• Bernoulli vacuum end-effectors 8” and 12” • two Load-ports for 8” and 12” • four stations for shipping boxes • four stations for packing material• GUI/operator interface

• two 6-axis robots• customized vacuum end-effectors 8” and 12” • six stations for frame casettes• four stations for shipping boxes • four stations for packing material• GUI/operator interface


• green light visual inspection• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for better cleanroom class• UPS (uninterruptible power supply)• ionizer

• OCR reader for wafer ID• RFID antennas• End-effector change station• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• ionizer

• OCR reader for frame ID• RFID antennas• End-effector change station• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• ionizer


mPT 200/300fmPT 200/300

The Packing Tool mPT 150/200 is designed for packing and unpacking of 150/200 mm (6”/8”) wafers by using contactless end-effectors.The mPT 150/200 can be equipped with a green light visual inspection optionally.

The Packing Tool mPT200/300 is designed for packing and unpacking of 200/300 mm (8”/12”) wafers by using Bernoulli vacuum end-effectors.

The Packing Tool mPT200/300f is designed for packing and unpacking of 200/300 mm (8”/12”) wafers on frames by using vacuum end-effectors.

Applications • packing • unpacking



Features • optimized footprint• high throughput• handling of warped wafers• contactless wafer handling• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

• optimized footprint• high throughput• handling of wafer• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

• optimized footprint• high throughput• handling of frames• Cleanroom class ISO class 6 • CE certificated• SEMI standards compliant

Basic Configuration

• one dual-arm robot• contactless end-effectors 6” and 8” • wafer flipping function• five stations for shipping boxes and packing material• one packing chuck unit• two cassette stations 6” / 8” with scanner• one pre-aligner• GUI

• two 6-axis robots• Bernoulli vacuum end-effectors 8” and 12” • two Load-ports for 8” and 12” • four stations for shipping boxes • four stations for packing material• GUI/operator interface

• two 6-axis robots• customized vacuum end-effectors 8” and 12” • six stations for frame casettes• four stations for shipping boxes • four stations for packing material• GUI/operator interface


• green light visual inspection• OCR reader for wafer ID• SECS/GEM interface• FFU (filter fan unit) for better cleanroom class• UPS (uninterruptible power supply)• ionizer

• OCR reader for wafer ID• RFID antennas• End-effector change station• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• ionizer

• OCR reader for frame ID• RFID antennas• End-effector change station• SECS/GEM interface• FFU (filter fan unit) for higher cleanroom class• ionizer

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Ring Remover Fully Automatic Ring SeparationWafer with a thickness less than 80 micron stabilized after grinding with a ring on the outer perimeter. Before dicing it is necessary to remove the stabilization ring. Using this method lowers the risks of thin wafer handling (breakage, edge chipping) and decreases warpage.

Prior to final processing, wafers must be separated from the ring. The mechatronic Ring Removers Series mRR fully automatically removes the ring.

Ring Remover mRR 200

The Ring Remover mRR 200 enables fully automated handling of film frames and removing pre-cut rings from the laminated wafer 200 mm (8“).


Applications • automated ring removing • automated ring removing

Features • optimized footprint• throughput of up to 80 wafers on film frames per hour • Cleanroom class ISO class 6 • CE certificated• SEMI standard compliant

• optimized footprint• throughput of up to 60 wafers on film frames per hour• cassette placement by OHT or manual • Cleanroom class ISO class 6 • CE certificated• SEMI standard compliant

Basic Configuration

• one dual-arm robot• two frame end-effectors 8”• two cassette ports for 200 mm (8”) wafers on film frames• two ring remover stations 8” • wafer flipping function• GUI

• one dual-arm robot• two frame end-effectors 12” • two cassette ports for 300 mm (12”) wafers on film frames• two ring remover stations 12” • wafer flipping function• robot linear track• GUI


• OCR reader for frame ID• RFID for frame casettes• barcode reader for frame ID• SECS/GEM interface• ionizer• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)

• OCR reader for frame ID• RFID for frame cassette • barcode reader for frame ID• SECS/GEM interface• ionizer• FFU (filter fan unit) for higher cleanroom class• OHT loading• UPS (uninterruptible power supply)


mRR 300



Applications • automated ring removing • automated ring removing

Features • optimized footprint• throughput of up to 80 wafers on film frames per hour • Cleanroom class ISO class 6 • CE certificated• SEMI standard compliant

• optimized footprint• throughput of up to 60 wafers on film frames per hour• cassette placement by OHT or manual • Cleanroom class ISO class 6 • CE certificated• SEMI standard compliant

Basic Configuration

• one dual-arm robot• two frame end-effectors 8”• two cassette ports for 200 mm (8”) wafers on film frames• two ring remover stations 8” • wafer flipping function• GUI

• one dual-arm robot• two frame end-effectors 12” • two cassette ports for 300 mm (12”) wafers on film frames• two ring remover stations 12” • wafer flipping function• robot linear track• GUI


• OCR reader for frame ID• RFID for frame casettes• barcode reader for frame ID• SECS/GEM interface• ionizer• FFU (filter fan unit) for higher cleanroom class• UPS (uninterruptible power supply)

• OCR reader for frame ID• RFID for frame cassette • barcode reader for frame ID• SECS/GEM interface• ionizer• FFU (filter fan unit) for higher cleanroom class• OHT loading• UPS (uninterruptible power supply)

w e c a n h a n d l e i t

11mechatron ic systemtechn ik gmbh

Notes

mechatronic systemtechnik gmbhTiroler Straße 809500 VillachAustria

phone +43 (0) 4242 33 999 – 0fax +43 (0) 4242 33 999 – 10mail [email protected] web www.mechatronic.at

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