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Chip in board encapsulation

Julien Bonis

bonis@lal.in2p3.fr

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Encapsulation

Chip in board PCB FEV7 Chip bonding by CERNWire depth are about 0.3mm from surface

LAL encapsulation Hybrid SA (CH) encapsulation Manual process Industrial process

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LAL encapsulation method : Resin injection

Low viscosity epoxy (Araldite 2020) injected under Teflon cap Cavity for glue excess

Glue Viscosity [CPS]

Araldite 2020 150

Stycast 1265 600

EP30MD 1700

EPO-TEK E4110 1200Sole of the cap

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5mm

1mm

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Hybrid SA (CH) encapsulation method : Glob top (Jetting process)

Resine are spurt on bonding as ink on paper with inkjet printer

• Industrial automatic process • Black resine• Thin but irregular surface

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5mm

1mm

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Shortage of resine :

Hybrid S.A prefere realise themself bonding Present bonding wasn’t optimizise to globtop, too higth .PCB design should be modify to reduce wire length

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Jetting Globtop encapsulation

Disadvantages•Black opaque resin•Irregulare surface•Need fitting

Advantages•Industrial process, automatique and fast.•Subcontractor (bonding and encapsulation in same place)

Injection encapsulation under Téflon cap

Disadvantages•Manual process, need studies for industrialisation•No subcontractor possible•Polymerisation need time

Advantages•Transparent resin : visual bonding control•Flat surface•Sure result