Applied Material Taiwan Tech Forum presentation by TSMC
Transcript of Tsmc Keynote
1. C3 and Wii Philosophy -IC Manufacturing Partnership Enabler
Dr. Chyi S. Chern Manufacturing Technology Center , TSMC
2. Outline C3 in the IC industry Competitiveness Cost
Effectiveness Collaboration and Co-development Wii (Win-Win) in the
Supply Chain Not only Disintegration but also integration Customer
Needs vs Productization Strategy Profitable and Healthy Supply
Chain A new Integrated Partnership Model Summary
3. C3 Philosophy Competitiveness Advanced Technology
Productization and Manufacturing Excellence Customer Partnership
Cost Effectiveness Collaboration and Co-development
4. Moores Law and More Source: 2005 ITRS Moores Law: the
downscaling of minimum dimension enable the integration of an
increasing number of transistors on a chip The integration of CMOS-
and non-CMOS technology within a package will become increasingly
important.
5. Rapid Advancement of CMOS Cu/LK3.0 Lg= 115nm 00 ITRS
Technology Generation (nm) 130 01 ITRS 90 65 05 ITRS TSMC 45
Cu/ELK2.5 06 ITRS Lg= 30nm 32 Cu/XLK2.0 22 Lg= 13nm 00 02 04 06 08
10 12 14 16 ITRS: International Technology Roadmap for
Semiconductors Technology leadership is essential to meet cost,
power, performance, quality and time-to-market requirements of
customers
7. Broadening Beyond CMOS Logic TSMC Technology Offerings 32nm
45nm 65nm 90nm 0.13m 0.15/0.18m 0.25m 0.35m >0.5m Specialty
Embedded Embedded Logic Mixed High CMOS Image Memory Flash DRAM
Signal/RF Voltage Sensor Available Now Development
8. Typical Production Ramp-up Source: 2005 ITRS Production
tools typically need 12 to 24 months to develop prior to ship to
customers. Product qualification may take 12 to 24 months to reduce
D0 to meet volume production scale.
9. Quick Delivery of Technology Solution through New Tool
Design (AMAT) Challenge of STI gap filling Quick solution Vertical
profile, Complete Fill HARP IE No void/ No seam +
10. Fast Development of Advanced Tool Roadmap Standing alone
tools All-in-one solution Clean + WN glue + W plug + SiCoNi ALD W
ALD WN ALR CVD W PNL WN 50% CoO Reduction RPC WCVD 50% Rc Reduction
Ti/TiN Glue
11. Albany NanoTech Center (ANT) Albany NanoTech (ANT) Albany
NanoTech is a fully-integrated research, development, prototyping,
pilot manufacturing and education resource managing a strategic
portfolio of state-of-the-art laboratories, a supercomputer and
shared-user facilities and an array of research centers located at
the University at Albany - SUNY. The Albany NanoTech complex boasts
the only fully integrated 200mm/300mm wafer resource of its kind in
the world for prototyping and integration of nanotechnology
innovations. Its portfolio of programmatic activity ranges from
emerging computer chips with higher functionality and complexity,
to nanosystems based sensor- and system-on-a-chip technologies.
Albany NanoTech works with over 100 companies located worldwide
providing technology development and commercialization support for
pre-competitive and proprietary projects. ANT - Sematech North The
establishment of Sematech North at Albany NanoTech is the first
expansion of Sematech beyond its Austin, Texas headquarters and
research facility since the consortium was founded in 1987. A joint
five-year $320M program is in place to conduct research and
development in the area of advanced lithography infrastructure for
extreme ultraviolet (EUV) lithography. ANT - Tokyo Electron
Technology Center America Tokyo Electron Limiteds (TEL) Albany
R&D facility complements and expands its global research and
development activities, as well as manufacturing capabilities in
Austin, Texas; Phoenix, Arizona; and Boston, Massachusetts. It is
the first research center to be located outside of Japan. In
Albany, TEL performs advanced tool design and prototyping and
access to the facilities has enhanced internal development efforts
shortening the time required to bring critical technology from the
research lab to the production floor. ANT - Center of Excellence in
Nanoelectronics The Center of Excellence in Nanoelectronics at
Albany NanoTech is a fully-integrated technology deployment,
product prototyping, manufacturing support, and workforce training
resource for emerging generations of integrated circuitry (IC). Its
targeted portfolio of nanoelectronics-based products ranges from
emerging microprocessor and memory computer chips with higher
functionality and complexity, to the rapidly evolving areas of
micro- and nanosystem based quot;systems-on-a-chipquot; (SOC)
technologies, including biochips, optoelectronics and photonics
devices, and nanosensors for energy and the environment. ANT -
Center for Advanced Thin Film Technology This
university/industry/State initiative has two objectives: to advance
the productivity, competitiveness and expansion of existing
industries in critical thin film and coating areas of key relevance
to advanced electronics, optoelectronics and photonics and to
support the creation, spin-off and growth of new industries in
these areas. The Center for Advanced Thin Film Technology offers an
array of unique resources for thin film processing, patterning,
characterization and analysis. Primary areas of research include
microelectronics, optoelectronics/photonics, hard coatings and
advanced energy technologies. Research programs include computer
chip interconnects, vapor phase processing, characterization and
modification of materials, materials and plasma, electron
microscope studies of materials, ion beam characterization, and
modifications of materials and x-ray and neutron optics. Resources
include state-of-the-art 8-inch wafer computer fabrication,
patterning and testing facilities; cluster tools for
no-exposure-wafer processing and etching; high-resolution atomic
imaging systems; and a complete array of ion beam, electronic beam,
and x-ray diagnostic and failure analysis equipment.
12. Intimate Customer Partnership Seamless collaboration with
customers for realization of optimal product performance and the
shortest success learning curve Competent FA engineering capability
of devices, circuit layout, IC process , assembly, and testing
Wafer Design Service Manufacturing Product Engineering CP Test
Customer Production window analysis Design Device/circuit
simulation Packaging Statistical analysis Electrical FA Final Test
Physical FA
14. Increasing Fab cost by Technology nodes Source: Garner
07
15. Steep Price Erosion of Consumer Electronics 100 80 ASP
(Arbitrary Unit) Digital Camera Digital TV DVD Players 60 40 20 0
1998 2000 2002 2004 2006 2008 Year Source: iSuppli, tsmc, 2005
17. Tool analysis: tool Productivity Simulator Complex &
Powerful Simulator Wet CEE Log Analyzer WISDOM Development new
methodology for tool productivity improvement The Tool Internal
Motion is not Black Box any more Simple & Faster Tool
Optimization Tool Enhancement Benchmarking New mechanism Chamber
idle New control logic
18. Productivity Breakthrough through DFM Producer GT: Original
Design cant meet Foundrys complex high-mix operation, DFM tool can
improve near 30% idle time. Original Best for Producer GT Producer
SE Production 3rd Chamber Dual Blade Dual LL 4 LPs 30% WPH 90% WPH
improvement improvement COO reduce 20%
19. Fab Scale and Flexibility Scale and flexibility accommodate
the impact of high product Mega mix Mini Regular fab fab fab Mini
Regular Mega Cycle Time Mini fab fab fab Scale (WSPM) ~10K ~25K
~80K fab Scale (WSPM) 1~10K ~25K ~80K CAPEX ($B) 3~4 6 Mega CAPEX
($B) 1 3~4 6 fab Tool Backup Limited Medium Flexible Tool Backup
Limited Medium Flexible Fab Utilization Product Ramp Limited Medium
Agile Product Ramp Limited Medium Agile Mini Operating High Medium
Low fab Cycle Time CostOperating Cost High Medium Low
Infrastructure Limited Medium Vast Infrastructure Limited Medium
Vast Mega Cycle Time Long Medium Short fab Cycle Time Long Medium
Short Delivery Unstable Medium Precise Time Delivery Unstable
Medium Precise
20. C3 Philosophy Competitiveness Cost Effectiveness
Collaboration and Co-development Flexible Collaboration with
Research Institutes DFMs in the Supply Chain Integrated
Partnership
21. Flexible Collaboration with Research Institutes tsmc ITRI
BEOL FEOL MRAM Co-development Low cost Fast read/write speed CMOS
compatible
22. Collaborative Service Partnership Reactive and local
optimization Proactive and global optimization Design for
Manufacturing Market Design EDA Lib/IP Foundry Backend Point Tool
Yield Basic Solution Building Improvement Blocks Design for
Test
24. Accurate Technology Modeling Silicon Modeling- Within Die
Variation As Manufactured Scaling results in tightening of circuit
timing requirements Timing variability reduction is key issue OPC,
CMP, (R,C), dummy insertion models, verified on circuits and
integrated into EDA tools
25. Technology Model Application - CMP Cu thickness variation
reduction during design Design Layout CMP Simulation CMP Cu
Thickness & Hot Spot Display CMP Hot Spot Fix CMP Simulation
CMP Cu Thickness & Hot Spot Display
26. Technology Partnership with Tool Supplier ECP defect
eliminated by partnership with tool supplier. Defect-free Yield
Killing Process Defect Tool Supplier Substrate Hardware Control
Design Failure Analysis, Integration Failure Mechanism Optimization
Foundry
27. Technology Partnership with Material Supplier Cu sheet
resistance uniformity improved by partnership with material
supplier Chemical supplier (arb. Unit) Optimization of 2.0
Chemistry and abrasives 1.5 1.0 Integration Issues and optimization
spec. definition Foundry
28. Customized Interconnect Offerings TSMC offers customized
interconnect to meets the needs of high packing density, high
performance (low-K, low-R), and low cost. Example 45nm BEOL High
Performance Standard Cell e.g. MPU e.g. ASIC, GPU, Mz 2XMetal Mz Mz
USG, k=4.2 10 Min/Max metal layers: 1-2 Mz My Mz 9 Low-k, k=2.9
Min/Max metal layers: 1-2 My Mx 8 My Mx Mx 7 Low-k , k~2.55 Mx Mx 6
Min/Max metal layers: Mx > 1-7 for standard cell Mx 5 > 1-5
for high performance Mx Mx 4 Mx Mx 3 Mx M1 Mx 2 Low-k, k~2.55 M1 1
M1 Min/Max metal layers: 1
29. 3-Way Integrated Technology Partnerships ELK (2nd
generation low-k) realization through the joint efforts of material
and tool suppliers. Tool Supplier ELK ELK Realization Requirement
PECVD E-Beam deposition UV Curing Foundry Integration Optimization
Pore Porogen Inorganic matrix Control of ELK Successful material
and ELK integration Material Supplier mechanical strength
30. Wii (Win-Win) Philosophy Not only Disintegration but also
integration Vertical integration vs Horizontal disintegration
Supply chain transformation behavior Business Position control
through Standardization Customer Needs vs Productization Strategy
Profitable and Healthy Supply Chain
31. Supply Chain Integration or Disintegration - Bi-helix model
by Prof. Charles Fine/MIT standpoint Vertical Horizontal
Integration Industry Disintegration Industry Integrated product
Modulated product Competitors with Technology unique technology
Breakthrough Multi-domain know- Supplier dominates how complexity
the market Look for Look for High profit resulted Organizational
Horizontal vertical from proprietary Rigidity Disintegration
integration system
32. Example of Supply Chain Transformation Behavior - PC
Industry (1/2) Vertical Integrated Computer Industry and integrated
product offering 1975 ~ 1985 IBM DEC Others CPU OS Peripheral
Application Software Network Services HW Integration
33. Example of Supply Chain Transformation Behavior - PC
Industry (2/2) Horizontal Divided Computer industry and modularized
product offering 1985 ~ 1995. Intel Moto AMD Others CPU MS Mac
Linux OS Peripheral HPQ EPSON Seagate Others Application Software
MS Lotus SAP CA HW Integration Dell HPQ IBM Others
34. The Disintegration of Semiconductor Industry IDM/ASIC
System Co. IDM/ASIC IDM/ASIC Fabless Co. Fabless Co. System System
Design System Design Design System System IP Design IC IC Design IC
Design IC Design Design Design IC Design System/IC Design Design
Services Fab Fab Fab Foundry Foundry Assembly & Test Assembly
Contract & Test Assembly Assembly & Test Assembly &
Test & Test 1986 1990 2000
35. Number of equipment companies (generating 80% of total WFE
avenue) Possibilities to provide acceptable ROI for equipment
company Equipment company process development alliances and
mergers. Create joint technology development consortia between
semiconductor manufactures and equipment manufactures.
36. Wii (Win-Win) Philosophy Not only Disintegration but also
integration Customer Needs vs Productization Strategy Design-in for
Tools, Silicon Processing, and IPs Products serves as Exact
solutions to Customers or Customers profitability Products serves
as Best Tools to Customers or Customers profitability Profitable
and Healthy Supply Chain
37. The IC Industry Driver in each Decade 10 Unit/end user 1
Consumer Electronics PC 1/10 Minicomputer 1/100 Mainframe 1970 1980
1990 2000 2010 Year
38. Digital Convergence and Ubiquitous Environment - Create new
phases of needs
39. Apple Digital Music Domain Trilogy - integrated innovative
service model Source: STPI 05 Apple company provides Music
everywhere service through package of iPod + iTunes + peripheral
products to meet consumer needs with enormous value than individual
innovation.
40. Technology Portfolio Required by Broad-based Consumer ICs
High Growth High Volume Digital TV/Set-top Box Cellular Base-Band
Technologies Cellular Application Graphic Processor Advanced
Processor Hard Disk Drive Game Console High End Switch & Router
Wireless LAN High End Printer High Speed SRAM TFT-LCD
Controller/Driver Sensor Regulator Interface Technologies
Mainstream CMOS Image Sensor MCU with Embedded Flash RFID Power
Management PC Peripheral Advanced Tech.: