Status report of test procedures for the readout pixel chips in Catania

F.Riggi

ITS Meeting, June 2002

Summary

•Status of equipment for wafer and single chip testing in Catania

• Recent progresses

• Outlook and future problems

Test system for single chip

MB-card

Power Supply

VME-cratewith pilot and JTAG controller

M-card with chip

Bridge to PC

Wafer probing system

MB-card

Power Supply VME-cratewith pilot and JTAG controller

Bridge to PC

Power Supply

Probe Station with Probe Card

CLEAN ROOM

Equipment in Catania

Semiautomatic Probe Station (K. Suss PA200)

Equipment in Catania

Bonding stations

Equipment in Catania

Electronics

Software for acquisition/analysis

LabView-based programs

Analysis with Root/C++

Training

- 2 persons from Catania have already spent a first training period at CERN (end of 2001) in order to:

- test all the relevant cards to be used- carry out tests on single chips- carry out tests on wafer with probe station- establish a common protocol evaluation

Porting of hardware, software and all that

Hardware: VME, power supplies, bridge, PC Pilot module JTAG controller MB card single chip cards probe-card

Software: LabVieW Specific software for chip testing Simple Analysis programs under ROOT

Everything in place and tested

Recent progresses

Remote and “on-site” check-up of the Catania facilities from the CERN pixel group (special thanks to Petra and Peter for coming):

Identified and addressed several points to be improved in view of mass production Reliability of probe station (software check-up, other tests in progress) Improvement of organization of the clean room and overall procedures Upgrading of the probe station with joystick-controlled motion of the microscope(request to INFN under way) Possible additional training at CERN

Small improvements

Electronics

Small improvements

Rearrangement of items

Typical test results 1

Threshold distribution(Chip #68)

Mean threshold of 18.4 mV

Typical test results 2

Noise Distribution(Chip #68)

Mean noise of 1.8 mV

Typical test results 3

Threshold Map(Chip#68)

Outlook and future problems

• Start first tests on wafer and compare results with reference at CERN• Future: Moving out to the new Department building

Moving out to the new Department building

A new Department building is almost ready in Catania and all services (teaching and research) are expected to move out to this new location.

Time scale for this operation is of the order of several months

Of course several problems can originate

How can this affect our specific task?

Moving out to the new Department building

The present status of the building

Moving out to the new Department building

What about the clean room and related equipment?

Moving out to the new Department building

What about the clean room and related equipment?

• A new and larger (60 m2 ) clean room has been designed and approved

• Tender already started

Moving out to the new Department building

The new clean room

Size of present clean room

Moving out to the new Department building

Important:

Air cleaning and all basic material for the future clean room will be totally new

No need to dismount any equipment from the present clean room until the new one is ready

Conclusions

All facilities necessary for wafer testing in Catania have been tested in place.

Possible new tests and training periods at CERN

A significant improvement of the operations could come from microscope motorization in the near future

First wafer tests could start soon

Problems related to the moving out to new Department are (hopefully) under control, with minimization of inoperative time