Fan-Out Packaging Processes Comparison 2020...©2020 by System Plus Consulting | SP20479 –Fan-Out...

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Fan-Out Packaging Processes Comparison 2020

In-depth technical and cost overview of key Fan-Out process technologies form Infineon, nepes, TSMC, SEMCO and ASE.

SP20479 - PACKAGING report by Stéphane ELISABETHJanuary 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Fan-Out Technlogies 8

o eWLB, inFO, RCP, ePLP, M-series

Device Teardown 22

o Radar, Smartphones & Wearables

o Smartphone Evolution

Market Analysis 35

o Patent Application

o Fan-out Evolution and Drivers

o Fan-out Activity Market Forecast

Physical Analysis 41

o Summary of the Physical Analysis 42

o Automotive market: Infineon’ eWLB vs. nepes/NXP’ RCP for Thermal Dissipation

Infineon RRN7745P vs. NXP MR2001 45

o Package Analysis

Package View & Dimensions

Package Cross-Section

Package Process Analysis

o Wearable market: TSMC’ inFO vs. SEMCO’ ePLP for High I/O density

Apple A12 vs. Samsung Exynos 9110 53

o Consumer market: Amkor’ eWLB vs. ASE/Deca’ M-Series for Side Wall Protection

Qualcomm WCD9335 Vs. Qualcomm PM8150 61

o Consumer & Wearable market: nepes/NXP’ RCP vs. STATS ChipPAC’ eWLB for SiP

NXP SCM-iMX6 Vs. Cypress CY8C68237FM-BLE 69

Manufacturing Process 75

o Global Overview: Thermal Dissipation, High I/O, Side Wall Protection, SiP

o Fan-Out Packaging Process & Fabrication Unit

Cost Analysis 85

o Summary of the cost analysis 86

o Yields Explanation & Hypotheses 89

o Front-End Cost Analysis 90

o MMIC packaging for thermal disspation Cost Analysis 92

RCP and eWLB Packaging Cost

Packaging Cost per Process Step

RCP vs. eWLB Component Cost

o AP packaging for High I/O Cost Analysis 98

o Audio Codec packaging for Side Wall Protection Cost Analysis 104

o Packaging for SiP Cost Analysis 110

Cost Comparison Analysis 116

o Summary of physical and cost analysis

o Board Level Reliability vs. Cost Estimation

Feedbacks 120

SystemPlus Consulting services 122

Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Device Teardown

Market Analysis

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Executive Summary

• Back in 2015, only Outsourced Semiconductor Assembly and Test (OSAT) players were involved in Fan-Out (FO) packaging. In 2016, TSMC led the entry of foundries into this market with its integrated FO (inFO) packaging technology. Next, Integrated Device Manufacturers (IDMs) like Samsung joined the race with new in-house technology at the panel level. The result is that in 2019 OSATs have only a third of the market. Even with this reduced share, they are still developing and enhancing their portfolio in this segment. Recently ASE, in partnership with Deca Technologies, has entered the core market with its M-Series technology. Next, nepes bought the technology from Deca. As the market is continuously moving, System Plus Consulting offers an overview of the technologies on the market, providing the original equipment manufacturers’ (OEMs’) technical and cost choices of fan-out packaging.

• This report provides insights on technology data for FO packaging for different application segments. It includes a comparative study of eight components from power management integrated circuits (PMICs) to processors to radar Monolithic Microwave Integrated Circuits (MMICs) using Fan-Out technology from different suppliers.

• Physical data of several components has been compared in term of process flow, cost and integration to provide a largepanel of OEM technical and economic choices from the market such as:• embedded Wafer Level Ball (eWLB) grid array from Infineon, Amkor and STATSChipPAC• Redistributed Chip Package (RCP) from nepes• M-Series from ASE/Deca Technologies• Integrated Fan-Out (inFO) from TSMC• Enhanced Panel Level Packaging (ePLP) from SEMCO

• The report includes a description of each process flow for the five major fan-out technologies on the market. It also contains a complete cost analysis of the packaging and tries to explain OEM choices.

Overview / Introduction

Device Teardown o Denso DNMWR009o Continental ARS4-Ao Apple Watch Series 4o Samsung Galaxy Watch

o Samsung Galaxy S10 5Go Samsung Galaxy S7 Edgeo FitBit Charge 3o Smartphone Evolution

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Denso DNMWR009 – 77 GHz Radar

• The radar features two receiver, one transmitter and one power amplifier MMIC.

• These four component are all packaged using eWLB technology.

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Fan-Out Packaging Technology – Smartphones Evolution

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Fan-Out Packaging Technology – Smartphones Evolution – 2019

Device Teardown

Market Analysis

Physical Analysis o Summaryo Thermal Dissipation

o Views & Dimensionso Overview and Cross-Sectiono Structure

o High I/Oo Views & Dimensionso Overview and Cross-Sectiono Structure

o Side Wall Protectiono Views & Dimensionso Overview and Cross-Sectiono Structure

o SiPo Views & Dimensionso Overview and Cross-Sectiono Structure

Cost Analysis

Cost Comparison

FeedbacksRelated ReportsAbout System Plus

Summary of the Physical Analysis

Device Teardown

Market Analysis

Cost Analysis

Cost Comparison

Package View & Dimensions

Device Teardown

Market Analysis

Cost Analysis

Cost Comparison

Package Overview

• Min. L/S: XX / XX µm

• Min. Line Pitch: XX µm

• Min. Line to Pad: XX µm

• Pad Dimensions: Ø XX µm (Outer)Ø XX µm (Inner).

• BGA Pad Dimensions: Ø XX µm (Outer)

XX µm

XX µm XX µm

Device Teardown

Market Analysis

Cost Analysis

Cost Comparison

Package Cross-Section

Device Teardown

Market Analysis

Cost Analysis

Cost Comparison

Process Structure

Device Teardown

Market Analysis

Physical Analysis

Manufacturing Process Flowo Global Overviewo Front-End Processo Packaging process flow

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Amkor’s eWLB vs. ASE’s M-series Packaging Process

Device Teardown

Market Analysis

Physical Analysis

Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Front-End Costo Thermal Dissipation Packaging

Costo High I/O Packaging Costo Side Wall Protection Packaging

Costo SiP Packaging Cost

Cost Comparison

Feedbacks

Related Reports

About System Plus

eWLB Packaging Cost

Device Teardown

Market Analysis

Physical Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

inFO vs. ePLP Packaging Cost per process steps (1/2)

Device Teardown

Market Analysis

Physical Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

eWLB vs. M-Series Packaging Cost per process steps (2/2)

Device Teardown

Market Analysis

Physical Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Component Cost

Device Teardown

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparisono Summary of Physical and Costo Board Level Reliability

Estimation vs. Cost

Feedbacks

Related Reports

About System Plus

Summary of Cost Analysis

Device Teardown

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• Fan-Out Packaging: Technologies and Market Trends 2019• Equipment and Materials for Fan-Out Packaging 2019• Status of the Advanced Packaging Industry 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

ADVANCED PACKAGING• ASE/Deca M-Series Fan-Out Process• Advanced packaging technology in the Apple Watch

Series 4’s System-in-Package• Samsung Exynos 9110 with ePLP: First Generation of

Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

SystemPlusConsultingSERVI CES

Device Teardown

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings

Device Teardown

Market Analysis

Physical Analysis

Cost Analysis

Cost Comparison

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr

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www.systemplus.fr

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Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 chris.youman@yole.fr

Fan-Out Packaging Processes Comparison 2020...©2020 by System Plus Consulting | SP20479 –Fan-Out...

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Transcript of Fan-Out Packaging Processes Comparison 2020...©2020 by System Plus Consulting | SP20479 –Fan-Out...

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