Datacon 8800 CHAMEOadvanced - Besi · PDF fileDatacon 8800 CHAMEOadvanced Highest Productivity...
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Datacon 8800 CHAMEO advanced Highest Productivity for FO-WLP As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to adress increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any FO-WLP packaging process, supporting both face- down (flip mode) and face-up (non flip mode) package designs. Highlights Future Proof Equipment • Extra Speed +40% • enhanced accuracy 5 μm / 3 μm @ 3s • 300 mm / 340 mm FO-WLP Carrier • Face-down & face-up (recipe-controlled) • Clean class ISO 5, FOUP load port, Tape & Reel FACE UP/DOWN ADVANCED ACCURACY ADVANCED OPTIONS EXTRA SPEED DUAL PICK & PLACE HIGHEST RELIABILITY FLEXIBILITY www.besi.com 3
Transcript of Datacon 8800 CHAMEOadvanced - Besi · PDF fileDatacon 8800 CHAMEOadvanced Highest Productivity...
Datacon 8800 CHAMEOadvanced
Highest Productivity for FO-WLP
As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to adress increasing demands for performance, form factor, and warpage control.
The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any FO-WLP packaging process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.
Highlights
Future Proof Equipment
• Extra Speed +40%• enhanced accuracy 5 μm / 3 μm @ 3s• 300 mm / 340 mm FO-WLP Carrier• Face-down & face-up (recipe-controlled)• Clean class ISO 5, FOUP load port, Tape & Reel
Flip Chip
Inspec
tion
M
CMAcc
uracy
WL-FOBWL-FOB SiPSiP
eWLB
Consumer
AutomotiveM
obile
Computing
Electronics
FACE UP/DOWN
ADVANCEDACCURACY
ADVANCED OPTIONS
EXTRASPEED
DUAL PICK & PLACE
HIGHEST RELIABILITY
FLEXIBILITY
www.besi.com
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Extra Speed +40% - Improved CoO• Based on 4 Mpix 6 x 6 mm FOV cameras• Based on improved vision hardware & software• Based on optimized movements
Face-up / Face-Down• NEW Face-up option from wafer and / or T&R• Recipe controlled, quick change-over • Multi chip capability
Advanced Accuracy• 5 µm @ 3s global accuracy• 3 µm @ 3s local accuracy• APO Automatic Placement Optimization
New Process Options• Clean class ISO 5 (US class 100)• FOUP load port• Tape & Reel handling
FeatureDatacon 8800
FC QUANTUMsigma
Datacon 8800CHAMEOplus Datacon 8800 CHAMEOadvanced
Local accuracy 5 µm @ 3s 6 µm @ 3s 3 µm @ 3s
Global accuracy - 10 µm @ 3s 5 µm @ 3s
Vision system 2 Mpix, 12 x 12 mm FOV 1 Mpix, 4 x 3 mm FOV 4 MPix, 6 x 6 mm FOV
Strips, Boats, Panels 200 mm 340 mm 340 mm
C2W 8” 12” 12”
Fluxer opt. opt.
Multi Chip -
UPH (dipping process) 6000 3500 6000
UPH (FO-WLP/ no dipping) - 5000 7000
Clean Class ISO 6 ISO 5 (opt.) ISO 5 (opt.)
Face-down
Face-up - - opt.
Tape & Reel (roadmap) - opt.
FOUP load port - - opt.
Temperature - opt. (constant) opt. (constant)
Capability Integrity enhanced standard basics + options enhanced standard
Pre-Heat Station - opt. opt.
Local Reflow - - -
Lead Time 4 weeks 12 weeks 8-10 weeks
New!
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www.besi.com - [email protected]
