Die Attach FilmDie Attach FilmINNOSEM WL SeriesINNOSEM WL Series

January. 2012January. 2012

R&D CenterR&D Center-- PKG materials 1team PKG materials 1team --

목 차

▣ Activities of INNOX DAF

▣ Structure of INNOX DAF

▣ Product Code Description

▣ DAF Product Line-up

▣ General Properties of WL Series

▣ Recommend Condition of DAF

▣ Evaluation of DAF

▣ Appendix. Appendix.

1. PKG Description

2. Process Condition

3. Workability & Reliability

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Customer Model Application PKG Reliability

MSL L1

MSL L2a

MSL L1

MSL L2aH社 WL -03D

End-customer

S社(PKG) uSD&SD PKG Qualified S社

A社LGA PKG Qualified

BGA PKG Qualified

B社

K社

W社 MCP PKG Qualified Taiwan customer

Se社TSOP PKG Qualified

FBGA PKG QualifiedH社 外

B社(Card)

WL -02DS

(WL -05A)

uSD&SD, UFD Qualified L社

DDP PKG Qualified

DDP/ODP PKG Qualified

Ha社WL -02DS

(WL -05A)TSOP PKG Under Eval’

A社

(Non-filler type)

H社

■ Customer List _ Domestic

▣ Activities of INNOX DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Customer Model Application PKG Reliability

MSL L2a

End-customer

S社(TWN)

uSD/SD Card QualifiedTFBGA Qualified TSOP QualifiedLGA Under Eval’

S社/Sa社Sa社Sa社M社

O社(TWN)uSD/SD Card QualifiedTFBGA Qualified LGA Under Eval’

S社/Sa社Sa社

K社(TWN)MCP PKG QualifieduSD/BGA Under Eval’

Sd社(TWN) uSD Card Qualified Sa社

E社(CHN)

WL -02DS

(WL -05A)

uSD/SD Card Qualified Sa社

P社(TWN) uSD/TFBGA Under Eval’ T社/E社

Sa社(CHN) uSD/LGA/BGA/MCP Under Eval’

A社(TWN) FBGA/aQFN Under Eval’

C社(CHN) uSD/LGA/BGA/MCP Under Eval’

WL -02DS

(WL -05A)

I社

▣ Activities of INNOX DAF

■ Customer List _ Overseas

World Best INNOXVISION 2015

ConfidentialR&D CENTER

WL SeriesItems Material

WL0010 WL0020 WL0025 WL0040

Cover Film PET Film 36㎛

Die Attach Film Epoxy Composite 10㎛ 20㎛ 25㎛ 40㎛

PSA UV Adhesive 10㎛Dicing Film

Base Film PO Film 100㎛

▣ Structure of INNOX DAF

Cross-sectionPrecut shape

A

B

Cover film

Adhesive Layer

PSA

Base filmDicing film

Precut dimension

A B C

8” 220±1mm 279±5mm 290±2mm

12” 320±1mm 378±5mm 390±2mm

C

World Best INNOXVISION 2015

ConfidentialR&D CENTER

INNOSEM WL 0 020 02DS

Revision No.

Die Attach Film Thickness(㎛)

Base Film Thickness(mil)

WL : Wafer Backside Lamination Film

PW : Penetration WBL

Products Name

▣ Product Code Description

World Best INNOXVISION 2015

ConfidentialR&D CENTER

INNOX H社Item Unit

WL -02DS FH-9211S

Test Method

Cover Film ㎛ 36 38

Die Attach Film ㎛ 20 20Dimension ThicknessMicro-Gauge

Dicing Film ㎛ 110 110

Glass Transition Temperature (Tg) ℃ 208 197 DMA

α1 ( < Tg ) ppm /℃ 86.8 89.2CTE

α2 ( > Tg ) ppm /℃ 213.6 215.2TMA

35℃(Before Cure) MPa 36.67 36.73

ThermalProperties

Elastic Modulus 250℃(After Cure) Mpa 8.59 4.93

DMA

Before UV 1.20 1.80Peel Strength between DAF and

Dicing FilmAdhesiveProperties

N/25㎜After UV 0.14 0.10

Adhesion Strength of DAF N/m 840 1150

UTM

Dwell time (@150℃) Min. 120 30

Die Shear Strength kgf > 10.0 > 10.0

Moisture Absorption % < 0.5 < 0.5Others

Work Life (at room temp.) Day < 90 -

INNOXMethod

▣ General Properties of WL Series

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Process Item Unit Recommend Condition

Temp ℃ 65~70Wafer Mount

Temp ℃ 125~150D/A Cure

Time

Pressure N/㎠ 10~15

Blade Rotation rpm 40~45K

Feed Speed ㎜/sec 30~80Sawing

Blade height ㎛ 70~80

Center Wave Length ㎚ 365

Illumination mw/㎠ 60~80UV Cure

Light Amount mj/㎠ 200

Temp ℃ 120~150

Time sec 0.5~2.0D/A

Pressure Kgf 1.0~2.0

min 30~60

Wire Bond Temp ℃ 120~175

EMC Mold User Condition

Temp ℃ 175~180Cure

Time min 60~120

▣ Recommend Condition of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Wafer Mount Dicing Pick up

Blade Rotation :

40,000~45,000rpm

Feed Speed : 30~80㎜/sec

Blade Height : 70㎛

Temp. : 65~70℃

UV Cure

UV Radiation :

150~200mj/㎠

1st Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

2nd Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

BT Substrate

UV Dicing

DAF

Wafer

▶▶ Application of Application of 4Die Stack

3rd Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

World Best INNOXVISION 2015

ConfidentialR&D CENTER

4th Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

▶▶ Application of Application of 4Die Stack

Wire Bonding

Temp. : 120~150℃

Die Attach Cure

Temp. : 125℃

Time : 30min

Mode : Ramp up 30min

Molding

Temp. : 175~180℃

Time : 60~120min

Mode : Ramp up 30min

Cure

User Condition

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Package Description(unit : ㎜)

ID Items Dimension

ASubstrate Thickness

0.19㎜

B Mold clearance 0.43㎜

C1~C4 Film Thickness 20+/-3㎛

D Die Thickness 0.070㎜

Assembly BOM set

Item Supplier Model

Substrate L Co. ADS37312-002

Film Adhesive INNOX WL0020-02DS

Gold Wire H Co. 0.8mil Pd Alloy(US-U Type)

Mold Compound C Co. SG-8300BA(14pi * 5.8g)

1. PKG Description

C1A

C2

DC3

C4

B

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

ParameterItems Unit

Nand Controller

Machine - YAMAHA YV100XT

Lamination Temp. ℃ 67 67

Lamination Pressure MPa 0.5 0.5

Lamination Speed mm/sec 17 17

Wafer Thickness ㎛ 70 200

Items UnitParameter

Nand Controller

Machine - DISCO DFD-6361

Die Size ㎜ 12.530 x 13.590 2.425 x 4.782

Blade Type - ZH05 CD / ZH05 BB 27HDCD / 27HCBC

Blade Height ㎛ 160 / 70 200 / 70

Rotation Speed RPM 40K / 50K 40K / 45K

Feed Speed ㎜/sec 40 40

2-1. Wafer Lamination Condition

2-2. Sawing Condition

2. Process Condition

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

ParameterItems Unit

Nand Controller

Machine - Shinkawa SPA-300

Die Size ㎜ 12.530 x 13.590 2.425 x 4.782

Die Thickness ㎛ 70 200

Quantity of Pin EA 13 2

Pick-up Time [msec.] 200 200

Pin Height ㎛ 350 200

Wafer Expanding ㎜ 4.0 4.0

Items Unit Parameter

Lamp Type - High Pressure Mercury Lamp

Illumination mw/㎠ 80

Light Amount mj/㎠ 200

2-3. UV Cure Condition

2-4. Pick-up Condition

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

ParameterItems Unit

Nand Controller

Machine - Shinkawa SPA-300

Temperature ℃ 120 135

Bond Force gf 500~1000 400

Bond Time msec. 1000 500

2-5. Die Attach Condition

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Sawing Result (Nand)

3-1. Workability of WL0020

3. Workability & Reliability

Rotation Speed Feed Speed Wafer Sawing Line Base Film Sawing Line

45k rpm 40㎜/s

Pick up Result (Nand)

Pin Height Pick-up missPick-up Quantity

Sub Parameter

300㎛ 0 1500ea

Wafer Expanding : 4.0㎜

Pin Quantity : 13ea

Pick up Force : 70gf

Pick up Time : 200㎳

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

3-2. Reliability of WL0020

(1) MRT L2 : Pass

Reliability Condition of WL0020

Item MRT(85℃/60%RH, 168hr)

WL0020 Level 2 Pass (0/190ea)

▣ Evaluation of DAF

World Best INNOXVISION 2015

ConfidentialR&D CENTER

▣ Appendix 1. Appendix 1. Storage Condition

Items Specification

Shelf Life Before openingBelow 5℃ / 1 year

RT / 3 month

Aging condition RT / 4hr

After wafer mount RT / 60 daysWorking

ConditionAfter UV Irradiation RT / 60 days

It is recommended that UV cure should be proceeded within 60days from wafer

mount process.

After UV Irradiation, pick up process should be finished within 60days

World Best INNOXVISION 2015

ConfidentialR&D CENTER

1. Test Purpose

- Checking Void after Mold by Stage Hold Time / Temperature

2. Test Item

1. Mold testing by Stage Hold Time / Temperature

- 30, 60, 90, 120min / 150℃

3. Test Condition

` Die Attach Stage Hold Mold PMC & MRT

30min

60min

90min

Reliability(Dwell Time)

Process

130℃

Roll Lamination150℃

190℃

120sec,

50kgf

PMC : 180℃ 120min

(Rising 30min)

MRT : 115℃ Boiling

120min

Solder 260℃

30sec 120min

BT Sub.

GlassAdhesive

[ Sample Structure ]

4. Test Result

30min 60min 90min 120min

WL0020-02DS Vanish Vanish Vanish Vanish

FH-9211S Vanish Trap Trap Trap

▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Sub attach Stage hold Mold PMC MRT Result

150℃

30minVanish

150℃

60minVanish

150℃

90minVanish

02DS

150℃

120minVanish

(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))

▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Sub attach Stage hold Mold PMC MRT Result

150℃

30minVanish

150℃

60minTrap

150℃

90minTrap

FH-9211S

150℃

120minTrap

▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)

(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))

Thank youThank youThank you