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Die Attach FilmDie Attach FilmINNOSEM WL SeriesINNOSEM WL Series

January. 2012January. 2012

R&D CenterR&D Center-- PKG materials 1team PKG materials 1team --

목 차

▣ Activities of INNOX DAF

▣ Structure of INNOX DAF

▣ Product Code Description

▣ DAF Product Line-up

▣ General Properties of WL Series

▣ Recommend Condition of DAF

▣ Evaluation of DAF

▣ Appendix. Appendix.

1. PKG Description

2. Process Condition

3. Workability & Reliability

World Best INNOXVISION 2015

ConfidentialR&D CENTER

Customer Model Application PKG Reliability

MSL L1

MSL L2a

MSL L1

MSL L2aH社 WL -03D

End-customer

S社(PKG) uSD&SD PKG Qualified S社

A社LGA PKG Qualified

BGA PKG Qualified

B社

K社

W社 MCP PKG Qualified Taiwan customer

Se社TSOP PKG Qualified

FBGA PKG QualifiedH社外

B社(Card)

WL -02DS

(WL -05A)

uSD&SD, UFD Qualified L社

DDP PKG Qualified

DDP/ODP PKG Qualified

Ha社WL -02DS

(WL -05A)TSOP PKG Under Eval’

A社

(Non-filler type)

H社

■ Customer List _ Domestic




Customer Model Application PKG Reliability

MSL L2a

End-customer

S社(TWN)

uSD/SD Card QualifiedTFBGA Qualified TSOP QualifiedLGA Under Eval’

S社/Sa社Sa社Sa社M社

O社(TWN)uSD/SD Card QualifiedTFBGA Qualified LGA Under Eval’

S社/Sa社Sa社

K社(TWN)MCP PKG QualifieduSD/BGA Under Eval’

Sd社(TWN) uSD Card Qualified Sa社

E社(CHN)

WL -02DS

(WL -05A)

uSD/SD Card Qualified Sa社

P社(TWN) uSD/TFBGA Under Eval’ T社/E社

Sa社(CHN) uSD/LGA/BGA/MCP Under Eval’

A社(TWN) FBGA/aQFN Under Eval’

C社(CHN) uSD/LGA/BGA/MCP Under Eval’

WL -02DS

(WL -05A)

I社


■ Customer List _ Overseas



WL SeriesItems Material

WL0010 WL0020 WL0025 WL0040

Cover Film PET Film 36㎛

Die Attach Film Epoxy Composite 10㎛ 20㎛ 25㎛ 40㎛

PSA UV Adhesive 10㎛Dicing Film

Base Film PO Film 100㎛

▣ Structure of INNOX DAF

Cross-sectionPrecut shape

A

B

Cover film

Adhesive Layer

PSA

Base filmDicing film

Precut dimension

A B C

8” 220±1mm 279±5mm 290±2mm

12” 320±1mm 378±5mm 390±2mm

C



INNOSEM WL 0 020 02DS

Revision No.

Die Attach Film Thickness(㎛)

Base Film Thickness(mil)

WL : Wafer Backside Lamination Film

PW : Penetration WBL

Products Name

▣ Product Code Description



INNOX H社Item Unit

WL -02DS FH-9211S

Test Method

Cover Film ㎛ 36 38

Die Attach Film ㎛ 20 20Dimension ThicknessMicro-Gauge

Dicing Film ㎛ 110 110

Glass Transition Temperature (Tg) ℃ 208 197 DMA

α1 ( < Tg ) ppm /℃ 86.8 89.2CTE

α2 ( > Tg ) ppm /℃ 213.6 215.2TMA

35℃(Before Cure) MPa 36.67 36.73

ThermalProperties

Elastic Modulus 250℃(After Cure) Mpa 8.59 4.93

DMA

Before UV 1.20 1.80Peel Strength between DAF and

Dicing FilmAdhesiveProperties

N/25㎜After UV 0.14 0.10

Adhesion Strength of DAF N/m 840 1150

UTM

Dwell time (@150℃) Min. 120 30

Die Shear Strength kgf > 10.0 > 10.0

Moisture Absorption % < 0.5 < 0.5Others

Work Life (at room temp.) Day < 90 -

INNOXMethod

▣ General Properties of WL Series



Process Item Unit Recommend Condition

Temp ℃ 65~70Wafer Mount

Temp ℃ 125~150D/A Cure

Time

Pressure N/㎠ 10~15

Blade Rotation rpm 40~45K

Feed Speed ㎜/sec 30~80Sawing

Blade height ㎛ 70~80

Center Wave Length ㎚ 365

Illumination mw/㎠ 60~80UV Cure

Light Amount mj/㎠ 200

Temp ℃ 120~150

Time sec 0.5~2.0D/A

Pressure Kgf 1.0~2.0

min 30~60

Wire Bond Temp ℃ 120~175

EMC Mold User Condition

Temp ℃ 175~180Cure

Time min 60~120

▣ Recommend Condition of DAF



Wafer Mount Dicing Pick up

Blade Rotation :

40,000~45,000rpm

Feed Speed : 30~80㎜/sec

Blade Height : 70㎛

Temp. : 65~70℃

UV Cure

UV Radiation :

150~200mj/㎠

1st Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

2nd Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

BT Substrate

UV Dicing

DAF

Wafer

▶▶ Application of Application of 4Die Stack

3rd Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf



4th Die Attach

Temp. : 120~150℃

Time : 0.5~2.0sec

Press : 1.0~2.0kgf

▶▶ Application of Application of 4Die Stack

Wire Bonding

Temp. : 120~150℃

Die Attach Cure

Temp. : 125℃

Time : 30min

Mode : Ramp up 30min

Molding

Temp. : 175~180℃

Time : 60~120min

Mode : Ramp up 30min

Cure

User Condition



Package Description(unit : ㎜)

ID Items Dimension

ASubstrate Thickness

0.19㎜

B Mold clearance 0.43㎜

C1~C4 Film Thickness 20+/-3㎛

D Die Thickness 0.070㎜

Assembly BOM set

Item Supplier Model

Substrate L Co. ADS37312-002

Film Adhesive INNOX WL0020-02DS

Gold Wire H Co. 0.8mil Pd Alloy(US-U Type)

Mold Compound C Co. SG-8300BA(14pi * 5.8g)

1. PKG Description

C1A

C2

DC3

C4

B




ParameterItems Unit

Nand Controller

Machine - YAMAHA YV100XT

Lamination Temp. ℃ 67 67

Lamination Pressure MPa 0.5 0.5

Lamination Speed mm/sec 17 17

Wafer Thickness ㎛ 70 200

Items UnitParameter

Nand Controller

Machine - DISCO DFD-6361

Die Size ㎜ 12.530 x 13.590 2.425 x 4.782

Blade Type - ZH05 CD / ZH05 BB 27HDCD / 27HCBC

Blade Height ㎛ 160 / 70 200 / 70

Rotation Speed RPM 40K / 50K 40K / 45K

Feed Speed ㎜/sec 40 40

2-1. Wafer Lamination Condition

2-2. Sawing Condition

2. Process Condition




ParameterItems Unit

Nand Controller

Machine - Shinkawa SPA-300

Die Size ㎜ 12.530 x 13.590 2.425 x 4.782

Die Thickness ㎛ 70 200

Quantity of Pin EA 13 2

Pick-up Time [msec.] 200 200

Pin Height ㎛ 350 200

Wafer Expanding ㎜ 4.0 4.0

Items Unit Parameter

Lamp Type - High Pressure Mercury Lamp

Illumination mw/㎠ 80

Light Amount mj/㎠ 200

2-3. UV Cure Condition

2-4. Pick-up Condition




ParameterItems Unit

Nand Controller

Machine - Shinkawa SPA-300

Temperature ℃ 120 135

Bond Force gf 500~1000 400

Bond Time msec. 1000 500

2-5. Die Attach Condition




Sawing Result (Nand)

3-1. Workability of WL0020

3. Workability & Reliability

Rotation Speed Feed Speed Wafer Sawing Line Base Film Sawing Line

45k rpm 40㎜/s

Pick up Result (Nand)

Pin Height Pick-up missPick-up Quantity

Sub Parameter

300㎛ 0 1500ea

Wafer Expanding : 4.0㎜

Pin Quantity : 13ea

Pick up Force : 70gf

Pick up Time : 200㎳




3-2. Reliability of WL0020

(1) MRT L2 : Pass

Reliability Condition of WL0020

Item MRT(85℃/60%RH, 168hr)

WL0020 Level 2 Pass (0/190ea)




▣ Appendix 1. Appendix 1. Storage Condition

Items Specification

Shelf Life Before openingBelow 5℃ / 1 year

RT / 3 month

Aging condition RT / 4hr

After wafer mount RT / 60 daysWorking

ConditionAfter UV Irradiation RT / 60 days

It is recommended that UV cure should be proceeded within 60days from wafer

mount process.

After UV Irradiation, pick up process should be finished within 60days



1. Test Purpose

- Checking Void after Mold by Stage Hold Time / Temperature

2. Test Item

1. Mold testing by Stage Hold Time / Temperature

- 30, 60, 90, 120min / 150℃

3. Test Condition

` Die Attach Stage Hold Mold PMC & MRT

30min

60min

90min

Reliability(Dwell Time)

Process

130℃

Roll Lamination150℃

190℃

120sec,

50kgf

PMC : 180℃ 120min

(Rising 30min)

MRT : 115℃ Boiling

120min

Solder 260℃

30sec 120min

BT Sub.

GlassAdhesive

[ Sample Structure ]

4. Test Result

30min 60min 90min 120min

WL0020-02DS Vanish Vanish Vanish Vanish

FH-9211S Vanish Trap Trap Trap

▣ Appendix 2.Appendix 2. Dwell Time (Void Vanish)



Sub attach Stage hold Mold PMC MRT Result

150℃

30minVanish

150℃

60minVanish

150℃

90minVanish

02DS

150℃

120minVanish

(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))




Sub attach Stage hold Mold PMC MRT Result

150℃

30minVanish

150℃

60minTrap

150℃

90minTrap

FH-9211S

150℃

120minTrap


(stage hold 150℃ ; 30,60,90,120min)(stage hold (stage hold 150150℃℃ ; ; 30,60,90,120min30,60,90,120min))

Thank youThank youThank you

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