Bosch Sensortec BMA355 3-Axis MEMS Accelerometer teardown reverse costing report by published Yole Developpement
MICRO-BUMP ASSIGNMENT FOR 3D ICS USING ORDER RELATION TA-YU KUAN, YI-CHUN CHANG, TAI-CHEN CHEN DEPARTMENT OF ELECTRICAL ENGINEERING, NATIONAL CENTRAL UNIVERSITY,
NEMS
Nano Electronic Mechanical Systems
Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, and Sung Kyu Lim School of Electrical and Computer Engineering, Georgia Institute of Technology National.
The TSV Revolution and Fermilab’s MPW Run Experiences R. Yarema Fermilab TIPP 2011, Chicago June 8-13.
TSV-Aware Analytical Placement for 3D IC Designs Meng-Kai Hsu, Yao-Wen Chang, and Valerity Balabanov GIEE and EE department of NTU DAC 2011.
onchip sensors
The Via Revolution
THIRD GENERATION IMAGE SENSORS: OPPORTUNITIES AND CHALLENGES Orit Skorka and Dileepan Joseph University of Alberta Edmonton, AB, Canada Electrochemical.
Through Silicon Vias EECS713 Daniel Herr. Why Through Silicon Vias (TSVs)? Demand for Faster, Smaller Chips Allows for Higher Density 3D chips Higher.
MEPTEC Report Spring 2010
