Rippard_KITP
Microwave Engg- Passive Devices
The Influence of RF Substrate Materials on Passive Intermodulation (PIM)
FR2_T04_1_PAU_INTA_MicroSat_A_Camps.pdf
2012_11_Taconic PIM_english
Slide 19/3/2002 S. Xie, V. Paidi, R. Coffie, S. Keller, S. Heikman, A. Chini, U. Mishra, S. Long, M. Rodwell Department of Electrical and Computer Engineering,
Slide 1 V. Paidi Department of Electrical and Computer Engineering, University of California, Santa Barbara High Frequency Power Amplifiers.
