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4 December 2002, ITRS 2002 Update Conference 2002 ITRS Factory Integration ITWG Michio Honma, NEC Jeff Pettinato, Intel.
2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test.
Evaluating interventions to end VAW: Challenges and opportunities Mary Ellsberg, PhD IGWG Technical Update Promising Practices in Monitoring and Evaluation.
Elevation of Privilege The easy way to threat model Adam Shostack Microsoft.
Thin ply technology advantages An overview of the TPT-TECA project Joel Cugnoni, Robin Amacher, John Botsis Laboratory of applied mechanics and reliability.
Thin ply composites: Experimental characterization and modeling ICCM19 Montréal 2013 In partnership with North-TPT, FHNW, RUAG Technology, RUAG space,
© November, 2001 LeBlond and Associates, LLC Overview of a Training Program Produced by LeBlond & Associates, LLC Thanks for taking the time to view this.
