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The Chip Insider ® April 3, 2014 Equipment & Emerging Markets
Applied Materials ENDURA: Over 20 Years of Metallization Leadership
• Introduced in April 1990
• Aggressive Marketing around The World
• Endura is the Most Successful Platform
• Revenues exceed $20B
• Extension from PVD to CVD/ALD
• Complex Process Integrations
• Success Endures
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ENDURA Introduced in April 1990
• First staged vacuum architecture
• First ultra-high vacuum (10-9 torr)
production system
– Electromigration reduced by factor of nine
• Continuous vacuum between processes
– Five stage vacuum with high integrity
• Most complex platform to demonstrate
>90% uptime
– First platform to use magnetically coupled
vacuum robots
– Single central block of aluminum
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Aggressive Marketing around The World
4/3/2014 3
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Sales Soared and Share went Vertical
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Applied Materials’ Endura Over 20 years of metallization leadership
• Undisputed leader across 3 decades
• Expansion of applications and films
• Original Endura specs included
integration of processes: – CVD, WCVD
– RTP
– Etch & Cleaning
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ENDURA is the most successful platform The longest running major platform
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Standard PVD
Collimation &
Long Throw
IMP
SIP & EnCoRe
RF PVD
1st Gen Ionized PVD 2nd Gen Ionized PVD 3rd Gen Ionized PVD
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Endura’s brought in more than $20B
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Endura’s Extension from PVD to CVD/ALD
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Blanket PVD Films PVD for Film Coverage
20 Years of CVD/ALD
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Over 100 Processes Drive the Revenues
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More Than PVD
Endura is driven by:
• Device performance and yield solutions
• Precision Materials Engineering leadership
Key technologies available:
• PVD
• CVD
– Thermal & Plasma Enhanced
• ALD
– Thermal & Plasma Enhanced
• Chemical Cleans
4/3/2014 10
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Complex Process Integration Enables Challenging HVM applications
Flexibility:
• To meet demanding integration requirements – Results in both performance and cost benefits
System reliability:
• Enabled up to 7 integrated process steps – In high volume manufacturing for multiple nodes
Metal Gate:
• Integrated PVD, CVD, and ALD technologies that
have enabled the first generation of metal gate in
high volume production
• ALD deposition for conformal films
• RF PVD deposition for low damage high purity
PVD metal
• Integrated PVD or CVD wetting layers and
CVD/PVD Al Fill
4/3/2014 11
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Endura Platform – Success Endures Continuous Refinement • Capability upgrades for manufacturing at 22nm node
and below
• Improvements for defect reduction and backside
metal contamination
– Minimum contact wafer transfer blades / electrostatic discharge
control
– Engineered lift pins and minimum contact points
– Electrostatic chuck and pedestal contact points
– High performance coatings on components
– Coordinate system and chamber moves with optimized motion
profiles
– Advanced slit door materials with specialized movements to
minimize defect creation
– Optimized gas flow patterns, specialized diffusers and pressure
equalization routines
• Defect performance at 40nm defect size
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