COMPLETE TEARDOWN

WITH:

• Detailed photos

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• Comparison between InvenSense’s previous custom IMUs in the iPhone 7, in the iPhone 6S and the ICM-30630 device

InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

Title: InvenSense ICM-

20789 – 7-Axis Combo

Pages: 175

Date: October 2017

Format: PDF & Excel file

Price: Full report:

EUR 3,490

World’s first ‘7-Axis’ motion tracking device targeting drone applications

together a 6-axis IMU and a pressure sensor, moving it into droneapplications.

The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axisdevice, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and abarometric pressure sensor previously developed by Sensirion in the samepackage. Compared with the stand-alone sensor hub, this approach eliminatesa package and minimizes board area requirements.

The pressure sensor’s MEMS capacitive architecture provides the industry’slowest noise at the lowest power. Combined with the motion-tracking 6-axisinertial sensor in a small footprint, the device is ideal for a wide range ofmotion tracking applications.

The inertial MEMS sensor is fabricated with a minimal number of masks and isdirectly assembled on the application-specific integrated circuit (ASIC) byeutectic bonding. Using knowledge obtained by acquiring Sensirion’s pressuresensor division, InvenSense was able to design its own pressure sensor. Thedevice is shipped in a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.

This report includes a detailed technology and cost analysis of the ICM-207897-axis motion tracking device. A comparison with the previous generation ofcombo sensors from InvenSense is also included in the report.

Having supplied Apple for many years,InvenSense (TDK) is a leader in the inertialmeasurement unit (IMU) market. It has alarge market share, competing with Boschand others. This year, with the acquisition ofSensirion’s barometric pressure sensordivision, InvenSense has entered a newmarket area. It has now released of its first‘7-axis’ motion tracking combo, bringing

TABLE OF CONTENTS

Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

• Package

Package views and dimensions, opening and cross-section

• Pressure Sensor Die

View, dimensions, and marking Delayering and process Cross-section

• MEMS Die

View, dimensions and marking Cap removed Sensing area Cross-sections of the sensor, cap,

and seal

• ASIC Die

View, dimensions, and marking Delayering and process Cross-section

Manufacturing Process Flow

• ASIC front-end process and wafer fabrication unit

• Pressure sensor process flow and wafer fabrication unit

• MEMS process flow and wafer fabrication unit

• Packaging process flow and assembly unit

Cost Analysis

• Yield hypotheses• Pressure sensor front-end cost• Pressure sensor back-end 0:

probe test and dicing• Pressure sensor front-end cost

per process steps• Pressure sensor wafer and die

cost• ASIC front-end cost• ASIC back-end 0: probe test and

dicing• ASIC wafer and die cost• MEMS front-end cost• MEMS back-end 0: probe test

and dicing• MEMS front-end cost per

process steps• MEMS wafer and die cost• Back-end: packaging cost• Back-end: packaging cost per

process steps• Back-end: final test cost• IMU component cost

Estimated Price Analysis

Comparison with InvenSenseIMU MP-67B, Sensor Hub ICM-30360 and iPhone 7 Plus OIS IMU

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AUTHORS:

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to set up its laboratory. Hepreviously worked at AtmelNantes Technological AnalysisLaboratory and at HirexEngineering in Toulouse.

YvonLe Goff (Lab)

Yvon joined SystemPlus Consulting in 2011

StéphaneElisabeth

Stéphane has a deepknowledge of materials

characterizations and electronicssystems. He holds an EngineeringDegree in Electronics andNumerical Technology, and a PhDin Materials for Micro-electronics.

previously worked in micro-electronics R&D for CEA/LETI inGrenoble and for STMicro-electronics in Crolles.

NicolasRadufe (Lab)

Nicolas is in charge ofphysical analysis. He

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RELATED REPORTS

6-Axis OIS IMUs: STMicroelectronics LSM6DSM

6-Axis OIS IMUs: InvenSense IMU in iPhone 7 Plus

Bosch BME680 Environmental Sensor with Integrated Gas

Sensor

STMicroelectronics has releasedthe LSM6DSM, providing a smallerdevice with a footprint of2.5x3mm.

In the iPhone 7 Plus, Apple uses anew custom version of theInvenSense ICM-20600 in a 3x3mm16-pin package compared to a2.5x3mm 14-pin package.

The world's first environmentalsensor combining gas, pressure,humidity and temperature sensingfunctions in a 3mm x 3mm footprintpackage.

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Pages: 155Date: December 2016Full report: EUR 3,290*

Pages: 152Date: July 2017Full report: EUR 3,490*

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