Dieter Müller May 15, 2006
Industrial Applications of Vacuum
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- overview applications of vacuum technology- motivation of vacuum design in industrial applications- examples of solutions in Coating- example of solution in Process Industry- examples of solutions in Analytical (mass spectrometry)- outlook
Analyt meth.
most analytical intruments require HV/UHV
Industr meth.
the majority of industrial processes require fine vacuum
Dieter Müller May 15, 2006 Nachdruck, auch auszugsweise, verboten Proprietary & Confidential /© by Leybold Vakuum
Drivers for design of industrial vacuum system(i.e. 90% of all systems)
- Analytical Instruments:reach required vacuum quality within specified time
- Coating/Semiconductor/Process Industryfulfill given production yield
system uptime
better vacuum performance only tolerated if better competitivenesscan be archieved (and paid by market)
reduction of manufacturing costs and/or lower CoO drive designof machines after innovation phase
environment-friendly production
Diff.v.pu.pr.rang.
DryPumps
Ion P
umps
Getter
Pumps
Dieter Müller May 15, 2006
Example Coating IndustryLayout of a coating system for 300 mm Wafers
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V = 8 l
V = 8 l
V = 8 l V = 8 l
V = 8 l
V = 8 l
V = 16 l
V = 8 l
V = 6 l
V = 10 lV = 10 l
V = 100 l
V = 230 l
Etch
PVD
PVD
PVD
PVD
PVD
PVD
Load Lock
Transfer modul
Cooling down modul
Degas modul
Load Lock chamber
Main chamber
Dieter Müller May 15, 2006
market requirements
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Main chamber:50% Aluminium, 50% stainless steelall other chambers: Aluminium
initial evacuation time to 1x10-07 mbar base pressure: < 24 hoursprocess time per wafer and process chamber: 30 spressure during sputtering: 6x10-03 mbarbase pressure in main chamber during processing: < 1x10-06 mbar
Dieter Müller May 15, 2006
first draft of vacuum schematics:
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Etch
PVD
PVD
PVD
PVD
PVD
PVD
Load Lock
Transfer modul
Cooling down modul
Degas modul
EcoDry L EcoDry M
EcoDry M
EcoDry M
EcoDry M
= TW250S
Main chamber
Load Lock chamber
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
necessary computing possibilities
CompuVac © NT for WindowsTM
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
3 - Describing a vacuum systemSetup in principle:
Chamber (Process: pressure, gas flow)
Pump stages
Components (conductances)
(Medium)
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
3 - Describing a vacuum system: Pumps
A) Backing pumpspumping speed: S = f (pHV)
B) Roots pumpscompression: K = f (Q, K0, pFV)
C) High vacuum pumps (turbomolecular, diffusion, cryo)pumping speed: S = f (pHV)
D) Cryo surfacespumping speed: S = f (pHV)
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
3 - Describing a vacuum system: Conductances
E) Pipesw/ or w/o apertures
F) Rectangular ductstransformation into circular pipes; w/ or w/o apertures
G) (Other) components - elbows, valves, filters..Transformation into circular pipe equivalents
Direct function of conductance C = f (p)
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
4C - Influence: Gas load caused by desorption
Pump down p = f (t)
1E-05
1E-04
1E-03
1E-02
1E-01
1E+00
1E+01
1E+02
0 20 40 60 80 100
Time t [s]
Pres
sure
p
[mba
r]
+ MAG2000, w/ Deso 4E-07 mbarl/(s*cm^2)
Example - Chamber: Volume: 75 l Surface: 2.0 m^2 Starting p: 50 mbar Target p: 1E-04 mbar
EW-TuL5: CompuVac NT - A New Generation Vacuum Design Tool © Leybold Vacuum / AVS 52nd Symposium & Exhibition Boston, MA 2005 / Nov. 1st 2005
4C - Influence: Gas load caused by desorption
Pump down p = f (t)
1E-05
1E-04
1E-03
1E-02
1E-01
1E+00
1E+01
1E+02
0 20 40 60 80 100
Time t [s]
Pres
sure
p
[mba
r]
D65B + WS501, w/o Deso
+ MAG2000, w/ Deso 4E-07 mbarl/(s*cm^2)
+ MAG2000, w/ Deso 4E-08 mbarl/(s*cm^2)
+ MAG2000, w/o Deso
Example - Chamber: Volume: 75 l Surface: 2.0 m^2 Starting p: 50 mbar Target p: 1E-04 mbar
( )
factordecay
rate desorption spez.
−
−
⎟⎠⎞
⎜⎝⎛
⋅=
α
α hh
Deso at
AatQ 11
h1
&
Dieter Müller May 15, 2006
assumptions: degassing ratessteel 2x10-08 mbarl/scm²aluminium 6x10-08 mbarl/scm²no further desorption, permeation, or leaks
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PVD EtchPVD PVD PVD PVD PVD
EcoDry L
8x TW250S
DN10l = 3000 mm
Trans-fer
Main chamber
4x TW250S
calculation model:
0 5 1 0 1 5 2 0 25 30
1 0 - 8
1 0 - 5
1 0 - 2
1 0
10 4
p [mb a r ]
t [ h ]
Abp ump ku r v e
initial evacuation -Main chamber &
PVD- and Etch-chambers
1,0 E-7 mbar after approx.18 h
Dieter Müller May 15, 2006 Nachdruck, auch auszugsweise, verboten Proprietary & Confidential /© by Leybold Vakuum
DN10l = 3000 mm
conditioning ofLoad Lock chamber, Degas module, Cooling down modul
Load lock Degas modulCooling downmodul
3x EcoDry M
3x TW250S
Load lock chamber
TW250S
calculation modell:
0 5 1 0 1 5 2 0 25
1 0 - 8
1 0 - 5
1 0 - 2
10
104
p [mba r ]
t [ h ]
Abp umpku r v e
initial evacuation of empty device-
Load lock chamber,Load lock, Degas and Cooling down modul
1,0 E-7 mbar 22 h
positive results calculated for empty chamber
Dieter Müller May 15, 2006
next step: chamber loaded with wafer
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0 10 2 0 3 0 4 0 50 6010 - 10
1 0- 8
1 0- 6
1 0- 4
1 0- 2
p [ mba r ]
t [ s ]
Desorptionsrate des Wafersbeim Beladen der Load Lock: q = 2E-7 mbarl/s*cm²Desorptionsrate des Wafersbeim Beladen der Load Lock : q = 2E-8 mbarl/s*cm²Desorptionsrate des Wafersbeim Beladen der Load lock : q = 2E-9 mbarl/s*cm²Druckverlauf in der Kammer ohne Wafer
pressure in main chamber loaded with waferat different degassing rates
(without Wafer)
high impact from unknown/non-reproduceable degassing rate of waferdegas module highly recommended
degassing rate of wafer willdecline during time in chamber
Dieter Müller May 15, 2006
next step: manufacturing of laboratory devicewithout load-lock chamber
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Etch
PVDPVD
PVD
PVD
PVD
PVD
Transfer modul
EcoDry L EcoDry M
EcoDry M
= TW250S
Main chamber
1 20 1 40 16 0 18 0 2 001 0 - 8
1 0 - 6
1 0 - 4
1 0 - 2
1p [mba r ]
t [ s ]
Gasflowd uring Sputtering:4,5 * 10-3 mbar
results:cycle times verifiedpumps archieve specified pressuresdegassing chamber necessary
Dieter Müller May 15, 2006
finally: picture of a commercial machine
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Picture: Unaxis, Data Storage Coating System
web coating
data storage
short movies:
Dieter Müller May 15, 2006 Nachdruck, auch auszugsweise, verboten Proprietary & Confidential /© by Leybold Vakuum
Typical industrial applicationsin Process Industry
• Industrial Furnaces• Metallurgical Systems• Coating• Packaging• Distillation• Drying
Leak Testing
Re-melting of special alloysCleaning and Vacuum DryingHeat Treatment
Distillation
Dieter Müller May 15, 2006 Nachdruck, auch auszugsweise, verboten Proprietary & Confidential /© by Leybold Vakuum
Typical environment for industrial vacuum pumps
• High dust or particle load• Corrosive media can enter pump• Vapors (e.g. water, oil, fluxing agents,
waxes, resins, oligomers) need to be pumped
• Pumping of pure Oxygen gets more usual, e.g. in Coating applications
2
Sintering of cutting tools. Dewaxing process under vacuum.
Vacuum Sintering of cutting tools
Application Example
PEG used as binding material is found within the pumping chamber and the rotors. Rotary Vane Pumps failed due to accumulation of this material inside the oil circuit.
Vacuum Sintering of cutting tools
Rotors and pumping chamber can be cleaned manually by acetone which is reasonable for infrequent cleaning (6 – 8 weeks)
Dismantling the pumping chamber is necessary.
Vacuum Sintering of cutting tools
Water
For frequent cleaning purpose a flushing kit can be used when
rotors turning.No dismantling of the pump
chamber is necessary!
Vacuum Sintering of cutting tools
Cleaning results after flushing with 8 litres water.
Before cleaning After cleaning
Dry pump can handle process related layers!Manual cleaning or flushing are possible!
Vacuum Sintering of cutting tools
Dieter Müller May 15, 2006
education level in industry may be lower than in large research facilities
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example: conductance losses unknown in evacuation of cryogenic lines?
Dieter Müller May 15, 2006 Nachdruck, auch auszugsweise, verboten Proprietary & Confidential /© by Leybold Vakuum
Typical Analytical Instruments
•Mass Spectrometers
•Electron Microscopes
•X-Ray Analyser
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Definition :
Analytical Instruments are used to investigate and identifysubstances and/or structures.Vacuum is needed - to isolate the species from the environment in order to get a clear signal. The lower the pressure, the better;
- to produce the necessary free length of path inorder to achieve high resolution images and spectra or to warrant the required lifetime of the electrodesat X-ray guns
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Some Applications for Analytical Instruments
Mass-Spectrometer
Electron Microscopes Leakdetector
X-ray analyser
Health Care GenomicsProteomicsDrug DiscoveryMetabolism
Defense / Security Bomb DetectionForensic
Qualiy Control SemiconductorAutomotiveFoodEnviromental Control
Mapped the human genome and develop new drugs based on their research
separation and identification of proteins
the sum of the processes in the buildup and destruction of protoplasm
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Mass Spectrometer: Defined as a machine, that determines what substances are and/or how much there is
Sample of substance
Mass Spectrometer
What it is andhow much
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Mass Spectrometerfunctional principle
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
M1M2
M1
M2
1) Sample Inlet- GC gas chromatograph- LC liquid chromatograph- ICP ion coupled plasma- MALDI matrix assistedlaser desorption/ionisation
Mass Spectrometers consist of 3 main components
2) Mass seperatorthis can be
- Quadrupole, - Ion Trap, - Magnetic sector, - Time of Flight Tube
3) Detectorthis can be
- Electron Multiplier, - Channelplate
Solid or liquid samples will be evaporated
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
1 mbar 10E-3 mbar 10E-5 mbar
Rotary Vane Pumps
TMP TMP
controller controller
Typical Vacuum Schematic of a Mass Spectrometer1000 mbar
atmospheric
pressure
orifices
Continuos decreasing pressure
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
1 mbar 10E-3 mbar 10E-5 mbar
Special Vacuum Pumps for Mass Spectrometers
TW 70LScartridge TW 220/150
cartridgeTW 220/150with customised housing
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
customer requirement: cost/size/weight – reduction:(Multiple Inlet Turbo)
1 mbar 10E-3 mbar 10E-5 mbar
Rotary Vane Pumps
controllerDual Inlet Turbo
one TMP less!
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Typical Vacuum Schematic(Multiple Inlet Turbo)
1 mbar 10E-3 mbar 10E-5 mbar
Backing Pump
controllerTriple Inlet Turbo
one more TMP less!
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Typical Vacuum Schematic(Multiple Inlet Turbo and Twin Inlet Vane Pump)
1 mbar 10E-3 mbar 10E-5 mbar
TITwin Inlet
Vane Pump
controllerDual Inlet Turbo
one RVP less!
Vacuum Pumps for Analytical Instruments
© Leybold Vacuum – Proprietary and Confidential
Typical Vacuum Pumps for a Mass Spectrometer
TW 220/150with customised housingintegrated into a MSof Thermofinigan
displayed onANALYTICA showMunich 2004
Dieter Müller May 15, 2006
Thank You !
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