Sony C
onfiden
tial
PERSONAL COMPUTER
SVE14A SeriesSERVICE MANUAL
Revision History
Design and specifications are subject to changewithout notice.
9-890-924-01
Ver.1-2012I
Sony VAIO and CLIE are trademarks or regis Caution Markings for Lithium/Ion Battery TheSony, VAIO and CLIE are trademarks or regis-teredtrademarks of Sony. Microsoft, Windows,Windows Media, Outlook, Bookshelf and otherMicrosoft products are trademarks or registeredtrademarks of Microsoft Corporation in theUnited States and other countries. The wordBluetooth and the Bluetooth logo are trademarksf Bl t th SIG I AMD th AMD l th
Caution Markings for Lithium/Ion Battery - Thefollowing or similar texts shall be provided onbattery pack of equipment or in both the operatingand the service instructions.
CAUTION: Danger of explosion if battery isincorrectly replaced. Replace only with the same
i l t t d d b thof Bluetooth SIG, Inc. AMD, the AMD logo, otherAMD product names and combinations thereofare trademarks of Advanced Micro Devices, Inc.Intel Inside logo, Pentium, Celeron and Core aretrademarks or registered trademarks of Intel Cor-poration. Transmeta, the Transmeta logo, CrusoeProcessor, the Crusoe logo and combinationsth f t d k f T t C ti
or equivalent type recommended by the manu-facturer. Discard used batteries according to themanufacturers instructions.
CAUTION: The battery pack used in this devicemay present a fi re or chemical burn hazard if mis-treated. Do not disassemble, heat above 60C(140F) i i t Di f d b ttthereof are trademarks of Transmeta Corporation
in the USA and other countries. Graffi ti, Hot-Sync, PalmModem, and Palm OS are registeredtrademarks, and the Hotsync logo and Palm aretrademarks of Palm, Inc. or its subsidiaries. (M)and Motrola are trademarks of Motrora, Inc. OtherMotrola products and services with (R) mark like
(140F) or incinerate. Dispose of used batterypromptly. Keep away from children.
CAUTION: Chang ing the back up battery. Overcharging, short circuiting, reverse charg-ing, multilation or incineration of the cells mustbe avoided to prevent one or more of the fol-
Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and servicesin this manual are trademarks or registered trade-Marks of their respective owners. In this manual,the (TM) or (R) mark are not specified.
lowing occurrences; release of toxic materials,release of hydrogen and/or oxygen gas, rise insurface temperature. If a cell has leaked or vented, it should bereplaced immediately while avoiding to touchit without any protection.
The components identified by mark containThe components identified by mark containconfidential information. Strictly follow the instructions whenever thecomponents repaired and/or replaced.
2
Service and Inspection Precautions
1. Obey precautionary markings andInstructions
Labels and stamps on the cabinet, chassis, andcomponents identify areas requiring special pre-cautions Be sure to observe these precautions
4. Inspect after completing service
After servicing, inspect to make sure that allscrews, components, and wiring have beenreturned to their original condition. Also checkthe area around the repair location to ensure thatcautions. Be sure to observe these precautions,
as well as all precautions listed in the operatingmanual and other associated documents.
2. Use designated parts only
The sets components possess important safetyh t i ti h b tibilit d
prepair work has caused no damage, and confirmsafety.
5. When replacing chip components...
characteristics, such as noncombustibility andthe ability to tolerate large voltages. Be sure thatreplacement parts possess the same safety charac-teristics as the originals. Also remember that the
mark, which appears in circuit diagrams andparts lists, denotes components that have particu-larly important safety functions; be extra sure to
l th d i t d t
Never reuse components. Also remember thatthe negative side of tantalum capacitors is easilydamaged by heat.
6. When handling flexible printboards...
use only the designated components.
3. Always follow the original designwhen mounting parts and routingWires
The original layout includes various safety fea
The temperature of the soldering-iron tipshould be about 270C.
Do not apply the tip more than three times tothe same pattern.
Handle patterns with care; never apply force.
The original layout includes various safety fea-tures, such as inclusion of insulating materials(tubes and tape) and the mounting of parts abovethe printer board. In addition, internal wiring hasbeen routed and clamped so as to keep it awayfrom hot or high-voltage parts. When mountingparts or routing wires, therefore, be sure to du-Pli t th i i l l t
Caution: Remember that hard disk drives areeasily damaged by vibration. Always handlewith care.
Plicate the original layout.
2[Sony Confidential]
SVE14A Series (9-890-924-XX)
TABLE OF CON
Section Title Page
CHAPTER1 BLOCK DIAGRAMCHAPTER1. BLOCK DIAGRAM1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Models)
.......................................................1-2.SVE14A Series (For Int-Gfx Models) ...........................
1-11-2
(to 1-2)CHAPTER2. FRAME HARNESS DIAGRAM2-1.SVE14A Series (TOP)....... 2-2.SVE14A Series (BOTTOM).......
CHAPTER3 EXPLODED VIEWS
2-12-2
(to 1 2)
(to 2-2)CHAPTER3. EXPLODED VIEWSScrewsS-1. Screws.............
PalmrestP-1. Palmrest..........
3-2
3-3Main Board
M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) ........................................................
M-2. Main Board (For Int-Gfx Models) ....Bottom
3-43-5
BottomB-1. Bottom.........
ODDD-1. ODD...
HDDH 1 HDD
3-6
3-7
H-1. HDD...LCD
L-1. LCD (Without Touch Screen)................................L-2. LCD (With Touch Screen)...
3-8
3-93-10
3
NTENTS
Section Title Page
A i
(to 3-11)
Accessories A-1. Accessories...............
CHAPTER4.OTHERS4-1. Replacing the CPU .. 4-1
3-11
p g4-2. Holding Method of Main Board......4-3. Handing and Holding Method of LCD..........
(to 4-3)
4 14-24-3
x History of the changes is shown as the RevisionHistory at the end of this data.
3[Sony Confidential]
SVE14A Series (9-890-924-XX)
CHABLOCK DIA
1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Mo
1-
APTER1.AGRAModels)
-1[Sony Confidential]
SVE14A Series (9-890-924-XX)
Touch PAD
FDI
BIOS ROM64M bit x125MHZ
XTAL
Digital Mic
Camera 0.3M and HD
Camera Module
PECI
HW Thermal Protection *3
Reverse type
Reverse type
SATA 3Gb/s
K/B backlit
TMDS
HD+(1600x900)HD(1366x768)
LVDS LVDS
CRTCRT
(USB3.0 x 4) SATA 6Gb/s
204 pin
SO-DIMM 01600/1333 MHZDDR(III)
SO-DIMM 11600/1333 MHZDDR(III)
Realtek ALC269Q_VA
1600/1333 MHZ
Mini-PCIE Card (BT+WLAN)(WLAN only)
SATAHDD
Ext. Mic In Jack
PWM/TACH
HM76TDP 4W989 Ball FCBGA25 mm X 25 mm
DMI X4Gen2
HDA
PCH (PPT)Panther Point-M
Headphone Jack
LPC
Ethernet GbERTL8111F-CG
1600/1333 MHZ
BATT IDFAN Lid Switch
TransformerNETSWAPNS692412
SMBus 2
USB 2.0
Int. Speaker1.5Walt x 2
USB2.0
Thermal sensorG7811P81U
SMBus
4
(PCIE x 8)(SATA x 6)
GPIO
BATT CONN
35001 Bus
SATA ODD
PS/2
3
HDMI
PCH SPI
204 pin
Light sensor
ALS_LX
Ext. Mic In Jack
w/ Class D Amp.
PCIE3
PECI
R5U220Card Reader
MS Duo(HG)SD Card
G sensorLIS331DLHTR
(W/ BATT Charger)
PowerButton&Switch
PCI-E Gen2
GFX
DDR3 VRAM
PCIE X16
29mm X 29mm
AMDThames-XT
2 USB3.0(USB 2.0x 12)
Status LED
DB*A(Switch)
USB 3.0 X1(W/ USB2.0 X1)
Local Sensor:DDR3Remote Sensor:GPU
Temp.SW 1:CPUTemp.SW 2:AMBIENTTemp.SW 3:GPU
ClickPad
RJ45
USB 2.0 CONN.X2
DB*B(Function)
USB 3.0 X1(W/ USB2.0 X1)
NuvotonNPCE895LA0BX
TFBGA-144
VRAM 512MB/1GB/2GB64Mx16bitx4pcs64Mx16bitx8pcs128Mx16bitx8pcs
Processor(IVB) Dual/Quad Core(SNB) Dual Core
37.5 mm X 37.5 mm
Micro-FCPGA-988B(988-pin rPGA socket)TDP: Dua/Quad Core(35W)
SPI EC ROM
K/B
Touch Screen
1-2.SVE14A Series (For Int-Gfx Models)
1-(EN
-2ND)
[Sony Confidential]SVE14A Series (9-890-924-XX)
Touch PAD
FDI
BIOS ROM64M bit x125MHZ
XTAL
Digital Mic
Camera 0.3M and HD
Camera Module
PECI
HW Thermal Protection *3
Reverse type
Reverse type
SATA 3Gb/s
K/B backlit
TMDS
HD+(1600x900)HD(1366x768)
LVDS LVDS
CRTCRT
(USB3.0 x 4) SATA 6Gb/s
204 pin
SO-DIMM 01600/1333 MHZDDR(III)
SO-DIMM 11600/1333 MHZDDR(III)
Realtek ALC269Q_VA
1600/1333 MHZ
Mini-PCIE Card (BT+WLAN)(WLAN only)
SATAHDD
Ext. Mic In Jack
PWM/TACH
HM76TDP 4W989 Ball FCBGA25 mm X 25 mm
DMI X4Gen2
HDA
PCH (PPT)Panther Point-M
Headphone Jack
LPC
Ethernet GbERTL8111F-CG
1600/1333 MHZ
BATT IDFAN Lid Switch
TransformerNETSWAPNS692412
SMBus 2
USB 2.0
Int. Speaker1.5Walt x 2
USB2.0
Thermal sensorG7811P81U
SMBus
4
(PCIE x 8)(SATA x 6)
GPIO
BATT CONN
35001 Bus
SATA ODD
PS/2
3
HDMI
PCH SPI
204 pin
Light sensor
ALS_LX
Ext. Mic In Jack
w/ Class D Amp.
PCIE3
PECI
R5U220Card Reader
MS Duo(HG)SD Card
G sensorLIS331DLHTR
(W/ BATT Charger)
PowerButton&Switch
2 USB3.0(USB 2.0x 12)
Status LED
DB*A(Switch)
USB 3.0 X1(W/ USB2.0 X1)
Local Sensor:DDR3Remote Sensor:GPU
Temp.SW 1:CPUTemp.SW 2:AMBIENTTemp.SW 3:GPU
ClickPad
RJ45
USB 2.0 CONN.X2
DB*B(Function)
USB 3.0 X1(W/ USB2.0 X1)
NuvotonNPCE895LA0BX
TFBGA-144
Processor(IVB) Dual/Quad Core(SNB) Dual Core
37.5 mm X 37.5 mm
Micro-FCPGA-988B(988-pin rPGA socket)TDP: Dua/Quad Core(35W)
SPI EC ROM
K/B
Touch Screen
CHAFRAME HARNESS DIA
2-1.SVE14A Series (TOP)
2-
APTER2.AGRAM
-1[Sony Confidential]
SVE14A Series (9-890-924-XX)
2-2.SVE14A Series (BOTTOM)
2-(EN
-2ND)
[Sony Confidential]SVE14A Series (9-890-924-XX)
CHAEXPLODED
Section PageScrews
S-1.Screws.Palmrest
3-2Palmrest
P-1.Palmrest.Main Board
M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) .....................................................................
M-2. Main Board (For Int-Gfx Models) ...
3-3
3-43-5
BottomB-1.Bottom.
ODDD-1.ODD.
HDD
3 5
3-6
3-7
H-1.HDD.LCD
L-1.LCD (Without Touch Screen)..L-2.LCD (With Touch Screen)...
Accessories
3-8
3-93-10
A-1.Accessories.... 3-11
3-
APTER3.D VIEWS
PalmrestLCD
Palmrest
BottomMain Board
ODD
Bottom
HDD
LCD
or
LCD
Palmrest
BottomMain Board
HDDODD
-1[Sony Confidential]
SVE14A Series (9-890-924-XX)
S-1. Screws
3--2[Sony Confidential]
SVE14A Series (9-890-924-XX)
P-1. Palmrest
3--3[Sony Confidential]
SVE14A Series (9-890-924-XX)
M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Mode
3-
ls)
-4[Sony Confidential]
SVE14A Series (9-890-924-XX)
M-2. Main Board (For Int-Gfx Models)
3--5[Sony Confidential]
SVE14A Series (9-890-924-XX)
B-1. Bottom
3--6[Sony Confidential]
SVE14A Series (9-890-924-XX)
D-1. ODD
3--7[Sony Confidential]
SVE14A Series (9-890-924-XX)
H-1. HDD
3--8[Sony Confidential]
SVE14A Series (9-890-924-XX)
L-1. LCD (Without Touch Screen)
3--9[Sony Confidential]
SVE14A Series (9-890-924-XX)
L-2. LCD (With Touch Screen)
3-10[Sony Confidential]
SVE14A Series (9-890-924-XX)
A-1. Accessories2005P C d
2006AC Ad tPower Cord AC Adapter
2007Battery Pack
2008Carrying Case
2011Carrying Pouch
2010Keyboard Skin
3-(EN
2006AC Adapter(Stick Type)AC Adapter(Stick Type)
2009Bluetooth Mouse
2012Cable Clip
11ND)
[Sony Confidential]SVE14A Series (9-890-924-XX)
CHAO
4-1. Replacing the CPU1. Removing the CPU1. Insert a flat-blade screwdriver into the notch as shown
illustration and rotate it so that the protrusion comes to theillustration and rotate it so that the protrusion comes to thelock release position.
2. Pull the CPU gently upward to lift it out of the CPU socket
11
1
Unlock Lock
2
4-
APTER4.THERS
2. Installing the CPU1. Align the triangle reference mark of the mark the CPU with that of the CPU
socket and insert all the pins of the CPU to the corresponding holes of thesocket and insert all the pins of the CPU to the corresponding holes of theCPU socket.
2. Insert the flat head (-) screwdriver into the specified position and rotate the screwdriver to the LOCK position.
2
Reference marks
2
1
Unlock Lock
-1[Sony Confidential]
SVE14A Series (9-890-924-XX)
4-2 Holding Method of Main Board
1. When operating with both hands, gently hold the middle of Main board edge as show2. When operating with one-hand, gently hold the middle of Main board edge and keep
(Level)(Level)
4-
w.vertical.
(Vertical)(Vertical)
-2[Sony Confidential]
SVE14A Series (9-890-924-XX)
4-3 Handing and Holding Method of LCD1. Handling Method of LCDg
1) Take LCD Panel out of packing box withits both sides.
2) Holding the opposite side of PCB withone hand, take off the tape of shielding bag
Note not to press the PCB.
2. Holding Method of LCD
, p g gwith the other hand.
(Front View)(Front View)
4-(EN
3) Holding one side of LCD Panel with onehand, take off the shielding bag with the
4) Besides the protector sheet, there isalso another soft film on the surface of g g
other hand. Samsung LCD. The soft film is under theprotector sheet. Remove it carefully withone tape.
(Rear View)(Rear View)
-3ND)
[Sony Confidential]SVE14A Series (9-890-924-XX)
SVE14A Series
This manual and the constituent data may not be replicated, copied nor reprinted in whole or in part without prior written authorization of Sony Corporation
Sony Corporation 22
9-890-924-01
English 2012IF00-1
2012 Sony CorporationPublished by Sony Corporation VAIO & Mobile Business Group
CS & Quality Div. VAIO Global CS Dept.
Revision History
Suffix Ver. Date
-01 Ver 1 2012 09 24 First Edition01 Ver.1 2012.09.24 First Edition
554
Contents QM No.
[Sony Confidential]SVE14A Series (9-890-924-XX)
COVERTABLE OF CONTENTSCHAPTER1.BLOCK DIAGRAM1-1.SVE14A Series(For Ext-Gfx(THAMES-XT(M))Models)1-2.SVE14A Series (For Int-Gfx Models)
CHAPTER2.FRAME HARNESS DIAGRAM2-1.SVE14A Series (TOP)2-2.SVE14A Series (BOTTOM)
CHAPTER3.EXPLODED VIEWSS-1. ScrewsP-1. PalmrestM-1. Main Board (For Ext-Gfx(THAMES-XT(M))Models)M-2. Main Board (For Int-Gfx Models)B-1. BottomD-1. ODDH-1. HDDL-1. LCD (Without Touch Screen)L-2. LCD (With Touch Screen)A-1. Accessories
CHAPTER4.OTHERS4-1. Replacing the CPU1. Removing the CPU2. Installing the CPU
4-2 Holding Method of Main Board4-3 Handing and Holding Method of LCD1. Handling Method of LCD2. Holding Method of LCD
Revision History