Despiece SVE14A Series

Sony C

onfiden

tial

PERSONAL COMPUTER

SVE14A SeriesSERVICE MANUAL

Revision History

Design and specifications are subject to changewithout notice.

9-890-924-01

Ver.1-2012I

Sony VAIO and CLIE are trademarks or regis Caution Markings for Lithium/Ion Battery TheSony, VAIO and CLIE are trademarks or regis-teredtrademarks of Sony. Microsoft, Windows,Windows Media, Outlook, Bookshelf and otherMicrosoft products are trademarks or registeredtrademarks of Microsoft Corporation in theUnited States and other countries. The wordBluetooth and the Bluetooth logo are trademarksf Bl t th SIG I AMD th AMD l th

Caution Markings for Lithium/Ion Battery - Thefollowing or similar texts shall be provided onbattery pack of equipment or in both the operatingand the service instructions.

CAUTION: Danger of explosion if battery isincorrectly replaced. Replace only with the same

i l t t d d b thof Bluetooth SIG, Inc. AMD, the AMD logo, otherAMD product names and combinations thereofare trademarks of Advanced Micro Devices, Inc.Intel Inside logo, Pentium, Celeron and Core aretrademarks or registered trademarks of Intel Cor-poration. Transmeta, the Transmeta logo, CrusoeProcessor, the Crusoe logo and combinationsth f t d k f T t C ti

or equivalent type recommended by the manu-facturer. Discard used batteries according to themanufacturers instructions.

CAUTION: The battery pack used in this devicemay present a fi re or chemical burn hazard if mis-treated. Do not disassemble, heat above 60C(140F) i i t Di f d b ttthereof are trademarks of Transmeta Corporation

in the USA and other countries. Graffi ti, Hot-Sync, PalmModem, and Palm OS are registeredtrademarks, and the Hotsync logo and Palm aretrademarks of Palm, Inc. or its subsidiaries. (M)and Motrola are trademarks of Motrora, Inc. OtherMotrola products and services with (R) mark like

(140F) or incinerate. Dispose of used batterypromptly. Keep away from children.

CAUTION: Chang ing the back up battery. Overcharging, short circuiting, reverse charg-ing, multilation or incineration of the cells mustbe avoided to prevent one or more of the fol-

Dragomball are the trademarks of Motrola, Inc.

All other names of systems, products and servicesin this manual are trademarks or registered trade-Marks of their respective owners. In this manual,the (TM) or (R) mark are not specified.

lowing occurrences; release of toxic materials,release of hydrogen and/or oxygen gas, rise insurface temperature. If a cell has leaked or vented, it should bereplaced immediately while avoiding to touchit without any protection.

The components identified by mark containThe components identified by mark containconfidential information. Strictly follow the instructions whenever thecomponents repaired and/or replaced.

2

Service and Inspection Precautions

1. Obey precautionary markings andInstructions

Labels and stamps on the cabinet, chassis, andcomponents identify areas requiring special pre-cautions Be sure to observe these precautions

4. Inspect after completing service

After servicing, inspect to make sure that allscrews, components, and wiring have beenreturned to their original condition. Also checkthe area around the repair location to ensure thatcautions. Be sure to observe these precautions,

as well as all precautions listed in the operatingmanual and other associated documents.

2. Use designated parts only

The sets components possess important safetyh t i ti h b tibilit d

prepair work has caused no damage, and confirmsafety.

5. When replacing chip components...

characteristics, such as noncombustibility andthe ability to tolerate large voltages. Be sure thatreplacement parts possess the same safety charac-teristics as the originals. Also remember that the

mark, which appears in circuit diagrams andparts lists, denotes components that have particu-larly important safety functions; be extra sure to

l th d i t d t

Never reuse components. Also remember thatthe negative side of tantalum capacitors is easilydamaged by heat.

6. When handling flexible printboards...

use only the designated components.

3. Always follow the original designwhen mounting parts and routingWires

The original layout includes various safety fea

The temperature of the soldering-iron tipshould be about 270C.

Do not apply the tip more than three times tothe same pattern.

Handle patterns with care; never apply force.

The original layout includes various safety fea-tures, such as inclusion of insulating materials(tubes and tape) and the mounting of parts abovethe printer board. In addition, internal wiring hasbeen routed and clamped so as to keep it awayfrom hot or high-voltage parts. When mountingparts or routing wires, therefore, be sure to du-Pli t th i i l l t

Caution: Remember that hard disk drives areeasily damaged by vibration. Always handlewith care.

Plicate the original layout.

2[Sony Confidential]

SVE14A Series (9-890-924-XX)

TABLE OF CON

Section Title Page

CHAPTER1 BLOCK DIAGRAMCHAPTER1. BLOCK DIAGRAM1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Models)

.......................................................1-2.SVE14A Series (For Int-Gfx Models) ...........................

1-11-2

(to 1-2)CHAPTER2. FRAME HARNESS DIAGRAM2-1.SVE14A Series (TOP)....... 2-2.SVE14A Series (BOTTOM).......

CHAPTER3 EXPLODED VIEWS

2-12-2

(to 1 2)

(to 2-2)CHAPTER3. EXPLODED VIEWSScrewsS-1. Screws.............

PalmrestP-1. Palmrest..........

3-2

3-3Main Board

M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) ........................................................

M-2. Main Board (For Int-Gfx Models) ....Bottom

3-43-5

BottomB-1. Bottom.........

ODDD-1. ODD...

HDDH 1 HDD

3-6

3-7

H-1. HDD...LCD

L-1. LCD (Without Touch Screen)................................L-2. LCD (With Touch Screen)...

3-8

3-93-10

3

NTENTS

Section Title Page

A i

(to 3-11)

Accessories A-1. Accessories...............

CHAPTER4.OTHERS4-1. Replacing the CPU .. 4-1

3-11

p g4-2. Holding Method of Main Board......4-3. Handing and Holding Method of LCD..........

(to 4-3)

4 14-24-3

x History of the changes is shown as the RevisionHistory at the end of this data.

3[Sony Confidential]


CHABLOCK DIA

1-1.SVE14A Series (For Ext-Gfx (THAMES-XT(M)) Mo

1-

APTER1.AGRAModels)

-1[Sony Confidential]


Touch PAD

FDI

BIOS ROM64M bit x125MHZ

XTAL

Digital Mic

Camera 0.3M and HD

Camera Module

PECI

HW Thermal Protection *3

Reverse type

Reverse type

SATA 3Gb/s

K/B backlit

TMDS

HD+(1600x900)HD(1366x768)

LVDS LVDS

CRTCRT

(USB3.0 x 4) SATA 6Gb/s

204 pin

SO-DIMM 01600/1333 MHZDDR(III)


Realtek ALC269Q_VA

1600/1333 MHZ

Mini-PCIE Card (BT+WLAN)(WLAN only)

SATAHDD

Ext. Mic In Jack

PWM/TACH

HM76TDP 4W989 Ball FCBGA25 mm X 25 mm

DMI X4Gen2

HDA

PCH (PPT)Panther Point-M

Headphone Jack

LPC

Ethernet GbERTL8111F-CG

1600/1333 MHZ

BATT IDFAN Lid Switch

TransformerNETSWAPNS692412

SMBus 2

USB 2.0

Int. Speaker1.5Walt x 2

USB2.0

Thermal sensorG7811P81U

SMBus

4

(PCIE x 8)(SATA x 6)

GPIO

BATT CONN

35001 Bus

SATA ODD

PS/2

3

HDMI

PCH SPI

204 pin

Light sensor

ALS_LX

Ext. Mic In Jack

w/ Class D Amp.

PCIE3

PECI

R5U220Card Reader

MS Duo(HG)SD Card

G sensorLIS331DLHTR

(W/ BATT Charger)

PowerButton&Switch

PCI-E Gen2

GFX

DDR3 VRAM

PCIE X16

29mm X 29mm

AMDThames-XT

2 USB3.0(USB 2.0x 12)

Status LED

DB*A(Switch)

USB 3.0 X1(W/ USB2.0 X1)

Local Sensor:DDR3Remote Sensor:GPU

Temp.SW 1:CPUTemp.SW 2:AMBIENTTemp.SW 3:GPU

ClickPad

RJ45

USB 2.0 CONN.X2

DB*B(Function)

USB 3.0 X1(W/ USB2.0 X1)

NuvotonNPCE895LA0BX

TFBGA-144

VRAM 512MB/1GB/2GB64Mx16bitx4pcs64Mx16bitx8pcs128Mx16bitx8pcs

Processor(IVB) Dual/Quad Core(SNB) Dual Core

37.5 mm X 37.5 mm

Micro-FCPGA-988B(988-pin rPGA socket)TDP: Dua/Quad Core(35W)

SPI EC ROM

K/B

Touch Screen

1-2.SVE14A Series (For Int-Gfx Models)

1-(EN

-2ND)

[Sony Confidential]SVE14A Series (9-890-924-XX)

Touch PAD

FDI

BIOS ROM64M bit x125MHZ

XTAL

Digital Mic

Camera 0.3M and HD

Camera Module

PECI

HW Thermal Protection *3

Reverse type

Reverse type

SATA 3Gb/s

K/B backlit

TMDS

HD+(1600x900)HD(1366x768)

LVDS LVDS

CRTCRT

(USB3.0 x 4) SATA 6Gb/s

204 pin



Realtek ALC269Q_VA

1600/1333 MHZ

Mini-PCIE Card (BT+WLAN)(WLAN only)

SATAHDD

Ext. Mic In Jack

PWM/TACH

HM76TDP 4W989 Ball FCBGA25 mm X 25 mm

DMI X4Gen2

HDA

PCH (PPT)Panther Point-M

Headphone Jack

LPC

Ethernet GbERTL8111F-CG

1600/1333 MHZ

BATT IDFAN Lid Switch

TransformerNETSWAPNS692412

SMBus 2

USB 2.0

Int. Speaker1.5Walt x 2

USB2.0

Thermal sensorG7811P81U

SMBus

4

(PCIE x 8)(SATA x 6)

GPIO

BATT CONN

35001 Bus

SATA ODD

PS/2

3

HDMI

PCH SPI

204 pin

Light sensor

ALS_LX

Ext. Mic In Jack

w/ Class D Amp.

PCIE3

PECI

R5U220Card Reader

MS Duo(HG)SD Card

G sensorLIS331DLHTR

(W/ BATT Charger)

PowerButton&Switch

2 USB3.0(USB 2.0x 12)

Status LED

DB*A(Switch)

USB 3.0 X1(W/ USB2.0 X1)

Local Sensor:DDR3Remote Sensor:GPU

Temp.SW 1:CPUTemp.SW 2:AMBIENTTemp.SW 3:GPU

ClickPad

RJ45

USB 2.0 CONN.X2

DB*B(Function)

USB 3.0 X1(W/ USB2.0 X1)

NuvotonNPCE895LA0BX

TFBGA-144

Processor(IVB) Dual/Quad Core(SNB) Dual Core

37.5 mm X 37.5 mm

Micro-FCPGA-988B(988-pin rPGA socket)TDP: Dua/Quad Core(35W)

SPI EC ROM

K/B

Touch Screen

CHAFRAME HARNESS DIA

2-1.SVE14A Series (TOP)

2-

APTER2.AGRAM



2-2.SVE14A Series (BOTTOM)

2-(EN

-2ND)


CHAEXPLODED

Section PageScrews

S-1.Screws.Palmrest

3-2Palmrest

P-1.Palmrest.Main Board

M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Models) .....................................................................

M-2. Main Board (For Int-Gfx Models) ...

3-3

3-43-5

BottomB-1.Bottom.

ODDD-1.ODD.

HDD

3 5

3-6

3-7

H-1.HDD.LCD

L-1.LCD (Without Touch Screen)..L-2.LCD (With Touch Screen)...

Accessories

3-8

3-93-10

A-1.Accessories.... 3-11

3-

APTER3.D VIEWS

PalmrestLCD

Palmrest

BottomMain Board

ODD

Bottom

HDD

LCD

or

LCD

Palmrest

BottomMain Board

HDDODD



S-1. Screws

3--2[Sony Confidential]


P-1. Palmrest



M-1. Main Board (For Ext-Gfx (THAMES-XT(M)) Mode

3-

ls)



M-2. Main Board (For Int-Gfx Models)



B-1. Bottom



D-1. ODD



H-1. HDD



L-1. LCD (Without Touch Screen)



L-2. LCD (With Touch Screen)

3-10[Sony Confidential]


A-1. Accessories2005P C d

2006AC Ad tPower Cord AC Adapter

2007Battery Pack

2008Carrying Case

2011Carrying Pouch

2010Keyboard Skin

3-(EN

2006AC Adapter(Stick Type)AC Adapter(Stick Type)

2009Bluetooth Mouse

2012Cable Clip

11ND)


CHAO

4-1. Replacing the CPU1. Removing the CPU1. Insert a flat-blade screwdriver into the notch as shown

illustration and rotate it so that the protrusion comes to theillustration and rotate it so that the protrusion comes to thelock release position.

2. Pull the CPU gently upward to lift it out of the CPU socket

11

1

Unlock Lock

2

4-

APTER4.THERS

2. Installing the CPU1. Align the triangle reference mark of the mark the CPU with that of the CPU

socket and insert all the pins of the CPU to the corresponding holes of thesocket and insert all the pins of the CPU to the corresponding holes of theCPU socket.

2. Insert the flat head (-) screwdriver into the specified position and rotate the screwdriver to the LOCK position.

2

Reference marks

2

1

Unlock Lock



4-2 Holding Method of Main Board

1. When operating with both hands, gently hold the middle of Main board edge as show2. When operating with one-hand, gently hold the middle of Main board edge and keep

(Level)(Level)

4-

w.vertical.

(Vertical)(Vertical)



4-3 Handing and Holding Method of LCD1. Handling Method of LCDg

1) Take LCD Panel out of packing box withits both sides.

2) Holding the opposite side of PCB withone hand, take off the tape of shielding bag

Note not to press the PCB.

2. Holding Method of LCD

, p g gwith the other hand.

(Front View)(Front View)

4-(EN

3) Holding one side of LCD Panel with onehand, take off the shielding bag with the

4) Besides the protector sheet, there isalso another soft film on the surface of g g

other hand. Samsung LCD. The soft film is under theprotector sheet. Remove it carefully withone tape.

(Rear View)(Rear View)

-3ND)


SVE14A Series

This manual and the constituent data may not be replicated, copied nor reprinted in whole or in part without prior written authorization of Sony Corporation

Sony Corporation 22

9-890-924-01

English 2012IF00-1

2012 Sony CorporationPublished by Sony Corporation VAIO & Mobile Business Group

CS & Quality Div. VAIO Global CS Dept.

Revision History

Suffix Ver. Date

-01 Ver 1 2012 09 24 First Edition01 Ver.1 2012.09.24 First Edition

554

Contents QM No.


COVERTABLE OF CONTENTSCHAPTER1.BLOCK DIAGRAM1-1.SVE14A Series(For Ext-Gfx(THAMES-XT(M))Models)1-2.SVE14A Series (For Int-Gfx Models)

CHAPTER2.FRAME HARNESS DIAGRAM2-1.SVE14A Series (TOP)2-2.SVE14A Series (BOTTOM)

CHAPTER3.EXPLODED VIEWSS-1. ScrewsP-1. PalmrestM-1. Main Board (For Ext-Gfx(THAMES-XT(M))Models)M-2. Main Board (For Int-Gfx Models)B-1. BottomD-1. ODDH-1. HDDL-1. LCD (Without Touch Screen)L-2. LCD (With Touch Screen)A-1. Accessories

CHAPTER4.OTHERS4-1. Replacing the CPU1. Removing the CPU2. Installing the CPU

4-2 Holding Method of Main Board4-3 Handing and Holding Method of LCD1. Handling Method of LCD2. Holding Method of LCD

Revision History

Despiece SVE14A Series

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