ZXG10 BSC(V2)Installation Manual
description
Transcript of ZXG10 BSC(V2)Installation Manual
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Installation Manual of ZXG10-BSC (V2)
Preface
The ZXG10 is a GSM mobile communication system independently developed by ZTE Corporation. It is composed of the ZXG10-MSS (Mobile Switching System) and ZXG10-BSS (Base Station System). The ZXG10-BSS provides and manages radio transmission in GSM, and consists of such equipment as ZXG10-BSC (Base Station Controller) and ZXG10-BTS (Base Transceiver Station).
This Installation Manual of ZXG10-BSC (V2) mainly introduces the project installation process of the ZXG10-BSC (V2), including the installation preparation, installation methods and procedure, and debugging. Chapter 1, System Overview, briefly introduces the system functions of BSC, composition of each function module and equipment commissioning process; Chapter 2, Equipment Structure, covers the overall structure of the BSC and the equipment parameters; Chapter 3, Preparation for Project Installation, describes requirements to the installation environments, needed instruments and meters, and methods of unpacking and inspection; Chapter 4, Hardware Installation, describes the installation flow and methods; Chapter 5, Inspection and Power-on, explains methods of power-on, power-off and transmission connection, and installation of the maintenance terminals; Chapter 6, Software Installation, briefly describes how the BSC-related software is installed and debugged; and Chapter 7 mainly shows how to operate the installation, storage and transportation. Appendix A lists the alarms, Appendix B collects the UNIX commands and Appendix C offers the abbreviations.
Generally the ZXG10-BSC (V2) in this manual is shortened as BSC.
This set of documents also contains the following manuals:
ZXG10-BSC (V2) Technical Manual
ZXG10-BSC (V2) Operation Manual
ZXG10-BSC (V2) Maintenance Manual
Installation Manual of ZXG10-BSC (V2)
Statement: The actual product may differ from what is described in this manual due to frequent update of ZTE products and fast development of technologies. Please contact the local ZTE office for the latest updating information of the product.
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Contents
1 SYSTEM OVERVIEW......................................................................................................1
1.1 SYSTEM STRUCTURE..........................................................................................................1 1.1.1 GSM network structure ....................................................................................................1 1.1.2 Composition of BSS.........................................................................................................2 1.2 HARDWARE SYSTEM STRUCTURE.........................................................................................4 1.2.1 Module introduction .........................................................................................................4 1.2.2 Function structure............................................................................................................7 1.2.3 Rack structure .................................................................................................................8 1.3 EQUIPMENT INSTALLATION AND COMMISSIONING PROCESS.....................................................9
2 EQUIPMENT STRUCTURE ..........................................................................................11
2.1 EQUIPMENT STRUCTURE...................................................................................................11 2.1.1 Features of single-cabinet structure...............................................................................11 2.1.2 Features of multi-cabinet structure ................................................................................12 2.1.3 Structure features of the plug-in box ..............................................................................13 2.1.4 Structure features of the card ........................................................................................14 2.2 BSC RACK CONFIGURATION ..............................................................................................15 2.2.1 No submultiplexing ........................................................................................................15 2.2.2 Rack configuration with submultiplexing ........................................................................18 2.2.3 GPRS rack configuration ...............................................................................................22 2.3 BOARD CONFIGURATION OF EACH LAYER OF UNITS ..............................................................22 2.4 EQUIPMENT PARAMETERS.................................................................................................25
3 PREPARATION OF INSTALLATION.............................................................................29
3.1 CHECK OF INSTALLATION ENVIRONMENT.............................................................................29 3.1.1 Requirements on equipment room.................................................................................29 3.1.2 Requirements on power supply and grounding..............................................................37 3.2 INSTRUMENT AND METER PREPARATION..............................................................................39 3.3 TECHNICAL RESOURCES PREPARATION ..............................................................................40 3.4 UNPACKING AND INSPECTION ............................................................................................40
4 HARDWARE INSTALLATION.......................................................................................43
4.1 HARDWARE INSTALLATION FLOW........................................................................................43
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4.2 INSTALLATION OF THE RACK...............................................................................................43 4.2.1 Rack installation.............................................................................................................43 4.2.2 Connection between racks ............................................................................................46 4.2.3 Connection between the side plate and rack .................................................................47 4.2.4 Installation of the front door and rear door .....................................................................48 4.3 INSTALLATION OF THE POWER P (POWP) OF THE RACK.......................................................48 4.3.1 Introduction to functions.................................................................................................48 4.3.2 Functionality ..................................................................................................................49 4.3.3 Input, output and indicators............................................................................................51 4.4 INSTALLATION OF INTERNAL WIRES.....................................................................................52 4.4.1 Clock interface board (CKI)............................................................................................52 4.4.2 Digital switching network interface (DSNI) board ...........................................................53 4.4.3 Trunk interface (TIC) board............................................................................................53 4.4.4 Module processor (MP) .................................................................................................54 4.4.5 Configuration of backplane jumpers...............................................................................54 4.5 INSTALLATION OF EXTERNAL CABLES ..................................................................................56 4.5.1 Cable connection of the BSC system without sub-multiplexing......................................56 4.5.2 Configurations of cables of the BSC system with sub-multiplexing ................................73 4.5.3 Cable connections of BSC (GPRS) ...............................................................................80 4.6 CHECK OF THE HARDWARE INSTALLATION ..........................................................................81 4.6.1 Check of the rack installation .........................................................................................81 4.6.2 Check of base and peripherally installed terminal equipment ........................................82 4.6.3 Check of the array of racks............................................................................................82 4.6.4 Check of cables .............................................................................................................82
5 INSPECTION AND POWER-ON ...................................................................................86
5.1 DESCRIPTION OF BOARDS.................................................................................................86 5.1.1 Indicators on the panel of the control layer ....................................................................86 5.1.2 Indicators on the panel of the network switching layer ...................................................88 5.1.3 Indicators on the panel of the TC unit ............................................................................94 5.1.4 Indicators on the panels of the POWB and POWP units ................................................96 5.1.5 Indicators on the panel of the GPRS unit .......................................................................97 5.2 INSPECTION BEFORE POWER-ON .....................................................................................101 5.3 STEPS OF POWER-ON.....................................................................................................102 5.4 CHECK OF BOARD STATUS...............................................................................................104
6 SOFTWARE INSTALLATION......................................................................................105
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6.1 INITIAL INSTALLATION FLOW OF THE SYSTEM SOFTWARE.....................................................105 6.2 INSTALLATION OF MP .....................................................................................................106 6.3 INSTALLATION OF THE BACKGROUND OPERATION AND MAINTENANCE SYSTEM ......................109 6.4 SYSTEM DEBUGGING ......................................................................................................119 6.4.1 Contents of BS system debugging...............................................................................119 6.4.2 Debugging of the system setup function ......................................................................120 6.4.3 Troubleshooting test ....................................................................................................120 6.4.4 Service test..................................................................................................................123 6.4.5 Operation and maintenance subsystem test ................................................................125 6.4.6 GPRS test contents .....................................................................................................127 6.4.7 Installation and test records .........................................................................................128
7 PACKAGING, STORAGE AND TRANSPORTATION..................................................129
7.1 PACKING .......................................................................................................................129 7.2 STORAGE ......................................................................................................................131 7.2.1 Storage conditions .......................................................................................................131 7.2.2 Placement....................................................................................................................131 7.3 EQUIPMENT TRANSPORTATION AND PORTAGE....................................................................132
APPENDIX A BS SYSTEM ALARMS........................................................................................133
A.1 BSC ALARM LIST............................................................................................................133 A.2 BTS ALARM LIST ............................................................................................................135 A.3 GPRS ALARM LIST .........................................................................................................140 A.4 NOTIFICATION TYPE LIST .................................................................................................141
APPENDIX B UNIX COMMON COMMANDS............................................................................142
APPENDIX C ABBREVIATIONS ...............................................................................................151
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1 System Overview
1.1 System structure
The BSC, an important part of the GSM digital mobile communication system, is a component of the BSS (Base Station System). It aims to manage the radio resources on a radio network and is capable of supporting various services of GSM.
As an upgraded version of the ZXG10-BSC (V1.x), the ZXG10-BSC (V2) is a multi-module product designed on the basis of ETSI Specification Phase2+, with the capacity and processing capability reaching 2048 TRXs. It inherits all advantages of the ZXG10-BSC (V1.x), featuring high-reliability, high cost performance and excellent functions. The completely opened network platform helps to support various services of GSM, and it has an obvious edge over the similar equipment currently running on various networks.
1.1.1 GSM network structure
The composition of a GSM digital mobile communication network is as shown in Fig. 1-1.
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BSC
BTS
MSC/VLR
SGSN
SMC
HLR
EIR
MS
Other PLMN
GGSNGGSN
PDN TE
PSTNMSC/VLR
MAP-E
MAP-DUm
Abis
Gf
Gr
Gn Gp
Gd
Gs
Gb
Gi
A MAP-H
MAP-F
MAP-C
Fig. 1-1 Architecture of GSM mobile communication network
The ZXG10-BSC (V2) provides three interfaces in the GSM900/1800 and EGSM900 systems: its Abis interface connects the BTS, its A interface connects the MSC and its Gb interface connects the SGSN. In the system, it is mainly in charge of radio resources management, BS management and monitoring, power control, handover and BS traffic statistics.
1.1.2 Composition of BSS
Fig. 1-2 illustrates the structure and equipment of a typical ZXG10-BSS.
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MS
Ater Interface
Um Interface
BSC
BTS
TIC
Abis Interface
TC
A Interface
MSC
OMC
Q3 Interface
TIC
Abis Interface
SM SM
BIE
BTS
BIE
SGSN
Gb Interface
PLMN
PDN
Acon Interface
SM SMBIE
Abis Interface
BTS
Fig. 1-2 Architecture of ZXG10-BSS
Generally the BSS is composed of the BTS, BSC and TC:
1. BTS
The BTS (Base Transceiver Station) is the radio part in the BSS, and it includes the baseband unit, the carrier unit and the control unit. This station, controlled by BSC, serves as the radio transceiving equipment in a certain cell by implementing the conversion between the BSC and wireless channels, the radio transmission between the BTS and MS via the air interface, and other related control functions.
The BTS is interconnected with the BSC using the Abis interface, with E1 interface equipment configured at both sides.
2. BSC
Serving as the control part in the BSS, the ZXG10-BSC fulfills the switching function in the BSS. One end of the BSC can be connected with multiple BTSs, while the other with the MSC and OMC. The BSC is oriented to the radio network. Its main functions include radio network management; radio resources management; monitoring and managing wireless BS sites; controlling the establishment, connection and release of
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radio connections between BTSs and MSs; controlling the locating, handover and paging of MSs; providing voice coding, transcoding and rate adaptation; as well as the operation and maintenance of BSS. The quantity of BTSs controlled by the BSC in the BSS varies with the traffic volume.
3. TC (Trans-Coder)
The TC mainly implements the voice conversion between the various voice codes adopted in the radio interface of the GSM system and the 64kb/s A-law PCM codes. In addition, TC is also responsible for the data rate adaptation processing in circuit-type data services. In a typical application pattern, the ZXG10-TC is located between MSC and BSC.
With TC located at the side of the MSC, the low voice encoding transmission rate used on the air interface may reduce the cost of transmission lines through the transmission SubMultiplexer SM and BIE between the MSC and BSC and those between the BSC and BTS. If the SM is used between the BSC and TC, the interface between the near end and remote end (BSC and TC) is called Ater interface, while that between the TC and MSC is named A interface.
1.2 Hardware system structure
1.2.1 Module introduction
The ZXG10-BSC (V2) is of a multi-module structure and mainly contains the following seven functions:
1. Abis interface function
2. Circuit switching function
3. Packet switching function
4. Land equipment operation management and SS7 transfer function
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5. Radio resources management function
6. Transcoding and rate adaptation function
7. Sub-multiplexing function (designed for economizing the transmission equipment)
Different function unit names are categorized in the BSC (V2) based on the functions:
1. The function unit of the module that carries the BS interface function is named BIU (Abis Interface Unit). It is configured in the same shelf to complete the interface processing of the carrier frequency, and distribute traffic timeslots and signaling timeslots.
2. The function unit of the circuit switching module is named NSU (Network Switching Unit). It supports the network switching of 32K × 32K bits in frame consistency.
3. The function unit of the packet switching module is named as PCU (Packet Control Unit). It fulfills the GPRS function.
4. The function unit of the land equipment operation management and SS7 equipment is named SCU (System Control Unit). It implements direct management on the BSC land circuit equipment and transfer of SS7, ensuring consistent working of the BSC system.
5. The function unit of the radio resources management equipment is named RMU (Radio Management Unit) or RRU (Radio Resources Unit). It fulfills the service processing of 256/240 carrier frequencies.
6. The function unit of the transcoding and rate adaptation equipment is named TCU (Transcoding Unit) and AIU (A Interface Unit). It fulfills transcoding and rate adaptation.
Meanwhile, the modular structure enables the system to be configured with corresponding hardware/software according to the user capacity, and number of sites, etc. The module structure of the system is shown in Fig. 1-3.
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RMM1
RMM2
RMM7
SCM OMM
RMM8
...
Fig. 1-3 BSC module structure
1. OMM
It mainly fulfills configuration, management and maintenance of the foreground
equipment through the SERVER.
2. SCM
As the core of the BSC, this module is mainly for management maintenance of
the BSC equipment and allocation of SS7, and it consists of the following parts:
1) SCU (System Control Unit)
2) NSU (Net Switching Unit)
3) TCU (TransCoder Unit)
4) AIU (A Interface Unit)
5) BIU (Abis Interface Unit)
6) FSMU (Far SubMultiplexing Unit) and NSMU (Near SubMultiplexing Unit);
7) PCU (Packet Control Unit)
3. RMM (Radio Management Module)
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It is mainly for radio resources management and consists of RMUs. 1~8 RMMs
can be provided by the system.
1.2.2 Function structure
The general block diagram of the ZXG10-BSC is shown as Fig. 1-4:
NSU
BIU#11
RMU
BIU#12
BIU#81
RMU
BIU#82
NSMU
FSMU
…
8M× 2
2M× 8
Abis interface
RMM#1…
8M× 28M× 2
RMM#8
E1
…NSMU
FSMU
E1…
8M× 2
…
SCUBIE OMM
TCU AIU
TCU AIU
TCU
…
8M× 2
SCM
TCU AIU
TCU AIU8M× 2
…
A Interface
PCUGb Interface8M× 2
2M×16
Fig. 1-4 BSC system structure
Itemization of each function unit to boards helps to understand the basic structure of the BSC hardware system. Fig. 1-5 provides the basic structure of the BSC hardware system (the submultiplexing unit is omitted).
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MEM
MP MP
1RMU
MPMP
MPMPMP
SMEM
MP
SCU
BOSN
BIPP TCPP
TIC
TIC
SMB
#1
#6
…
E1× 4
#1( 2× 8M)Abis Interface
BIU
BIPP
#2
MPMP LAPD
S
……
kRMU
SYCK
TCPP
DRT
DRT
AIPPTIC
TIC
#1
#n …
#1 #1
#8 #8… …
E1× 4
AIU
TCU
NSU
DRT DTI
MPMP MPMP MPMP
PCU
A Interface
…
…
MEM
MP MP
1RMU
MPMP
MPMPMP
SMEM
MP
SCU
BOSN
BIPP TCPP
TIC
TIC
SMB
#1
#6
…
E1× 4
#1( 2× 8M)Abis Interface
BIU
BIPP
#2
MPMP LAPD
S
……
kRMU
SYCK
TCPP
DRT
DRT
AIPPTIC
TIC
#1
#n …
#1 #1
#8 #8… …
E1× 4
AIU
TCU
NSU
DRT DTI
MPMP MPMP MPMP
PCU
A Interface
…
…
BOSN
BIPP TCPP
TIC
TIC
SMB
#1
#6
…
E1× 4
#1( 2× 8M)Abis Interface
BIU
BIPP
#2
MPMP LAPD
S
……
kRMU
SYCK
TCPP
DRT
DRT
AIPPTIC
TIC
#1
#n …
#1 #1
#8 #8… …
E1× 4
AIU
TCU
NSU
DRT DTI
MPMP MPMP MPMP
PCU
A Interface
…
…
Note 1: The shaded blocks represent the boards of the BSC (V2) that are compatible in BSC (V1)
Note 2: k≤8, n≤15
Fig. 1-5 Basic structure of the BSC hardware system
1.2.3 Rack structure
Based on different functions, the BSC system is designed with six types of shelves. The BSC system function can be achieved via the combination of these six shelves.
The six types of shelves are as follows:
1. BCTL (Backplane of ConTroL)
2. BNET (Backplane of NET)
3. BATC (Backplane of A interface and TransCoder)
4. BBIU (Backplane of Abis Interface Unit)
5. BSMU (Backplane of SubMultiplexing Unit)
6. GPRS shelf PCU (Packet Control Unit)
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For example, a small-capacity configuration is as shown in Fig. 1-6 (single
rack):
6 BBIU
5 BCTL (RMU)
4 BCTL (SCU)
3 BNET
2 BATC
1 BATC
Fig. 1-6 Single-rack configuration
The system capacity can be enlarged through adding the BCTL (RMU) shelves, thus one SCM module can carry a maximum of eight RMM modules, and the BBIU shelves and the BATC shelves should be added correspondingly.
There are various modes for TC configuration, e.g., it can be located at the BSC side, or at the MSC side. Such configuration correspondingly determines the plug-in location of the BATC shelf.
1.3 Equipment installation and commissioning process
Normal and reliable operation of the ZXG10-BSC (V2) on the network is closely related to the quality of the project installation. Therefore, it is particularly important to create a set of systematic and proper installation process. The equipment installation process is shown in Fig. 1-7.
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St art
Pr oject p rep aratio n
Sta rt inspec tion
Rack insta lla tion
Electr ic installatio n
Transmiss ionconnect ion
Po wer-onaccepted T roubles hooting
S oftw areinsta lla tion
S ystem t est
End
N
Y
Fig. 1-7 Installation process of the ZXG10-BSC (V2)
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2 Equipment Structure
2.1 Equipment structure
The ZXG10-BSC (V2) is of a multi-module structure, and in accordance with the capacity, it can be physically configured as a single-cabinet structure or a multi-cabinet structure.
2.1.1 Features of single-cabinet structure
The dimensions of the single-cabinet are as shown in Fig. 2-1.
2200
mm
810mm
870mm
600mm
Side board
Support arms
Front door ( two leaves)
Fig. 2-1 Diagram of single-cabinet structure
Rack dimensions: 2200mm × 810mm × 600mm (height × width × depth);
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the width varying to 870mm when a side board is added.
This single cabinet features the following:
1. Solid structure, cabinet skeleton welded into a whole with section steel, with enough rigidity and strength.
2. Simple and clear-colored in international pop color series, natural combination of navy blue and off-white making the cabinet tidy, lively and vivid.
3. Easily installed/removed, conducive to debugging and maintenance. Both the front and back doors can be opened at either side. And the mounting boards at the two sides can be removed/installed conveniently.
4. Installed on top of the cabinet is the ventilation meshwork. Cabinets adopt forced heat dissipation mode, so that the cool wind enters the cabinet from its bottom, through the crevices between the circuit boards on each layer, while the hot wind goes out from the top meshwork.
5. At most seven plug-in boxes can be installed in the cabinet (including a power plug-in box on top of the cabinet).
2.1.2 Features of multi-cabinet structure
The multi-cabinet features the following:
1. The multi-cabinet structure means that many single cabinets with the same basic structure and dimensions are arrayed in an orderly row.
2. The four support arms under each single cabinet can be adjusted to keep them horizontal and at the same height. The cabinets can be located on the ground of the equipment room directly, or fixed on the section steel base in the equipment room without the four support arms.
3. When the cabinets are arranged in a row, the side boards are mounted at both sides of the array of cabinets while between the cabinets, there is none, as shown in Fig. 2-2. For multi-cabinet in more than one row,
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the side boards should be mounted at both sides of each row.
SideboardSide
board
Fig. 2-2 Multi-cabinet in one row
4. When the cabinets are arranged in one row, the upper and lower beams are tightly
fixed with bolts between the adjacent cabinets.
2.1.3 Structure features of the plug-in box
1. Dimensions of all the plug-in boxes: 279.5mm × 790mm × 319mm (height × width × depth).
2. Simply structured: it is composed of aluminum front beam, aluminum back beam, right/left side board and guide rail bar. The plug-in boxes with different functions just vary in the back plane and circuit cards.
3. The guide rail of the plug-in box is made of aluminum profile, and each plug-in box has 27 slots with the interval of 25mm between adjacent slots. The plug-in box structure is shown in Fig. 2-3.
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279.
5mm
319 m
m
790mm
25mmSide board
Aluminum back beam
Guide rail bar Backplane
Aluminumfront be am
Fig. 2-3 Plug-in box structure
2.1.4 Structure features of the card
The dimensions of all the plug-in PCBs are: 300mm × 234mm × 1.5mm (height × width × depth)
A card is composed of the panel, ejector lever and PCB. The name on the panel is corresponding to the slot on the plug-in box. On a PCB there are two plugs corresponding to the sockets on the back plane. The plugs are either 64-core or 96-core depending on the number of inlet wires. The structure of a card is shown in Fig. 2-4.
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234mm
300m
m
1.04
1.5mm
Plugs
Panel
Ejector lever
Fig. 2-4 Card structure
2.2 BSC rack configuration
2.2.1 No submultiplexing
1. N_trx≤240
For a small capacity, e.g., 240 TRXs, only one rack is needed, called dual-module BSC (one SCM and one RMM), and Fig. 2-5 illustrates the rack configuration.
Note: The number of the modules here corresponds to that of the BCTLs
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on the rack.
BBIU
BCTL (RMU)
BCTL (SCU)
BNET
BATC
BATCLayer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Fig. 2-5 N_trx≤240 rack configuration
If there are not many TRXs, just one layer of BATC might suffice.
2. 240<N_trx≤480
Here two racks should be configured to meet the capacity requirement, called three-module BSC, and Fig. 2-6 illustrates the rack configuration.
#1
BBIU
BCTL (RMU)
BCTL (SCU)
BNET
BATC
BATCLayer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
#2
BBIU
BCTL (RMU)
BATC
BATC
Fig. 2-6 240<N_trx≤480 rack configuration
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3. 480<N_trx≤720
Here three racks should be configured to meet the capacity requirement, called four-module BSC, and Fig. 2-7 illustrates the rack configuration.
#1
BBIU
BCTL(RMU)
BCTL (SCU)
BNET
BATC
BATCLayer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
#2
BBIU
BCTL (RMU)
BATC
BATC
BATC
BATC
#3
BBIU
BCTL (RMU)
Fig. 2-7 480<N_trx≤720 rack configuration
4. 720<N_trx≤960
Here three racks should be configured to meet the capacity requirement, called five-module BSC, and Fig. 2-8 illustrates the rack configuration.
#1
BBIU
BCTL (RMU)
BCTL (SCU)
BNET
BATC
BATCLayer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
#2
BBIU
BCTL (RMU)
BATC
BATC
BATC
BATC
#3
BBIU
BCTL (RMU)
BBIU
BCTL (RMU)
BATC
BATC
Fig. 2-8 720<N_trx≤960 rack configuration
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2.2.2 Rack configuration with submultiplexing
There are two submultiplexing access points in the ZXG10-BSC (V2): Acon interface and Ater interface, respectively as submultiplexing interfaces at the RMM and TC sides selected by users.
The number of sub-multiplexing units is calculated according to the number of modules located at the far end. When the Ater interface is a submultiplexing one, all TC units are located at the far end. Then every four layers of TC shelves need one pair of submultiplexing units (one NSMU and one FSMU) and one far-end TC rack. When the Acon interface is a submultiplexing one, every two far-end RMMs need one NSMU and several FSMUs (the number of FSMUs equals to that of the far-end RMM racks). The quantity calculation, according to the specific conditions during implementation, employs the following principles: every two RMMs in the same RMM room can share one far-end RMM rack, while the far-end RMMs in different RMM rooms cannot share the far-end RMM rack and FSMU (although they can share the NSMU).
1. Far-end racks in the case of sub-multiplexing
1) Far-end RMM rack
One far-end RMM rack is composed of one far-end sub-multiplexing shelf and
one or two groups of RMMs. The rack diagram is shown in Fig. 2-9.
BBIU-1Layer 6
BCTL (RM U-1)Layer 5
BBIU-2Layer 4
BCTL (RM U-2)Layer 3
FSM ULayer 2
Layer 1
Fig. 2-9 Far-end RMM rack diagram
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As required, one or two RMM modules can be selected.
2) Far-end TC racks
One far-end TC rack is composed of one far-end sub-multiplexing shelf and up
to four TC shelves. The rack diagram is shown in Fig. 2-10.
Layer 6
FSMULayer 5
BATC-1Layer 4
BATC-2Layer 3
BATC-3Layer 2
BATC-4Layer 1
Fig. 2-10 Far-end TC rack diagram
2. Near-end BSC racks in the case of sub-multiplexing
The rack diagram of the BSC central rack in the case of sub-multiplexing is illustrated in the following description, where we will use these abbreviations:
N13 – indicates that the TC is located at the near-end, one RMM is located at the near end, and three RMMs are located at the far end.
F21 – indicates that the TC is located at the far-end, two RMMs are located at the near end, and one RMM is located at the far end.
In addition, for “BSMU ()”, characters in brackets express the connected far-end unit.
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The locating principle of the near-end rack is to place sub-multiplexing shelves on Rack 1 and 2, and the rest by sequence.
1) Near-end BSC rack configuration in the case of N31
In this case, the near-end BSC includes all TCs and three RMMs; and the
far-end BSC has two RMMs. The near-end BSC rack configuration diagram is
shown in Fig. 2-11.
Layer 6
Layer 5
Layer 4
Layer 3
Layer 2
Layer 1
BSM U( BBIU-1)
BCTL( SCU)
BNET
BATC-1
BATC-2
#1
BBIU-2
BCTL( RM U-2)
BATC-3
BATC-4
BATC-5
BATC-6
#2
BBIU-3
BCTL( RM U-3)
BBIU-4
BCTL( RM U-4)
BATC-7
BATC-8
#3
Fig. 2-11 Near-end BSC rack configuration diagram in the case of N31
2) Near-end BSC rack configuration in the case of N22
In this case, the near-end BSC includes all TCs and two RMMs; and the
far-end BSC has two RMMs. The near-end BSC rack configuration diagram is
shown in Fig. 2-12.
Layer 6
BSMU(BBIU-1~2)Layer 5
BCTL( SCU)Layer 4
BNETLayer 3
BATC-1Layer 2
BATC-2Layer 1
#1
BBIU-3
BCTL(RMU-3)
BATC-3
BATC-4
BATC-5
BATC-6
#2
BBIU-4
BCTL(RMU-4)
BATC-7
BATC-8
#3
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Fig. 2-12 Near-end BSC rack configuration diagram in the case of N22
3) Near-end BSC rack configuration in the case of F31
In this case, the near-end BSC includes three RMMs; and the far-end BSC
includes all TCs and one RMM. The near-end BSC rack configuration diagram
is shown in Fig. 2-13.
Layer 6
B SM U (BB IU -1)Layer 5
BCTL(SCU)Layer 4
B N ETLayer 3
BSM U (BATC-1~4)Layer 2
BSM U (BATC-5~8)Layer 1
#1
BBIU -2
BCTL(RM U-2)
BBIU -3
BCTL(RM U-3)
#2
B BIU-4
BCTL(RM U -4)
#3
Fig. 2-13 Near-end BSC rack configuration diagram in the case of F31
4) Near-end BSC rack configuration in the case of F22
In this case, the near-end BSC includes two RMMs; and the far-end BSC has
all TCs and two RMMs. The near-end BSC rack configuration diagram is
shown in Fig. 2-14.
Layer 6
B S M U (B B IU -1~2)Layer 5
B C TL(SC U )Layer 4
B N E TLayer 3
B SM U (B A TC -1~4)Layer 2
B SM U (B A TC -5~8)Layer 1
#1
B B IU -3
B C TL(R M U -3)
B B IU -4
B C TL(R M U -4)
#2
Fig. 2-14 Near-end BSC rack configuration diagram in the case of F22
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2.2.3 GPRS rack configuration
The ZXG10-BSC (V2) GPRS is of standard configuration with only one rack including a set of GIU and eight sets of SPCUs. The rack number is arranged as GPRS rack following BSC rack when the racks are arranged side by side, and the GPRS rack structure diagram is as shown in Fig. 2-15.
B G IU
B P C U 1
B P C U 2
B P C U 3
B P C U 4
L a y e r 1
L a y e r 2
L a y e r 3
L a y e r 4
L a y e r 5
L a y e r 6
Fig. 2-15 ZXG10-BSC (V2) GPRS shelf diagram
In the ZXG10-BSC (V2) design, one SPCU unit contains up to seven BRP boards, three FPR boards, all of them are N+1 backed up. Of them, one BRP board can support up to 80 cells and 80 PS channels. Thus, one fully configured SPCU unit, containing up to six active BRP boards, can support a maximum of 480 cells or 480 PS channels. One FRP board at the Gb interface can process up to 10 NSVC. Therefore, one fully configured SPCU unit, containing up to two active FRP boards, can be configured with a maximum of 20 NSVCs.
2.3 Board configuration of each layer of units
1. The board configuration of the BBIU is shown in Fig. 2-16.
2
POWB
1 3
TIC
4
TIC
5 6
TIC
7
TIC
8 9
TIC
10
TIC
11
BIPP
12
BIPP
13
COMI
14
COMI
15
BIPP
16
BIPP
17
TIC
18
TIC
19 20
TIC
21
TIC
22 23
TIC
24
TIC
25 26
POWB
27
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Fig. 2-16 BBIU board configuration
2. The board configuration of the BCTL (RMU) is shown in Fig. 2-17.
2
POWB
1
SMEM
3 4 5
MP
6 7 8 9
MP
10 11 12
COMM
13
COMM
14
COMM
15
COMM
16
COMM
17
COMM
18
COMM
19
COMM
20
COMM
21
COMM
22
COMM
23
COMM
24
COMM
25
COMM
26
POWB
27
Fig. 2-17 BCTL (RMU) board configuration
3. The board configuration of the BCTL (SCU) is shown in Fig. 2-18.
2
POWB
1
SMEM
3 4 5
MP
6 7 8 9
MP
10 11 12
COMM
13
COMM
14
COMM
15
COMM
16
COMM
17
COMM
18
COMM
19
COMM
20
COMM
21
COMM
22
COMM
23
COMM
24
PEPD
25
MON
26
POWB
27
Fig. 2-18 BCTL (SCU) board configuration
4. The board configuration of the BNET is shown in Fig. 2-19.
2
POWB
1
CKI
3
SYCK
4 5 6
SYCK
7 8 9
BOSN
10 11
BOSN
12
DSNI
13
DSNI
14
DSNI
15
DSNI
16
DSNI
17
DSNI
18
DSNI
19
DSNI
20
DSNI
21
DSNI
22 23 24 25 26
POWB
27
Fig. 2-19 BNET board configuration
5. The board configuration of the BATC is shown in Fig. 2-20.
2
POWB
1
TCPP
3
TCPP
4
E/DRT
5
E/DRT
6
E/DRT
7
E/DRT
8
E/DRT
9
E/DRT
10
E/DRT
11
E/DRT
12
AIPP
13
AIPP
14
TIC
15
TIC
16 17
TIC
18
TIC
19 20
TIC
21
TIC
22 23
TIC
24
TIC
25 26
POWB
27
Fig. 2-20 BATC board configuration
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6. The board configuration of the NSMU is shown in Fig. 2-21.
The BSMU shelf can provide the near-end sub-multiplexing function, called the NSMU.
2
POWB
1 3 4 5 6 7 8 9
NSPP
10
NSPP
11
TIC
12
TIC
13 14
TIC
15
TIC
16 17
TIC
18
TIC
19 20
TIC
21
TIC
22 23 24 25 26
POWB
27
Fig. 2-21 NSMU board configuration
7. The board configuration of the FSMU is shown in Fig. 2-22.
The BSMU shelf can provide the far-end sub-multiplexing function, called the FSMU.
2
POWB
1
CKI
3
SYCK
4 5 6
SYCK
7 8 9
FSPP
10
FSPP
11
TIC
12
TIC
13 14
TIC
15
TIC
16 17
TIC
18
TIC
19 20
TIC
21
TIC
22 23 24 25 26
POWB
27
Fig. 2-22 FSMU board configuration
8. The board configuration of the PCU is shown in Fig. 2-23.
BRP
2
POWB
1
BRP
3
BRP
4
BRP
5
BRP
6
BRP
7
FRP
8
FRP
9
FRP
10
FRP
11
PUC
12
PUC
13 14
PUC
15
PUC
16
FRP
17
FRP
18
FRP
19
BRP
20
BRP
21
BRP
22
BRP
23
BRP
24
BRP
25
BRP
26
POWB
27
Fig. 2-23 PCU board configuration
9. The board configuration of the GIU is shown in Fig. 2-24.
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2
POWB
1 3 4
HMS
5
HMS
6 7 8 9
GIPP
10
GIPP
11
TIC
12
TIC
13 14
TIC
15
TIC
16 17
TIC
18
TIC
19 20
TIC
21
TIC
22 23 24 25 26
POWB
27
Fig. 2-24 GIU board configuration
2.4 Equipment parameters
The subsystem of the ZXG10-BSC is designed for the GSM900/1800 and EGSM900 systems, thus to control and monitor the BSs of 900MHz, 1800MHz and extended 900MHz specified in the GSM900/1800 and EGSM900 Specifications. It also fulfills the handover process between two cells in different frequencies of GSM900 and 1800, and implements proper configuration and adjustment to the planning of the two different cells.
While as a packet-style data service of the GSM, the GPRS is introduced at the GSM Phase2+, and provides end-to-end mobile data service based on the packet switching and transmission technology. It can utilize the radio resources and network land resources efficiently, and is especially applicable to long-term, small-traffic burst data services.
The main technical performance and parameters of the ZXG10-BSC (V2) is as follows:
1. Standard BSC in the switching matrix of 32K × 32K capacity.
2. Radio resources management and BS monitoring functions, implementing BSS operation and maintenance management and BS testing.
3. Supporting connection, paging, location and switching of the MS, providing the TRAU and GPRS functions, and supporting the uplink and downlink data service transmission functions of the MS.
4. The TRAU adopts the VAD technology, supporting discontinuously
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sending and receiving the DTX.
5. The TRAU can be set with an independent rack as independent equipment. The TRAU is shared by multiple BSCs or built in the BSC or MSC.
6. The PCU can provide cross connection function of the circuit service, enabling the A interface and Gb interface services to multiplex one PCM line, the timeslot of which can be flexibly configured.
7. Supporting transmission in both acknowledgement and non-acknowledgement mode of the uplink and downlink packet data.
8. Supporting channel coding modes of the CS1 ~ CS4, and dynamically adjusting the channel coding mode in accordance with the monitoring and testing results.
9. The MAC is in the dynamic allocation mode.
10. The PDCH coexists with the circuit service channel in the cell, and the dynamic conversion between the PDTCH and TCH channels according to the service status is supported.
11. Supporting the GSM900/1800 MHz and EGSM900M BS, and the automatic switchover of the MS between different modes.
12. Supporting the star, chain, ring and tree networking of the BTS.
13. Support multiple handover modes: Synchronized, asynchronized, pseudo-synchronized and pre-synchronized handover.
14. Supporting CBCH.
15. Supporting the SMS in both Chinese and English (point-to-point SM and cell broadcast SM).
16. Supporting the frequency hopping scheme in the unit of timeslot, and the TDMA frame frequency hopping is an instance of the timeslot frequency hopping.
17. Completely meeting all the data requirements of the power control
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and switching control indicated in the GSM05.08 Specification.
18. Supporting macro cellular, micro cellular and pico cellular systems.
19. Supporting concentric and multi-layer networking technologies.
20. Supporting a maximum of 512 cells, 1024 TRXs, featuring powerful processing capability, and capable of reducing the networking complexity of the system, improving the network quality and economizing the equipment room investment.
21. The largest traffic volume: 2000 Erlang (Erlang is the traffic load unit).
22. BHCA: More than 250K.
23. The interface link capability is as shown in Table 2-1.
Table 2-1 Interface link capability
Interface link type Maximum capacity
Abis interface 320 * E1 trunks
SS7 link 16 * 64K bit/s links or two 2M SS7 links
A interface 256 * E1 trunks
Gb interface 64M bit/s
24. The number of the A interface and Abis interface links can be flexibly configured as required.
25. The reliability index is the same as that of the switching system, and is compliant with specifications of the Red Papers of the Ministry of Post and Telecommunication and the YDN065-1997: the MTBF ≥ 0.1 million hours.
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26. Parameters of the system’s working environment and the BSC racks are shown in Table 2-2.
Table 2-2 Parameters of the system’s working environment and the BSC racks
Parameter name Parameter index
Power -48VDC
Rack dimensions
2200mm (H) × 810mm (W) × 600mm (D) (excluding the left/right side boards)
2200mm (H) × 870mm (W) × 600mm (D) (including the left/right side boards)
Power consumption ≤600W
Weight ≤200kg (excluding the left/right side boards)
≤270kg (including the left/right side boards)
Ambient temperature: 15°C~30°C (long-term)
Relative humidity 40%~65% (long-term)
DC voltage fluctuation range -57V~-40V
AC voltage fluctuation range 198V~242V
Frequency deviation 50Hz±5Hz
The software structure of the ZXG10-BSC (V2) features the following:
1. Perfect fault tolerance of the BSS state machine can allow the sequence of various messages of A interface and Gb interface, thus improving the butting capability between the BSC and various types of MSCs/SGSNs.
2. The BSS state machine can enhance the traffic processing capacity of BSC.
3. It has a perfect design in transaction handling, and features high reliability and security.
4. It has an automatic emergency self-protection system, so as to guarantee the user application in case of BCCH carrier frequency failure.
5. The diagnosis and testing system and monitor-alarming system ensure a secure and reliable operation of the system.
6. It can automatically adjust the configuration of the circuit service and packet service in accordance with the practical services, thus ensuring full use of the radio resources.
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3 Preparation of Installation
3.1 Check of installation environment
3.1.1 Requirements on equipment room
1. Layout of equipment room
Generally, the equipment room is classified into main equipment room and
auxiliary equipment room. The main equipment room is used to install the
principal equipment of the BSC system, while the auxiliary equipment room is
used to install such accessories as the operation and maintenance equipment,
manual position, UPS, battery set, etc. To make the principal equipment run in
an independent environment and at the same time facilitate maintenance and
management, the main and auxiliary equipment rooms must be separate but
not far from each other to make the connecting line between them as short as
possible. The operation and maintenance station is arranged in the way that
the operation and maintenance personnel face the front side of the principal
equipment. Generally the main equipment room and the operation and
maintenance room are separated with a glass wall. And, once conditions permit,
the principal equipment and the primary power supply should better not be
installed in the same room.
2. Area of equipment room
The area of the equipment room should be sufficient to hold the principal
equipment and auxiliary equipment of the BSC system for the final capacity
and to pile materials and equipment. In front of the BSC system cabinet, there
should be at least 1.5m clear space for the convenience of opening the door
and maintenance. When cabinets are arranged into multiple rows, the front
side of the first row of cabinets faces the operation and maintenance console,
and two rows of cabinets are arranged back to back. The distance between the
back sides of two rows of cabinets is not less than 1.2m, and the distances
between the front/back/left/right side of a cabinet row and the wall is not less
than 0.8m (the distance between the side with adjusting and testing devices
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and the wall is 1m).
3. Height of the equipment room
The height of the equipment room refers to the clear height from the beam
bottom or wind duct to the upper surface of the floor. It shouldn’t be lower than
3m for upper routing and 2.7m for lower routing.
4. Walls and doors/windows of the equipment room
The walls of the equipment room should be treated with anti-absorbing, fireproof and dampproof coatings or wall paper, or coated with lusterless paint. The layout of the doors and windows of the equipment room should be reasonable with the effective height no less than 2m and width of 1m after opening the door. Doors and windows should better be double-layer glass, sealed with the dust-proof rubber strip, and should be kept clean.
5. Floor of the equipment room
The weight-bearing capacity of the floor in the main equipment room is more than 450kg/m2, and that of the auxiliary equipment room is more than 300kg/m2. The floor must be laid and supported in a flat and firm way. The level error per square meter is no more than 2mm.
The floor must be anti-static. The system resistance value of the floor should comply with YD/T 754-95 General Rules for Anti-Static Protection of Communications Equipment Room (issued in June 1995). The floor must be statically grounded by connected to the grounding facilities with highly conductive line via the 1MΩ current-limiting resistor.
In addition, the optimum height of the floorboard is 300mm to 330mm, without garish patterns. The paints on the surface of the floor shall be lusterless without the volatilization of harmful substances. Dampproof, rodent-resistant and mothproof precautions shall be taken under the floor.
If the lower wiring mode is employed, hidden pipes, ground slots and openings shall be reserved under the floor, and their quantities, locations and sizes shall meet the requirements for laying various wires and cables,
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with the convenience for maintenance and laying of cables during future capacity expansion.
The equipment environment needs to meet the following requirements as well:
1. Requirements for temperature and relative humidity
The temperature and humidity of the working environment inside the
equipment room are measured at the spot of 1.5m above the floor and 0.4m
away from the equipment when there is no protective plate in front of or at the
back of the equipment rack. The measured value of working environment of the
ZXG10-BSC shall meet the following requirements as shown in Table 3-1.
Table 3-1 Requirements of the ambient temperature and relative humidity
Name Long-term working conditions Short-term allowed conditions
Temperature 15°C~30°C 0°C ~45°C
Relative humidity 40%~65% 20%~90%
Here short-term working duration means no more than 48 consecutive hours, and no more than 15 accumulated days in one year.
2. Electromagnetic interference resistance design
The equipment room shall be far away from high-power radio transmitting station, radar transmitting station, and high-frequency large-current equipment. The actual electric field intensity radiated to the equipment room shall be controlled below 300mV/m, and the intensity of magnetic field shall be less than 11Gs.
Generally, the following anti-radiation measures are recommended:
1) Shield the equipment room or shield against the definite electromagnetic radiation interference source.
2) Install a shielding wall between the principal equipment of the system
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and the equipment containing a transmitter with high-frequency radiation, and using separate power supply lines.
3) The power line and the conductive line in the pipe shall be grounded reasonably and the shield layer of all the cables shall be grounded.
4) Twist the signal lines and return lines so that the conductive voltage caused by the line radiation interference offsets itself.
5) Separate the power supply lines and signal lines as much as possible and avoid laying them down in parallel.
6) Strictly separate the grounding wires of the AC and DC power supplies in the equipment room.
3. Air-conditioning and ventilation design
Too high or too low temperature and humidity in the equipment room will bring about unfavorable effects to the equipment’s life span. For example, when the temperature is 10°C over the normal temperature, the equipment life span will be half reduced. Too low temperature will weaken the performance of the optical components, transistors and other devices. Under long-term high relative humidity, the insulation of some insulating material may degrade or leakage may even happen, and the metal parts of the equipment may corrode. While the low relative humidity in long term will make the insulating gaskets dry and shrink thus the fixed screws may become loose and strong static discharge may be generated, damaging the CMOS circuit on the machine.
In order to guarantee the environment conditions for equipment operation, air-conditioning and ventilation devices must be installed. Generally, the main equipment room shall be equipped with the air-conditioning equipment that runs perennially, and other auxiliary equipment rooms shall also be equipped with the air-conditioning equipment that runs seasonally according to various conditions (including the climate condition and the economic condition of the user).
The basic requirements of the air-conditioning equipment are:
1) Air-conditioning humidity: 30% ~ 75%
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2) Air-conditioning temperature: 18°C ~ 28°C
The capacity of the air-conditioning and ventilating system shall be determined on the basis of calculating the quantity of heat produced by the principal equipment of the system plus the quantity of heat produced by external heat sources (such as the heat radiated by the sun to the equipment room through the window or wall, the heat produced by the maintenance personnel inside the equipment room as well as the heat brought by the maintenance personnel when coming in or going out).
In order to guarantee the safe and reliable operation of the air-conditioning and ventilation system, the air-conditioning equipment is generally required to be dual systems, with the capacity of each system more than half of the total air-conditioning capacity.
The airtight conditions of the equipment room must not be damaged due to the installation of air-conditioning equipment, meanwhile, the content ratio of fresh air delivered to the equipment room shall not be less than 5%, so as to guarantee the appropriate air freshness inside the room.
To ensure the cleanness of the air, the dirt density and particle size, the densities of salts, acids and sulfides should strictly comply with CF 014-95 Communications Equipment Environment Conditions (Provisional Regulations), because these harmful gases may speed up metal corrosion and aging of some parts. Measures shall also be taken to prevent the incursion of such harmful gases as SO2 and H2S into the equipment room, so as to protect the health of the working personnel.
Since hot air generally flows upward, the cooling and heat radiation of the principal equipment also employs the upward exhausting mode. So, when centralized air-conditioning system is installed, the air should be taken in from the bottom and returned to the top. The air inlet is located under the movable floor, which is helpful for the heat radiation of the equipment. The blast pipe is not installed on the top, guaranteeing that no dew will be produced under any circumstance.
Generally speaking, large equipment rooms should be equipped with the air-conditioners with humidity regulation, while small equipment rooms
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may just be equipped with the common-type cabinet or window air-conditioners.
4. Fire protection design
The main building of the equipment room must meet corresponding requirements in the national GBJ 16-17 Fire Protection Specifications in Building Engineering. Based on the local fire protection regulations, the corresponding fire equipment shall be equipped and sufficient fire passages shall be reserved. Notice boards bearing “Key Fire Protection Site” shall be hung at proper locations. It is strictly forbidden to store flammable or explosive articles in the principal or auxiliary equipment room, and notice boards with “No Smoking” or “Smoking and lighting fires strictly forbidden” shall be posted up at eye-catching places. Effective fire-fighting equipment shall be equipped and placed within easy access, and effective water supply facilities for fire fighting shall be installed at proper positions. The stored amount of water for fire protection is expected to guarantee the fighting of fire for 2 hours. However, it is inadvisable for the water supply pipes, water drainage ducts and rainwater ducts to pass through the equipment room, and fire hydrants should not be installed in the equipment room. Alarming devices for smog and high temperature shall be installed and inspected frequently to guarantee their good performances.
5. Illumination design
An incandescent light bulb (or emergency lighting device) should be installed at a proper place between the racks to provide light for equipment installation and maintenance. At the same time, the equipment should be kept from long-time exposure to the light or sunshine lest that the circuit boards or components will easily distort or age due to the long-time high temperature. It is recommended that colored glass and non-tint transparent curtain be used for windows. The principal illumination of the equipment room employs fluorescent lamps that are embedded into the ceiling, with an average illumination of 300~450Lx.
6. Lightning protection design
The lightning protection design is the most important content in security design. When the height of the building’s main-body or its auxiliary facilities (such as chimney, antenna, and water tower) is over 15m, effective lightning protection measures shall be taken according to the lightning protection requirements for Class II civil buildings and
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constructions. In the lightning protection design, measures shall be taken to guard against direct-strike lightning and the incursion of lightning current. Protective measures should also be taken to defend flank attack lightning when a high-rise building serves as the equipment room. Flank attack lightning is often encountered in areas rich in lightning (e.g., Guangxi, Jiangxi, Guangdong, Fujian, Hunan, and Yunnan with more than 80 daily lightnings). Therefore, protective measures against flank attack lightning shall be taken in design in line with the specific conditions, e.g., connect the metal window frame of the building with the lightning protection lead wire, or install horizontal lightning-protection metal straps on the external surface of the wall by separating them with certain spaces along the height of the building.
The following lightning protection measures shall be taken for the main building body of the equipment room.
1) Install lightning protection nets or lightning protection straps on the parts of the building that are liable to lightning.
2) Protruding objects such as chimney, antenna and water tower, shall be equipped with overhead conductor or arrestor.
3) The sectional area of the lead wire of the lightning protection device is no less than 200mm2, with a distance not greater than 30m, and the impulse grounding resistance of the lightning protection grounding device for the building is not greater than 10Ω.
4) Outdoor cables and metal pipes are grounded before coming into the building;
5) The grounding entities shall be the metal parts (e.g., walls, reinforcing steel bars inside pillars) of the building itself, which shall be used as the lead wire of the lightning ground, and such lead wires shall be electrically connected with each other to balance the electric potential inside the building.
In the past, the lightning protection ground of the building was separated from the ground of telecom and power supply systems, and large distances were required between various grounding devices. However, due to such reasons as small building
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sites, most of these requirements of distance were not satisfied. In fact, they can not be separated in many circumstances, so it is advisable to employ joint grounding systems for the lightning protection of the buildings. The joint grounding system connects the operating ground and protection ground for telecom use and the lightning protection ground of the building as well as the ground of the industrial frequency AC power supply system together. The requirement for the grounding resistance of joint grounding is quite strict. Since the grounding resistance required for BSS equipment room is less than 10Ω, while the grounding requirements for different telecom equipment vary, the joint grounding resistance shall be determined according to the minimum resistance value of the various grounding devices.
In addition, proper lightning protection devices for the power supply must be installed to the lines of the mains input to the equipment room.
7. Quakeproof ability
The BSC room shall be equipped/installed with quakeproof facilities, so that the
switching system room has the ability to withstand the earthquake with a
seismic magnitude of 7 on the Richter scale.
8. Anti-static design
The influence of static electricity on the equipment may often be neglected, but it is a very serious problem, to which great attention must be paid. From the data available from related materials and the failure analysis made to the on-site repaired parts of ZTE Corporation, 50% of the component damage among damaged parts is caused by static electricity. In addition, the destruction of static electricity to the device is often not the once-for-all kind, it will accumulate these damages, and in this course, intermittent failure or performance deterioration will occur in the operation of the equipment. The static electricity may cause software fault, as a result, the electric switches and control circuits may not function properly or even act wrongly.
Static induction mainly originates from the following aspects:
1) External electrical fields, such as outdoor high-voltage power transmission lines and lightning.
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2) Internal systems of indoor environment, floor material and overall structure, etc.
3) Discharge of the static electricity on the body of the O&M personnel to the equipment through body contact.
In order to effectively eliminate the harm due to electric static discharge (ESD),
the following measures may be taken:
1) Ground the equipment well;
2) Lay anti-static floor and make grounding connection for the floor.
3) The O&M personnel should wear ESD wrist ring in operation, and connect the ESD ring with the electric static discharge hole on the equipment rack.
3.1.2 Requirements on power supply and grounding
1. DC power supply requirements:
1) Voltage range: the nominal voltage of the primary power supply to the equipment room shall be -48V, which has an allowance of -57V~40V.
2) The noise level indices of DC power supply voltages shall meet the general specifications of the former MPT.
3) The DC power supply shall have over-voltage/current protection and indication system.
2. AC power supply requirements:
1) Three-phase power supply: 380V±38V, 50Hz±2.5V, waveform distortion <5%
2) Single-phase power supply: 220V±22V, 50Hz±2.5V, waveform distortion <5%
3) The standby generator voltage waveform distortion shall be
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5%~10%.
3. Grounding requirements
Grounding plays an important role in guaranteeing a good electromagnetic condition and anti-interference ability for the operating environments of the principal equipment and auxiliary equipment of the system, so great attention must be paid.
Firstly, it should meet YD/T 1051-2000 General Technology Requirements on Power Support System of Communication Bureau (Station), details of which are mentioned in 6. Lighting protection design of 3.1.1. Next, certain factors that affect the grounding resistance should be taken into consideration such as state of soil, grounding body resistance and grounding cables.
1) The type of the soil has the greatest influence on the grounding resistance. For a place with poor soil state, resistance reducing agent (e.g., propenamide) can be added around the ground pole to reduce the resistance rate of the soil and the contact resistance between the soil and the grounding devices. Temperature and humidity may also affect the grounding resistance. When the temperature is lower than 0oC and the humidity is too low, the grounding resistance varies greatly. So in northern districts, the grounding stake may be buried deeply and the chemical auxiliaries may be added to meet the requirements for grounding resistance.
2) The connecting cables between the grounding stake and the grounding bolt on the principal equipment of the system shall be of copper core, with a sufficiently large sectional area that is generally no less than 50mm2. The length shall be as short as possible and the sectional area of the copper wire shall be increased further when the length exceeds 50m. Both ends of the connection wire shall be processed with tinning or thermal tin dipping, and the coating, varnish, paint and oxidized layer, etc., shall be removed from the fastening points, so as to guarantee good contact between the two metal surfaces. All the grounding connection parts should be protected against rusting, and the grounding bolts must be secured by using the mechanical method to guarantee the connection with low resistance.
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The grounding stake should be of angle iron with a length not less than 2m, and it would be best to use a grounding net if conditions permit.
3) It must be pointed out that, before the commissioning of the equipment, the user should take an accurate measurement of the grounding resistance, and provide data to the engineering personnel of our party. If the grounding resistance does not meet the requirement, principally, the commissioning should be postponed till some measures are taken by the user (our party may dispatch engineering personnel for assistance if necessary) and the grounding resistance meets the requirement. After the equipment is put into operation, the maintenance personnel must measure the grounding resistance regularly and record the results. If the grounding resistance increases, proper measures should be taken to reduce it, so as to meet the requirements for grounding resistance during equipment operation.
3.2 Instrument and meter preparation
1. Mechanical installation toolkit.
Professionals will complete mechanical installation and provide guide for
on-site installation.
2. Electrical installation toolkit. ZTE professionals must participate in electrical installation.
3. Other related instrument and meters contain the following types:
1) Straight screwdriver and cross screwdriver
2) Tweezers
3) Piers (nipper pliers, slope pliers, and pincer pliers)
4) Iron
5) Extractor
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6) Multimeter
7) Programming card
8) Eraser
9) Anti-static wrist strap
4. Installation notice
Before unpacking and installing the equipment on site, the user should notify ZTE engineers to go to the site.
3.3 Technical resources preparation
The commissioning personnel shall prepare the corresponding technical documents for reference:
1. ZXG10-BSC (V2) Technical Manual
2. ZXG10-BSC (V2) Installation Manual
3. ZXG10-BSC (V2) Operating Manual
4. ZXG10-BSC (V2) Maintenance Manual
3.4 Unpacking and inspection
As the ZXG10-BSC equipment is rather expensive, it should be well packed and attached with clear waterproof and shockproof marks during its transportation. After the equipment arrives at the operator’s installation site, it should be handled with care and kept away from sunlight and rain.
Before unpacking and inspecting, count the overall number of the components
against the attached shipping list, check whether the appearance of the case is
intact. If yes, unpack it. If there are cargo mistakes, shortage or the package is
severely damaged, stop unpacking immediately and report it to related
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departments to find out the cause.
1. Notes for the unpacking inspection
1) When the equipment arrives on site, both the engineers of ZTE Corporation and representatives of the user must be present for the unpacking inspection. If the customer unpacks the equipment on his own, ZTE Corporation will not be responsible for any harmful consequences.
2) During the unpacking, the equipment should be handled gently so as to protect the surface paint of the equipment. And please pay attention to the anti-static requirements of circuit boards.
2. Unpacking
Parts list and technical documentation are put in No. 1 packing box.
Connecting bolts between racks are put in the control cabinets.
1) First, open No.1 packing box. The installation personnel should first read the technical documents and check the list. If there is any damages inside the packages, careful inspection should be done and detailed records should be taken.
2) Wooden case for side boards: open the side cover, take out a pair of well-bound side plates, cut the band open and take the plates out.
3) Wooden case for doors: Open the side cover and take out the bound front and back doors, then cut off the binding strap and take out the two pairs of doors.
4) Wooden case for racks: first, open the top cover (cover with the arrow of storage and transportation), make the case upright, note that the support arm is adown, and pull out the racks from the case.
3. Counting the pieces
After unpacking, check the devices with the configuration table and packing list, check whether the accessories are complete, and whether the parts are deformed or damaged.
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Finally, the field engineers of ZTE and the user shall jointly sign the Unpacking and Inspection Report and return it to the Marketing Department and the local office in the specified time.
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4 Hardware Installation
4.1 Hardware installation flow
The installation steps of the ZXG10-BSC (V2) are briefly shown in Fig. 4-1.
Start
Constructenvironment of
equipment room
Install racks
Install POWP
Preliminaryinspection
End
Acceptanceinspection
Install otherequipment
Y
N
Y
N
Fig. 4-1 Installation flow of the ZXG10-BSC (V2)
4.2 Installation of the rack
4.2.1 Rack installation
1. Before rack installation, find out the wire-routing direction. For the top cabling mode, first remove the top cover of the rack.
2. For shockproof considerations, the rack still has to be reinforced. The
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base, as shown in Fig. 4-2, can be produced by the user or customized by ZTE, while the height of the bracket depends on the floor height.
1. Bracket 2. Channel section steel
Fig. 4-2 Schematic diagram of the base
3. Horizontal adjustment of the section steel base: Loosen the fixing bolts between the section steel guide rail and the bracket, and adjust the adjustable bolts between the rail and the bracket until the rail is horizontal; then add proper steel blocks between the rail and the bracket near the fixing bolts and loosen the adjustable bolts; finally, tighten the fixing bolts, as shown in Fig. 4-3.
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1. Standard floor 2. Channel section steel 3. Hexagonal bolt 4. Adjustable bolt
5. Bracket 6. Stand bar bolt 7. Spring washer, plain washer, nut 8. Steel block
Fig. 4-3 Schematic diagram of the base’s horizontal adjustment
4. Fixing of a rack: First remove the four stand bars under a rack, and fix the rack to the section steel base with bolts, plain washers, spring washers, and nuts, as shown in Fig. 4-4.
1. Standing column 2. Spring washer, plain washer, nut 3. Nut pad 4. Hexagonal bolt
Fig. 4-4 Schematic diagram of rack fixing
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4.2.2 Connection between racks
Racks can be connected in two modes:
Fig. 4-5 shows the first mode of rack connection. The short beams of the top and bottom shelves of the rack are equipped with connecting plates, between which four M8 × 25 hexagonal bolts, four plain washers, four spring washers and four nuts are used respectively to secure the two racks.
1. Spring washer, plain washer, nut 2. Connecting block 3. Hexagonal bolt 4. Shelf
Fig. 4-5 Schematic diagram of rack connection mode I
Fig. 4-6 shows the second connection mode. On the sides of the short beams of the top and bottom shelves of the rack there are mounting holes, where four M10 × 100 hexagonal bolts, four plain washers, four spring washers and four nuts are used to secure the two racks.
1. Spring washer, plain washer, nut 2. Short beam 3. Hexagonal bolt 4. Long beam
Fig. 4-6 Schematic diagram of connection mode II
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4.2.3 Connection between the side plate and rack
Side plates are attached to the left and right sides of the rack. The connection between the upper end of the side plate and the rack is shown in Fig. 4-7. The upper end of the side plate is connected to the short beam on the top via bolts with spring slip rings.
1. Pins, spring 2. Slip ring 3. Hanging board 4. Spring washer, plain washer, nut 5. Shelf 6. Upper end of the side plate
Fig. 4-7 Schematic diagram of connecting the upper end of the side plate to the rack
The lower end of the side plate can be connected to the rack in two modes.
1. As shown in Fig. 4-8, use M8 × 25 hexagonal bolts, plain washers, spring washers and nuts to connect the lower hanging board of the side plate to the connecting plate on the short beam of the bottom frame of the rack.
1.Spring washer, plain washer, nut 2. Beam 3. Connecting block 4. hexagonal bolt 5. Shelf 6. Lower end of the side plate
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Fig. 4-8 Schematic diagram of side plate-rack connection mode I
2. As shown in Fig. 4-9, on the lower hanging board of the side door and on the short beam of the bottom frame, there are mounting holes, where the M8 × 25 hexagonal bolts, plain washers, spring washers and nuts can be used in the fastening.
1. Washer 2. Hanging board 3. Hexagonal bolt 4. Shelf 5. Lower end of the side plate
Fig. 4-9 Schematic diagram of connection mode II
4.2.4 Installation of the front door and rear door
There are eight pivots installed on the rack framework. During installation of the front/rear door, place the bottom hole of the door to the sleeve on the pivot. And on the back of the upper part of the door there is a hook with a spring. Now pull it down till the pivot pin aims at the upper pivot. After the door is installed, it should be easily closed and opened. When the screws of the pivot are loosened, the location of the supporting board of the pivot can be adjusted to the left or right till equal door clearance is reached.
4.3 Installation of the power P (POWP) of the rack
4.3.1 Introduction to functions
At the top of the rack is the POWP distribution box, which has two primary inputs, and, after insulation, the two inputs are provided to the whole rack in two channels via the busbar of the rack. The fan inside the POWP
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distribution box cools the whole rack. The fan is also powered by the insulated primary power supply. Inside the power distribution box are three PCBs, two of which, on the left and right respectively, are boards with the same functions for insulating POWP.
The POWP distribution box has such functions as detecting the -48V voltage of the input primary power, monitoring the over-/under-voltage as well as monitoring, indicating and giving alarm for the system status and lightning protection.
4.3.2 Functionality
1. Two channels of primary power supply
The main feature of the POWP distribution box of the ZXG10–BSC (V2) is the 1+1 protection of the primary power supply. That is, if only one of the two primary power supplies is normal, then the busbars on both sides of the rack will keep a normal power supply, thus the power supply is kept stable. The primary power supply reaches the POWP insulating board via the 30A air switch.
2. POWP insulating board (POWI9806)
The function of the POWP insulating board is to insulate the input –48V from the output -48V to prevent the two primary power supplies from interfering with each other. At the input end of the primary power supply, over-voltage protection is available; while at the output end of the primary power supply, lightning protection is available. This board is especially designed for the safety and reliability of the main lines of the –48V, the –48V ground, and the protection ground (P.GND). The connecting wires between the terminals on the back of the POWP distribution box and the POWP insulating board and the connecting wires between the switch and the POWP insulating board are both soldered.
3. POWP detecting board (POWT9806)
The POWP detecting board functions to detect and display the status of
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the left and right primary power supply inputs and the status of the fans. This board adopts a chip-microprocessor system (89C51), and uses the A/D converter (MAX187) to detect the –48V output voltages of POWP on a real-time basis, monitor the supply of the POWP system and its operation, and report the results to the control layer via the RS485 bus as well.
4. Clear and reliable wire connections
The connecting wire of –48V, –48V ground and protection ground inside the POWP distribution box are reliable, and will not become loose even when the panel of the box is removed. For both the POWP distribution box and the POWP circuit board, wiring descriptions are provided to avoid any wrong installation. The –48V grounding wire and the protection grounding (P.GND) wire on the rear of the box are soldered and then fastened to the terminal. Wires inside the POWP distribution box are fixed with metallic clips so that the wires do not fall off. All slots of the POWP boards have lockers to avoid inverse insertion.
The terminals must be safe and reliable. The main connecting wires of the –48V, –48V ground, and protection ground employ the multi-strand soft wires with a diameter of 2.8mm, i.e., 19 strands altogether, each strand having a diameter of 0.06mm.
The colors of the –48V, –48V ground and the protection ground connecting wires must keep identical to those of the connecting wires on the busbar.
5. The system will be able to timely detect the output voltages and working statuses and give alarm timely
The POWP detection system can timely and accurately detect the –48V output voltage of the POWP through A/D conversion; and can timely report to the control layer via the RS485 bus the working conditions of the POWP and the fan system. Meanwhile, in hardware, it can display the working status on LEDs on a real-time basis and give timely alarms.
6. Reasonable thermal design with a little redundancy
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Against the maximum system load requirements and the worst working environments, the system thermal design is performed. On the basis of reasonable thermal design, and considering the long-time faultless operation of the POWP, the thermal design of the POWP has made adequate redundancy so that the life span of the power devices is prolonged, and system reliability is greatly enhanced.
7. Replacement of devices when power is on
Inside the POWP distribution box, the working status of the fan can be detected timely, and once the fan breaks down, it can be replaced when power is on.
8. Protection functions
When the input power supply is inverted, or the load is shorted, the air switch (30A) can effectively cut off the primary power supply. A fan short-circuit can burn the fan’s fuse, but the detecting circuit of the POWP board does not affect the -48V power supply. When any of the left and right power supplies fails or shuts down, the detecting board can still work normally.
4.3.3 Input, output and indicators
The POWP distribution box has two (left and right) primary power supply inputs on the rear, each consisting of–48V, –48V ground and protection ground (P.GND).
It has two (left and right) outputs on the rear, each consisting of –48V, –48V ground and the protection ground (P.GND). The output is fulfilled in the parallel dual mode. On the rear of the POWP distribution box there is an RS485 output port. The POWP detecting board has five red fan alarm indicators. In case a fan breaks down, the corresponding indicator will turn on. On the panel of the POWP distribution box there are four LEDs, whose meanings are given in the Table of POWB and POWP Panel Indicators in Section 5.1.4.
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4.4 Installation of internal wires
In the rack of the ZXG10-BSC (V2), there are various boards and backplane jumper cables with different configurations. Functions of boards vary with jumpers, including the clock interface board (CKI), digital switching network interface board (DSNI), trunk interface circuit board (DTI), module processor (MP), etc. In addition, jumper cables on the backplane will cooperate with the system RS485 bus to monitor functions of backplanes of each layer. Listed below are jumper descriptions in the alphabetical order.
4.4.1 Clock interface board (CKI)
The CKI board has a total of 20 jumpers ranging from X5 to X24, used to select the matching impedance under different clock references. The jumpers are described in Table 4-1:
Table 4-1 Jumper description for the CKI board
Jumper name Jumper description
X5~X8
Used respectively to select the line matching impedance for the 2MHz references of 2MHz0, 2MHz1, 2MHz2, and 2MHz3. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
X9~X12
Used respectively to select the line matching impedance for the 5MHz references of 5MHz0, 5MHz1, 5MHz2 and 5MHz3.When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
X13~X15 Select the characteristic impedance of line 0 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
X16~X18 Select the characteristic impedance of line 1 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
X19~X21
Select the characteristic impedance of line 2 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
X22~X24
Select the characteristic impedance of line 3 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.
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4.4.2 Digital switching network interface (DSNI) board
The DSNI board has a total of 3 jumpers, X3, X4A, and X4B, which can be configured to connect the COMM board (of MP level) and the PP board (of PP level). The jumper descriptions are listed in Table 4-2:
Table 4-2 Jumper description for the DSNI board
Jumper name Jumper description
X3, X4A and X4B
Used for DSNI configuration; when pin 1 and pin 2 are connected, configure it as DSNI of MP level, connecting with the COMM board; when pin 2 and pin 3 are connected, configure it as DSNI of PP level, connecting with the PP board.
4.4.3 Trunk interface (TIC) board
The TIC board has a total of six DIP switches ranging from S2 to S7, which are used to configure the matching impedance and line frame format. Descriptions of DIP switches are listed in Table 4-3.
Table 4-3 Descriptions of DIP switches for the TIC board
Line frame format configuration
Software-related configuration Description TIC position
S2
At the Gb interface 120 B X X
75 A X X
off
on
, X0XX
There is no E1 frame format on the line. It works in transparent mode.
At the non-Gb interface 120 B X X
75 A X X
off
on
, X1XX Transmit in the E1 frame format
Impedance matching configuration
Line impedance
75Ω 120Ω
Software-related configuration
S2 120 B X X
75 A X X
off
on
, 1XXX 120 B X X
75 A X X
off
on
, 0XXX
4-line E1 impedance matching
S3 120 120 120 120
75 75 75 75
off
on
, 1111 120 120 120 120
75 75 75 75
off
on
, 0000
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Bt8370 of line 1 S4 120 120 120 120
75 75 75 75
off
on
, 1111 120 120 120 120
75 75 75 75
off
on
, 0000
Bt8370 of line 2 S5 120 120 120 120
75 75 75 75
off
on
, 1111 120 120 120 120
75 75 75 75
off
on
, 0000
Bt8370 of line 3 S6 120 120 120 120
75 75 75 75
off
on
, 1111 120 120 120 120
75 75 75 75
off
on
, 0000
Bt8370 of line 4 S7 120 120 120 120
75 75 75 75
off
on
, 1111 120 120 120 120
75 75 75 75
off
on
, 0000
Note: 1=on; 0=off
4.4.4 Module processor (MP)
The MP board has one 8-bit DIP switch, which is used to set the MP node number. In BSC, this value indicates the BSC module number in the same NE, within the range of 1 to 32 (on the PCB, 1 indicates the lowest bit, while 8 the highest bit). It will do so far the foreground and background configurations are the same. The DIP switch of MP is shown in Fig. 4-10.
Value: 1 Value: 32
Fig. 4-10 DIP switch of MP
4.4.5 Configuration of backplane jumpers
4.4.5.1 Near-end units
The backplane jumper configurations are shown in Fig. 4-11. The backplane jumpers (6 × 2) are used to configure the slot numbers on each layer. To cooperate with the RS485 bus monitoring system, there is also a
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1 × 2 jumper located under the 6 × 2 jumpers, used to set the terminal matching resistance. The following description is given when facing the rear of the rack.
SIG6-1=011111Layer 6
SIG6-1=101111Layer 5
SIG6-1=110111Layer 4
SIG6-1=111011Layer 3
SIG6-1=111101Layer 2
SIG6-1=111110Layer 1
Top of the back of the rack
Bottom of the back of the rack
Fig. 4-11 Backplane jumper configuration
The 6 × 2 jumpers on the left side and right side represent signals SIG1~6:
They are used to set the slot No. The interior pin is the ground, and the exterior pin is the signal. Short-circuit signal is 0, and open-circuit signal is 1. Configurations of SIG1 ~ SIG6 must be the same. The left and right sides are distinguished by SIG7. This signal is fixed to a high level on the left side, while on the right side, it is fixed to the ground.
The 1 × 2 jumpers on the left and right sides:
They are used to set the matching resistance. Short-circuit: using the 120Ωterminal matching resistance; open-circuit: not using the terminal matching resistance. If this layer is at the last node of the RS485 bus link,
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then the matching resistance should be connected. Otherwise, the jumper should be open. On the same RS485 bus link, only one jumper should be configured to be short-circuited.
4.4.5.2 Far-end units
On the SMU backplane of the far-end unit, besides the jumper units the same as mentioned above, there are also jumpers for RS485 configuration, as follows:
X140 and X141 are used to configure the slot No. of the GPP board, which can be configured as FSPP, NSPP or GIPP by connecting X140 and X141. For the connection, please refer to the description printed on the backplane.
X123, X133, X137 and X138 are used to connect the RS485 bus of POWB to that of GPP; while X149 and X150 are the impedance matching jumpers of the RS485 bus monitored by FSPP. Since FSPP monitors the RS485 buses of its rack, all the RS485 buses of POWB of this rack should be connected to FSPP in the cascading mode; that is, X132, X133, X137 and X138 should be connected while X149 and X150 disconnected. Otherwise, keep X132, X133, X137 and X138 disconnected and short X149 and X150.
4.5 Installation of external cables
4.5.1 Cable connection of the BSC system without sub-multiplexing
Connections of cables are almost the same despite the different rack capacities, although the number of cables will increase with the increase of capacity. To avoid repeated discussion, we will only describe the cable connections in detail in the case of N_trx≤240, and only connection changes will be introduced for other cases.
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4.5.1.1 NN_trx≤240
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections from BIPP to the T network are as shown in Table 4-4.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=54~57) socket on the DSNI board in the BNET shelf.
Table 4-4 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
Signal line 1# L3_DSNI3-S_SPC56~57 DN1~8 is described in Table 4-5.
Table 4-5 Description of the signal line 1# L3_DSNI3-S_SPC56~57 DN1~8
Name Description
1# Rack No. when racks are assembled (seen from the front, the leftmost rack is No.1 rack)
L3 Indicating the layer-3 backplane from the bottom of the rack
DSNI3-S Indicating the symbol name of the 96-pin socket
SPC56~57 Indicating the symbol name of the specific identifiers on the socket.
DN1~8 Indicating the specific positions on the socket: the positions 1~8 of the DOWN 96-pin socket
Signal line 1# L6_BIPP_L_CNT0 UP25~32 is described in Table 4-6.
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Table 4-6 Description of the signal line 1# L6_BIPP_L_CNT0 UP25~32
Name Description
1# Rack No. when racks are assembled (seen from the front, the leftmost rack is No.1 rack)
L6 Indicating the layer-6 backplane from the bottom of the rack
BIPP Indicating the symbol name of the 96-pin socket
L Indicating the left side of the backplane (seen from the back of the rack)
CNT0 Indicating the symbol name of the specific identifiers on the socket
UP25~32 Indicating the specific positions on the socket: the positions 25~32 of the UP 96-pin socket
2. The clock and HW cables from ATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
The connections from TCPP to the T network are as shown in Table 4-7.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~3) socket on the DSNI board in the BNET shelf.
Table 4-7 Connections from TCPP to the T network
DSNI end TCPP end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
3. The HW cables for 2M messages from the BCTL (SCU) layer to the BNET layer
Type E cables (2MHWI, 2MHWO); Name: cables from DSNI to COMM; Type: 3×8 cables.
The connections from the COMM end to the DSNI end are as shown in Table 4-8.
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DSNI end - “MPCn” (n=0~31) socket position on the DSNI0-C (or DSNI1-C) board in the BNET shelf.
COMM end - “COMMnD1” (or “COMMnD2”) (n=1~12) socket position on the COMM board in the BCTL (SCU) shelf.
Table 4-8 Connections from the COMM end to the DSNI end
COMM end DSNI end
L4_COMM1_COMM1D1 DN25~32 L3_DSNI0_C_MPC0.2 UP1~8
L4_COMM2_COMM2D1 DN25~32 L3_DSNI1_C_MPC1.3 UP1~8
L4_COMM3_COMM3D1 DN17~24 L3_DSNI0_C_MPC8.10 UP17~24
L4_COMM4_COMM4D1 DN17~24 L3_DSNI1_C_MPC9.11 UP17~24
L4_COMM5_COMM5D2 DN25~32 L3_DSNI0_C_MPC12.14 UP25~32
L4_COMM6_COMM6D2 DN25~32 L3_DSNI1_C_MPC13.15 UP25~32
(to be continued)
COMM end DSNI end
L4_COMM7_COMM7D2 DN25~32 L3_DSNI0_C_MPC16.18 DN1~8
L4_COMM8_COMM8D2 DN25~32 L3_DSNI1_C_MPC17.19 DN1~8
L4_COMM9_COMM9D2 DN25~32 L3_DSNI0_C_MPC20.22 DN17~24
L4_COMM10_COMM10D2 DN25~32 L3_DSNI1_C_MPC21.23 DN17~24
L4_COMM11_COMM11D2 DN25~32 L3_DSNI0_C_MPC24.26 DN9~16
L4_COMM12_COMM12D2 DN25~32 L3_DSNI1_C_MPC25.27 DN9~16
4. Connection control cables from the BCTL (SCU) layer to the BNET layer
Type F cables; Name: cables from COMM to BOSN; Type: “1-to-2” 3×8 cables.
The connections from the COMM end to the DSN end are as shown in Table 4-9.
COMM end – “COMMnD2” (n=3~4) socket position on the COMM board in the BCTL (SCU) shelf.
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DSN (CLK) end - “COMM0” (or “COMM0’”) socket position on the DSN board in the BNET shelf.
DSN end - “COMM1”(or “COMM1’”) socket position on the DSN board in the BNET shelf.
Table 4-9 Connections from the COMM end to the DSN end
COMM end DSN end (CLK) DSN end
L4_COMM3_COMM3D2 DN25~32
L3_DSN_COMM0 DN25~32
L3_DSN'_COMM1' DN17~24
L4_COMM4_COMM4D2 DN25~32
L3_DSN'_COMM0' DN25~32
L3_DSN_COMM1 DN17~24
5. 2MHW cables from BBIU to BCTL (RMU)
Type E+ cables (2MHWI, 2MHWO); Name: cables from COMI to COMM; Type: “1-to-2” 3×8 cables.
The connections from the COMM end to the COMI end are as shown in Table 4-10.
COMI end – “CNCn” (n=0~13) socket on the COMI board in the BBIU shelf.
COMM end – “COMMnD2” (n=1~12) socket on the COMM board in the BCTL (RMU) shelf.
Table 4-10 Connections from the COMM end to the COMI end
COMM end COMI end
RMU_COMM1_COMM1D2 DN25~32
RMU_COMM2_COMM2D2 DN25~32 BBIU_COMI_CNC0.1 UP1~8*
RMU_COMM3_COMM3D2 DN25~32
RMU_COMM4_COMM4D2 DN25~32 BBIU_COMI_CNC2.3 UP9~16
RMU_COMM5_COMM5D2 DN25~32 BBIU_COMI_CNC4.5 UP17~24
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RMU_COMM6_COMM6D2 DN25~32
RMU_COMM7_COMM7D2 DN25~32
RMU_COMM8_COMM8D2 DN25~32 BBIU_COMI_CNC6.7 UP25~32
RMU_COMM9_COMM9D2 DN25~32
RMU_COMM10_COMM10D2 DN25~32 BBIU_COMI_CNC8.9 DN1~8
RMU_COMM11_COMM11D2 DN25~32
RMU_COMM12_COMM12D2 DN25~32 BBIU_COMI_CNC10.11 DN9~16
RMU_PEPD_PEPDD2 DN25~32
RMU_MON_MOND2 DN25~32 BBIU_COMI_CNC12.13 DN17~24
6. The clock cables from AIPP of BATC to SYCK of BNET
Type H+ cables (8K); Name: cables from AIPP to SYCK; Type: “1-to-2” 3×8 cables.
The connections from the AIPP end to the SYCK end are as shown in Table 4-11.
AIPP end – “8KREF” socket position on the AIPP board in the BATC shelf.
SYCK end - “E8K” socket position on the SYCK board in the BNET shelf.
Table 4-11 Connections from the AIPP end to the SYCK end
DTI end SYCK end
L1_BATC_AIPP_8KREF UP1~8
L2_BATC_AIPP_8KREF UP1~8 B L3_BNET_SYCK_E8K UP4~11
7. The 8K clock cables from the BBIU layer to the BCTL (RMU) layer
Type K+ cables (8K); Name: cables from COMI to MP; Type: “1-to-2” 3×8 cables.
The connections from the COMI end to the MP end are as shown in Table 4-12.
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COMI end – “CNC14” or “CNC15” socket on the COMI board in the BBIU shelf.
MP end - “MP-1D1” or “MP-2D1” socket on the MP board in the BCTL (SCU) shelf.
Table 4-12 Connections from the COMI end to the MP end
COMI end MP end
BCTL_MP-1_MP-1D1 DN14~21 BBIU_COMI_CNC14, 15 DN25~32
BCTL_MP-2_MP-2D1 DN14~21
8. The 8K clock cables the from BNET layer to the BCTL (SCU) layer
Type K cables (8K); Name: cables from DSNI to MP; Type: 3×8 cables.
The connections from the DSNI end to the MP end are as shown in Table 4-13.
DSNI end - “MPCn” (n=28~31) socket position on the DSNI1-C board in the BNET shelf.
MP end - “MP-1D1” (or “MP-2D1”) socket position on the MP board in the BCTL (SCU) shelf.
Table 4-13 Connections from the DSNI end to the MP end
DSNI end MP end
L3_DSNI0-C_MPC28, 30 DN25~32 L4_MP-1_MP-1D1 DN14~21
L3_DSNI1-C_MPC29, 31 DN25~32 L4_MP-2_MP-2D1 DN14~21
9. Cables in the BCTL (SCU) layer from the MON board to DSNI and POWB
Type A cables (RS485); Name: cables from MON to DSNI and POWB; Type: “1-to-6” 3×8 cables.
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The connections from the MON end to the POWBn end are as shown in Table 4-14.
MON end - “MOND2” socket position on the MON board in the BCTL (SCU) shelf.
FBI end - “RS485” socket position on the FBI1 board in the BNET shelf.
POWB end – “485-IN” socket on the POWB board on the right at layer-6 of rack n (n is the rack No., and ranges 1~6).
Table 4-14 Connections from the MON end to the POWB end
MON end POWB end DSNI end
1# L4_MON_MOND2 DN25~32
n# L6_POWB_R_485-IN UP1~8
1# L3_FBI2'__RS485-IN UP1~8
10. RS485 cables of power supplies on the two adjacent layers
Type B cables (RS485); Name: cables from the upper-layer power supply to the lower-layer power supply; Type: 3×8 cables.
The connections from the upper-layer RS485 end to the lower-layer RS485 end are as shown in Table 4-15.
Upper-layer RS485 end - “485-OUT” socket position on the POWB board on layer Ln+1 (n is the layer No., and ranges 1~6 from bottom up).
Lower-layer RS485 end - “485-IN” socket position on the POWB board on layer Ln (n is the layer No., and ranges 1~6 from bottom up).
Table 4-15 Connections from the upper-layer RS485 end to the lower-layer RS485 end
Upper-layer RS485 end Lower-layer RS485 end
Ln+1_POWB_L (R) _485-OUT UP9~16 Ln_POWB_L (R) _485-IN UP1~8
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11. RS485 cables of power supplies on the same layer
Type C cables (RS485); Name: cables of power supplies on the same layers; Type: 3×8 cables.
Connections from the left RS485 end to the right RS485 end are as shown in Table 4-16. The connections are in the left-right symmetry.
The left RS485 end – “485_OUT” socket position on the left POWB board in the bottom layer.
The right RS485 end – “485_OUT” socket position on the right POWB board in the bottom layer.
Table 4-16 Connections from the left RS485 end to the right RS485 end
The left RS485OUT The right RS485OUT
N# POWB_L_485-OUT UP9~16 N# POWB_R_485-OUT UP9~16
12. RS485 cables connecting POWPs
Type Z cables (RS485); Name: POWP cables; Type: 3×8 cables are used for one end, and round-head cables are used for the other end.
The connections of POWB with POWP are as shown in Table 4-17.
The last POWB end on the left - “485_OUT” socket position on the left POWB board in the top shelf.
POWP end - the position of the round-head socket on POWP.
Table 4-17 Connections of POWB with POWP
RS485OUT RS485IN
L6_POWB_L_485-IN UP1~8 POWP_485IN
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13. Network cables (Type O cables) used to connect the background
Connection cables from MP to the Ethernet; Type: 3×8 cables are used on one end, and RJ45 cables are used on the other end.
Connection relations:
MP end - “MP-1D2” or “MP-2D2” socket on the MP board in the BCTL (SCU) shelf.
RJ45 end – “RJ45” socket on HUB.
14. Cables (P-type cables) of sensors
Cables from PEPD to sensors. 3×8 cables are used on one end, and smog, temperature/humidity and infrared sensors are connected to the other end.
Connection relations:
PEPD end – “PEPDD2 (SENSOR)” socket on the PEPD board in the BCTL (SCU) shelf.
15. 6-pin power supply plug Type Q cable, which powers each board through the backplane, and the power supply plug is as shown in Fig. 4-12.
3
2
1
6
5
4
GND
GNDP
-48VIN
GND48
GNDP
GND
Fig. 4-12 The power supply plug as seen from the soldering surface of the backplane
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4.5.1.2 240<N_trx≤480
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections BIPP to the T network are as shown in Table 4-18.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=50~57) socket on the DSNI board in the BNET shelf.
Table 4-18 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32
2. The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
The connections from the DSNI end to the TCPP end are as shown in Table 4-19.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~7) socket on the DSNI board in the BNET shelf.
Table 4-19 Connections from TCPP to the T network
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DSNI end BATC end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC6~7 UP25~32 2# L3_TCPP-CNT UP25~32
3. For connections of other cables, please refer to Section 4.5.1.1.
4.5.1.3 480<N_trx≤720
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections from BIPP to the T network are as shown in Table 4-20.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=46~57) socket on the DSNI board in the BNET shelf.
Table 4-20 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI3-S_SPC48~49 UP1~8 3# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC46~47 DN25~32 3# L6_BIPPR-CNT1 UP25~32
2. The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
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The connections from the DSNI end to the TCPP end are as shown in Table 4-21.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~11) socket on the DSNI board in the BNET shelf.
Table 4-21 Connections from TCPP to the T network
DSNI end BATC end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC6~7 UP25~32 2# L3_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC8~9 DN1~8 2# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC10~11 DN9~16 2# L1_TCPP-CNT UP25~32
3. For connections of other cables, please refer to Section 4.5.1.1.
4.5.1.4 720<N_trx≤960
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections from BIPP to the T network are as shown in Table 4-22.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=42~57) socket on the DSNI board in the BNET shelf.
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Table 4-22 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI3-S_SPC48~49 UP1~8 3# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC46~47 DN25~32 3# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC44~45 DN17~24 3# L4_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC42~43 DN9~16 3# L4_BIPPR-CNT1 UP25~32
2. The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
The connections from the DSNI end to the TCPP end are as shown in Table 4-23.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~15) socket on the DSNI_S board in the BNET shelf.
Table 4-23 Connections from TCPP to the T network
DSNI end BATC end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC6~7 UP25~32 2# L3_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC8~9 DN1~8 2# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC10~11 DN9~16 2# L1_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC12~13 DN17~24 3# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC14~15 DN25~32 3# L1_TCPP-CNT UP25~32
3. For connections of other cables, please refer to Section 4.5.1.1.
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4.5.1.5 960<N_trx≤1200
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections from BIPP to the T network are as shown in Table 4-24.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=44~57) socket on the DSNI board in the BNET shelf.
Table 4-24 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI3-S_SPC48~49 UP1~8 3# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC46~47 DN25~32 3# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC44~45 DN17~24 3# L4_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC42~43 DN9~16 3# L4_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC40~41 DN1~8 4# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC38~39 UP25~32 4# L6_BIPPR-CNT1 UP25~32
2. The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
The connections from the DSNI end to the TCPP end are as shown in Table 4-25.
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TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~19) socket on the DSNI-S board in the BNET shelf.
Table 4-25 Connections from TCPP to the T network
DSNI end BATC end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC6~7 UP25~32 2# L3_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC8~9 DN1~8 2# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC10~11 DN9~16 2# L1_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC12~13 DN17~24 3# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC14~15 DN25~32 3# L1_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC16~17 UP1~8 4# L4_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC18~19 UP9~16 4# L3_TCPP-CNT UP25~32
3. For connections of other cables, please refer to Section 4.5.1.1.
4.5.1.6 1200<N_trx≤1800
1. The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.
The connections from BIPP to the T network are as shown in Table 4-26.
BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.
DSNI end – “SPCn” (n=28~57) socket on the DSNI board in the BNET shelf.
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Table 4-26 Connections from BIPP to the T network
DSNI end BIPP end
1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32
1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI3-S_SPC48~49 UP1~8 3# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC46~47 DN25~32 3# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC44~45 DN17~24 3# L4_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC42~43 DN9~16 3# L4_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC40~41 DN1~8 4# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC38~39 UP25~32 4# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC36~37 UP17~24 5# L6_BIPPL-CNT0 UP25~32
1# L3_DSNI2-S_SPC34~35 UP9~16 5# L6_BIPPR-CNT1 UP25~32
1# L3_DSNI2-S_SPC32~33 UP1~8 5# L4_BIPPL-CNT0 UP25~32
1# L3_DSNI1-S_SPC30~31 DN25~32 5# L4_BIPPR-CNT1 UP25~32
1# L3_DSNI1-S_SPC28~29 DN17~24 6# L6_BIPPL-CNT0 UP25~32
2. The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.
The connections from the DSNI end to the TCPP end are as shown in Table 4-27.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
DSNI end – “SPCn” (n=0~31) socket on the DSNI_S board in the BNET shelf.
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Table 4-27 Connections from TCPP to the T network
DSNI end BATC end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L1_TCPP_CNT UP25~32
1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC6~7 UP25~32 2# L3_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC8~9 DN1~8 2# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC10~11 DN9~16 2# L1_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC12~13 DN17~24 3# L2_TCPP-CNT UP25~32
1# L3_DSNI0-S_SPC14~15 DN25~32 3# L1_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC16~17 UP1~8 4# L4_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC18~19 UP9~16 4# L3_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC20~21 UP17~24 4# L2_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC22~23 UP25~32 4# L1_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC24~25 DN1~8 5# L2_TCPP-CNT UP25~32
1# L3_DSNI1-S_SPC26~27 DN9~16 5# L1_TCPP-CNT UP25~32
3. Type A+ cables in the BCTL (SCU) layer from the MON board to POWB
Type A+ cables (RS485); Name: cables from MON to POWB; Type: “1-to-2” 3×8 cables. Refer to Table 4-28 for the connection relations.
Table 4-28 Connections from MON to POWB
MON end POWB end
1# L4_MON_MOND1 DN17~24 6# L6_POWB_R_485-IN UP1~8
4. For connections of other cables, please refer to Section 4.5.1.1.
4.5.2 Configurations of cables of the BSC system with sub-multiplexing
4.5.2.1 The case that the Acon interface holds the sub-multiplexing
We will take the rack in the case 240<N_trx≤480 as an example, its configuration is described in Section 2.2.
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Cables in this configuration include:
1. Type D cables from TCPP to DSNI
2. Type D cables from NSPP to DSNI
3. Type X cables from FSPP to BIPP
4. Type E cables from DSNI to SCU/COMM
5. Type F cables from SCU/COMM to DSN
6. Type E+ cables from COMI to RMU/COMM
7. Type H+ cables from NSPP to SYCK of the BNET layer
8. Type H+ cables from FSPP to SYCK of this layer
9. Type K cables from DSNI to the 8K clock of MP
10. Type A cables – RS485 cables from MON to POWB and FBI. Note that no type A cables are used for the far-end racks.
11. Type B cables – RS485 bus cables connecting POWBs on different layers in a near- or far-end rack
12. Type C cables - RS485 bus cables connecting POWBs on the same layer
On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L1 and J2_L3 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables won’t be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 3×8 cables won’t be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention:
1) On a far-end rack, these four jumpers must be shorted.
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2) On a far-end rack, the terminal resistors of the RS485 bus must be connected. For this example, the RS485 bus is terminated at the left and right POWBs of J3_L6 (the top BBIU), so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X42 and X46 of J3_L6.
13. Type O cables connecting background network cables on a near-end rack
14. Type P cables connecting PEPD and sensors on a near-end rack
15. Type Q cables connecting power supplies on a near- or far-end rack
16. Type Z cables connecting POWB and POWP on a near- or far-end rack
Now, we will only discuss Items 2, 3, 7 and 8 in detail, for description of other items, please refer to relevant contents in previous sections.
1. The clock and HW cables from NSPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from NSPP to the T network; Type: 3×8 cables.
The connections from NSPP to the T network are as shown in Table 4-29.
NSPP end – “NSPP0” socket on the NSPP board in the NSMU shelf.
DSNI end – “SPCn” (n=0~7) socket on the DSNI board in the BNET shelf.
Table 4-29 Connections from NSPP to the T network
DSNI end NSPP end
1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_NSMU_NSPP0 UP25~32
1# L3_DSNI0-S_SPC2~3 UP9~16 1# L2_NSMU_NSPP0 DN1~8
1# L3_DSNI0-S_SPC4~5 UP17~24 1# L2_NSMU_NSPP0 DN9~16
1# L3_DSNI0-S_SPC6~7 UP25~32 1# L2_NSMU_NSPP0 DN17~24
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2. The clock and HW cables from FSMU to BBIU
Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to BIPP; Type: 3×8 cables.
The connections from FSPP to BIPP are as shown in Table 4-30.
FSPP end – “HW2~9” sockets on the FSPP0 board in the BSMU shelf.
BIPP end – “CNT” socket on the BIPP board in the BBIU shelf.
Table 4-30 Connections from FSPP to BIPP
BIPP end FSPP end
L4_TCPP_CNT UP25~32 L5_FSPP0_HW2-3 DN1-8
L3_TCPP_CNT UP25~32 L5_FSPP0_HW4-5 DN9-16
L2_TCPP_CNT UP25~32 L5_FSPP0_HW6-7 DN17-24
L1_TCPP_CNT UP25~32 L5_FSPP0_HW8-9 DN25-32
3. Cables for the 8K clock reference from NSMU to BNET
Type H+ cables (8KREF+, 8KREF-; Name: cables from NSPP to SYCK; Type: “1-to-2” 3×8 cables. Refer to Table 4-31 for the connection relations.
NSPP end – “8KREF” socket on the NSPP board in the BSMU shelf.
SYCK end - “E8K” socket on the SYCK board in the BNET shelf.
Table 4-31 Connections from NSMU to the T network
SYCK end NSPP end
L2_NSPP0_8KREF UP1~8 L3_BNET_SYCK_E8K UP4~11
L1_NSPP0_8KREF UP1~8
4. Cables for the clock reference from FSPP to SYCK in a far-end BSMU
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Type H+ cables (8KREF+, 8KREF-; Name: cables from FSPP to SYCK; Type: “1-2” 3×8 cables. Refer to Table 4-32 for the connection relations.
FSPP end – “8KREF” socket on the FSPP board in the BSMU shelf.
SYCK end - “E8K” socket on the SYCK board in the BSMU shelf.
Table 4-32 Connections from NSMU to the T network
SYCK end FSPP end
L4_BATC_AIPP_8KREF UP1~8 L5_FSMU_SYCK_E8K UP4~11
L3_BATC_AIPP_8KREF UP1~8
4.5.2.2 The case that the Ater interface involves the sub-multiplexing
We will take the rack in the case 240<N_trx≤480 as an example, its configuration is described in Section 2.2.
Cables in this configuration include:
1. Type D cables from BIPP to DSNI
2. Type D cables from NSPP to DSNI
3. Type X cables from FSPP to TCPP
4. Type E cables from DSNI to SCU/COMM
5. Type E cables from SCU/COMM to DSN
6. Type E+ cables from COMI to RMU/COMM
7. Type H+ cables from the near-end NSPP to SYCK of the BNET layer
8. Type H+ cables from the far-end AIPP to SYCK of the FSMU layer
9. 8K clock cables from DSNI to MP
10. Type A cables -RS485 bus cables from MON to POWB and FBI. Note
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that no type A cables are used for the far-end racks.
11. Type B cables - RS485 bus cables connecting POWBs on different layers in a near- or far-end rack.
12. Type C cables - RS485 bus cables connecting POWBs on the same layer
On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L2 and J3_L5 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables won’t be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 3×8 cables won’t be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention:
1) On a far-end rack, these four jumpers must be shorted.
2) The terminal resistors of the RS485 bus must be connected to the RS485 bus. For this example, the RS485 bus is terminated at the left and right POWBs of J2_L1, so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X154 and X157 of J2_L1.
13. Type O cables connecting background network cables on a near-end rack
14. Type P cables connecting PEPD and sensors on a near-end rack
15. Type Q cables connecting power supplies on a near- or far-end rack
16. Type Z cables connecting POWB and POWP on a near-end rack
17. Type Z+ cables connecting POWB and POWP on a far-end rack
For the connection methods of Items 1, 4~6, and 9 ~ 15 among the 17 items
above, please refer to detailed description in Section 4.5.1, and for those of
Items 2 and 7, please refer to Section 4.5.2.1. Now, we will only discuss Items
3, 8 and 17.
1. The clock and HW cables from BATC to FSMU in the far-end rack
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Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to TCPP; Type: 3×8 cables.
The connections from FSPP to TCPP are as shown in Table 4-33.
FSPP end – “HW2~9” sockets on the FSPP0 board in the BSMU shelf.
TCPP end – “CNT” socket on the TCPP board in the BATC shelf.
Table 4-33 Connections from FSPP to TCPP
TCPP end FSPP end
L4_TCPP_CNT UP25~32 L5_FSPP0_HW2-3 DN1-8
L3_TCPP_CNT UP25~32 L5_FSPP0_HW4-5 DN9-16
L2_TCPP_CNT UP25~32 L5_FSPP0_HW6-7 DN17-24
L1_TCPP_CNT UP25~32 L5_FSPP0_HW8-9 DN25-32
2. Cables for the 8K clock reference from AIPP to FSMU in the far-end rack
Type H+ cables (8KREF+, 8KREF-); Name: cables from AIPP to SYCK of FSMU; Type: “1-to-2” 3×8 cables.
The connections from AIPP to SYCK are as shown in Table 4-34.
AIPP end – “8KREF” socket on the AIPP board in the BATC shelf.
SYCK end - “E8K” socket on the SYCK board in the BSMU shelf.
Table 4-34 Connections from AIPP to SYCK
AIPP (end-1 and end-2) SYCK end
L4_BATC_AIPP_8KREF UP1~8
L3_BATC_AIPP_8KREF UP1~8 L5_FSMU_SYCK_E8K UP4~11
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3. RS485 cables connecting POWPs in the far-end rack
Type Z cables (RS485): POWP cables of the last POWB end on the left. Type: 3×8 cables are used for one end, and round-head cables are used for the other end. Refer to the relevant part in Section 4.5.1 for the connection method.
4.5.3 Cable connections of BSC (GPRS)
The No. of the GPRS rack depends on the number of BSC racks; if there are four BSC racks, then the GPRS rack is the fifth one.
1. Cables from BNET to BPUC
Type D cables; Name: cables from BNET to BPUC; Type: 3×8 cables.
The connections from BNET to BPUC are as shown in Table 4-35.
BNET end – “SPC” socket on the DSNI board in the BNET shelf.
BPUC end – “TNET(V2.0)” socket on the BPUC board in the BPUC shelf.
Table 4-35 Connections from BNET to BPUC
BNET BPUC
1# L3_DSNI2-S_SPC32~33 UP1~8 n# L2_BPCU-96PIN_TNET (V2.0) UP1~8
1# L3_DSNI1-S_SPC30~31 DN25~32 n# L3_BPCU-96PIN_TNET (V2.0) UP1~8
1# L3_DSNI1-S_SPC28~29 DN17~24 n# L4_BPCU-96PIN_TNET (V2.0) UP1~8
1# L3_DSNI1-S_SPC26~27 DN9~16 n# L5_BPCU_96PIN_TNET (V2.0) UP1~8
2. Cables from BNET to BGIU
Type D cables; Name: cables from BNET to BGIU; Type: 3×8 cables.
The connections from BNET to BGIU are as shown in Table 4-36.
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BNET end – “SPC” socket on the DSNI board in the BNET shelf.
BGIU end – “TNET” socket on the GIPP board in the BGIU shelf.
Table 4-36 Connections from BNET to BGIU
BENT end BGIU
1# L3_DSNI1-S_SPC24~25 DN1~8 n# L1_BGIU_GIPP_TNET UP1~8
4.6 Check of the hardware installation
4.6.1 Check of the rack installation
1. Racks must be installed vertically. After installation, both the horizontal and vertical deviation should not exceed 3mm.
2. The layout of racks must meet the design requirements. The main aisle between rows of racks must be aligned in a straight line with an error lower than 5mm. The adjacent racks should be close to each other and the racks in one row should be on the same plane.
3. Fixing screws must be fastened, and the exposed part (height) of the same kind of screws should be identical.
4. No component on the rack is allowed to go off or be damaged, and the paint coating should not peel off or be damaged. If the paint coating peels off or is damaged, the relevant part should be re-coated. All the labels should be present and clear.
5. The rack installation shall be reinforced for shock resistance, if necessary, anchor bolts can be used to secure the rack to the ground.
6. Connectors must have good contact with flexible plugging/unplugging. The surface of the plugged slots should be even and flat.
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4.6.2 Check of base and peripherally installed terminal equipment
1. The installation location of the base should meet the engineering design requirements.
2. Racks shall be aligned in a straight line, adjacent racks shall be put closely together, and the racks shall be in the same plane without obvious unevenness.
3. The peripheral terminal equipment should be all ready and complete, installed at the proper positions, and in normal operation.
4. Alarming devices in the equipment room must be fixed at eye-catching locations and tightly fixed.
4.6.3 Check of the array of racks
The configuration of racks depends on the capacity, so no specific restriction is placed on the length of rack rows. However, the connection cables between devices are generally restricted to less than 15m. In addition, the area of the equipment room should also be taken into account. After the total capacity and configuration are determined, the total number of racks and the quantity of various shelves are determined. Furthermore, the adjacent relationship between different racks also counts. With each single module being a group, the central rack is usually placed in the middle of the single module. The number of rack rows, racks in each row, primary passages, and secondary passages, are determined by the total number of racks.
4.6.4 Check of cables
The cables of the system are classified into external cables and internal cables.
The external cables mainly include various trunk cables and power supply (-48V) cables. The external cables of the ZXG10-BSC (V2) include E1 cables connecting with BTS and MSC, and cables connecting with the primary power supply. The connector of the E1 cable connected to BSC is standard RF coaxial connector
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CC4Y-J32//CC4-J32B//CC4Y-J32B//1.0/2.3-J3T, and the connector connected to BTS can be selected as required. The cable is the 75Ω coaxial cable. Each rack has one set of primary power supply cables connected to the cables of POWP with two signal cables: -48V and –48V ground, the connector connected to POWP employs the lug and the other end can be selected as required.
The internal cables mainly include RS485 monitoring cables, 8MHW cables, clock cables, connection control cables, Ethernet cables and sensor cables, etc. Cables inside a rack are already installed before the delivery of the equipment, while those among racks should be installed on site.
1. Laying of the power supply cables
1) Requirements for connection of the power cables and grounding cables
Good grounding of BSC is an important guarantee for lightning protection and anti-interference, as well as the basis for stable and reliable operation of the equipment. The grounding resistance should comply with the relevant standards. If necessary, the grounding connectors should be processed against corrosion to ensure low-resistance grounding.
To make the power supply cables easier to lead in, each rack has a -48V leading-in box, i.e., the POWP. This part is the inlet for the power supply of the whole rack, and it chiefly implements such functions as the filtering, under-/over-voltage detection, giving alarms and over-voltage protection for the -48V power supply. For easier cabling, the whole POWP is designed into a drawer structure, which is installed on the top of the rack.
2) Requirements for the bundling of power cables and grounding cables
The power cables and grounding cables should be laid following the principle that they are separated from other cables. For in-rack cabling, the cables should be bundled separately without being bundled with other cables, and separate bundling is also required for out-rack cabling such as
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in the cable trough or ditch. The power cables and grounding wires should pass through the fixing shelves on both sides of the rack, and be bound at the inner edge on the external side of the fixing shelf. Each fixing shelf should be bound. The cable clips should be located on the external side of the fixing shelf.
3) When the power cables and grounding cables are connected to the terminals of the POWP, a pair of pliers shall be used to twist the cables into the routing shape, with even routing and neat bundling. During cabling, the cables far away from the terminals should be put outside, while those close to the terminals should be put inside.
4) Before laying power cables and grounding cables, length of the needed cables should be measured and some extra length should be taken, for just in case. If the cable is found not long enough during cable layout, stop laying and replace the cable with a new one. It is not allowed to make joints or soldering points in the middle of the cable.
2. Laying of trunk cables
1) When the equipment is installed with a base and the conductive floor is installed inside the equipment room, it is recommended for the user to employ the bottom cabling mode. If no base is installed, then the top cabling mode should be adopted, but a cable tray should be mounted on the top of the rack.
A. Bottom cabling mode
In the case of ground installation, as there are four support arms below the
rack, there is some space between the bottom shelf of the rack and the ground,
which can be used for cabling; in the case of reinforcement installation, the
rack is installed on a section steel base instead of support arms, then cables
should be laid through the ground ditch under the rack.
B. Top cabling mode
To implement the top cabling mode, the top mesh of the rack is divided into two
parts of different sizes. Loosen the screws that fasten the top mesh and
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remove the small top mesh board from the back of the top cover, so that cables
can be led out from the top.
2) The trunk cables should be laid separately from the power cables.
3) The turning radius of coaxial cables should not be less than 40mm, so that the core can be protected from being damaged.
4) The insulating layer of cables cannot be damaged. And the cables should be laid for the convenience of future maintenance and expansion.
5) Cables laid on the cable tray must be bundled. The bundled cables should be close to each other and look straight and neat. The spaces between cable clips should be even and cables should be bundled with appropriate tightness.
6) Cables laid inside the cable trough may be not bundled, but should be arranged in order. No cable is allowed to run over from the trough. Cables should be bundled where they come into or go out from a trough and where they make a turn.
7) The cables should be laid from the rack to the distribution frame. During the laying, the cables should keep somewhat loose and after the laying, some excessive length of the cables should be saved. Please refer to the connector installation position for the cable layout, the cables on the left side of the rack should be placed at the left cabling position, and those on the right side should be placed at the right cabling position. During cabling in a cable trough or under the movable floor, the cables should be bundled as per racks. The cables should be straight and in order, and the laid cables should be arranged neatly without damage on the external sheath, and a margin should be left if necessary.
8) The No. of both ends of a trunk cable should correspond to each other.
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5 Inspection and Power-on
5.1 Description of boards
Listed below are the meanings of status of indicators on the panels of various boards of the ZXG10-BSC (V2) rack, and the functions of various switch buttons.
5.1.1 Indicators on the panel of the control layer
Descriptions of indicators on the panel of the control layer are listed in Table 5-1.
Table 5-1 Indicators on the panel of the control layer
Board name
Legend Indicator or switch
Description
Indicating the running status of the board.
Flashing slowly: Normal
Constantly on: Abnormal RUN: HL1
Off: Abnormal
Indicating the failure status of the board.
On: Board fault FAU: HL2
Off: Normal
Indicating the active/standby status of the board.
Constantly on: In the active status MST: HL3
Off: In the non-active status
Indicating the active/standby status of the board.
MP
HL1HL2HL3HL4
SW1SW2SW3
RES: HL4
Constantly on: In the standby status
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(to be continued)
Board name Legend Indicator or
switch Description
Off: In the non-standby status
Lockless button – Changeover switch SW: SW1 Press this switch to change over the
active/standby status of the board.
Lockless button – Reset switch RST: SW2
Press this switch to reset the board.
Power switch with lock button
ON/OFF: SW3 Push this switch down to power on and spring up to power off.
Indicating the running status of the board.
SMEM
HL1HL2
RUN: HL1
Constantly on: Normal
Indicating the running status of the board.
Flashing slowly: Normal RUN: HL1 On together with the FAU indicator: The board has faults
Indicating the failure status of the board.
On together with the RUN indicator: The board has faults
FAU: HL2
Off: Normal
Lockless button – Reset switch
COMM
(MPPP)
(MPMP)
HL1HL2
SW1
RST: SW1 Press this switch to reset the board.
Indicating the running status of the board.
COMM
(MTP)
HL1HL2
SW1
RUN: HL1 Flashing slowly: SS7 link obstructed
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(to be continued)
Board name Legend Indicator or
switch Description
Flashing fast: SS7 link normal
Indicating the failure status of the board.
Flashing slowly: Board fault FAU: HL2
Off: Normal
Lockless button – Reset switch
RST: SW1 Press this switch to reset the board.
Indicating the running status of the board.
Flashing slowly: Normal RUN: HL1
Flashing slowly together with the FAU indicator: The board has faults.
Indicating the failure status of the board.
Flashing slowly together with the RUN indicator: The board has faults.
FAU: HL2
Off: Normal
Lockless button – Reset switch
COMM
(LAPD)
HL1HL2
SW1
RST: SW1
Press this switch to reset the board.
Indicating the running status of the board.
Flashing slowly: Normal
Flashing fast: The sensor is being preheated.
RUN: HL1
Constantly on/off: Abnormal
Indicating the failure status of the board.
On: The board has faults FAU: HL2
Off: Normal
Lockless button – Reset switch
PEPD (MON)
HL1HL2
SW1
RST:SW1 Press this switch to reset the board.
Note: There is a keyboard interface and a monitor interface on the MP panel, which are used for the software debugging.
5.1.2 Indicators on the panel of the network switching layer
Descriptions of indicators on the panel of the network switching layer are listed in Table 5-2.
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Table 5-2 Indicators on the panel of the network switching layer
Board name
Legend Indicator or switch
Description
Indicating the running status of the board.
Flashing slowly: Normal
Flashing fast: The data is being loaded in synchronization mode.
RUN: HL1
Constantly on/off: Abnormal
Indicating the failure status of the board.
On: The board has faults.
Flashing slowly: communication between this board and the upper-level board has faults.
FAU: HL2
Off: Normal
Indicating the active/standby status of the board.
Constantly on: In the active status MST: HL3
Off: In the non-active status
Indicating the active/standby status of the board.
Constantly on: In the standby status RES: HL4
Off: In the non-standby status
Lockless button – Changeover switch
BOSN
HL1HL2HL3HL4
SW1SW2
EXCH: SW1 Press this switch to change over the active/standby status of the board.
(to be continued)
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Board name Legend Indicator or
switch Description
Lockless button – Reset switch RST: SW2
Press this switch to reset the board. Indicating the running status of the board. Flashing slowly: Normal RUN: HL1 Flashing fast: Communication between this board and MP failed Indicating the failure status of the board. On: The board has faults Flashing slowly: Communication between this board and the upper-level board failed
FAU: HL2
Off: Normal Indicating the active/standby status of the board. Constantly on: In the active status MST: HL3
Off: In the non-active status Indicating the active/standby status of the board. Constantly on: In the standby status RES: HL4
Off: In the non-standby status Lockless button – Changeover switch
SW: SW1 Press this switch to change over the active/standby status of the board. Lockless button - Reset switch
DSNI/ COMI
HL1HL2HL3HL4
SW1SW2
RST: SW2 Press this switch to reset the board. Indicating the running status of the board. On: Normal RUN: HL1 Flashing fast: Communication with SYCK failed Indicating the failure status of the board. On: The board has faults CKI
H L 1H L 2H L 3H L 4
S W 1S W 2S W 3
H L 5H L 6H L 7H L 8H L 9H L 1 0H L 1 1
FAU: HL2
Off: Normal
(to be continued)
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Board name
Legend Indicator or
switch Description
Indicator for 8kHz reference existence
Constantly on: 8kHz reference exists. 8kHz: HL3
Off: 8kHz reference does not exist.
Indicator for 2MHz reference existence
Constantly on: 2MHz reference exists. 2MHz: HL4
Off: 2MHz reference does not exist.
Indicator for 5MHz reference existence
Constantly on: 5MHz reference exists. 5MHz: HL5
Off: 5MHz reference does not exist.
Indicator for 2Mb/s reference existence
Constantly on: 2Mb/s reference exists. 2Mb/s: HL6
Off: 2Mb/s reference does not exist.
REFI: HL7~HL10
Four indicators indicate the selected ones of the 16 references in the binary system, top one to bottom one respectively indicate the high bit to low bit, 1 for On, 0 for Off.
0~3: 8K0~3; 4~7: 2MHz0~3
8~11: 5MHz0~3; 12~15: 2Mb/s 0~3
Indicating the “enabled” status of manual selection of the clock reference.
Constantly on: Manual selection of the clock reference is enabled.
MANEN: HL11
Off: Manual selection of the clock reference is disabled.
MANSL: SW1 Lockless button – Selection switch
(to be continued)
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Board name
Legend Indicator or
switch Description
Clock reference selection switch: Up to 16 references can be selected in turn by pressing this switch.
Lockless button – Selection switch
MANEN: SW2 Press this switch to set CKI to the “manual enabled” or “manual disabled” status alternately.
Lockless button – Reset switch
RST: SW3 Press this switch to reset the board.
Indicating the running status of the board. RUN: HL1 Constantly on: Normal
Indicating the failure status of the board.
On: The board has faults FAU: HL2
Off: Normal
Indicating the active/standby status of the board.
Constantly on: In the active status MST: HL3
Off: In the non-active status
Indicating the active/standby status of the board.
Constantly on: In the standby status MST: HL4
Off: In the non-standby status
Fast capture mode indicator of the board
Constantly on: The board is working in the fast capture mode.
CATCH: HL5
Off: The board is working in the non-fast capture mode.
Tracing mode indicator of the board
Constantly on: The board is working in the tracing mode. TRACK: HL6
Off: The board is working in the non-tracing mode.
SYCK
HL2HL3HL4
SW1SW2SW3
HL5HL6HL7HL8HL9HL10HL11
HL1
SW4
HL12
HOLD: HL7 Hold mode indicator of the board
(to be continued)
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Board name
Legend Indicator or
switch Description
Constantly on: The board is working in the hold mode.
Off: The board is working in the non-hold mode.
Free mode indicator of the board
Constantly on: The board is working in the free mode. FREE: HL8
Off: The board is working in the non-free mode.
Clock reference source indicator of the board
Constantly on: The SYCK board uses the clock reference from the CKI board.
REFI: HL9
Off: The SYCK board does not use the clock reference from the CKI board.
Clock reference source indicator of the board
Constantly on: The SYCK board uses the clock reference from itself. REFI: HL10
Off: The SYCK board does not use the clock reference from the board itself.
Clock reference source indicator of the board
REFI: HL11 Constantly on: The SYCK board uses the clock reference from itself.
REFI: HL11 Off: The SYCK board does not use the clock reference from itself.
Indicating the “enabled” status of manual selection of the clock reference.
Constantly on: Manual selection of the clock reference is enabled.
MANI: HL12
Off: Manual selection of the clock reference is disabled.
SYCK
MANSL: SW1 Lockless button – Selection switch
(to be continued)
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Board name
Legend Indicator or
switch Description
The clock reference can be manually selected in turn with this switch.
Lockless nutton – Enable switch
MANSL: SW2
Press this button to turn on/off the indicator that indicates the manual selection of clock reference enabled or disabled. Only when this indicator is on, the manual selection is enabled.
Lockless button – Changeover switch SW: SW3 Press this button to change over the
active/standby status of the board.
Lockless button – Reset switch
RST: SW4 Press this switch to reset the board.
5.1.3 Indicators on the panel of the TC unit
Descriptions of indicators on the panel of the TC unit are listed in Table 5-3.
Table 5-3 Indicators on the panel of the TC unit
Board name
Legend Indicator or
switch Description
Indicating the running status of the board.
Flashing slowly: Normal
Flashing fast: Communication between this board and MP failed
RUN: HL1
Constantly on/off: Abnormal
Indicating the failure status of the board.
On: The board has faults
DRT/
EDRT
HL1HL2HL3
SW1
FAU: HL2
Flashing slowly: Communication between this board and the upper-level board failed
(to be continued)
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Board name Legend Indicator or
switch Description
Off: Normal
Indicating whether there is traffic to handle on this board.
Constantly on: None of DSPs have traffic to handle.
IDLE: HL3
Off: There is traffic being handled.
Lockless button – Reset switch
RST: SW1 Press this switch to reset the board.
Indicating the running status of the board.
Flashing slowly: Normal
Constantly on/off: Abnormal RUN: HL1
Flashing fast: Communication between this board and MP failed
Indicating the failure status of the board.
On: The board has faults
Flashing slowly: Communication between this board and the upper-level board failed
FAU: HL2
Off: Normal
Indicating the status of the first E1 port on the board.
Flashing fast: Normal
Constantly on: Alarming DT1: HL3
Off: E1 port is not initialized.
DT2: HL4 Indicating the status of the second E1 port on the board; refer to DT1 for the indications of “On”.
DT3: HL5 Indicating the status of the third E1 port on the board, refer to DT1 for the indications of “On”.
DT4: HL6 Indicating the status of the fourth E1 port on the board; refer to DT1 for the indications of “On”.
Lockless button – Reset switch
TIC
HL2HL3
SW1
HL1
HL5HL6
HL4
RST: SW1 Press this switch to reset the board.
5.1.4
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5.1.5 Indicators on the panels of the POWB and POWP units
Descriptions of indicators on the panels of the POWB and POWP units are
listed in Table 5-4.
Table 5-4 Indicators on the panel of the power supply unit
Board name
Legend Indicator or switch
Description
Indicating the running status of the board.
Constantly on: Normal RUN: HL1
Off: The board has faults
Indicating the failure status of the board.
On: The board has faults
POWB
HL1
HL2
FAU: HL2
Off: Normal
Power distributor (POWP) of the rack
1 2 3 4 5 6
Fun power indicator 1
Constantly on: Normal
-48V indicator 2
Constantly on: Normal
Under-voltage indicator
Constantly on: Under-voltage input 3
Off: Normal input voltage
Over-voltage indicator
Constantly on: Over-voltage input 4
Off: Normal input voltage
5 Socket of anti-static wrist strap
Power distributor (POWP) of the rack
6 Power switch: Up - on; Down - off
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5.1.6 Indicators on the panel of the GPRS unit
Descriptions of indicators on the panel of the GPRS unit are listed in Table 5-5.
Table 5-5 Indicators on the panel of the GPRS unit
Board name Legend Indicator or switch Description
RUN: HL1
FAU: HL2
Combination of these two indicators expresses different
status:
1. Both flashing fast: The board is started and waiting for
establishment of the HDLC link.
2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize
data or to notify synchronization of data.
3. Both constantly on: After correction of inconsistent IP
address and unit No., waiting for the manual reset.
4. HL1 – Flashing slowly, HL2 - Off: Normal
Indicating the active/standby status of the board.
On: ActiveMST: HL3
OFF: Non-active
Indicating the active/standby status of the board.
On: StandbyMST: HL4
Off: Non-standby
Lockless button – Changeover switch
EXCH: SW1 Press this switch to change over the active/standby status of the
board.
PUC
HL1HL2HL3HL4
SW1SW2
RST: SW2 Lockless button – Reset switch
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(to be continued)
Board name Legend Indicator or switch Description
Press this switch to reset the board.
RUN: HL1
FAU: HL2
Combination of these two indicators expresses different status:
1. Both flashing fast: The board is started and waiting for establishment of the HDLC link.
2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize data or to notify synchronization of data.
3. Both constantly on: After correction of inconsistent IP address and the unit No., waiting for the manual reset.
4. HL1 – Flashing slowly, HL2 - Off: Normal
Indicating the status of DSP1
Flashing slowly: Normal
GDPP (FRP/BRP)
HL1HL2DSP1DSP2
SW1
DSP1 (this indicator is unavailable on the FRP board) Off: DSP1 does not run.
Indicating the status of DSP1
Flashing slowly: Normal DSP2 (this indicator is unavailable on the FRP board) Off: DSP2 does not run.
GIPP
RST: SW1 Lockless button - Reset switch
(to be continued)
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Board name Legend Indicator or switch Description
Press this switch to reset the board.
RUN: HL1
FAU: HL2
Combination of these two indicators expresses different status:
1. Both flashing fast: The board is started and waiting for establishment of the HDLC link.
2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize data or to notify synchronization of data.
3. HL1 – Flashing slowly, HL2 - Off: Normal
Indicating the active/standby status of the board.
On: Active MST: HL3
OFF: Non-active
Indicating the active/standby status of the board.
On: Standby MST: HL4
Off: Non-standby
Lockless button – Changeover switch
EXCH: SW1 Press this switch to change over the active/standby status of the board.
GIPP
GIPP
HL1HL2HL3HL4
SW1SW2
RST: SW2 Lockless button – Reset switch
(to be continued)
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Board name Legend Indicator or switch Description
Press this switch to reset the board.
RUN: HL1
FAU: HL2
Combination of these two indicators expresses different status:
1. Both flashing fast: The board is started and waiting for establishment of the HDLC link.
2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize data or to notify synchronization of data.
3. HL1 – Flashing slowly, HL2 – Off: Normal
Indicating the status of the first E1 port on the board.
Flashing fast: Normal
Constantly on: Alarming
DT1: HL3
Off: E1 port is not initialized.
Indicating the status of the second E1 port on the board.
TIC
HL2HL3
SW1
HL1
HL5HL6
HL4
DT2: HL4
Ditto
Indicating the status of the third E1 port on the board. DT3: HL5
Ditto
Indicating the status of the fourth E1 port on the board. DT4: HL6
Ditto
Lockless button - Reset switch
TIC
RST: SW1 Press this switch to reset the board.
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5.2 Inspection before power-on
A thorough inspection should be performed before the system is powered on.
1. Requirements for temperature, humidity and power voltage in the equipment room
1) Temperature: 15°C ~30°C
2) Relative humidity: 40%~65%
3) DC voltage: nominal value -48V (permitted range: -57V~-40V)
2. Check of cables
1) Check whether the power cables and grounding cables of each layer and each rack are connected properly.
2) Whether the connectors are inserted into their position and whether the contact is reliable.
3) Whether jumpers are properly set on each board.
4) Whether the foreground and background are connected properly.
5) Whether the version of the booting program loaded on each board is correct.
3. Check of other hardware
1) Whether equipment labels are complete, clear and correct.
2) Whether PCBs are inserted at the their positions and nothing is absent.
3) Whether various selection and control switches of the equipment are set at their specified start positions.
4) Whether the fuse of the equipment is of the required specifications.
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5) Whether the racks are properly grounded, with the grounding resistance meeting relevant technical requirements.
6) No short-circuit exists between the positive polar and negative polar of the power supply.
7) Whether the racks are aligned tidily and neatly, and whether the rack flags are correct and clear.
8) Whether the pins on backplanes are distorted or short-circuited.
5.3 Steps of power-on
After the above checks, power on the equipment in the following order,
otherwise the equipment may fail to begin working normally.
If the hardware passes the check, then power on the equipment in the following steps:
1. Before the power-on, make sure that the power cables are connected properly without damage and short-circuit; and ensure all the boards and power supplies are at their positions (the power switches should be at “OFF”); and ensure the software hardened on each board is of correct version, and no board is inserted into the slot.
2. Measure whether the primary input of POWP is normal; if not, get it back to normal based on necessary consultation.
3. Switch on the POWP and see whether it is normal and whether the -48V output is in the normal range (if not, find out the cause and ensure normal output).
4. After inserting the power supply (such as POWB) of a certain layer, turn it on, and observe its operation; if no abnormality occurs, turn it off.
5. Repeat step 4 to see if the power supply on each layer of the equipment is normal.
6. Turn on again a power supply of a certain layer (such as POWB),
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then insert a board of this layer. (Insert the board along the guide rail and make sure that the two connectors on the board align with the sockets on the backplane. After the board is inserted, press the locking lever vertically to the panel of the board, a “crack” sound will indicate that the board is locked.) Observe the operation of the board, and insert other boards only after making sure that the board is running normally. (The hot-swapping is allowed for all boards other than the power board.) If nothing abnormal happens, turn off the power supply on this layer.
7. Instructions on hot-swapping of boards:
While plugging and unplugging boards, always remember to wear the anti-static wrist strap. Do not forcedly plug/unplug hot-swappable boards by abnormal means or tools. Note especially that to unplug a board, first open the locking levers and then pull out the board once in the direction reverse to the insertion direction.
Boards that hot-swapping is not allowed must be plugged or unplugged after the power is cut off.
8. Repeat step 6 till all boards are inserted into their slots.
Then power on the whole system in the following steps:
1. Turn on the primary power distributor on the rack to lead the primary power supply into the rack.
2. Turn on the secondary power supplies in the following steps:
1) First turn on the secondary power supply of the peripheral interface units at a lower level.
2) Then turn on the secondary power supply on the control layer.
3) Finally turn on the working power supplies on the MP board and the background server.
Note: There is no constraint on the starting-up procedure of the power
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supplies among modules.
If any equipment is faulty or needs maintenance, or in any other case when the power supply of the cabinet should be turned off, then turn off the power in an order reverse to that mentioned above.
Note: Make sure that all secondary power supplies are turned off before turning off the primary power supply.
During the operation of the equipment, if the power-off recovery test of the primary power supply is required, all secondary power supplies and the power supply of the MP background should be turned on.
5.4 Check of board status
1. After power-on, the potential difference between racks shall be less than 0.1V.
2. After the power-on, the outputs of POWBs on various layers shall be within a nominal range. When conditions allow or when it is necessary, the ripple noise of the output voltages should be tested to see if they meet requirements.
3. Simulation test of the load capability of backup power supplies, i.e., when a single power supply is working, measure the power index from the remote end.
4. Check whether the status of each indicator on boards is normal after power-on (for definitions of the indicators on boards, please refer to Section 5.1).
5. Check whether the ventilation fans of the racks are working normally, whether the alarm devices with visual and audible alarms operate normally, and whether the clock device is working normally with nominal precision.
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6 Software Installation
6.1 Initial installation flow of the system software
1. Preparations
1) Engineering information: hardware environment, radio resources, etc.
2) Setup CD of the ZXG10-BSC
The setup CD mainly includes the BSC and BTS version software, OMCR (V2) software and GPRS software.
3) OS software, including Windows NT, Solaris 2.5.1 or Solaris2.6
4) ORACLE8.0.5 database software
5) TCPIP.CFG and ZXG10.CFG configuration files
6) Properly configured foreground and background data files
2. Installation flow
Initial installation of the system software includes installation of the MP
software and background operation & maintenance system software. The
installation of the background operation & maintenance system software is
divided into the server installation and client installation. The installation flow is
shown in Fig. 6-1.
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Install the clientsoftware
Dubug
Install the serversoftware
Install the MPsoftware
St ar t
End
Fig. 6-1 Initial installation flow of the system software
6.2 Installation of MP
1. Installation flow
1) Copy BSC and BTS version software to the C:\VERSION directory, and change the main version number of BSC into: “ZXGBSC”.
2) Copy the data files to the \data\work directories of various MPs.
3) Change file C:\USER\SUPER\PROG\LOGON into “:sb:version/zxgbsc”, and change the attribute of the LOGON file into read-only and hidden.
4) Copy the TCPIP.CFG and ZXG10.CFG file templates to the C:\CONFIG directory.
5) Change the configuration file TCPIP.CFG under the C:\CONFIG\ directory.
6) Reset and restart MP.
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2. The configuration variables of the communications configuration file TCPIP.CFG are described in the Table 6-1.
Table 6-1 Configuration variables of TCPIP.CFG
Configuration variable name
Sub-item Description
BscID [MAIN] BSC ID, non-zero value of BYTE type. The foreground is insensitive to this setting, but OMCR uses it to manage multiple BSCs.
IsRemote [MAIN] Whether this module is put at the far-end. Value: 0 or 1.
TcpPort [MAIN] The port by which MP accepts the link establishment request from TCP, usually set to 5000.
Server Mno [SERVER] Machine No. of server. Multiple servers may be configured, but two at most for the time being. The quantity is defined in SYSCFG.INI.
Server IP [SERVER] IP address of the server.
Test IP [SERVER] IP address of the test server. This address should not be the same as the IP address of any server and LMT.
LMT Mno [LMT] Machine No. of the local maintenance terminal.
LMT IP [LMT] IP address of the local maintenance terminal.
Module [MODULE] MP module No. If this MP is the same as the module No., then read the IP behind it. No.1 is the central module, and No. 2~9 are peripheral modules.
Left IP [MODULE] IP address of the MP which is inserted into the left slot.
Right IP [MODULE] IP address of the MP which is inserted into the right slot.
3. Configuration examples
[MAIN]
BscID = 18
IsRemote = 0
TcpPort = 5000
[SERVER]
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Server Mno = 127
Server IP = 192 168 018 065
Server Mno = 138
Server IP = 192 168 018 066
Test IP = 192 168 018 179
[LMT]
LMT Mno = 200
LMT IP = 192 168 018 070
[MODULE]
Module = 1
Left IP = 192 168 018 001
Right IP = 192 168 018 033
Module = 2
Left IP = 192 168 018 002
Right IP = 192 168 018 034
Module = 3
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Left IP = 192 168 018 003
Right IP = 192 168 018 035
Module = 4
Left IP = 192 168 018 004
Right IP = 192 168 018 036
Module = 5
Left IP = 192 168 018 005
Right IP = 192 168 018 037
6.3 Installation of the background operation and maintenance system
Solaris OS is a relatively stable UNIX OS provided by Sun Microsystems. The OMCR (V2) system is the NMS software with Solaris OS as the server and NT as the workstation, and the application core of the whole system service is based on UNIX OS.
The installation of the background operation & maintenance system includes the installation of the server software and client software. For the basic UNIX commands to be used in the following installation process, please refer to Appendix B.
The installation of the server software includes the following steps:
1. Install the Solaris 2.5.1 or Solaris 2.6 OS.
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2. Install ORACLE 8.0.5 database.
3. Install OMCR (V2) server program.
4. Import data file.
5. Install the peripherals like printer.
Server OS installation:
1. System hardware and software requirements
As ORACLE and OMCR will be installed in the Solaris, advanced hardware and software are required
1) Host: Sun SPARC server.
2) Memory: at least 32M, and usually above 512M to effectuate good performance.
3) Hard disk: at least 6G to ensure long-term stable running of the system.
4) OS: Solaris 2.5.1 or Solaris 2.6 (SunOS 5.5.1 or SunOS 5.6).
5) OS patches: the latest patch programs provided by Sun.
6) Other software: ORACLE 8.0.5, OMCR (V2).
2. Install Solaris on Sun
Before installation, you should know the hardware environment of your system, such as the hard disk space and the memory. The installation steps are as follows:
1) Insert Solaris OS installation CD into CD-ROM drive of the system.
2) Restart the system.
3) Switch to root user, and restart the system.
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Press Stop+A (press Stop key and A key at the same time) when the system begins to restart.
4) With the OK prompt, input the command: boot cdrom.
5) Select the language displayed in the installation process, and input the serial No. for the language (English) selected.
6) Input the number of MBs indicating the hard disk space. Select the size of the swap partition to be used during installation. For ORACLE installation in the next step, the swap partition is recommended to be three times of the physical memory, and if there is more than 1G physical memory in the system, the swap space may be two times of the physical memory, or even less.
7) When the system instruct you to select disk partition to be used in Solaris installation, just accept the default partition (/dev/dsk/c0t0d0s1).
8) The installation environment software will be copied to the hard disk, and then the system will reboot, and several minutes later, the system identification window will appear.
9) In the system identification window, input the information about the system, as shown in Table 6-2:
Table 6-2 System information
System information to be provided Example
Host name Sun10
Network connection Yes
IP address 138.1.20.3
Network mask (255.255.255.0 by default) 255.255.0.0
Name service “NIS+” , “NIS” , “DNS” or “None” None (by default)
Domain name NULL
Name server NULL
IP address of server NULL
Time zone East Asia->PRC
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Date and time 15:03 on November 22, 2000
Root password Sun10omc
Power management (to determine whether the system uses this function)
No
10) Answer questions raised during Solaris installation. See Table 6-3 for details.
Table 6-3 Some questions and suggested answers during Solaris installation
Questions to be answered during installation
Answers to be selected
Version to be installed 2.6 5/98
Default installation or self-defined installation Self-defined
Language environment of software installed English
Software set Five options in all, and select the second one
Partition condition Not changed
To select the partition, note that the partition needed for installing ORACLE database should be 3.5GB at least, and that for installing OMCR server program should be 2GB at least, and the swap partition of the system should be 512MB at least.
11) Wait for the completion of Solaris installation.
This process may last for one hour, depending on the software to be installed
and the speed of the system.
12) Check the “Installation abstract” shown at the end of Solaris installation process.
13) After the installation is over, the system will automatically eject the installation disk.
6.3.1.1 Installing ORACLE database
1. Preconditions
In Solaris installation, set up partition "/oracleapp" not smaller than 3.5G as the
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partition for Oracle installation. To install ORACLE in other partitions, just
change "/oracleapp" in this document to the corresponding partition path.
2. Preparations before installation
1) In the identity of root user, create dba user group, and create the oracle user that belongs to this group.
2) In the identity of root user, change the owner of the directory "/oracleapp" to oracle.
3) In the identity of root user, create local bin directory, e.g. /opt/bin directory, and make sure that each user has the right to visit this directory.
4) In the identity of oracle user, create 4 sub-directories as installation points (a software installation point, and three database installation points), such as
/oracleapp/u01
/oracleapp/u02
/oracleapp/u03
/oracleapp/u04
5) In the identity of oracle user, create $ORACLE_BASE path,
software_mount_point/app/oracle/, such as
/oracleapp/u01/app/oracle
6) In the identity of root user, change /etc/profile file.
#/etc/profile file
ORACLE_OWNER=oracle
export ORACLE_OWNER
ORACLE_BASE=/oracleapp/u01/app/oracle
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export ORACLE_BASE
ORACLE_HOME=$ORACLE_BASE/product/8.0.5
export ORACLE_HOME
LD_LIBRARY_PATH=$LD_LIBRARY_PATH:$ORACLE_HOME/lib:/usr/openwin/lib:$ORAC
LE_HOME/jdbc/lib:/usr/local/lib (no line feed allowed in actual operations)
export LD_LIBRARY_PATH
ORACLE_SID=omc
export ORACLE_SID
ORACLE_TERM=xSun5
export ORACLE_TERM
CLASSPATH=$CLASSPATH:$ORACLE_HOME/jdbc/lib
export CLASSPATH
PATH=$PATH:/usr/bin:/opt/bin:$ORACLE_HOME/bin:/usr/local/bin:/usr/ccs/bin
export PATH
ORA_NLS33=$ORACLE_HOME/ocommon/nls/admin/data
export ORA_NLS33
NLS_LANG=AMERICAN_AMERICA.WE8ISO8859P1
Export NLS_LANG
TMP_DIR=/var/tmp
export TMP_DIR
umask 022
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7) In the identity of root user, change /etc/system file.
#/etc/system file
set shmsys:shminfo_shmmax=4294967295
set shmsys:shminfo_shmmin=1
set shmsys:shminfo_shmmni=100
set shmsys:shminfo_shmseg=10
set semsys:seminfo_semmns=200
set semsys:seminfo_semmni=70
8) Restart the machine.
9) In the identity of root user, run cdrom_mount_point/orainst/oratab.sh script to create and set oratab file and corresponding rights under /var/opt/oracle directory. The instance information about ORACLE is saved in the oratab file.
3. Installation processes
Log in to Solaris as an oracle user, run the installer “orainst” in the CD. For
specific installation processes, please refer to the related document about
oracle installation. A simple installation process is as follows.
1) Select CUSTOM mode for installation.
2) There are several installation modes:
Install, Upgrade or De-Install Software
Create/Upgrade Database Objects
Perform Administrative Tasks
For installation for the first time, select the first installation mode above.
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3) Select: Install New Product - Create DB Objects.
4) Reserve the default path: ORACLE_BASE, ORACLE_HOME.
5) Reserve the default path: Installer Log, SQL Log, Makefile Log, OS Log.
6) Select: Install From CD-ROM.
7) Keep the value of ORACLE_SID unchanged.
8) Select: NLS: Native Language – American English.
9) Select the desired product for installation.
Client Software
Net8
Oracle UNIX Installer
Oracle8 Enterprise (RDBMS)
Oracle8 Partitioning Option
PL/SQL 8.0.5.0.0
Pro*C/C++
SQL*Plus
TCP/IP Protocol Adapter
Oracle Intelligent Agent
Solaris Documentation
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JDBC
10) Reserve the default value: Group To Act as DBA: dba.
11) Reserve the default value: OSOPER Group – dba.
12) Select: File System-based Database.
Database storage type: File System or Raw Devices.
13) Select “Y”: Distribute Control Files Over 3 Mount Points.
/oracleapp/u02
/oracleapp/u03
/oracleapp/u04
14) Database character set: select WE8ISO8859P1.
This character set is not listed in the installation interface of the installer and
therefore needs to be input manually.
15) NLS Character Set: WE8ISO8859P1.
Select WE8ISO8859P1 as the character set to realize national language
support (NLS) function. This character set is not listed in the installation
interface of the installer and therefore needs to be input manually.
16) Input password: Password For “system”.
During installation, input “oracle” as password where it is required without
exception. And the password may be changed after installation.
17) Input password: Password For “sys”.
18) Select “N”: Do not Set the Password For “internal”.
19) Input password: Password for the TNS Listener.
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20) Select “N”: Multi-Threaded Server (N).
21) Reserve the default value: Control Files.
/oracleapp/u02/oradata/omc(SID)/control01.ctl
/oracleapp/u03/oradata/omc(SID)/control02.ctl
/oracleapp/u04/oradata/omc(SID)/control03.ctl
Reserve the default value: Files:
/oracleapp/u01/app/oracle/product/8.0.5/dbs/orapwomc
/oracleapp/u02/oradata/omc/system01.dbf
/oracleapp/u02/oradata/omc/redoomc01.log
/oracleapp/u03/oradata/omc/redoomc02.log
/oracleapp/u04/oradata/omc/redoomc03.log
/oracleapp/u02/oradata/omc/rbs01.dbf
/oracleapp/u02/oradata/omc/temp01.dbf
/oracleapp/u02/oradata/omc/users01.dbf
/oracleapp/u02/oradata/omc/tools01.dbf
22) Select “N”: LSM (Legato Storage Manager).
23) JDBC (select all).
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24) Select “Y”: Help For SQL *PLUS (Y).
25) Select “Y”: Demo Table For SQL *PLUS (Y).
26) Reserve the default value: ORACLE_DOC directory: /oracleapp/u01/app/oracle/doc.
27) Select: Formats For UNIX Documentation (both html and pdf).
28) Start installation.
4. Work after installation
In the identity of root user, execute $ORACLE_HOME/orainst/root.sh.
6.4 System debugging
6.4.1 Contents of BS system debugging
After BSC software and hardware are installed, overall debugging is performed
so as to find possible problems and get prepared for the normal acceptance,
cutover and running of the system.
Debugging of the base station system includes the following contents:
1. Equipment installation technical test
For the details, please refer to Chapter 5.2, Inspection before power-on.
2. System setup functions
System initialization loading.
3. Troubleshooting test
4. Service test
1) Call service
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2) Various switching modes
Operation and maintenance subsystem test
1) Man-machine commands
2) Configuration management
3) Alarm management function
4) Performance measurement and performance management functions
5) Security management
6.4.2 Debugging of the system setup function
Initialization: BSC initialization is normal.
6.4.3 Troubleshooting test
1. Active/standby switchover
1) Switchover of active/standby MPs
A. Fault switchover
B. Manual switchover
C. Man-machine command switchover
Switchover works normally. Subscribers in the status of talking or ringing will not be influenced, but those in the process of connecting may be influenced. MP can realize switchover from active to standby, or standby to active.
2) BOSN board active/standby switchover
A. Fault switchover
B. Manual switchover
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C. Man-machine command switchover
Switchover works normally. Subscribers in the status of talking or ringing should not be influenced, but those in the process of connecting may be influenced. BOSN can realize switchover from active to standby, or standby to active.
3) GPP board active/standby switchover
A. Fault switchover
B. Manual switchover
C. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.
4) COMI board active/standby switchover.
A. Fault switchover
B. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.
5) DSNI active/standby switchover:
A. Fault switchover
B. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.
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6) COMI board active/standby switchover
A. Fault switchover
B. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.
7) POWB hot backup function
POWB hot backup function is implemented normally. Call connection is not
affected, and there should be an alarm report when POWB gets faulty.
2. Restarting the system
1) System restart after power-off
A. Board indicators work normally.
B. PCM system returns to normal.
C. Link No. 7 can be reactivated.
D. LAPD link can return to normal.
E. All cells can return to normal.
F. OMCR can give the correct alarm content.
G. Communication between foreground and background return to normal.
H. BSS services return to normal.
2) MTP board restart: NO.7 (SCCP) is interrupted, but it may return to normal.
3) LAPD restart: LAPD link with BTS is broken, but it can return to normal.
4) PEPD board restart: it can return to normal.
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5) MONI board restart: it can return to normal.
6) MPPP board restart: communication between BSC MP and PPs is broken, but it may return to normal.
7) MPMP board restart: communication among BSC modules is broken, but it can return to normal.
8) DRT board restart: The trunk to MSC is broken, but it can return to normal.
9) TIC board restart: The trunk to MSC is broken, but it can return to normal.
6.4.4 Service test
6.4.4.1 Call service
1. Local MS→local PSTN subscriber
A local MS calls an idle local PSTN, the called PSTN subscriber will reply, and the call is completed. When a local MS calls an idle local PSTN subscriber, the called rings and the caller hears the ring-back tone, the calling MS will turn off his mobile phone, and the call shall be released properly. MS calls local PSTN subscriber, and when the called is busy, the call should be capable of being released correctly. MS calls local PSTN subscriber, and when the called is a null number, MS should hear null number announcement tone. MS calls an idle local PSTN subscriber, and when the called does not answer or the timer is timeout, the call should be capable of being released successfully.
2. Local MS→long distance PSTN
MS calls an idle distance PSTN subscriber, and the distance PSTN subscriber
answers.
3. Local PSTN subscriber→local MS
A local PSTN subscriber calls an idle local mobile subscriber, the MS
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answers, and the call should be capable of being completed. Local PSTN calls local busy MS, the caller should be able to release correctly, without affecting the call of the called. Local PSTN subscriber calls MS, and when the called does not answer and the timer is timeout, the call should be capable of being released. Local PSTN subscriber calls local idle MS, but when the radio channel is congested, the call should be capable of being released successfully. Local PSTN subscriber calls local idle MS, but when the ground trunks are all busy, the call should be capable of being released correctly.
4. Local MS→local MS
An MS calls another idle MS and the called party answers the call, the call shall be completed successfully. MS calls another idle MS, and when the called answers and the caller hooks on first, the call should be capable of being released successfully. An MS calls another idle MS, and when the called answers, the called hooks on first, the call should be capable of being released successfully. An MS calls another local busy MS, the caller should be able to release correctly, without affecting the call of the called. An MS calls another idle MS, and the called party does not answer the call until timeout, the call shall be released. An MS calls another MS, when the called MS gives no paging response, the call should be capable of being released successfully. An MS calls another MS, when the called number is a null number and the caller hears null number announcement tone, the call should be capable of being released successfully. An MS calls another MS, and when the radio channel is congested, the call should be capable of being released successfully.
5. Local PSTN subscriber→non-local MS
PSTN calls an MS roaming locally, the MS answers, the call should be capable of being completed.
6. Long-distance PSTN subscriber→local MS
A long-distance PSTN subscriber calls local MS, the MS answers, the call
should be connected.
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7. Remote MS→local MS
A remote MS calls an idle local MS, and the local MS answers, then the call
shall be connected. A local MS roaming remotely calls local MS, local MS
answers, the call should be capable of being completed. Remote MS roaming
to the third party calls local MS, local MS answers, the call should be capable
of being completed. A local MS roaming remotely calls local MS, local MS
answers, the call should be capable of being completed.
8. Local MS→remote MS
A local MS calls an idle remote MS that does not roam, and the called answers,
then the call should be connected. A local MS calls a local MS, local MS that
roams to a remote network, and the called answers, then the call should be
connected. A local MS calls a remote local MS that roams to the local network
and the called answers, the call should be connected. A local MS calls an MS
that roams to a third-party remote network and calls a local MS, the called
answers, then the call should be connected.
6.4.4.2 Handover test
1. Handover function in the same cell: Handover can be performed normally.
2. Handover function between two adjacent cells controlled by the same BSC: Handover can be performed normally.
3. Handover function between two adjacent cells controlled by different BSC: Handover can be performed normally.
4. Directed retry controlled by the same BSC: Handover can be performed normally.
5. Directed retry controlled by different BSCs: Handover can be performed normally.
6.4.5 Operation and maintenance subsystem test
1. Man-machine commands
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BSS can input all commands and configuration data via the remote OMC
interface, and transmit them to BSS along X.25 link. It supports local MMIs of
all BSCs and BTSs.
2. Configuration management
The data can be correctly configured in accordance with the radio network of
the subscribers. The operation and maintenance center should be able to
modify, add and delete data easily and correctly.
3. Alarm management
The alarm management subsystem should perform various functions: collect various BTS and BSC alarms timely and correctly, and report to OMCR; ensure that no alarm is lost or repeated; correctly send status of each board to OMCR, such as the active/standby status, etc., save the alarm in BSC for certain period of time when the foreground is disconnected from the background, and after communication restores, send the alarm to OMCR; support various man-machine commands for the board, such as reset, switchover; whether to provide hot backup of current alarm information between active/standby MP, and during active MP switchover, no alarm information will be repeated or lost.
The alarm function can be tested by simulating all possible alarms in the system environment, and through the alarm background of OMCR, checking whether the alarms can be reported and recovered correctly. We can check whether man-machine commands can be executed correctly by sending various supported commands from the alarm background of OMCR to BSC.
4. Performance management
For the performance measurement sub-system, it should create and terminate various measurement tasks issued by background, i.e. perform correct maintenance according to man-machine commands of background; send measurement data to background timely and correctly. The measurement data collected may truly reflect the running status of the system. When the foreground is disconnected from the background, the
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former saves the data in BSC, and then sends to OMCR after communication restores.
The performance is tested mainly through artificial service flows, to observe at the OMCR performance measurement background whether relevant data are correct; and via this background, add to or delete from the foreground the measurement tasks to see whether BSC can handle these operations correctly.
5. Security management
Security management includes various management for authentication, access control, user, user group, operation log, etc. In addition, BSC has the system restriction function, restricting the input of MMI commands from the local I/O terminal, remote connection terminal or via X.25 data link.
6.4.6 GPRS test contents
1. Hardware function test
2. Software version check
Check the version number of the software manufactured with that of the running software. They should be consistent.
3. Fault test
Once the system is restarted after power-off, the Gb link can be re-activated, and each BVC can become normal again.
4. Switchover and restart test
1) PUC board active/standby switchover
A. Fault switchover
B. Manual switchover
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C. Man-machine command switchover
2) GIPP board active/standby switchover.
1 Fault switchover
2 Manual switchover
3 Man-machine command switchover
3) BRP restart: it can return to normal.
4) FRP restart: it can return to normal.
5. Service test
1) Gb interface test
NSVC status observation, blocking, unblocking; BVC status observation, blocking, unblocking, signaling BVC resetting.
2) Packet service test
GPRS attachment, detachment; PDP activation, deactivation; packet service test (PING, WAP, FTP, HTTP).
6.4.7 Installation and test records
When installing and testing BSC software and hardware, please keep careful records of all installation items and test results, especially for the faults and corresponding solvents in the project.
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7 Packaging, Storage and Transportation
7.1 Packing
All parts and components of ZXG10-BSC (V2) are packed by adopting reasonable quakeproof, vibration-free and other precaution measures, so as to protect the equipment during transportation.
The whole system of ZXG10-BSC (V2) is packed in separate packages. These packages include rack package, doorplate package, side plate package, MP package, power supply package, cable package, and delivery-attached documentation package.
Each package has obvious outside markers, which indicate the product name, model, handling and placing direction, as well as dampproof, fragile, waterproof and piled layer indications, so as to avoid damages, confusion, mismatching, etc., while storing and transporting the equipment.
1. Packing of plug-in units
Take down the plug-in units from the rack, pack them with anti-static bag and put in large foam-padded carton box. Operate in an order reverse to the above one for assembling racks on site.
2. Rack packing
Rack package contains plug-in boxes, backplanes, power plug-in box on top of the rack, plug-in units, backplane signal lines (excluding cabinet top cover, front and back door plates and side plates). First pack them with anti-static bag and then put in a wooden box. Operate in an order reverse to the above one for assembling racks on site.
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The size of the wooden box is 958mm (length) × 2148mm (width) × 813mm (depth), as shown in Fig. 7-1.
958m
m81
3mm
2148mm
Fig. 7-1 Exterior dimensions of the wooden box
3. Door packing
Wrap the 4 front and back doors separately in EPE packages, separate them with foam boards, and then put them into door packing boxes. Operate in an order reverse to the above one for assembling racks on site.
Size of the wooden box: 238mm (length) × 1988mm (width) × 508mm (depth)
4. Side door packing
Wrap the two left and right side doorplates separately with EPE packages, stack them up by placing foam boards in-between, and then put them into the side doorplate packing box. Operate in an order reverse to the above one for assembling racks on site.
Size of the wooden box: 178mm (length)×2,123mm (width) × 708mm (depth)
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7.2 Storage
7.2.1 Storage conditions
Ordinary goods should be placed in special-purpose rooms and taken care of by somebody designated by the user. The room should satisfy the following conditions:
1. Temperature: 0°C ~ 35°C, relative humidity: 20% ~ 75%, without dense dirt or corrosive materials around.
2. No direct sunshine or other direct thermal radiation.
3. The warehouse should be fixed with a thermometer, hygroscope, air-conditioner, ventilation fan, and facilities providing protection against dust, mold, corrosion and rodents.
4. The warehouse should be installed with fire control and alarm devices.
5. The warehouse keeper should read the thermometer and hygroscope every day and keep proper record. To make the temperature and humidity meet relevant requirements (in case they fail to), proper measures should be taken.
6. The warehouse keeper should keep the warehouse clean and tidy, and open the windows or curtains only when it is necessary.
7.2.2 Placement
Keep the following in mind when storing goods:
1. Place the packing box as directed, with the arrow outside the packing box pointing upward. Do not place it upside down and do not overlap more than two boxes.
2. Usually, place computers and boards on top and cables at the bottom. Do not overlap more than four cartons.
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3. Store boards in cartons and insert isolating plates between the boards, so as to protect the boards against damage due to static electricity. Place no more than 20 boards in a carton to prevent the boards from pressing against each other. Wear anti-static wrist strap when handling the boards.
4. Place the box storing boards on rack to protect board from moisture.
7.3 Equipment transportation and portage
Special containers should be used for product transportation.
The products on transportation vehicles shall be placed neat and tidy, compact, safe, and reliable, so as to prevent shake-caused damages during transportation. Do not overlap more than three wooden boxes, no more than two fiber boxes, and no more than four cartons. Note that the computers and boards should be placed on the top of the vehicle, and cables at the bottom.
In long-distance transportation, the equipment MUST NOT be loaded in an ship or carload without awnings. In transshipment, equipment MUST NOT be placed in an open warehouse. During the transportation, equipment MUST NOT be loaded with flammable, explosive and erosive goods, and the parts should NOT be exposed to rain, snow, liquids or mechanical damages.
During transportation, keep the cargo away from the ferromagnetic and highly radiating objects.
Do not place the products and parts packed upside down when they are lifted for transportation.
No more than two cabinet packing boxes are allowed in the forklift every time, and the maximum height for lifting must be within the range; and the equipment parts must lie at the gravity center of the forklift.
Note the storage and transportation mark on the packing box when handling.
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Appendix A BS System Alarms
After ZXG10 is plunged into operation, start the centralized monitoring over its overall operation status so as to enable real-time maintenance and repairing. This function is implemented by the background alarming system. This Appendix lists alarms of various types for reference.
A.1 BSC alarm list
Table A-1 BSC alarm list
Alarm type Alarm level Description
Net drive board alarm 2 DSNI board has been inserted unstably, the board is not in the position, or communication with MP is interrupted or hardware is faulty.
Severe alarm on the power supply board
2 Voltage output is over or under voltage.
Clock interface board alarm
3 BITS clock reference is lost, or the clock interface board powers off or hardware is faulty, etc.
Common alarm of the power supply
4 The power supply board can not be monitored, is not in position, or powers off, etc.
SS7 access point unreachable
3 The communication link quality between BSC and MSC is not good.
SS7 L3 alarm 3 SS7 link communication quality is poor, and a lot of error signaling is received, etc.
SS7 SCCP alarm 2 When SCCP configures SSN status, the office ID can not be found out by DPC.
MP active/standby communication interrupted
2 The standby MP does not work normally, the shared memory board is faulty, etc.
MPPP board fault 2 Communication between MPPP and MP interrupted, power-off, hardware fault, or clock loss, etc.
SS7 board fault 3 Communication between MTP and MP interrupted, power-off, hardware fault, or clock loss, etc.
Alarm type Alarm level
Description
MON board fault 3 Communication between MON and MP interrupted, power-off, hardware fault, or clock loss, etc.
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SMEM board fault 2 Communication between SMEM and MP interrupted, power-off, hardware fault, or clock loss, etc.
Environment monitoring board fault
2 Communication between the environment monitoring board and MP interrupted, power-off, hardware fault, or clock loss, etc.
LAPD board fault 2 Communication between LAPD and MP interrupted, power-off, hardware fault, or clock loss, etc.
Trunk congestion 3 Trunk congestion
Trunk loading error 4 Trunk loading error
BIE unit alarm 3 Communication is interrupted, reporting the fault
BIE sub-unit alarm 4 Frame asynchronization
SM board fault 2 Communication between SM and MP interrupted, power-off, hardware fault, or clock loss, etc.
PCM cable fault between SM
3 A chip fault in the SM board or external line fault
SM sub-unit fault 3 Frame asynchronization
DRT board fault 2 Communication between DRT and MP interrupted, power-off, hardware fault, or clock loss, etc.
DTI board fault 2 Communication between DTI and MP interrupted, power-off, hardware fault, or clock loss, etc.
TC sub-unit alarm 3 Frame asynchronization
DSP ring fault on DRT 4 Software or hardware fault in DSP
PECM sub-unit alarm 4 Fault of a chip in the SM board or an external line, etc.
PECM board fault 3 Communication between PECM and MP interrupted, power-off, hardware fault, or clock loss, etc.
BSC equipment room ambient temperature alarm
2 Temperature is out of the normal working range of the switching system.
BSC equipment room ambient humidity alarm
3 Humidity is out of the normal working range of the switching system
BSC equipment room smog alarm
1 There is smog in the equipment room.
BSC equipment room infrared alarm
1 Somebody illegally enters the equipment room.
MP alarm 2 The standby MP is faulty.
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Alarm type Alarm level Description
The standby MP powers off
The standby MP software is faulty.
The standby database restores.
Database loading fails
The standby MPWatchDog overflows.
Insufficient MP disk space alarm
2 Hard disk space is insufficient.
MP bus alarm 1 The shared memory bus is faulty, and communication board bus is faulty.
MP database loading fault
2 The database loading failure, the database synchronous failure
Switching network fault 2 The switching network hardware, software or clock interface faults
Switching network dual faults
1 Communication with MP interrupted, clock fault, power-off, etc.
Clock board severe alarm
1 8K frame header and 8K clock output faults; 16K frame header and 16M clock output faults.
Clock board general alarm
3 Main D/A conversion is out of range, and it is normally caused by the clock aging.
A.2 BTS alarm list
Table A-2 BSC alarm list
Alarm type Alarm level
FUC-CHP0 communication interrupted 4
FUC-CHP1 communication interrupted 4
FUC-CHP2 communication interrupted 4
FUC-CHP3 communication interrupted 4
DSP0 initialization failure 3
DSP1 initialization failure 4
DSP2 initialization failure 4
DSP3 initialization failure 4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP0)
3
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Alarm type Alarm level
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP1)
4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP2)
4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP3)
4
Number of the CKU-receiving frame is abnormal. 4
The interface clock of FUC_CKU is faulty. 3
Flash Memory error 3
Other FUC hardware errors 4
WatchDog overflow of DSP0 4
WatchDog overflow of DSP1 4
WatchDog overflow of DSP2 4
WatchDog overflow of DSP3 4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP0)
4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP1)
4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP2)
4
There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP3)
4
WatchDog overflow of FUC 3
Attempts of programming is beyond limits in Flash Memory of FUC
4
Ch0 parameter configuration error 4
Ch1 parameter configuration error 4
Ch2 parameter configuration error 4
Ch3 parameter configuration error 4
Ch4 parameter configuration error 4
Ch5 parameter configuration error 4
Ch6 parameter configuration error 4
Ch7 parameter configuration error 4
CHP software version inconsistent 3
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Alarm type Alarm level
FUC software version inconsistent 3
No response from L3 layer software of FUC temporarily 4
LAPD link between FU and BSC interrupted 3
DLRC_AL downlink check error 3
Receiving RF local oscillator 1 out of lock 4
Receiving RF local oscillator 2 out of lock 4
Transmitting RF local oscillator 3 out of lock 3
Transmitting RF local oscillator 4 out of lock 3
Transmitting IF local oscillator 5 out of lock 3
Receiving IF local oscillator 6 out of lock 4
CU parameter configuration error 3
CU software version error 3
CU L4 layer software without response temporarily 4
CKU main clock alarm 2
CKU frame number alarm 3
CKU phase-locked loop out of lock alarm 4
CKU software version error 3
CKU L3 layer software without response temporarily 4
BIE software version error 2
BIE switching chip 1 fault 3
BIE switching chip 2 fault 3
BIE switching chip 3 fault 3
BIE switching chip 4 fault 3
E1 interface chip 1 read/write fault in BIE 4
E1 interface chip 2 read/write fault in BIE 4
E1 interface chip 3 read/write fault in BIE 4
E1 interface signal 1 loss alarm in BIE 3
E1 interface signal 2 loss alarm in BIE 3
E1 interface signal 3 loss alarm in BIE 3
E1 interface signal 1 forward slip code indication in BIE 4
E1 interface signal 2 forward slip indication in BIE 4
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Alarm type Alarm level
E1 interface signal 3 forward slip code indication in BIE 4
E1 interface signal 1 backward slip indication in BIE 4
E1 interface signal 2 backward slip indication in BIE 4
E1 interface signal 3 backward slip code indication in BIE 4
E1 interface signal 1 frame asynchronization alarm in BIE 3
E1 interface signal 2 frame asynchronization alarm in BIE 3
E1 interface signal 3 frame asynchronization alarm in BIE 3
BIE link parameter configuration error 3
No response from L3 layer software in BIE temporarily. 4
Fan 1 alarm 3
Fan 2 alarm 3
Fan 3 alarm 3
Fan 4 alarm 3
Fan 5 alarm 3
Fan 6 alarm 3
Fan 7 alarm 3
Fan 8 alarm 3
Fan 9 alarm 3
Temperature sensor 1 alarm 3
Temperature sensor 2 alarm 3
Temperature sensor 3 alarm 3
Temperature sensor 4 alarm 3
Temperature sensor 5 alarm 3
Temperature sensor 6 alarm 3
Dry contact 1 alarm 3
Dry contact 2 alarm 3
Dry contact 3 alarm 3
Dry contact 4 alarm 3
Dry contact 5 alarm 3
Dry contact 6 alarm 3
Dry contact 7 alarm 3
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Alarm type Alarm level
Dry contact 8 alarm 3
Dry contact 9 alarm 3
Dry contact 10 alarm 3
Dry contact 11 alarm 3
Dry contact 12 alarm 3
L3 layer software version error in EAM 3
Temporarily no response from L3 layer software in EAM 3
Attempts of programming is beyond limits in the FLASH of OMU 4
FLASH programming failure in OMU 4
FUBUS fault (communication between OMU and all FUs is interrupted) 3
OBBUS fault (communication between OMU and BIE/CKU/EAM is interrupted) 3
OMU backup board is not in position. 4
PA output power alarm 3
PA voltage standing wave ratio alarm 3
PA power amplifier tube over current alarm 4
PA power amplifier tube over voltage alarm 4
PA over temperature minor alarm (≥75°C) 4
PA over temperature major alarm (≥80°C) 3
Downlink check error from CHP to CUI 4
Low noise amplifier 1 alarm of the transmitter splitter 4
Low noise amplifier 2 alarm of the transmitter splitter 4
Standing wave minor alarm of the transmitter combiner 4
Standing wave major alarm of the transmitter combiner 3
PSB alarm 3
PSA alarm 3
CKD not in position 3
OMU communication link interrupted 2
BIE communication link interrupted 3
CKU communication link interrupted 3
EAM communication link interrupted 3
FU communication link interrupted 4
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Alarm type Alarm level
CU communication link interrupted 4
RTE communication link interrupted 3
PSA communication link interrupted 3
PSB communication link interrupted 3
PA communication link interrupted 4
MUL communication link interrupted 4
CKD communication link interrupted 4
HYCOM communication link interrupted 4
OMU board timeout has not been reported 3
BIE board timeout has not been reported 4
CKU board timeout has not been reported 4
EAM board timeout has not been reported 4
FU board timeout has not been reported 4
CU board timeout has not been reported 4
RTE board timeout has not been reported 4
PSA board timeout has not been reported 4
PSB board timeout has not been reported 4
PA board timeout has not been reported 4
MUL board timeout has not been reported 4
CKD board timeout has not been reported 4
HYCOM board timeout has not been reported 4
A.3 GPRS alarm list
Table A-3 BSC alarm list
Alarm type Alarm level
HDLC communication is interrupted in FRP board 3
8M8K clock loss in FRP board 2
8K clock loss in FRP board 2
FRP board frame relay circuit fault 3
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Alarm type Alarm level
MSVC link reset failure 3
HDLC communication is interrupted in BRP board 3
8M8K clock loss in BRP board 2
8K clock loss in BRP board 2
DSP fault in BRP board 4
PUC board failure. 3
PUC unit failure. 3
LAN fault inside SPCU 3
GIPP board failure. 3
LAN fault between SPCUs 2
A.4 Notification type list
Table A-4 Notification type list
Notification types Cause description
Peripheral control unit reset
Disk is full.
File is damaged. File operation error announcement
File bias value error.
TUP announcement
ISUP announcement
SCCP announcement
E1 interface slip code announcement
BSSAP announcement
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Appendix B UNIX Common Commands
Under Shell prompt, input UNIX commands.
The basic format of UNIX commands is as follows:
command parameter 1 parameter 2 ... parameter n
UNIX command consists of one command and 0~several parameters. The command and parameter are separated by a space, so are parameter and parameter. The format of UNIX command is similar to that of DOS command, but UNIX command is case sensitive and the command and parameter must be separated.
1. Login and exit
Input the username when the remote system prompts as “login:”, press <Enter>, and input the password in accordance with the system prompt. Note that the terminal does not display the password, just input as usual. Upon successful login, the system will give $> prompt or other prompts, indicating you have entered into the system’s working environment. Do use logout or exit command to exit the system or leave the terminal for long.
Note:
UNIX includes three common Shells: B Shell, C Shell and K Shell, and generally, B Shell is default in the system. The default prompts of B Shell and K Shell are "$", and that of C Shell is "%". The system prompt is "#" if the user logs in as root user.
2. User management command
Users of UNIX system include common users and super users, and each user belongs to an authority group. After login as root super user, it is possible to add user with useradd and delete user with userdel.
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1) Adding a user
useradd [-c uid comment] [-d dir] [-e expire] [-f inactive] [-g gid] [-G gid [,
gid…]] [-m [-k skel_dir]] [-s shell] [-u uid [-o]] username
username: the login name of the user, which is an essential parameter
uid comment: content saved in user ID explanation domain
dir: user’s HOME directory
expire: the exact date when user name expires
inactive: the number of days when username hasn’t been used before username is locked
gid: the name or ID of the group the user belongs to
Shell: user’s initial Shell
Skel_dir: the directory of the file copied to the user’s new HOME directory
Uid: user’s unique ID
-o: indicating that the user ID is not necessary to be unique
-g: a basic group selected for the user
-G: some basic groups selected for the user
E.g.: useradd –c OMC2.0 –d /home/omc –g root omc
Create a user omc, whose HOME directory is /home/omc, belonging to
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root group.
2) Deleting a user
userdel [-r] username
-r: delete user’s HOME directory when deleting a user
E.g.: userdel –r omc
Delete omc user, and delete his HOME directory at the same time
userdel omc
Delete omc user, but not his HOME directory
3. File and directory operation commands
pwd the command to show the current working directory
cd convert the working directory (“..” upper-level directory, “.” current directory)
E.g.: cd /home/omcuser
mkdir create sub-directory
E.g.: mkdir omctmp
Under the current directory, create subdirectory omctmp
rm /mv /cp move, copy and delete file
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E.g.: rm –r tmp delete all files and directories under the sub-directory tmp
rm gpo2001/7/12.log delete the log file of gpo
mv junk precious rename the file junk as precious, keeping the content unchanged.
cp junk precious copy file, existing two files with the same content.
ls -al list all files and directories in the system. The attributes of each item indicate the read/write and execution attributes of files/directories, including the file/directory number, host user, host group, file size, creation time, file name.
vi editor or other editors can be used to create file.
cat show the content of a text file
E.g.: cat test.conf or cat test.conf | more
tail show the last 10 lines of the file, applicable to large files.
E.g.: tail -f gpoc2001/7/11.log, capable of promptly showing the content of the updated current file
find used to search for a certain file
E.g.: find ../ amp2001/7/11.log search for the file named amp2001/7/11.log in the upper-level or included subdirectory.
grep search for character string in the whole text file
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E.g.: grep ‘hello world’ example.txt
4. File compression and decompression
tar most common backup commands
E.g.: tar -cvf ./2001/7/12log.tar . back up all files under the current
directory to 2001/7/12 log.tar file
tar –xvf omc20.xxxx-sparc.tar decompress the file to the current directory
gzip/gunzip compress/uncompress compression and decompression tool
E.g.: gzip omc20.xxxx-sparc.tar compress the omc20.xxxx-sparc.tar file to omc20.xxxx-sparc.tar.gz file
gunzip omc20.xxxx-sparc.tar.gz decompress the file to tar file
compress omc20.xxxx-sparc.tar compress the .tar file to
omc20.xxxx-sparc.tar.Z file
uncompress omc20.xxxx-sparc.tar.Z decompress omc20.xxxx-sparc.tar.Z to omc20.xxxx-sparc.tar file
5. Network-related commands
netstat: view the connection status of the current network interface of the server
ping view the contection status of the network e.g., ping 138.2.1.235
telnet: log in to other hosts e.g., telnet 138.2.1.235
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ifconfig configure local network interface, ifconfig –a is used to show the local IP address
6. How to execute other commands of the program at the background
To make a program run at the background, just add “&” at the end of the
command line.
E.g.: execute find command at the background to search for the file abc under the current directory or its subdirectory.
Execute the command, and the following contents will immediately display:
$ find . -name abc -print&
10722
$
10722 stands for process ID (PID).When find command is executed at the background, the result will be displayed.
7. Process-related commands
PS shows the process information as in Table B-1.
Table B-1 Process information shown by PS
UNIX command Explanations
ps Show the process information related to the terminal used
ps -u username Show the process of a certain user (e.g. ps -u abc)
ps –e Show the information of all running processes
ps –f The long list shows the information of each process
ps –ef the long list shows the information of all running processes
E.g., kill “kill” the process
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E.g., kill process ID or kill–9 process ID force-kill process
8. Steps for stopping out-of-control process
1) Log in as root user at the unlocked terminal
2) Use "ps -ef" and "grep keyword" command to search for the pid number of the out-of-control process
3) kill pid number. If it can’t be killed, then run "kill -9 pid number"
4) If it still can not be, use shutdown
9. View disk space
df –k show how much the disk spaces of the host are used
du –sk . show the disk space occupied by the current directory
10. The shutdown command of the system
reboot restart the system
shutdown the command to shut down and restart the system.E.g., shutdown –i6 restart the system
11. Install and uninstall local file system
mount /dev/device /directory/to/mount
Here, /dev/device is the file system to be installed;
/directory/to/mount is the installation point of the local file system
Note: Before installation, the host directory of the installation point must exist
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Options of the mount commands:
rw: rewritable
ro: read only
bg: background installation (if installation fails, the installation process will retry at the background until installation succeeds)
intr: installation may be interrupted
E.g. mount –o –rw,bg,intr /dev/hda4 /usr
umount /directory/to/mount
E.g. unmount /usr unmount the /usr file system from the current directory tree, and restore the original content under the directory
12. Load network file system
The most common operation is to visit the file directories of other hosts, provided that this file directory is shared by other hosts in NFS mode. e.g., to visit /export/home/omc directory of 138.2.1.235 machine:
$cd /net/138.2.1.235/export/home/omc
13. Other commands
vmstat view the use condition of the virtual memory of the system
date show the current system time
passwd set user password.For example, passwd, change the current user password
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which <filename> view which directory of the system a certain command is in
E.g., which ls view which directory the command ls is in.
14. Switch to root user
su
Password
15. Use of man tool
The most common help is the man tool in UNIX, whose basic use is man <topic>. In addition, man –sX <topic> can be used to specify the topic of Chapter X.man –K <topic> can be used to search for the topic containing the keyword <topic>.
E.g, man ls view all help topics of the command ls.
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Appendix C Abbreviations Abbr. Full name
AIPP A Interface Peripheral Processor
AIU A Interface Unit
BATC Backplane of A interface and TransCoder
BBIU Backplane of Abis Interface Unit
BCTL Backplane of ConTroL
BIE Base station Interface Equipment
BIPP Abis Interface Peripheral Processor
BIU Abis Interface Unit
BNET Backplane of NET
BOSN Bit-Oriented Switching Network
BRP BSSGP RLC/MAC Protocol processor
BSC Base Station Controller
BSMU Backplane of SubMultiplexing Unit
BSS Base Station System
BTS Base Transceiver Station
CKI ClocK Interface board
COMI COMmunication Interface board
COMM COMMunication board
DRT Dual-Rate Transcoder
DSNI Digital Switch Network Interface
DSP Digital Signal Processor
DTI Digital Trunk Interface
EDRT Enhanced DRT
EGSM Enhanced Global System for Mobile communicaion
FRP Frame Relay Protocol Processor
FSMU Far SubMultiplexing Unit
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(to be continued)
Abbr. Full name
FSPP Far Submultiplexing Peripheral Processor
GIPP Gb Interface Peripheral Processor
GPP General Peripheral Processor
GPRS General Packet Radio Service
GSM Global System for Mobile communication
HW HighWay
LAPD Link Access Protocol on the D channel
LED Low Emitting Diode
LMT Local Maintain Terminal
MON MONitor board
MPMP MP To MP
MPPP MP To PP
MS Mobile Station
MSC Mobile Switching Center
MSS Mobile Switch System
MTP Message Transfer Protocol
NSMU Near SubMultiplexing Unit
NSPP Near Submultiplexing Peripheral Processor
NSU Net Switching Unit
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCU Packet Control Unit
PDCH Packet Data CHannel
PEPD Peripheral Environment &Power Detecting board
POWB POWer B
POWP POWer P
PUC Packet Unit Controller
PSTN Public Switching Telephone Network
RMU Radio Manage Unit
RXLE Rx Level
RXQUA Rx QUAlity
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(to be continued)
Abbr. Full name
SCCP Signaling Connection Control Part
SCM System Control Module
SCU System Control Unit
SM SubMultiplexing
SMB Subrate Multiplexing to Bts
SMEM Share MEMory
SMPP Subchannel Multiplexing Peripheral Processor
SMU Subchannel Multiplexing Unit
SUBPP SUB Peripheral Processor
SYCK SYnchronous ClocK board
TC Trans Coder
TCP Transfer Control Protocol
TCPP TransCoder unit Peripheral Processor
TCU TransCoder Unit
TIC Trunk Interface Circuit