Package and Die Level Deprocessing

Sample Preparation Solutions for…

Electrical and Physical Failure Analysis

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The X-Prep® is a specialized CNC-based milling/grinding/polishing machine designed and engineered to support electrical and physical failure analysis techniques through high precision sample preparation.

Fault Localization – Electrical (EFA) • Package Level

• TDR, GMR/SQUID, Lock-In Thermography (LIT)

• Die Level • Photon/Thermal/Laser/Magnetic-based response, SEM-PVC, FIB (circuit

edit), eBeam Probing, atomic force probing (AFP)/nano-probing

Defect Identification – Physical (PFA) • Package Level

• Acoustic, pre-chemical decapsulation, substrate delayering • Die Level

• SEM, SIMS, frontside delayering

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Failure Analysis Tools and Methods Supported

Backside • CSAM – Scanning acoustic microscopy

• FIB – Focused ion beam – circuit edit/repair

• LADA – Laser assisted device alteration

• LIVA – Light induced voltage alteration

• LVP – Laser voltage probe

• OBIC – Optical beam induced current

• OBIRCH – Optical beam induced resistance change

• PEM – Photo emission microscopy (EMMI)

• SIMS – Substrate thinning and polishing

• TIVA – Thermal induced voltage alteration

Frontside • Decapsulation

• Delayering/deprocessing/reverse engineering

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Die and Package Level Device Examples

3D TSV – Stacked Die

• Flip-Chip - GPU

• NAND/Flash memory

• SoC, PoP, and SiC – mobile processors

• Hybrid Super SoC’s

• WL/CSP – Wafer and chip-scale package

• 2.5D Devices - FPGA

Lead-Frame

• TSOP – Thin small outline package

• SSOP – Shrink small outline package

• SOIC – Small outline IC

• DIP – Dual inline package

Leadless-Quad

• PLCC – Plastic leaded chip carrier

• QFN – Quad flat no-lead

• QFP – Quad flat package

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Sample Prep Examples/Results

Ceramic package Circuit board delayering

Pre-chemical decapsulation – Cu bond wire

MOSFET/Bipolar device FA

Silicon die thinned to near transparency through the backside

Multi-chip power module

QFN

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3D Capability

Flat-plane deprocessing (left) produces nonuniform material removal and

thickness. Deprocessing the device by following its profile

(right) ensures uniform material removal.

The X-Prep® 3D is useful for package deprocessing and die thinning for electrical fault localization methods that demand extreme uniformity of material removal and final thickness control. This capability is ideal for warped substrates that feature either convex or concave geometry. The advantage of deprocessing a device following its physical profile is that it remains in its “as-manufactured” physical state. This approach increases accuracy of material removal and reduces the risk of either mechanically induced or post-processing stress relaxation damage such as cracking and/or delamination. The functionality includes the capability to use and/or create custom/predictive maps to control the milling profile. Both symmetrical and asymmetrical profiles can be used and adjusted to match the physical changes encountered, providing a high degree of versatility to the operator.

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3D Capability – Concave – Package Level

In Support of… • Package-level failure analysis

• TDR, GMR/SQUID & Lock-In Thermography (LIT)

Uniform copper (Cu) pillar deprocessing - molded package, stacked die

Uniform FR4 substrate delayering

• Stacked die deprocessing – X-ray image before (top) and after (bottom) • 8-layer die stack deprocessed to die 7 • 4-layer board deprocessed to layer 1

As packaging technology continues to advance, the physical profile and shrinking density render the use of flat-plane sample preparation tools obsolete due to nonuniform deprocessing. The X-Prep® 3D overcomes these challenges and enables uniform deprocessing of all device types. Leading-edge technology and advanced components utilizing a closed-loop control system ensure unmatched accuracy and precision.

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In Support of… • Laser/Photon EFA Tools

• High NA SIL

• High-Throughput FIB processing • Design debug/circuit edit

• Nano/e-Probing

3D Capability – Convex – Die Level

Convex/Curved die profile

Electrical failure analysis toolsets continue to develop at a pace significantly faster than sample preparation techniques. New solid immersion lenses (SILs) have been developed that require tighter tolerances of silicon thickness for imaging through the backside. Traditional silicon thinning sample preparation techniques that utilize a flat-plane grinding/polishing process do not account for the device bow and have become obsolete.

High-precision sample preparation with the X-Prep® 3D produces uniform (edge-to-edge) remaining silicon thickness by following the natural curvature of the die. The device remains in its physical (manufactured) state and no thermal or mechanical stress/strain is introduced. The die may be thinned (without cracking) to any target thickness or to as little as 5 microns.

Obtain uniform remaining silicon thickness!

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High NA SIL

Optical Probing

SIMS

+/- 5 µm Uniformity and Ultra-thin

Dynamic relaxation of the package that occurs to the die as it is thinned causes the physical die profile to change, resulting

in nonuniform remaining silicon thickness, or RST.

Measurements of the substrate are therefore needed to adjust the physical tool profile to compensate for relaxation and allow thinning to tolerances better than +/- 5 microns

from target thickness.

The X-Prep® Vision™ measures the RST quickly and easily at the click of a button. The RST data is then used to modify the

physical tool profile prior to polishing.

See page 24 for product details

X-Prep® Vision™ Thin silicon to optical transparency!

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Feature Highlight

• 3D capability enables convex and concave profile deprocessing

• Closed-loop design ensures end-point precision and accuracy

• Guided workflow simplifies operation and minimizes the “learning curve” – regardless of experience

• Safety interlocked cover prevents operator access to spindle during operation

• Electronic proximity control prevents tool collision with fixture

• Tool-free fixture and tool interchangeability

• Quiet operation – ~15-20 dB over ambient

• Tool length detection ensures safe operation

• LED ring light provides full illumination above the sample

• Designed, engineered and built by Allied in the USA

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Technical Features/Capability

X & Y Axis • 1 µm resolution, 100 x 100 mm stage travel

• Multiple tool path and overlap options

• Selectable rate from 0.1 to 20 mm/s

Z-Axis • Closed-loop design

• 0.1 µm resolution

• 1 µm accuracy

• Three (3) modes of control:

• Position (Milling/Grinding)

• Position Force (Grinding/Polishing)

• Floating Force (Polishing)

Tilt • Dual-axis tilt control, 0.5 µm resolution

• Automatic 3-point sample leveling

• Level plane

• Angle specific

Operation • 12" color touch-screen

• Wizard-guided GUI

• Built-in help menus with instruction

• High definition (720p) live video X/Y definition

• Store and recall of steps & sequences

Spindle • Variable spindle RPM: 5,000 – 100,000

• Pneumatic tool change

• Powerful 3-phase AC current

• Uses tools with 3 mm Ø shank x 38 mm L

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Operation – Intuitive – Versatile – Easy-to-Use

The X-Prep® features a user-friendly, intuitive interface. As each screen appears in sequence, instruction is provided to the operator, ensuring every parameter and function is defined before operation so that no detail is overlooked. Graphic icons are found on many of the buttons for ease of identification. Help (?) buttons on each screen provide access to additional explanation and instruction for each operation. This quickly provides a reminder and training to those who infrequently use the machine. A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch-screen or external LCD monitor to help the operator define the X/Y boundary. The active display shows X + Y axis position as the stage moves the sample in reference to the crosshair. Zeroing enables measurements and sets the origin. The four-way arrows provide variable speed movement of the fixture/sample. Two buttons set X and Y distance to define the X/Y boundary.

A help (?) button on every screen provide specific instruction to the operator.

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Automatic Tilt Correction/Leveling

Tilted

Corrected

The difference in height between the points of contact on each axis are displayed on the touch-screen. Indication of tilt axis is provided by the

+/- symbol/value.

Automatic Sample Leveling Tilt adjustment (a standard feature) allows leveling the sample plane so it is parallel to the X/Y plane of the tool. Unevenly mounted or tilted samples can easily be leveled using this functionality. Contact on three points provides height data that is used to calculate the amount of adjustment needed. An automatic adjustment is made and it loops until the set tolerance has been achieved. Additional capability enables the operator to position the three points anywhere on the surface of the plane. The distance of lift between points can be set up to 8 mm to clear surface mount capacitors or other obstacles on the plane. The tolerance range can be defined from 0.5 to 100 µm. In cases where an angle other than parallel to the plane is desired, adjustment is also possible using the custom tilt function.

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System Information

The X-Prep® is an ideal tool for any laboratory involved with precision sample preparation to support various analytical methods. It is exceptionally useful in supporting microelectronic device failure analysis labs. Additional applications can be found in the medical, MEMS and optical device/component fields. The table-top, compact footprint requires little space. The operation interface is simple to use, making it a more appealing tool to a greater number of people without any significant training. The wizard-based software guides the operator through a screen sequence to simplify use and reduce reliance on memory and skill. The information created can be captured and stored into the system memory and recalled for later use. Backup to a memory card ensures protection of data. Item No. Description 15-9500 X-Prep® - 115V AC 15-9500-230 X-Prep® - 230V AC 15-9166 3D Software Module – Convex & Concave

• Adds both convex & concave deprocessing capability • Can be purchased and added at a later time

15-92RTP Ruby-Tipped Leveling Probe 15-92ASSORT Assortment Consumable Kit – see quote for details See following pages for accessories and consumables. Several options for training are available – please contact your Allied representative for further details.

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Accessories

Dust Extraction Vacuum, HEPA Filtration This quiet, vacuum provides maximum health protection from exposure to airborne contaminants generated from dry cutting and/or grinding processes. It features a triple filtration system with a carbon and micro-filter that are easy to change. Its automatic control operates the unit only when suction is required. Noise: ~ 15-20 dB over ambient. Dimensions: 13" (330 mm) W x 13" (330 mm) H x 15 " (381 mm) D Item No. Description dB CFM W H2O Lift 15-9180 Vacuum System, 115V AC 60 106 1200 98" 15-9185 Vacuum System, 230V AC 60 106 1200 98" Includes two (2) filter bags and one (1) micro-filter

Fixtures Each fixture is designed to accommodate a carrier insert onto which samples are mounted using wax. Wax offers an advantage over clamping when dealing with delicate samples, or for those so small that clamping is not an option. Borosilicate (glass) carriers maintain their shape through thermal cycling required to melt and harden wax. It is easily machined using diamond tools to produce pockets to accommodate items such as leads on device packages, capacitors or flip-chip die. Aluminum carriers can also be easily fitted into these fixtures and used as an alternative to glass for applications that require the carrier to provide electrical conductivity. All fixtures allow the sample to be submerged in lubricant to maintain lower temperatures for improved tool life and sample preservation as well as capturing particulates from becoming airborne. Item No. Description 15-9125 2" x 2" (50 x 50 mm), with 20 borosilicate carriers (#15-9126) 15-9135 3" x 3" (75 x 75 mm), with 10 borosilicate carriers (#15-9136) 15-9140 4" x 4" (100 x 100 mm), with 10 borosilicate carriers (#15-9141) 15-9147 4" x 6" (100 x 150 mm), with 10 borosilicate carriers (#15-9148)

2 x 2 3 x 3 4 x 4

Smartphone deprocessing

SmartCard

Memory Modules

4 x 6

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Consumables – Cutting Metal and Circuit Board

Carbide End Mills End mills are intended to be predominantly used to cut metal and/or metal alloys. Allied offers a complete line of solid carbide end mills whose item numbers appear in three (3) columns in the chart, each optimized for cutting the following three (3) material categories: PCB – FR4 Substrate Aluminum (Al) and/or Copper (Cu) Ferrous (Fe) Alloys – Steel, NiCo The material composition of PCB (FR4) substrate requires an end mill that is durable enough to cut through not only the metal and resin, but also the glass fiber laminate. These tools are different than what is used just for pure aluminum or copper which conduct more heat that prematurely wears ordinary end mills. For ferrous (Fe) alloys (steel) require an even different tool type than what is used for other materials.

Recommended for:

Aluminum, copper, ferrous (steel) alloys and titanium

Printed circuit boards

Solder balls

Hermetic (NiCo) lids

2-Flute 4-Flute

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Consumables – Cutting Metal and Circuit Board

Remove copper to expose silicon

Small diameter (< 3 mm) end mills provide excellent rigidity to the tip, whereas long reach

end mills (right) provide greater reach to produce deeper cuts

Open small areas as little as 100 x 100 µm

2-Flute End Mills – 38 mm L x 3 mm shank Ø Two-flute end mills have deeper, longer gullets for greater chip-carrying capacity and are center cutting. PCB (P) Al & Cu Ferrous (Fe) Diameter Qty - - - - 15-922F0.05 - - - - 0.05 mm Pk/4 15-922FP0.25 15-922F0.25 15-922FS0.25 0.25 mm PK/4 15-922FP0.5 15-922F0.5 15-922FS0.5 0.5 mm Pk/4 15-922FP0.7 15-922F0.7 15-922FS0.7 0.7 mm Pk/4 15-922FP1.0 15-922F1.0 15-922FS1.0 1 mm Pk/4 15-922FP1.5 15-922F1.5 15-922FS1.5 1.5 mm Pk/4 15-922FP3.0 15-922F3.0 15-922FS3.0 3 mm Pk/4

4-Flute End Mills – 38 mm L x 3 mm shank Ø Four-flute end mills produce finer finishes and last longer than 2-flute end mills because wear is distributed over a greater area. They also remove

material more quickly and can be moved across the sample at a higher rate. PCB (P) Al & Cu Ferrous (Fe) Diameter Qty 15-924FP0.7 15-924F0.7 15-924FS0.7 0.7 mm Pk/4 15-924FP1.0 15-924F1.0 15-924FS1.0 1 mm Pk/4 15-924FP1.5 15-924F1.5 15-924FS1.5 1.5 mm Pk/4 15-924FP3.0 15-924F3.0 15-924FS3.0 3 mm Pk/4

4-Flute, Long Reach – 38 mm L x 3 mm shank Ø Long-reach end mills feature cutting flutes that extend up from the tip approximately 3x the diameter of the tip to allow cutting into deep cavities. Al & Cu Ferrous (Fe) Diameter Qty 15-924F0.7-3 15-924FS0.7-3 0.7 mm Pk/4 15-924F1.0-3 15-924FS1.0-3 1 mm Pk/4 15-924F1.5-3 15-924FS1.5-3 1.5 mm Pk/4

Cut through circuit board material (FR4) with ease

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Consumables – Coarse Grinding

COARSE FINE

Plated Diamond Tools Plated diamond tools feature the coarsest diamond abrasive, which are useful for bulk material removal of: > Glass > Ceramic > Glass-Fiber Reinforced Circuit Boards > Sapphire > Mineral/Glass Filled Resins A silicon carbide dressing stick can be used to remove embedded material and extend the tool life. All tools are 38 mm in length

Item No. Diameter Abrasive Qty 15-92CP1.0 1 mm Coarse Pk/4 15-92CP1.5 1.5 mm Pk/4 15-92CP3.0 3 mm Pk/4 15-92FP0.7 0.7 mm Fine Pk/4 15-92FP1.0 1 mm Pk/4 15-92FP1.5 1.5 mm Pk/4 15-92FP3.0 3 mm Pk/4 Smaller diameters are available upon request 60-20106 Silicon Carbide, 2½" L x ½" x ½" Pk/4

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Consumables – Precision Grinding

Comparison showing the difference in roughness/surface finish of Plated (left) vs Bonded (right) diamond tools – in silicon.

Better profile

Finer finish

Less chipping

Less damage

Metal Bond Diamond Tools Metal bond diamond tools are recommended for grinding silicon and mold resins containing mineral and/or glass/silica filler. When compared with plated tools, bonded tools produce a finer surface finish and allow grinding closer to end point targets with significantly less damage. Bonded tools retain their shape and last longer than plated tools because as the bond and diamond layer wear, new diamond is exposed. As the tip wears, the geometry can be revived using the reshaping tool provided with the X-Prep®. All tools are 38 mm in length.

Item No. Diameter Abrasive Qty 15-92CMB3.0 3 mm Coarse Pk/2 15-92MMB1.0 1 mm Medium Pk/2 15-92MMB1.5 1.5 mm Pk/2 15-92MMB3.0 3 mm Pk/2 15-92FMB0.70 0.7 mm Fine Pk/2 15-92FMB1.0 1 mm Pk/2 15-92FMB1.5 1.5 mm Pk/2 15-92FMB3.0 3 mm Pk/2 15-92VFMB0.70 0.7 mm Very Fine Pk/2 15-92VFMB1.0 1 mm Pk/2 15-92VFMB1.5 1.5 mm Pk/2 15-92VFMB3.0 3 mm Pk/2

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Consumables – Grinding/Thinning

12 mm Ø 9 mm Ø

5 mm Ø

Diamond Grinding Discs These abrasive discs are used as an alternative to bonded diamond tools for thinning silicon where higher throughput is desired on large die/substrates. Discs are secured to mounts using LOCTITE® 460 or 454 and peel off easily when worn. Item No. Diameter Abrasive Qty 15-92CGD5 5 mm Coarse Pk/100 15-92CGD9 9 mm Coarse Pk/100 15-92MCGD5 5 mm Medium Pk/100 15-92MCGD9 9 mm Medium Pk/100 15-92FGD3 3 mm Fine Pk/100 15-92FGD5 5 mm Pk/100 15-92FGD9 9 mm Pk/100 15-92FGD12 12 mm Pk/100 15-92VFGD5 5 mm Very Fine Pk/100 15-92VFGD9 9 mm Pk/100 15-92VFGD12 12 mm Pk/100

Mounts Mounts are used in conjunction with grinding and/or polishing discs. Item No. Diameter Qty 15-92PS12 12 mm Pk/5 15-92PS9 9 mm Pk/5 15-92PS5 5 mm Pk/5 15-92PS3 3 mm Pk/5

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Consumables - Polishing

Shows highly polished, mirror-like surface finish (reflection on

silicon)

Polishing Discs Large diameter polishing discs are used for preparing larger samples to produce smooth, mirror-like, scratch-free finishes. Each polishing disc is secured to a mount using a high performance adhesive such as LOCTITE® 460 or 454 to hold it securely in place. Item No. Name, Diameter Qty Application 180-10953 Planar Pad, 12 mm Pk/50 180-10952 Planar Pad, 9 mm Pk/50 Coarse Polishing 180-10951 Planar Pad, 5 mm Pk/50 90-150-545 DiaMat, 12 mm Pk/50 90-150-544 DiaMat, 9 mm Pk/50 Intermediate/Final 90-150-543 DiaMat, 5 mm Pk/50 Polishing 90-150-735 Final-POL, 12 mm Pk/50 90-150-734 Final-POL, 9 mm Pk/50 Intermediate/Final 90-150-733 Final-POL, 5 mm Pk/50 Polishing 180-10025 Final A, 12 mm Pk/50 180-10024 Final A, 9 mm Pk/50 Final Polishing 180-10023 Final A, 5 mm Pk/50 180-10085 ChemPol, 12 mm Pk/50 180-10084 ChemPol, 9 mm Pk/50 Final Polishing 180-10083 ChemPol, 5 mm Pk/50

Item No. Description 71-40045 LOCTITE® 460 Liquid, 20 gram bottle 71-40045G LOCTITE® 454 Gel, 3 gram tube

Small-Diameter Polishing Tools and Accessories Small (3 mm and less) diameter polishing tools can be made by first punching a small disc from the pad, then adhering it to the polishing mounts using LOCTITE® 460 or 454 – see pg. 21. A cloth-making guide is available to all X-Prep® tool owners. Item No. Description, Size Qty 180-10940 X-Pad II, 6” x 6” Pk/4 180-10950 Planar Pad, 6” x 6” Pk/4 180-10930 Final-POL, 6” x 6” Pk/4 180-10105 Final A, 6” x 6” Pk/4 180-10960 ChemPol, 6” x 6” Pk/4 15-92P3-D Punch, 3 mm Ø Pk/25 15-92P2-D Punch. 2 mm Ø Pk/25 15-92P1.5-D Punch. 1.5 mm Ø Pk/25 15-92P1-D Punch, 1 mm Ø Pk/25 15-9253 Polishing Mount, 3 mm Ø Pk/20 15-9252 Polishing Mount, 2 mm Ø Pk/20 15-9251.5 Polishing Mount, 1.5 mm Ø Pk/20 15-9251 Polishing Mount, 1 mm Ø Pk/20

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Consumables - Polishing

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Consumables - Polishing

Diamond Compound, Polycrystalline Diamond compound is used for intermediate and final polishing to remove damage/scratches after the final grinding/thinning step. Polycrystalline diamond provides the best performance and surface finish. It is recommended to be used with a lubricant for maximum performance. The water soluble formula can be easily cleaned using water. Item No. Description 90-21035-S 15 µm, 18 Gram Syringe 90-21030-S 9 µm, 18 Gram Syringe 90-21025-S 6 µm, 18 Gram Syringe 90-21020-S 3 µm, 18 Gram Syringe 90-21015-S 1 µm, 18 Gram Syringe 90-21010-S 0.5 µm, 18 Gram Syringe Other micron sizes available. See Allied’s complete product catalog for more information.

X-Lube™ – Lubricant X-Lube™ is a solvent-free lubricant that is essential in helping maintain cooler cutting temperatures to avoid overheating the sample and reduces tool wear. It can be recycled and used several times before it needs to be disposed. It is also used with diamond compound for polishing operations. Item No. Description 15-92XL128 Gallon – 128 oz. (3.8 L) 15-92XL32 Quart - 32 oz. (950 mL)

Device/sample completely submerged without splash!

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Measurement - Validation

X-Prep ® Vision™ - Substrate Measurement System This metrology instrument enables measurement of silicon and semi-transparent substrates. It is necessary for applications that require uniform thinning to a specific target with a tolerance of +/- 5 microns or better. The X-Prep® fixture adapter is also secured to the motorized stage on the X-Prep® Vision™, ensuring the measurement/tool control coordinates remain aligned when transferred between systems. A library with over 130 materials including GaAs, InGaAs, SiC, Sapphire/Al2O3, InP, SiGe, GaN, photo-resist is included with every system. Item No. Description 15-50000 X-Prep® Vision™ - 1 mm to 10 micron IR, 100 – 240V AC 15-50005 X-Prep® Vision™ - 1 mm to 200 nm, IR & Visible, 100 – 240V AC Features:

• Multi-point scan and/or single-point silicon thickness measurement

• 0.2 micron/200 nm (visible) to 1 mm (IR) range of measurement

• Motorized, automatic X/Y and Z (auto-focus) with <1s acquisition time

• “Drive to Coordinate” navigation

• Viewing of either 2D plot/map or 3D graph

• C-mount camera adapter provided – HD camera sold separately

• X-Prep® tool owners receive Allied’s proprietary X-Correct™ software

Application note available – Contoured Device Sample Preparation Process

X-Prep® fixtures secure directly onto the stage

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Measurement & Observation

How It Works IR light is focused onto a sample, and a unique signal based on the refractive index of the material is created. The return signal is analyzed by the software to produce a thickness value.

LED and HD camera options

Either an LED marker or an HD camera may be added to provide additional assistance with sample alignment and positioning. The HD camera is secured directly to the c-mount adapter and features an HDMI output that can be connected to an HD monitor for viewing. A crosshair generated through the camera onto the screen enables more precise positioning. The LED marker produces a small dot on the surface of the sample to indicate the sensor position to confirm measurement location.

Item No. Description 15-50000-LED Visible LED Spot Marker 15-50000-HDC High Definition (720p) Camera & Ring Light

Software displays both 2D and 3D visualization

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Measurement & Observation

Digital Indicator Measurement Stand This apparatus is useful in measuring material removal with the X-Prep®. The large granite base of this system supports X-Prep® fixtures, and the locating bracket is used to ensure positioning accuracy so proper measurements can be obtained. Item No. Description 15-9120 Digital Indicator Measurement System with Granite Stand and Locating Bracket (120-30015-B)

• Precision granite stand, 6" W x 8" D x 2½" H • Height adjustable indicator position • Includes lifting lever • Metric and imperial indicator selectable • 0.001 mm (1 micron) resolution

Stemi 305 Stereomicroscope The Stemi 305 stereomicroscope is useful for sample inspection and/or for making tools. Item No. Description 12-S305R Stemi 305 Stereomicroscope 12-S305RC Stemi 305 Stereomicroscope with c-mount camera port, 0.5X

• Integrated LED reflected light illumination • Free working distance of 110 mm • 8x to 40x magnification range – 5:1 zoom ratio

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Technical Data

Electrical Voltage, AC: 115 or 230 at either 50 or 60 Hz frequency Current: 10A Watts: 1000

Air Pressure: 90 PSI (~6 BAR) compressed air – no flow Inlet Size: ¼” (~6 mm) OD tubing (push-in/tool free fitting) Quality: Class 3:4:3 – reference ISO 8573.1

Weight 210 lb. (95 kg)

Required tool dimensions Length: 38 mm (1.5”) Shank: 3 mm Ø

2376 E. Pacifica Place, Rancho Dominguez, CA 90220, www.alliedhightech.com – X-Prep® Rev. F/2-2015

X-Prep is a registered trademark of Allied High Tech Products, Inc. The Allied High Tech Products logo is a trademark of Allied High Tech Products, Inc. All rights reserved. All images are the copyright property of Allied High Tech Products, Inc. and may not be used without prior written permission. Allied reserves the right to make changes to the products and specifications outlined herein, with or without notification, at their sole discretion.