WP1 Gateway HW Design & Implementation
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Transcript of WP1 Gateway HW Design & Implementation
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WP1GatewayHWDesign&ImplementationLEADER: EUROTECH
INVOLVEDPARTNERS: ATOS, SKYWATCH, BIOASSIST, MOBISTAR, L IBEL IUM
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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WP1Objectives(recap)Mainobjective:
specification, designandimplementationofthehardwareofthemodular gateway.
Themodulargateway:• willbeavailableintwoversions:• the“makers”versionbasedonRaspberryPi;• theindustrialversionwithanewHWdesignbasedonIntelarchitecture.
• willbebasedonasetofcoreandexpansionmodules:• coremodules:carriermodule,cpumodule,thestoragemoduleorthepowersupply,etc.;
• extensionmodules:thecommunicationmodules,sensingmodules,etc..
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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WP1Objectives(recap2)Addresstwolevelsofmodularity:• modularityforexistingHW:anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;
• intrinsicmodularity:inthe industrialgatewayanyarchitecturalelement isamodule.
Hardwaremoduleinteroperability:❓ identifytheHWtechnologiesthatsimplifyandpromoteinteroperability;❓ specifyasetofruletofollowduringmodulesdesignanddevelopment.
Hardwareprototypes development:• Implementasetofprototypesofthe“makers”gateway;• Implementasetofprototypesoftheindustrialgateway;• implement asetofexpansionmodulesthatwillbeadoptedinthepilots.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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WP1- StatusT1.1 Wehavetostartcollectingtherequirement fromWP8:taskendsatM5.
T1.2Maker’sGatewaydesign:ongoing.
T1.3 DesignofindustrialGateway:ongoing.
Nextdeadlines:◦ M6- D1.1AGILEGatewayarchitecturespecificationsandinitialdesign◦ Gatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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WP1- Timeline
• D1.1- AGILEGatewayarchitecturespecificationsandinitialdesignGatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.
• D1.2- AGILEGatewayhardwarefinalprototypes2ndAGILERelease– HardwarePlatformFinaldesigns,featuresandfunctionalspecificationsofthehardwareprototypes.DeliveryofthefinalAGILEGatewayprototypes.
• MS1- AGILEInitialDesignMS1&DraftFrameworkReleaseInitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).
• MS2- AGILEFramework(SWandHW)release&InitialIntegrationDeliveryoftheAGILEplatform(softwarecomponents,makersandindustrialgatewayprototypes)andtheinitialintegrationofthesoftwarecomponents.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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DesignmethodologyDesignformodularity (DFM):DFMfollowstheemerging trendinHWdesignandmanufacturing knownas“BuildtoOrder”.◦ BTOproductsarenotbuiltuntilaconfirmedorderforproductsisreceived.◦ WeextendBTOalsotothedesignphase(notonlymanufacturing).◦ Traditionally,BTOisthemostappropriateapproachusedforhighlycustomizedorlowvolumeproducts.
◦ DFMallowstomapacustomdesigninadesignbasedonstandardmodules!
WhyBTO?Modularityhasacostandisonlypartiallycoveredbythehighercostofacustomproduct.
DFM&BTOobjectives:◦ reducetheeffectsoffixedcosts;◦ reducethedevelopmentcosts;◦ offercustomproductswithlowercosts.
Twodifferenttypesofmodularity:◦ modularityforexistingHW- anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;
◦ intrinsicmodularity- intheindustrialgatewayanyarchitecturalelementisamodule.
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DFMMethodology(design&dev)1. Analysisofthecompanyexpertise,background,verticalmarkets, customers,etc..
2. Requirementsdefinition intermsof:◦ systemfunctionalities,◦ targetprice,◦ leadtime,◦ lifecycle.
3. Referencepartitioning ofthesystemarchitecture.
4. Designreviewandoptimizationbasedonthetargetverticals:1. technicalaspects,2. manufacturing,stockingplanningandoperationaspects,3. verticalevaluation.Itprovidesasetoftrade-off,adjustmentsandcostsbalancing.
5. Referencepartitioning refinement.
6. Consolidatedmodulardesign(basedonoff-the-shelfmodulesand/orcustommodules).
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DFMMethodology(productimplementation)Customergatewaydesignandmanufacturing.
1. Customerrequirementsanalysis.
2. Mapping/fittingoftherequirementsonthegatewayconsolidateddesign.
3. Implementationchoicesaboutmodules:◦ thefunctionalmodulebecomesaphysicalmodule;◦ thefunctionalmoduleisintegratedonthecarrier;◦ thefunctionalmoduleisintegratedinSoC.
4. Potentialcustommodulesdevelopment.
5. Finaldesignofthecustomergateway.
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WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
FIRSTDESIGN
•Architecture&Configurationdefined
•ShieldforRaspberryPiindesign• Workingonfirstprototype• 2modulestobepluggedontopofRaspPi• RaspberryPiGPIOsaccessible forsensors
•HotSwapà Allowedbypressingbutton• Thegatewayisabletorecognizewhichmodule(amongthelistofsupportedmodules)hasbeenplugged
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WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
FIRSTDESIGN
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WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
FIRSTDESIGN
•CONNECTIVITY
• RaspberryPi2• 2modulestobeplugged• Wifi &3G/4Gà USBDongle• RaspberryPi3• 2modulestobeplugged• Wifi &BluetoothLowEnergyà includedinRaspberry• 3G/4Gà USBDongle
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WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
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WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
OtherREQUIREMENTS
•GettingRequirements fromPILOTS• Communicationtechnologies• Physicalconstraints(weightandvolume)
•GettingRequirements fromIoT Survey• Communicationtechnologies
•AccordingtoD1.1à definitionofaplanfortheelicitationofusecasedependent requirements fromWP8.
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Industrialmodulargateway:requirementsRequirementselicitationfrom:◦ Eurotechbackground;◦ horizontalrequirements;◦ WP8:pollution &airqualitymonitoring usecase.
Mainrequirements:◦ modulararchitecture;◦ togrowalibraryof standardHW“buildingblocks”tobereusedacrossverticalsandsystemconfiguration;
◦ confineanycustomizationoutside thecore“buildingblocks”,inparticularUserI/O,connectivity,mechanics&enclosure, thermalsolutions.
◦ standardComputerOnModule(COM)◦ forembeddedapplication,multivendorsupport,◦ commercialgradeandindustrialgradeversionsavailable,◦ withrecognizedroadmapuntil2018,◦ designedforIntelArchitecture.
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…mainrequirements:◦ UseofstandardBUSes providingperipheralenumerationsupport.◦ UseofwidelyadoptedstandardperipheralinterfacesforES.◦ SupportformultipleWAN/LANconnectivityoptions.◦ Verticals&certificationdrivenpowersupplyconfiguration.◦ Fanless thermaldesign.◦ Multiple storagesolutionsavailable.◦ Supportforawiderangeofenvironmentalsensingmodules◦ withpre-calibratedsensorconditioning.
◦ Timestampandoptionalgeo-localization information.◦ Maximumpowerconsumption40W.◦ Extendedtemperaturerangesupport(target-20+70°C).◦ Maximumsize:250x200x88mm(LxDxH,SBCfootprint,2rack-mountunit).
Industrialmodulargateway:requirements(2)
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I/OExpansionModule
Modulesphysicallyindependentandconnectedtothecarrierwithcabledconnection
CarrierModule
CPUModuleBoard
ManagementModule(BMM)
Powersupplymodule
InternalExpansionModule1
InternalExpansionModule3
AUXI/OModule
I/OModuleforfieldbus
InternalExpansionModule2
Modulesphysicallyindependentandconnectedtothecarrierviaaboardtoboardconnection
Canbeanexternalmoduleoraninternalexpansionorintegrated
UserI/O
Storagemodule
DFMGatewaymodulardesign
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IndustrialGatewayModulesCPUModule:◦ IntelAtomBayTrail orApolloLakefamilies◦ 10WTDPClassCPU◦ COMExpressType10
BoardManagementModuleBMM:◦ 32BitMicrocontroller◦ Managessystemandmodulesstatusandrelatedtransitions(coldboot,warmboot,lowpowerstatessuchassuspendorhybernate).
◦ Managessystemmaintenance,e.g.:◦ secureupdate,◦ autotest,◦ extendedinputwakeup&suspend,◦ specialfeatureslikeinjectionsensing,timedprocedure,etc.
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IndustrialGatewayModules(2)Storagemodule:
1. storageintegratedintheCPUmodule,e.g.eMMC Flash,SATASSD(e.g.itisusedinhighruggedandreliablesystemtoavoidvibrationissue).
2. Internalexpansion,e.g.mSATA SSDDriveorSDMemoryCard.
3. Externalstoragemodule,e.g.HDD/SDDDiskwithoptionalDriveBay.
AUXI/OModule(e.g.PoE orpaneldisplaybacklight):thesemoduleshaveapowerabsorptionthatisnotsupportedbythecarrierandmustbeconnecteddirectlytothepowersupplymodule.TheI/Omodulesarepoweredbythecarrier.
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IndustrialGatewayModules(3)I/OExpansionmodules:◦ theygeneratethesignalthatmustbeavailableontheexternalpanel;◦ implement I/Ofunctionalities foraspecificvertical;◦ provideconnectorsforaspecificvertical;◦ allowstocustomizetheexternalconnections.◦ Examples:◦ BUSconverter◦ Expander,e.g.I2C->10GPIO◦ IsolatedandprotectedI/O◦ SpecialfunctionslikeaparticularfieldbusforaScada application.
I/OExpansionModule
USB
EXTERNALPANEL
3xRS485
Ethernet RJ45ML2MIL
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IndustrialGatewayModules(3)UserI/OModules:itcanbeanexternalmoduleorasetoffunctionalitiesimplementedinthecarrier.It’scheaperthanI/Oexpansionandsatisfiesmechanicalrequirements.◦ SDMemoryCard.◦ Test,debuganddevelopmentinterfaces.◦ Maintenanceinterfaces.◦ Legacyinterfaces,likemouseandkeyboard.
I/OModulesforfieldbus:◦ integrated,providedbytheCPUmoduleorbytheBMM,e.g.CANBus;◦ internalexpansionmodule, providingpotentiallyanykindoffieldbus.
Powermodule:itcanbeintegratedorexternalandprovideawiderangepowerformultipledomainapplication(24V-110V).◦ Insulatedand/orprotectedversionavailable.◦ Support fortensionslowerthanthenominalrange(e.g.forautomotive).◦ DesignedforEN50155,MIL-STD,FCC,CE.
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CarrierModule
CPUModuleStandardCOMExpress
Rev.2.1
BoardManagement
Module(BMM)
IntegratedPowersupply
N xminiPCIeslots
expansion
GPSmodule(?)
I/OExpansionModule(CANBus,I/Oexpander)
OptionalPoE
custominternal
expansion
UserI/O
AlternatePowersupply
eMMCFlash
SATADRIVE(Drivebay?)
IntegratedMicroSDCardSlot
MaintenanceI/O
DumbI/OPanel(e.g.foruserI/O)
ConsolidateAGILEmodulargatewaydesign
Integratedmodule
Internalexpansion
Externalexpansion
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IndustrialgatewaypreliminaryspecificationsStandardCOMExpressRev.2.1
IntelAtomBayTrail andApolloLakeCPUfamilies.
8GBeMMC Flash
1xSATAinternalconnectoroncarrier(DriveBay),1xSATAinternalconnector,MicroSDslot(maintenance).
I/Ointerfaces:2x(10/100/100)Ethernet,1USB3.0circular,1USB2.0maintenance,1xRS232,3xRS485/RS422,1xCANBus,1xMiniDisplay,8xDigitalI/O,1xAudioLineIn,1xAudioLineout.
Radiointerfaces:3G/4G,802.11b/g/n,Bluetooth4.0BLE,GPS.
Power:24V/110V,4W-17W.
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D1.1DeliverableTOCandcontentsdiscussion.
Requirements:◦ wecanstartthe identificationoftheusecaseindependent requirements;◦ definitionofaplanfortheelicitation ofusecasedependentrequirementsfromWP8.
Definitionofadeadlineforcontributions.
Documentlinks:
https://redmine.create-net.org/dmsf/files/6340/download
https://drive.google.com/a/create-net.org/file/d/0B2wGNjDl_JNZeXFIakFwX1Btb3M/view?usp=sharing_eid&ts=5703c734
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Thanksfortheattention.That’sallfolks.