WE1005 Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee ModuleWE1005 V1.0 - Jan., 2020 Shenzhen RF-star...

WE1005 Low-Power 2.4 GHz IEEE 802.15.4

and ZigBee Module

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

Jan. 19th, 2020

WE1005

www.szrfstar.com V1.0 - Jan., 2020

Shenzhen RF-star Technology Co., Ltd. Page 1 of 24

ZigBee Module List

Chipset Core FLASH

(KB)

RAM

(KB) Model Antenna

Dimension

(mm)

TX

Power

(dBm)

Range

(M) Photo

CC2530 8051 256 8

XZZ-TIM2 PCB /

IPEX 18 34.4 20

PCB: 1000

IPEX: 1500

XZZ-TIM3 PCB /

IPEX 16 26.2 4.5

PCB: 400

IPEX: 600

XZZ-TIM4 PCB /

IPEX 16 26.2 20

PCB: 1000

IPEX: 1500

WE1005 PCB 16 22 4.5 300

RF-ZM-1338A PCB /

IPEX 16.8 22 3

PCB: 300

IPEX: 450

RF-ZM-1738A PCB /

IPEX 16.8 27.9 17

PCB: 550

IPEX: 850

RF-ZM-TI01 PCB 15.1 22.3 4.5 300

EFR32

MG1B232 M4 256 32

3B32_V102 PCB /

IPEX 14.8 20.4 19.5

PCB: 1000

IPEX: 1500

RF-ZM-SL01 PCB 14 21 19.5 1000

Note:

1. The communication distance is the longest distance obtained by testing the module's maximum transmission power

in an open and interference-free environment in sunny weather.

2. Click the picture to buy modules.

3. All modules with PCB antenna and IPEX connector are dispatched with PCB antenna only by default. If IPEX

connector is needed, pls check with me before quotation.

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WE1005



1 Device Overview

1.1 Description

WE1005 is a low power IEEE 802.15.4, ZigBee and RF4CE module based on TI CC2530F256. This module can be

widely applied to short distance wireless network communication field with the characteristics of low power consumption,

small volume, strong anti-interference ability and so on. The module uses RF- specific high dielectric constant, low loss

sheet, and four-layer board wiring. Capacitance inductance components are from high-precision and high Q Murata

GRM series. The module also uses onboard power supply filter circuit and RF optimization matching circuit, which makes

the module better stability and farther transmission distance. To meet the industrial application requirements, the module

can be equipped with a shield on it, which increases the anti-jamming capability.

1.2 Key Features

• RF

- 2.4 GHz IEEE 8.02.15.4 compliant RF

transceiver

- Excellent receiver sensitivity and robustness

to interface

- Programmable output power up to +4.5 dBm

- Very few external components

- Suitable for systems targeting compliance

with worldwide radio-frequency regulations:

ETSI EN 300 328 and EN 300 400 (Europe),

FCC CFR47 Part 15 (US) and ARIB STD-T-

66 (Japan)

• Microcontroller

- High-performance and low-power 8051

microcontroller core with code prefetch

- 256 KB in-system-programmable flash

- 8 KB RAM with retention in all power modes

- Hardware debug support

• Peripherals

- Powerful five-channel DMA

- Integrated high-performance op-amp and

ultralow-power comparator

- IEEE 802.15.4 MAC timer, general-purpose

timers (one 16-bit, two 8-bit)

- IR generation circuitry

- 32-kHz sleep timer with capture

- CSMA / CA hardware support

- Accurate digital RSSI /LQI support

- Battery monitor and temperature sensor

- 12 bit ADC with 8 channels and configurable

resolution

- AES security coprocessor

- Two powerful USARTs with support for

several serial protocols

- 19 general-purpose I/O pins (17 × 4 mA, 2 ×

20 mA)

- Watchdog timer

• Low Power

- Wide supply voltage range: 2.0 V to 3.6 V

- Active-mode RX (CPU idle): 24 mA

- Active-mode TX at 1 dBm (CPU idle): 29 mA

- Power-mode 1 (4 μs wake-up): 0.2 mA

- Power-mode 2 (sleep timer running): 1.0 μA

- Power-mode 3 (external interrupt): 0.4 μA

http://www.szrfstar.com/

WE1005



1.3 Applications

• 2.4 GHz IEEE 802.15.4 systems

• RF4CE remote control systems

• ZigBee systems

• Home automation

• Building automation

• Industrial control and monitoring

• Low-power wireless sensor networks

• Consumer electronics

• Health care

1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of WE1005

CC2530 GPIO

32.0 MHz 32.768 kHz

Reset

Balun

PCB Antenna

RF-N

RF-P

Filter & ANT Matching

Power Supply 2.0 V ~ 3.6 V


WE1005



Table of Contents

ZigBee Module List ............................................................................................................................................................ 1

1 Device Overview ............................................................................................................................................................. 2

1.1 Description ............................................................................................................................................................ 2

1.2 Key Features ....................................................................................................................................................... 2

1.3 Applications .......................................................................................................................................................... 3

1.4 Functional Block Diagram .............................................................................................................................. 3

Table of Contents ................................................................................................................................................................ 4

Table of Figures ................................................................................................................................................................... 5

Table of Tables ..................................................................................................................................................................... 5

2 Module Configuration and Functions ...................................................................................................................... 6

2.1 Module Parameters ........................................................................................................................................... 6

2.2 Module Pin Diagram ......................................................................................................................................... 7

2.3 Pin Functions ....................................................................................................................................................... 7

3 Specifications ................................................................................................................................................................... 9

3.1 Recommended Operating Conditions ....................................................................................................... 9

3.2 Handling Ratings ................................................................................................................................................ 9

3.3 Electrical Characteristics ................................................................................................................................ 9

3.4 RF Receive Section ........................................................................................................................................ 11

3.5 RF Transmit Section ....................................................................................................................................... 13

4 Application, Implementation, and Layout ............................................................................................................. 15

4.1 Module Photos .................................................................................................................................................. 15

4.2 Recommended PCB Footprint .................................................................................................................... 15

4.3 Schematic Diagram ......................................................................................................................................... 16

4.4 Basic Operation of Hardware Design ...................................................................................................... 16

4.5 Trouble Shooting .............................................................................................................................................. 18

4.5.1 Unsatisfactory Transmission Distance ........................................................................................ 18

4.5.2 Vulnerable Module .............................................................................................................................. 18

4.5.3 High Bit Error Rate ............................................................................................................................. 18

4.6 Electrostatics Discharge Warnings ........................................................................................................... 18

4.7 Soldering and Reflow Condition ................................................................................................................. 19

4.8 Optional Packaging ......................................................................................................................................... 20


WE1005



5 Certification ..................................................................................................................................................................... 21

5.1 FCC ....................................................................................................................................................................... 21

5.2 RoHS .................................................................................................................................................................... 21

5.3 CE .......................................................................................................................................................................... 22

6 Revision History ............................................................................................................................................................ 23

7 Contact Us ....................................................................................................................................................................... 24

Table of Figures

Figure 1. Functional Block Diagram of WE1005 ........................................................................................... 3

Figure 2. Pin Diagram of WE1005 ...................................................................................................................... 7

Figure 3. Photos of WE1005 ............................................................................................................................... 15

Figure 4. Recommended PCB Footprint of WE1005 (mm) .................................................................... 15

Figure 5. Schematic Diagram of WE1005 ..................................................................................................... 16

Figure 6. Recommendation of Antenna Layout ........................................................................................... 17

Figure 7. Recommended Reflow for Lead Free Solder ............................................................................ 19

Figure 8. Optional Packaging Mode ................................................................................................................. 20

Figure 9. FCC certificate ....................................................................................................................................... 21

Figure 10. RoHS Certificate ................................................................................................................................ 21

Figure 11. CE Certificate ...................................................................................................................................... 22

Table of Tables

Table 1. Parameters of WE1005 ......................................................................................................................... 6

Table 2. Pin Functions of WE1005 ..................................................................................................................... 7

Table 3. Recommended Operating Conditions of WE1005 ...................................................................... 9

Table 4. Handling Ratings of WE1005 .............................................................................................................. 9

Table 5. Table of Electrical Characteristics ...................................................................................................... 9

Table 6. Table of RF Receive .............................................................................................................................. 11

Table 7. Table of RF Transmit ............................................................................................................................. 13

Table 8. Temperature Table of Soldering and Reflow ................................................................................ 19


WE1005



2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of WE1005

Chipset CC2530F256

Supply Power Voltage 2.0 V ~ 3.6 V, recommended to 3.3 V

Frequency 2394 MHz ~ 2507 MHz

Maximum Transmit Power +3.0 dBm ±1.5 dBm

Receiving Sensitivity -85 dBm

GPIO 19 (17 × 4 mA, 2 × 20 mA)

Crystal 32 MHz, 32.768 kHz

RAM 8 KB

Flash 256 KB

Package SMT Packaging

Frequency Error ±20 kHz

Dimension 22.0 mm x 16.0 mm x (2.3 ± 0.1) mm

Type of Antenna PCB antenna

Operating Temperature -40 ℃ ～ +85 ℃

Storage Temperature -40 ℃ ～ +125 ℃


WE1005



2.2 Module Pin Diagram

Figure 2. Pin Diagram of WE1005

2.3 Pin Functions

Table 2. Pin Functions of WE1005

Pin Name Chip Pin Pin Type Description

1 GND GND Ground Ground

2 RES RESET_N Reset Reset, active low

3 P22 P2_2 I/O GPIO, debug DC

4 P21 P2_1 I/O GPIO, debug DD

5 VCC VCC VCC Power Supply: 2.0 V ~ 3.6 V

6 P20 P2_0 I/O GPIO

7 P17 P1_7 I/O GPIO

8 P16 P1_6 I/O GPIO

9 P15 P1_5 I/O GPIO

10 P14 P1_4 I/O GPIO



13 P11 P1_1 I/O GPIO, 20 mA drive capacity



WE1005





17 P10 P1_0 I/O GPIO, 20 mA drive capacity












WE1005



3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of WE1005

Items Condition Min. Typ. Max. Unit

Operating Supply Voltage Battery Mode 2.0 3.3 3.6 V

Operating Temperature / -40 +25 +85 ℃

Environmental Hot Pendulum / -20 +20 ℃/min

3.2 Handling Ratings

Table 4. Handling Ratings of WE1005

Items Condition Min. Typ. Max. Unit

Storage Temperature Tstg -40 +25 +125 ℃

Human Body Model HBM ±2000 V

Moisture Sensitivity Level 2

Charged Device Model ±500 V

3.3 Electrical Characteristics

Table 5. Table of Electrical Characteristics

Measured on the WE1005 reference design with TA = 25 ℃, VDD = 3.3 V, unless otherwise noted.

Boldface limits apply over the entire operating range, TA = –40°C to +85°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to

2507 MHz.

Parameter Test Conditions Min. Typ. Max. Unit

Icore Core current

consumption

Digital regulator on. 16-MHz RCOSC running. No

radio, crystals, or peripherals active.

Medium CPU activity: normal flash access(1), no

RAM access.

3.4 mA

32-MHz XOSC running. No radio or peripherals

active.

Medium CPU activity: normal flash access(1), no

RAM access.

6.5 8.9

mA

32-MHz XOSC running, radio in RX mode, –50- 20.5 mA


WE1005



dBm input power, no peripherals active, CPU idle.

32-MHz XOSC running, radio in RX mode at -100-

dBm input power (waiting for signal), no peripherals

active, CPU idle.

24.3 29.6

mA

32-MHz XOSC running, radio in TX mode, 1-dBm

output power, no peripherals active, CPU idle. 28.7

mA

32-MHz XOSC running, radio in TX mode, 4.5-dBm

output power, no peripherals active, CPU idle. 33.5 39.6

mA

Power mode 1. Digital regulator on; 16-MHz

RCOSC and 32-MHz crystal oscillator off; 32.768-

kHz XOSC, POR, BOD and sleep timer active; RAM

and register retention.

0.2 0.3 µA

Power mode 2. Digital regulator off; 16-MHz

RCOSC and 32-MHz crystal oscillator off; 32.768-

kHz XOSC, POR, and sleep timer active; RAM and

register retention.

1 2 µA

Power mode 3. Digital regulator off; no clocks; POR

active; RAM and register retention. 0.4 1 µA

Iperi

Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated).

Timer 1 Timer running, 32-MHz XOSC used. 90 µA




Sleep timer Including 32.753-kHz RCOSC. 0.6 µA

ADC When converting. 1.2 mA

Flash Erase. 1 mA

Burst write peak current. 6 mA

Wake-up and Timing

Power mode 1 → active Digital regulator on, 16-MHz RCOSC and 32-MHz

crystal oscillator off. Start-up of 16-MHz RCOSC 4 µs

Power mode 2 or 3 →

active

Digital regulator off, 16-MHz RCOSC and 32-MHz

crystal oscillator off. Start-up of regulator and 16- 0.1 ms


WE1005



MHz RCOSC

Active → TX or RX

Initially running on 16-MHz RCOSC, with 32-MHz

XOSC OFF 0.5 ms

With 32-MHz XOSC initially on 192 µs

RX/TX and TX/RX

turnaround 192 µs

Radio Part

RF frequency range Programmable in 1-MHz steps, 5 MHz between

channels for compliance with [1] 2394 2507 MHz

Radio baud rate As defined by [1] 250 kbps

Radio chip rate As defined by [1] 2 MChip/s

Flash erase cycles 20 K

cycles

Flash page size 2 KB

Note: (1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.

3.4 RF Receive Section

Table 6. Table of RF Receive



2507 MHz.

Parameters Test Conditions Min. Typ. Min. Unit

Receiver sensitivity PER = 1%, as specified by [1] -97 -92 dBm

[1] requires –85 dBm -88 dBm

Saturation (maximum input level) PER = 1%, as specified by [1]

[1] requires –20 dBm 10 dB

Adjacent-channel rejection, 5-MHz

channel spacing

Wanted signal – 82 dBm, adjacent

modulated channel at 5 MHz, PER =

1 %, as specified by [1].

[1] requires 0 dB

49 dB

Adjacent-channel rejection, -5-MHz

channel spacing


modulated channel at -5 MHz, PER =


49 dB


WE1005



[1] requires 30 dB

Adjacent-channel rejection, 10-MHz

channel spacing


modulated channel at 10 MHz, PER =


[1] requires 30 dB

57 dB

Adjacent-channel rejection, -10-MHz

channel spacing


modulated channel at -10 MHz, PER =


[1] requires 30 dB

57 dB

Channel rejection

≥ 20 MHz

Wanted signal – 82 dBm, Undesired

signal is an IEEE 802.15.4 modulated

channel, stepped through all channels

from 2405 to 2480 MHz. Signal level for

PER = 1%.

57 dB

Channel rejection

≤ –20 MHz 57 dB

Co-channel rejection

Wanted signal at –82 dBm. Undesired

signal is IEEE 802.15.4 modulated at the

same frequency as the desired signal.

Signal level for PER = 1%.

-3 dB

Blocking /

desensitizat

ion

5 MHz from band edge

Wanted signal 3 dB above the sensitivity

level, CW jammer, PER = 1%. Measured

according to EN 300 440 class 2.

-33 dBm

10 MHz from band edge -33 dBm



-5 MHz from band edge -35 dBm




Spurious

emission.

Only largest

spurious

emission

stated

within each

30 MHz–1000 MHz Conducted measurement with a 50-Ω

single-ended load.

Suitable for systems targeting

compliance with EN 300 328, EN 300

440, FCC CFR47 Part 15 and ARIB STD-

T-66.

-80 dBm

1 GHz–12.75 GHz -57 dBm


WE1005



band.

Frequency error tolerance(1) [1] requires minimum 80 ppm ±150 ppm

Symbol rate error tolerance(2) [1] requires minimum 80 ppm ±1000 ppm

(1) Difference between center frequency of the received RF signal and local oscillator frequency.

(2) Difference between incoming symbol rate and the internally generated symbol rate.

3.5 RF Transmit Section

Table 7. Table of RF Transmit



2507 MHz.

Parameters Test Conditions Min. Typ. Min. Unit

Nominal output

power

Delivered to a single-ended 50-Ω load through a balun using

maximum-recommended output-power setting 0 4.5 8 dBm

[1] requires minimum –3 dBm -8 10 dBm

Programmable

output power range 32 dB

Spurious emissions

Measured conducted

according to stated

regulations. Only

largest spurious

emission stated

within each band.

Max

recommended

output power

setting(1)

25 MHz–1000 MHz (outside restricted

bands) -60 dBm

25 MHz – 2400 MHz (within FCC

restricted bands) -60 dBm

25 MHz – 1000 MHz (within ETSI

restricted bands) -60 dBm

1800–1900 MHz (ETSI restricted band) -57 dBm

5150–5300 MHz (ETSI restricted band) -55 dBm

At 2 × fc and 3 × fc (FCC restricted

band) -42 dBm

At 2 × fc and 3 × fc (ETSI EN 300-440

and EN 300-328)(2) -31 dBm

1 GHz – 12.75 GHz (outside restricted

bands) -53 dBm

At 2483.5 MHz and above (FCC

restricted band) fc= 2480 MHz(3) -42 dBm


WE1005



Error vector

magnitude (EVM)

Measured as defined by [1] using maximum-recommended

output-power setting

[1] requires maximum 35%.

2%

Optimum load

impedance

Differential impedance as seen from the RF port (RF_P and

RF_N) towards the antenna

69 +

j29 Ω

Note:

(1) Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN

300 440, FCC CFR47 Part 15 and ARIB STD-T-66.

(2) Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass

filter connected between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be

connected to a good RF ground.

(3) Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved

by using a lower output-power setting or having less than 100% duty cycle.


WE1005



4 Application, Implementation, and Layout

4.1 Module Photos

Figure 3. Photos of WE1005

4.2 Recommended PCB Footprint

Figure 4. Recommended PCB Footprint of WE1005 (mm)


WE1005



4.3 Schematic Diagram

Figure 5. Schematic Diagram of WE1005

4.4 Basic Operation of Hardware Design

1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and

the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the

power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the

power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.

4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.

If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top

Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital

part of module and routed in the Bottom Layer (all copper is well grounded).


WE1005



5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer

or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect

the module performance. It is recommended to stay away from the module according to the strength of the

interference. If circumstances permit, appropriate isolation and shielding can be done.

7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended

to stay away from the module according to the strength of the interference. If circumstances permit, appropriate

isolation and shielding can be done.

8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for

example: USB 3.0.

9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the

antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality

antenna extension wire can be used to extend the antenna to the outside of the case.

10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

11. The recommendation of antenna layout.

The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of antenna

is a key factor to increase the data rate and transmission range.

Therefore, the layout of the module antenna location and routing is recommended as follows:

（1） Place the antenna on the edge (corner) of the PCB.

（2） Make sure that there is no signal line or copper foil in each layer below the antenna.

（3） It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module

is minimally affected.

Figure 6. Recommendation of Antenna Layout

Note: The hollow-out position is based on the antenna used.


WE1005



4.5 Trouble Shooting

4.5.1 Unsatisfactory Transmission Distance

1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.

Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The

performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to

the ground.

2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.

3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the

metal shell.

4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The

higher the data rate, the closer the distance.

5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower

the voltage, the smaller the power is.

6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.

4.5.2 Vulnerable Module

1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.

3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.

If there is no special demand, it is not recommended to use at too high or too low temperature.

4.5.3 High Bit Error Rate

1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or

modify the frequency and channel to avoid interferences.

2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.

3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

4.6 Electrostatics Discharge Warnings

The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions

below:

1. According to the anti-static measures, bare hands are not allowed to touch modules.

2. Modules must be placed in anti- static areas.

3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.

Static may result in the degradation in performance of module, even causing the failure.


WE1005



4.7 Soldering and Reflow Condition

1. Heating method: Conventional Convection or IR/convection.

2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5

3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.

4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.

5. Peak temperature: 245 ℃.

Table 8. Temperature Table of Soldering and Reflow

Profile Feature Sn-Pb Assembly Pb-Free Assembly

Solder Paste Sn63 / Pb37 Sn96.5 / Ag3.0 /

Cu0.5

Min. Preheating Temperature (Tmin) 100 ℃ 150 ℃

Max. Preheating Temperature (Tmax) 150 ℃ 200 ℃

Preheating Time (Tmin to Tmax) (t1) 60 s ~ 120 s 60 s ~ 120 s

Average Ascend Rate (Tmax to Tp) Max. 3 ℃/s Max. 3 ℃/s

Liquid Temperature (TL) 183 ℃ 217 ℃

Time above Liquidus (tL) 60 s ~ 90 s 30 s ~ 90 s

Peak Temperature (Tp) 220 ℃ ~ 235 ℃ 230 ℃ ~ 250 ℃

Average Descend Rate (Tp to Tmax) Max. 6 ℃/s Max. 6 ℃/s

Time from 25 ℃ to Peak Temperature (t2) Max. 6 minutes Max. 8 minutes

Time of Soldering Zone (tP) 20±10 s 20±10 s

Figure 7. Recommended Reflow for Lead Free Solder


WE1005



4.8 Optional Packaging

Figure 8. Optional Packaging Mode

Note: Default tray packaging.


WE1005



5 Certification

5.1 FCC

Warnings:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device

may not cause harmful interference, and (2) this device must accept any interference received, including interference

that may cause undesired operation.

FCC ID: 2ABTD-WE1005

Figure 9. FCC certificate

5.2 RoHS

RoHS Report No.: UTS16011090217A1

Figure 10. RoHS Certificate


WE1005



5.3 CE

CE Verification No.: CCIS16120099301V

Figure 11. CE Certificate


WE1005



6 Revision History

Date Version No. Description Author

2016.09.27 V1.0 The initial version is released. Aroo Wang

2018.08.02 V1.0 Update company address. Aroo Wang

2020.01.19 V1.0 Add ZigBee module list. Sunny Li

Note:

1. The document will be optimized and updated from time to time. Before using this document, please make sure it is

the latest version.

2. To obtain the latest document, please download it from the official website: www.szrfstar.com.


WE1005



7 Contact Us

SHENZHEN RF-STAR TECHNOLOGY CO., LTD.

Shenzhen HQ:

Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China

Tel.: 86-755-3695 3756

Chengdu Branch:

Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000

Tel.: 86-28-6577 5970

Email: [email protected], [email protected]

Web.: www.szrfstar.com

http://www.szrfstar.com/mailto:[email protected]://www.szrfstar.com/

ZigBee Module List1 Device Overview1.1 Description1.2 Key Features1.3 Applications1.4 Functional Block Diagram

Table of ContentsTable of FiguresTable of Tables2 Module Configuration and Functions2.1 Module Parameters2.2 Module Pin Diagram2.3 Pin Functions

3 Specifications3.1 Recommended Operating Conditions3.2 Handling Ratings3.3 Electrical Characteristics3.4 RF Receive Section3.5 RF Transmit Section

4 Application, Implementation, and Layout4.1 Module Photos4.2 Recommended PCB Footprint4.3 Schematic Diagram4.4 Basic Operation of Hardware Design4.5 Trouble Shooting4.5.1 Unsatisfactory Transmission Distance4.5.2 Vulnerable Module4.5.3 High Bit Error Rate

4.6 Electrostatics Discharge Warnings4.7 Soldering and Reflow Condition4.8 Optional Packaging

5 Certification5.1 FCC5.2 RoHS5.3 CE

6 Revision History7 Contact Us

WE1005 Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee ModuleWE1005 V1.0 - Jan., 2020 Shenzhen RF-star...

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Transcript of WE1005 Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee ModuleWE1005 V1.0 - Jan., 2020 Shenzhen RF-star...