WARMES · PDF file99ML 170 >40 1,1 Ceramic-15 16-30 ... Pitch of drilled edge to high ......

WARMES GmbH

PRESENTATION:

HIGH - CURRENT Printed Circuit Boards

HIGH – CURRENTPrinted Circuit Boards

As an optimal combination of power electronics with digital electronicsKorsten & Goossens GmbH has developed and Herr Thomas Mang has patentedthe High - Current Printed Circuit Board (EP 1 639 869 B1) for you. WARMES GmbH is the onlycontracted partner who can produce such high current PCB in China.

High current becomes a big issue in the business area of power electronics:

Power- and control electronic on the same board.

In power electronics, increasing currents must be realized with a minimum of space.

Thermal management is another challenge. Also because the components gets more powerful and they produce heat. Because of the integrated copper bus bar, heat problems can be solved more easily.

Due to all of these benefits reducing costs is the most important issue. As a result ofthe High current PCB, interfaces can be reduced, as well as integration of functionsand technical needs. So by the end system costs can be cut down to more than50%!!

Power electronics is probably the most increasing business area in the electronic industry, HC-PCB’s as a part of that will be basic technology in this field. Applicationslike cell connector board, converter and electric rectifier, Hybrid and Electric cars andother fields will be a million Dollar market.


Industrial Electronics

Propulsion Technology

Generation of Energy

Automotives

Construction Machines

Electric Vehicles

Railway Technology

Military, Aviation, Navy

Today‘s Projects and possible Application Areas


OverviewTechnical Aspects

1. Transportation of high currents on the PCB of up to 1.000 A

2. Heat management

3. Indexing new technical possibilities

4. Much degree of flexibility (design of PCB)

5. Reduction of interfaces on the PCB

6. Connection techniques

7. Functionality

8. Production parameters

9. Soldering parameters

Conceptual formulation: Calculating the profile of conductor forhigh currents related to:

Heat Case of usage and defect (shortcut/overheat protection) Thermal resistance (layer structure, materials, connections…) Lot of heat and capacity Radiation and convection (unforced and forced)

Forces Mechanical stress by heat and expansion System of static / Connections (bearings, chucks, screw joint…)

-> torsion & camber Magnetic fields Vibration, impulses und frequencies…

Technical AspectsTransportation of High Currents

Heat measure by Phoenix Contact:2mm and 6mm of conductor width, lead- free

Technical AspectsTransportation of High Currents

High Current conductor Al/Cu combination as carrier, conductor and cooler

Through-plated holes

Copper as High Current conductor

Aluminium cooler

Top and Bottom layer

Aluminium, integrated byParts Aluminium as High

Current conductor

Technical AspectsHeat Management

Aluminium as carrier and cooler

Copper as High Current conductor

„HEAT Pipelining“

Ceramics

Heapipe

Hot module

Base material

Copper

Heatpipe leading to outer cooler Ceramic tube

Heat radiation


• Press - Fit Technique


…with 400µ - technique–> 20mm conductor width= conductor width ≥ 100mm

…with 2,0mm high current conductor–> 4mm conductor width

= conductor width ≥ 26mm

Conceptual formulation: Realisation of 8mm² conductor cross section over different technologies

Space saving by integration of capacity

max. 26mm

20mm

Technical Aspectsnew Technical Possibilities

Top view:

Single layer PCB

2 - layer PCB 200µm Cu

400µm Cu

d=2,0mm Cu – thickness

PCB ≥ 100mm

Cross section:

4 - layer multilayer 100µm Cu


PCB ≥ 100mm

PCB ≥ 100mm

…with 2,0mm high current conductor–> 4mm conductor width

= conductor width ≥ 26mm

Example: Single layer PCB400µm Cu

With conventional technology:

Because of the height of the outer copper, the solder resist must be done by multiple printing or space has to be filled first.

With High – Current PCB of WARMES GmbH:

Because of the integrated high current conductors inside the PCB the result is an even surface where solder resist can be applied easily.

500µm Cu

Solder resist

Even surface

Technical AspectsIndexing new Technical Possibilities

400µm Cu

Improved voltage resistance


Reduced coverage of solder resist at the conductors edges leads to reduced voltage resistance. The result is danger by discharging through the air.


Because of the even surface and the integrated high current conductors the PCB gets increased voltage resistance.

500µm Cu


2- layer signal + high current layerHigh current layer at 0,6 – 2mm thickness



1

a)

1

2

b)

70µ

1234

1234

c)

35µ

1.500µ

Technological build-up

Technical AspectsMuch Degree of flexibility

Delivery also with RoHS - conformity

6- layer signal + 2 high current layersHigh current layers inside withe. g. 0,5 – 1mm of thickness

35µ

123456

d)

70µ

1.000µ

500µ

Technical AspectsMuch Degree of Flexibility


Integration of control and power currents


Connection of control and power –unit by cable

Power unit

Control unit

Technical AspectsReduction of Interfaces on the PCB

Solution so far Solution from now

Technical AspectsReduction of Interfaces on the PCB

Tapped holethrough high current layer

Connection jack with drill for screw

Threaded bolt

COMBICON – connector(e. g. press – fit contact)

Blind via

Drills isolated fromhigh current layer

Drills outside high current layer

Technical AspectsConnection Techniques

Mechanical possibilities for connectionsPress – fit contacts:

Thermal attachment on high current conductor

Surface for access

Electrical connection

Mosfet

Thermal connection Electrical connection

Even surface

High current conductor

Technical AspectsConnection Techniques

Reduction of scattering fields by integrating specific highcurrent layers or mass areas.Example: Scattering fields of a 4 layered multilayer board canbe reduced by adding specific high current layers.

Obtaining a higher material stability by inner high current layer.– Example: In contrary to a 4-layerd multilayer which has to be bolt

together the High - Current PCB is much more stable because the viasdo not crack.

Hülsenrisse

Technical AspectsFunctionality

In contrast to conventional technologies, with an optimized layout there will be no through hole plating necessary to carry high currents.

Because of the High – Current Technology, in contrast to traditional fabrication the danger of over- under etching factors can excluded.


Material quality

Exa

mpl

er fo

r bas

e m

ater

ials

Tg-V

alue

[°C

]

Vol

tage

re

sist

ance

[kV

/mm

]

Hea

t tra

nsm

issi

on

[W/m

*K]

DE 104 130 >40 0,3IS 410 170 >40 0,3IS 620 215 >40 0,399ML 170 >40 1,1

Ceramic - 15 16-30

Bei

spie

le fü

r W

erks

toffe

Spe

cific

ele

ktric

al

resistance[Ωmm2 /m

]

Hea

t ca

paci

ty[J

/kg*

K]

Hea

t tra

nsm

issi

on

[W

/m*K

]

Den

sity

[g/c

m³]

Cu-sheet 0,0178 385 380 8,92Al-sheet 0,0264 900 237 2,70Ceramic 1018 900 16-30 3,5


Format of data: Gerber or extended Gerber

Design rules: Avoidance of too complex structures of high – current layers,proportion of copper maximum at 75%

What to take care of when designing a high – current PCB

Declaration of copper thickness of all layers

Declaration of special materials e. g. solder special solder resist or base materials

Multiple printing of solder resist to get higher voltage resistanceTypical values: 20-30µm of solder resist per print on even surfaces, at the edgesabout 5-8µm at a voltage resistance of 160-190kV/mm

Final thickness of PCB ≤ 3,2mm; every high current-layer needs a coverage ≥ 0,3mm standard

At the area of depth - milling of course no through hole plating possible.

Technical AspectsProduction Parameters

... What to take care of when designing a high – current PCB

Maximum format of manufacturing: 570mm x 340mm, bigger formats on demand

Hole diameters: >=0,8mm – 1,5mm (depending on depth of drill and copper)

Pitch of drilled edge to high – current conductor >=1mm

Press – Fit Contacts as reliable and effective connector

High current conductors may not be composite inside a PCB

Declaration of Surface chem. Sn, chem. Ni/Au galv. Sn, galv. Ni/Au, galv. Ni/Au/Rh H.A.L. (lead free) subject to layout (limited)

Technical AspectsProduction Parameters

In General: PCBs have to be annealed with 120°C for 120 minutes

to avoid delaminating , just like every multi – layered PCB Usage of suitable flux Sufficient pre – heating and careful cool off (copper stores lots of heat)

Wave soldering (conventional equipment): Lead free at about 250°C - 270°C, 5 - 10 Sekunden (may vary) Improved soldering results with vacuum or higher wave pressure Better results by choosing suitable length and forms of connectors

Reflow – technique (SMD - equipment): Lead free at peak about 240°C and 0,8 m/min Dwell at Peak about 5 Sekunden

Technische AspekteSoldering Parameters


Integration of control and power unit


Control and power unit separately

Application: Battery drive for hall carriage machines

Commercial AspectsComparison



Product price: 180 Euro

Assembly costs: 20 Euro

Set-up: 20 Euro

System costs: 220 Euro

Product price: 100 Euro

Assembly costs: 5 Euro

Set-up: 10 Euro

System costs: 115 Euro

In this example cost saving is about 50%.

Commercial AspectsCost Opposite

Summary:

System price is at favourable price

Miniaturization (space saving + less weight)

Reduction of suppliers and mounting

Less numbers of interfaces

Shorter time of implementation

Saving of mechanical components

Technical progress with High – Current PCB possible

Servicemanagement

Commercial AspectsAdvantages

Twisted copper cable, integrated in FR4 or high temperature Material

Flat cell connected with high current PCB by Ultrasonic welding

Further DevelopmentsHigh current and signal electronicaround the corner

Ultrasonic weldingfor Li-Ion flat cells

2.5mm copper bus bar, integrated in FR4 or high temperature Material

High current and Polyimide in one PCB

Further DevelopmentsHigh current and signal electronicaround the corner

... just give us a call.we like to help you with your new applications and optimized PCB.

... And what can we do for YOU?

YOUR Contact Person:

Mr. Yingjun Zhang

WARMES GmbHLuxemburger Str. 267D-50354 HürthGermanyTelefone: +49 2233-708318Telefax: +49 2233-77888E-Mail: [email protected]

[email protected]

WARMES · PDF file99ML 170 >40 1,1 Ceramic-15 16-30 ... Pitch of drilled edge to high ......

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