Wafer/Panel Level Package Flowability and Warpage Project

Call for Sign-up WebinarProject Chair:

Renn Chan Ooi, Intel Corporation

Tanja Braun, Fraunhofer IZM

iNEMI Staff: Haley Fu

Session 2:

Thursday, March 15, 2018

China Time: 9:00-10:00 pm

US EDT: 9:00-10:00 pm

Recording (available for up to 6 months after webinar):https://inemi.webex.com/inemi/lsr.php?RCID=a8301aeda03c4712a2bd62bd9324b29d

Agenda

• Introduction of Project Chairs

• iNEMI Project Development Process

• Project Briefing– Companies Involved in Planning

– Background & Objectives

– Project Scope• Project IS/IS Not

• Work Plan

– Schedule

• How to Join

• Q&A

Note: All phones will be on mute until the end of the presentation

Introduction of Project Chairs

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Renn Chan Ooi, Intel Corporation

✓ Renn Chan joined Intel Corp since 2005 and

is Senior Assembly & Packaging Analyst

focusing on encapsulation and assembly

technology challenges.

✓ Received doctorate degree in Mechanical

Engineering from University of Sheffield, UK

in 2004.

✓ Field of interest includes thermo-fluids

analysis for assembly processes, imaging

processing and assembly flow visualization.

Tanja Braun, Fraunhofer IZM

✓ Tanja joined Fraunhofer IZM in 1999. Recent

research is focused on wafer and panel

level packaging technologies. She is head

of the group Assembly & Encapsulation

Technologies since 2016. Lead the Fan-out

Panel Level Packaging Consortium at

Fraunhofer IZM Berlin.

✓ Received Dr. degree from Technical

University of Berlin in 2013.

✓ Holds several patents in the field of

advanced packaging.

• Address knowledge gap(s) of industry:– Common problem

– Best solved by working together

– Timed success that aligns to business needs

– Best manifested on complex far reaching issues

– Often includes reliability testing & verification

• Requires teamwork across multiple levels of the

supply chain:– Ensures efficient alignment of goals and investments of the varied

team players;

– Supports the company’s commercial interests.

• Delivers a coordinated industry wide response and

capability set. – OEM/ODM/EMS/OSATs/Suppliers at multiple levels.

Successful iNEMI Projects

INPUT

SELECTION

DEFINITION

PLANNING

EXECUTION / REVIEW

CLOSURE

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iNEMI Project Development Process - 5 Steps

“ Project”

Limited to committed Members

“ Initiative”

Open for Industry input

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------------------- iNEMI Technical Committee (TC) Approval Required for ExecutionWe are here

iNEMI Project Management Policy

• Two governing documents for projects

– Statement of work (SOW): sets out project scope,

background, purpose, benefits, and outlines required

resources, materials, processes, project schedule, etc.

– Project Statement (PS): signed by participating

companies to secure commitment on resource and

time contributions.

• iNEMI Project requires iNEMI membership

– Signed membership agreement

– Commitment to follow iNEMI By-laws and IP policy

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Project Briefing

Companies Contributed to Project Formation

Background & Objectives

• Industry adaptation of wafer size > Φ300mm or panel >

300x300mm2.

• Flowability of mold impacts the quality and potentially

warpage of the wafer/panel for subsequent processes:

– Need to identify key processing factors that impacts

followability.

– Establish factors from flowability that impacts

warpage.

– Establish other material factors that impact post mold

warpage.

Scope 1 - Flowability: Focus and Strategy

• Granular powder:– Low flowability risk from initial members’ discussion,

considered for warpage study.

– Challenges of the keep out zone (KOZ) at wafer/panel

peripherals and the impact to flow and warpage.

• Liquid dispense:– Dispense pattern dictates knit lines/weld lines.

– Identify risk of flying dies from molding pressure.

– Understand material behavior of selected candidates.

– Identify working window and the cliff of failure.

– Explore opportunities from process parameters to

mitigate flow issues.

– Challenges of the KOZ at wafer/panel peripherals and

the impact to flow and warpage.

• Sheet lamination:– Challenges of the KOZ at wafer/panel peripherals and

the impact to flow and warpage.

– Issue of die displacement.

– Understand material behavior of selected candidates,

identify working window and the cliff of failure.

– Explore opportunities from process parameters to

mitigate flow issues.

KOZ

Scope 2 - Warpage: Focus and Strategy

• Simulation & Experimental Approach:

– Understand warpage related material property from material candidates.

– Prelim warpage simulation to identify feasible range of sample dimensions.

– Conduct actual molding for model validation and process understanding.

– Failure analysis (cross section) of mold material behavior.

– Final simulation DOEs for warpage optimization from process and material aspect.

• Chemical Shrinkage:

– Methodology in measuring mold material chemical shrinkage.

– Capability of incorporating it in warpage modeling – explore readiness of simulation software.

– The need for benchmark material with minimum or almost zero chemical shrinkage.

Project Scope: Is/Is Not Analysis

This Project IS: This Project IS NOT:

To conduct mold material property measurements.

To conduct solder joint reliability.

To conduct mold flow and warpage simulation to understand key modulating factors.

To evaluate RDL processes before/aftermold.

To conduct molding experiments on test vehicles based on simulation results.

To develop specific standard(s).

To evaluate flowability of mold process through inspection of void, flow marks, etc.

Biased towards specific suppliers, geographies or market segment.

To evaluate warpage of mold process through measurement tools.

Work Plan – Step 1

Step 1 – Material characterization and preliminary simulation

• Task 1: Process & TV finalize and source dummy die, panel, and other collaterals for project

– Mold first up until de-bonding on metal carrier.

– Wafer size >300mm and panel size of 400x400~600x600mm2.

– Dummy die size of 10x10mm with 200-300um silicon thickness.

– Mold thickness range from 00 to 500um.

– Die to die spacing 1/4 ~1x die size.

– Silicon die selection: pure silicon, dummy die with bump, etc.

• Task 2: Mold compound selection

– Up to 3 or more mold materials to be studied.

• Task 3: Molding material characterization for flowability and warpage simulation

– Curing kinetics (Kamal’s model).

– Rheokinetics (Macosko model).

– TMA, DMA, modulus, Poisson’s ratio measurements, etc., for warpage.

• Task 4: Chemical shrinkage measurement

– Comparison of chemical shrinkage measurements methodology.

– Application into curing and warpage simulation (e.g., PVTc models, etc.).

• Task 5: Conduct preliminary flow simulation to gain further insight

– Preliminary flow simulation to call out potential flow related risks and aide decision in finalizing/update test vehicle attributes.

• Task 6: Conduct preliminary warpage simulation with additional focus on chemical shrinkage

– Preliminary warpage simulation to call out potential CTE mismatch and chemical shrinkage related risks and aide decision in finalizing/update test vehicle attributes.

Ack: Moldex3D

Work Plan – Step 2

Step 2 – Molding experiments

• Task 7: Conduct molding of selected test vehicles

– Assemble finalized test vehicle and conduct selected molding process.

• Task 8: Conduct flowability inspection of test vehicles

– Potential short-shot, visual inspections, post assembly failure analyses, silica particle distributions,

etc., for flowability assessment.

– Flow simulation model fine tuning for flowability prediction.

• Task 9: Conduct warpage measurements of test vehicles

– Conduct warpage measurement and post assembly failure analyses.

– Thermo-mechanical simulation model fine tuning for warpage prediction.

Work Plan – Step 3

Step 3 – Final simulation DOEs

• Task 10: Finalize flow and warpage simulation DOEs to identify key modulating factors and process optimizations

– Finalize second round of simulation DOEs based on preliminary simulation and actual unit assembly learnings.

• Task 11: Conduct final simulation DOEs

– Conduct second round of simulation DOEs to cover working range and limits of flowability and warpage behavior of test vehicle and technology.

• Task 12: Data analysis and review for final reporting

Schedule

Task 0: Literature research X X X X X X X X X X X X X

Step 1: Material characterization and

preliminary simulation

Task 1: Finalize process and TV, and source

dummy die, panel, and other collaterals X X

Task 2: Mold compound selection X

Task 3: Mold characterization X X X

Task 4: Chemical shrinkage measurement X X X

Task 5: Preliminary flow simulation X X

Task 6: Preliminary warpage simulation X X

Step 2: Molding experiment

Task 7: Molding of test vehicles X X

Task 8: Flowability inspection of test vehicles X

Task 9: Warpage measurements of test vehicles X

Step 3: Final simulation

Task 10: Finalize the 2nd round simulation DOE X

Task 11: Conduct simulation X X

Task 12: Data analysis and final reporting X X

Q1 Q2 Q3 Q4 Q5

Checkpoint 1

Checkpoint 2

Expected Project Participants

• This project looks forward to the participation of epoxy mold

compound manufacturers, component suppliers, molding tool

manufacturers, mold flow simulation software companies,

thermos-mechanical warpage simulation software companies,

PCB fabricators, OSATS, foundries, and manufacturing research

institutes.

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How to Join

Sign-Up Due on April 14, 2018

• iNEMI membership is required to join the project

• Download SOW and PS from iNEMI web:

–http://community.inemi.org/wafer-panel-level-pkg-flo

• Sign the PS

–Signature of representative of participants

–Signature of manager approval

–Send scanned PS to infohelp@inemi.org

– iNEMI VP of Operations will sign and approve your participation

and send you back the completed PS with acceptance

• Join iNEMI membership, or questions, contact Haley Fu

(haley.fu@inemi.org)

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Resource In-kind Contribution

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Please input "Yes" for those items that your firm plans to provide in-kind support to this project. Specify in detail if

need in the bottom cell. The final experimental design and test vehicle design will be decided and agreed by the

project team.

Area Resource Needed In-kind Contribution

Materials

Mold compound

Dummy silicon die

Carrier

Substrates

Shield fence area and components for assembly

Other area of interest/components to be included in the study

Simulation Flow and warpage simulation

Test vehicle assembly Assembly facilities or services to build test vehicles

Measurement/Test

Mold material

properties

Curing kinetics (Kamal’s model)

Rheokinetics (Macosko model)

TMA

DMA

Modulus

Poisson’s ratio measurements

Chemical shrinkage

measurements

Flowability inspection

Warpage measurement

Failure analysis Failure analysis of final assembled test vehicles

Others Other suggested task with associated resource contribution

Detail description

of your in-kind

contribution

Questions?

www.inemi.org

Haley Fu

haley.fu@inemi.org