Wafer probe technology & application overview ira feldman 101108
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OSCILLOSCOPEDesign file: MSFT DIFF CLOCK WITH TERMINATORREV2.FFS Designer: Microsoft
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Wafer Probe Technology & Application Overview
Date: Wednesday Mar. 3, 2010 Time: 14:16:09
Application Overview
Ira Feldmana e d a650‐472‐1192iradave@gmail.comwww.hightechbizdev.comwww.hightechbizdev.com
1Silicon Valley Test Conference 2010© 2010 Ira Feldman
AgendaAgenda
• IntroductionIntroduction
• Application Examples
C h l i / b• Contact Technologies / Probe Types
• Top Vendors
• Hot Topics
• SummarySummary
• Resources
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Devices & Packages –Have Evolved!
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UV EPROM circa 1974http://www.cpushack.com/EPROM.html
Peripheral Pads ‐ LogicPeripheral Pads Logic
SWTW 2009: MEMS Technology – Enabling Design
Silicon Valley Test Conference 2010 4
http://www.chipworks.com/uploadedImages/Blog/blogimagessq310/AKM8975_6210_cal_branded.JPG
Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe
Fine Pitch LogicFine Pitch Logic
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Kulicke & Soffa: http://www.imaps.org/imaps2005/keynote.pdf
SWTW 2009: MEMS Technology – Enabling Design Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe
Area Array – Logic, µP, etc.Area Array Logic, µP, etc.
Silicon Valley Test Conference 2010 6http://www.tradekorea.com/product-detail/P00032217/Solder_Bump.html
Marketing Version of a CPU…Marketing Version of a CPU…
Intel Core i7-980X Extreme 6-Core Processor (32nm Q1 ’10)
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( )http://hothardware.com/News/Intel-Core-i7980X-Extreme-6Core-
Processor-Review/
…What Probe Really Sees…What Probe Really Sees
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Intel Technology Journal (6/2008):45 nm process ~50 µm tall Cu bumps
No One Solution Fits AllNo One Solution Fits All10
0nt
(K)
DRAM&
050
robe
Cou
& NOR FLASH
Memory
510
xim
ate
Pr
Microprocessor&
Logic
SOC&
Logic LCD /
NAND FLASH
1App
rox
TSV
g(Area Array)
g LCD /DisplayMemory
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150 100 6080 2040Approximate Pitch (µm)
Many Other ParametersMany Other Parameters
• “Pad” type – bond pad, BGA, column, bumpyp p , , , p
• Pad Configuration – peripheral, LOC, DLOC, array
• Die Size
• Pad Size ‐ passivation opening & keep away
• Pad Metal – Al, Cu, Au, solder, etc.
• Force Requirements
• Scrub Depth
• Frequency / Bandwidth• Frequency / Bandwidth
• Pad Density (probes / mm2)
• Active Area (size of probe array)Active Area (size of probe array)
• TemperatureSilicon Valley Test Conference 2010 10
Contact Technologies / Probe Types
• CantileverCantilever
• Blade
• VerticalVertical
• MEMS– VerticalVertical
– Micro Cantilever
– Torsional
• Spring
• Membrane
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CantileverCantilever
Technoprobe
K&S: http://www.imaps.org/imaps2005/keynote.pdf
Technoprobe
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BladeBlade
Silicon Valley Test Conference 2010 13SV Probe
Vertical ‐ Buckling BeamVertical Buckling Beam
M SWTW T t i l 2004
FormFactor: “MEMS for ProbeCard Applications” Chong Chan Pin – Semicon Singapore 2010
Mann: SWTW Tutorial 2004
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SV Probe “Trio”JEM “VC”
Vertical ‐ Buckling BeamVertical Buckling Beam
MicroProbe: Apollo Vertical
JEM: VC
Silicon Valley Test Conference 2010 15SV Probe: Trio
MEMS ‐ VerticalMEMS Vertical
Microfabrica MicroProbeMicrofabrica MicroProbeFormFactor (T1)
Silicon Valley Test Conference 2010 16MicroProbe (Vx-MP)
MEMS ‐Micro CantileverMEMS Micro Cantilever
Microfabrica
FormFactor (T3)
MJC (U P b )
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http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf
MJC (U Probe)JEM
MEMS ‐ TorsionalMEMS Torsional
Touchdown Technologies (ACCU-TORQ)Touchdown Technologies (ACCU TORQ)
SWTW 2010: “Low-Force MEMS Probe Solution for Full Wafer Single Touch Test” Matt Losey
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Spring PinsSpring Pins
http://www.nhkspg.co.jp/eng/mc/products/wlt.html
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http://www.ksdk.co.jp/eng/spring-probes.htmlJEM VS
MembraneMembrane
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Cascade Microtech Pyramid Probe
Top Vendors ‐ TechnologyTop Vendors Technology
Revenue per VLSI Research press release
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Revenue per VLSI Research press releasehttps://vlsiwebserver.vlsiresearch.com/public/cms_pdf_upload/458310.pdf
Based upon website and company responses to marketing inquires.
Top Vendors ‐ ApplicationsTop Vendors Applications
Based upon website and company responses to marketing inquires
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Based upon website and company responses to marketing inquires.
Hot Topics (1)Hot Topics (1)
B / b ll dMost
I i ti l • Bump / ball damage
• Cu probing
Inspirational
• High currentMost Inspirational
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Hot Topics (2)Hot Topics (2)
• High Frequency / high bandwidthHigh Frequency / high bandwidth– Advanced space transformers
Modeling– Modeling
– Direct Dock
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Hot Topics (3)Hot Topics (3)
• Operational – lower cost quicker cycle timeOperational lower cost, quicker cycle time
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SummarySummary
• Device product requirements drive bothDevice product requirements drive both packaging and test complexity– Essential to partner with suppliers from day one– Essential to partner with suppliers from day one
C f l l ti f b d d• Careful selection of probe card vendors– Know strengths & weaknesses for your devices
– Technology may limit performance & impact cost
– No one solution fits all
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ResourcesResources
• IEEE Semiconductor Wafer Test WorkshopIEEE Semiconductor Wafer Test Workshopwww.swtest.org
• International Test Conferencewww.itctestweek.org
• My blogswww.hightechbizdev.com
www.ateforum.com/tothepoint
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CreditsCredits
Thank you to the vendors who provided photos!Thank you to the vendors who provided photos!
• FormFactor
h b• Technoprobe
• MicroProbe
• JEM
• SV ProbeSV Probe
• Cascade Microtech
V i• VerigySilicon Valley Test Conference 2010 28