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SEMICONDUCTOR TECHNOLOGIES &

INSTRUMENTS

Wafer Inspection System for Frame & Whole Wafer

STI’s i Focus is a highly intelligent precision wafer inspection system that offers a comprehensive solution for the inspection of frame and/or whole wafer. Using STI’s proprietary On-The-Fly (OTFTM) vision, the i Focus can be configured to detect any type of micro defects arising from wafer processing, post dicing or packing. The OTFTM optical system encompasses pioneering technology in areas such as optics and illumination design, 2D, 3D and active die inspection algorithms. Patented Simultaneous Dual Illumination Image Capture Technology is used to eliminate escape and reduce overkill without compromising throughput.

Layout

i Focus Specifications

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Wafer Type Wafer Size (in.) Wafer Thickness Material Handling Load Port UPH MTBA MTBF Options User Interface

Frame Whole 6, 8, 12 (Frame) 6, 8, 12 (Whole) 0.40 mm to 1.20 mm Standard cassette 6”, 8” or 12” cassette (frame) 6” or 8” open cassette (whole) SEMI compliant FOUP Autodoor FOSB 300 mm whole wafer 8” open cassette adaptor (optional) 2D OTF

TM : 30 WPH @2.5x magnification

3D OTFTM

: 10 WPH (Based on 200 mm wafer) > 6 hours > 1000 hours Real-time Statistical Process Control SECS/GEM Compatible Windows 7 platform with GUI Full machine diagnostics capability

FACILITIES AC Power Supply Air Supply Vacuum Environment Dimension Weight

230 VAC, 30 A, 50/60 Hz, one phase 0.49 MPa – 0.59 MPa, 300 l/min -60 kPa to -80 kPa, ≥ 20 l/min

15° - 30°C 50% - 70% relative humidity 2280 x 1780 x 2004 mm 1835 x 1360 x 2004 mm (without port) 2000 kg

i Focus

SPECIFICATIONS DETAILS

SPECIFICATIONS DESCRIPTION

2D OTF

TM

3D OTF

TM

Scratch Damage FM defects Edge chip out Corner chip out Saw offset cut Coplanarity Bump Height

INSPECTION DETAILS

2280 mm

1835 mm

1360 mm

1780 mm

2004 m

m

INSPECTION FRAME WAFER WHOLE WAFER FRAME/WHOLE WAFER

SYSTEM 100

SYSTEM 150

SYSTEM 300

SYSTEM 350

SYSTEM 500

SYSTEM 550

2D OTFTM

SYSTEM

3D OTF

TM SYSTEM