Delivering Performant and Precise AI-Enabled Wafer Inspection
WAFER INSPECTION SYSTEM€¦ · WAFER INSPECTION SYSTEM The Automation Company proven measuring and...
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W AFER INSPECTION SYSTEM The Automation Company proven measuring and sorting system for silicon solar wafers modular design including devices for loading and unloading, inspecting, sorting, process linkage wafer inline check up to the edge e.g. saw mark, contamination and edge thickness variation detection perfect adaption of automation to measurement needs non contact quality control minimizes stress on the wafer as much as possible WIS Master PC for central receipe management to create customized inspection The quality of the wafer is crucial for the effectiveness of the future solar cell. The Jonas & Red- mann Wafer Inspection System sorts out damaged and faulty wafers. Using error-free wafers re- duces the breakage rates within the cell production process significantly. As a result customers save enormous costs. Wafer: 156 mm, mono/multi Capacity: 3600 wafers/hr. Uptime: > 97% Breakage: < 0,08%
Transcript of WAFER INSPECTION SYSTEM€¦ · WAFER INSPECTION SYSTEM The Automation Company proven measuring and...
WAFER INSPECTION SYSTEM
The Automation Company
proven measuring and sorting system for silicon solar wafers
modular design including devices for loading and unloading, inspecting, sorting, process linkage
wafer inline check up to the edge e.g. saw mark, contamination and edge thickness variation detection
perfect adaption of automation to measurement needs non contact quality control minimizes stress on the wafer as much as possible
WIS Master PC for central receipe management to create customized inspection
The quality of the wafer is crucial for the effectiveness of the future solar cell. The Jonas & Red-mann Wafer Inspection System sorts out damaged and faulty wafers. Using error-free wafers re-duces the breakage rates within the cell production process significantly. As a result customers save enormous costs.
Wafer: 156 m
m,
mono/m
ulti
Capacity: 3600 wafers/hr.
Uptime: > 97%
Breakage: < 0,08%
The Automation Company
Jonas & Redmann Group GmbH | Kaiserin-Augusta-Allee 113 | 10553 Berlin | Germany
phone +49 30 230 866-0 | fax +49 30 230 866-50 99 | [email protected] | www.jonas-redmann.com
1-sided 2-sided 2-sided
topology
saw mark Minimum detection level > 5 µm
accuracy (3σ): 2 µm
100 µm lat. res 100 µm lat. res 50 µm lat. res
edge thickness variation (ETV)
geometry 1-sided 2-sided 2-sided
WMT 3
total thickness variation (TTV) along 1 line along 3 lines along 3 lines
resistivity
surface
edge
chipping 1-sided 2-sided 2-sided
contamination - 2-sided 2-sided
WML lifetime upon request
MCI µ-crack -
ITWIS-master
WIS-database - -
INSPECTION CATEGORY PARAMETERS BASIC STANDARD PREMIUM
Input and Output carrier magazine and box direct linking with process equipment
Integration into Production stand alone solution inline connection connection to fully automated transport and linkage system
Inspection and Sorting conveyors synchronized to measurement tools (stop and go and on-the-fly) inline measurement configurable number of bins
Software standard MES interface protocols e.g. SECS/GEM and XML integration of separate manufacturing execution system (MES) terminal
Automation Features and Options
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