W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u...
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Transcript of W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u...
![Page 1: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/1.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM) TRT Barrel Cooling:
Electronics Motivation:
Overheating of electronics causes premature failure
Requirements: 100 mW per channel Total for type 1(inner) module ~ 30 W Want operating T < 50 ºC
Old Cooling Plan (works @ 60 mW): Heat generated by IC through stamp board through legs/sockets into cooling plate to mounting channel/tubing to cooling fluid
![Page 2: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/2.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
From Lund: ASDBLR & DTMROC dummy boards
(pictured here) Roof boards Readout and display software
![Page 3: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/3.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
Insulated box for performing cooling studies:
![Page 4: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/4.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
1 mm PG cooling plate on type 1 tension plate with Lund mockup electronics (one roof board and two stamp board sets removed)
![Page 5: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/5.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
Results: (60 mW / coolant at 14 ºC) 1.3 mm Aluminum cooling plate:
ASDBLR: 46.5 ºC DTMROC: 48.8 ºC roof boards: 38.8 ºC cooling, tension plates: ~ 27 ºC
1.0 mm Aluminum cooling plate: estimate 4 º higher than above
1.0 mm PG cooling plate: ASDBLR: 49.3 ºC DTMROC: 51.1 ºC roof boards: 39.5 ºC cooling, tension plates: ~ 27 ºC
(Typical range: ± 2 ºC) For 75 mW, add ~9 ºC
![Page 6: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/6.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
New Cooling Plan for 100 mW: Keep old scheme, and:
Make lower cooling plate thinner Add upper cooling plate Plates share cooling tubing
Reasons: Increase in power expected to
come mostly from upper chip (DTMROC)
Too late to make major changes to lower plate design
As always, must minimize material to reduce radiation length
![Page 7: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/7.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
New mockup, showing PG vertical rail connecting cooling plates
![Page 8: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/8.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
New mockup with one roof board removed, showing upper cooling plate
![Page 9: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/9.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
Results: (100 mW - 40/60) “0.6 mm” Aluminum cooling plates:
ASDBLR: 49 ºC DTMROC: 50 ºC roof boards: 28 ºC cooling, tension plates: ºC
![Page 10: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/10.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
Present Activities: Proceeding with two-plate prototype:
0.6 mm thick lower plate 0.6 mm (at min) upper plate 3.3 mm wide PG connection from
cooling tubing to upper plate, attached with metal-filled epoxy
Proceeding with FEA calculation: Will model one (or a few)
electronics stacks with all cooling parts
Steady state - simplifies problem Will be able to parameterize plate
thickness and material properties to validate and optimize design
![Page 11: W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics Motivation: u Overheating of electronics causes premature failure.](https://reader035.fdocuments.in/reader035/viewer/2022062421/56649e575503460f94b4f2f3/html5/thumbnails/11.jpg)
W. Ebenstein DOE ReviewDuke University September 1999
Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)
Summary: Two plate design works at 100 mW
Will fine tune dimensions, material choices from:
results of FEA calculations mockup results with various
configurations measured power consumption of
real electronics changes due to redesign of
board-to-board connection (Lund flex design)
changes due to placement of electronics on stamp boards