Top 10 New Features and Changes of the VSP1. Two-DKC architecture for scale-up growth2. Microprocessors separated from the CHA and DKA interface ports3. Elimination of separate Shared Memory components4. Faster memory and improved resilience against write-through operations5. SAS back end (replaces previous fibre channel back end)6. Faster microprocessor chips that deliver tightly integrated MP workloadsharing7. Microprocessor ownership of LDEVS for improved performance andworkload management8. Improved Storage Navigator 2 GUI with faster performance and paralleloperations by multiple users9. Integrated and consistent Command Line Interface (CLI) that supports allconfiguration and provisioning operations10.Hitachi Dynamic Tiering functionalityThere are several major hardware changes that significantly improve all areas of performance:New HiStar-E network: The largest difference is the complete replacement of the VSP's PCIe1.0 HiStar-E Networksystem, which was provided by the VSP Grid Switches (GSWs) that connected all the controller boards together. TheVSP G1000 has a new integrated Cache Path Control cache-switch (CPC board) design, and the HiStar-E networkis now operating primarily on PCIe3 paths (four times faster than equivalent PCIe1 paths). All controller boards nowhave four paths to the central HiStar-E grid (with one path per CPC board within the same controller).8-core Xeon processors: Another major performance enhancement is the move to 8-core Intel Xeon processors onthe processor boards (VSDs) in comparison to the 4-core processors used on the VSP. There now is 16GB of localRAM workspace per VSD board rather than the 4GB per VSD board on the VSP.FED and BED board processors: The VSP's Data Accelerator ASICs (Application Specific Integrated Circuit) werereplaced by the new LR8 Data Accelerator ASICs. The DA ASICs on the new front-end director and back-end directorboards are much faster than the DA ASICs used on the VSP front-end director and back-end director boards. There isnow 16GB of local RAM workspace per FED or BED board rather than the 4GB per board on the VSP.Back-end SAS drive links: The back-end disk controller (BED) boards each provide 16x 6Gbps SAS links via fourSAS 4W ports to the drives, providing twice as many drive paths as available on the VSP. There are now 8 columns ofdirectly attached drive trays behind the BEDs instead of 4, with each drive tray driven by 4 or 8 SAS links, whichdouble the back-end parallelism.Additional VSD processor boards: Either 2 or 4 VSD boards may be installed in place of 2 or 4 of the optional FEDboards for greatly increased processing power as this can double the number of Xeon cores in the system.