Ultra Low Loop Bonding Chip Scale Package Bonding · bonding, the vibration characteristics of the...
Transcript of Ultra Low Loop Bonding Chip Scale Package Bonding · bonding, the vibration characteristics of the...
CAPABILITY CONSISTENCYADAPTABILITY RELIABILITY
Courtesy of ASM
Courtesy of ASM
Multi-Tier Bonding Stacked-Die BondingAdvanced Stacked-Die Looping for Pyramid& Overhang Stacking
BPP UseableWire Ø (µm)
Recommended SPTPart Number
70
60
50
45
25
25
232020
PI-33085-435F-ZP34T-375
PI-30075-355F-ZP34T-300
PI-28063-335F-ZP34T-250PI-25063-305F-ZP34T-250PI-23055-281F-ZP34T-250
Tri-Tier, Quad Tier Bonding for Fine Pitch& Ultra Fine Pitch Application
BPP UseableWire Ø (µm)
Recommended SPTPart Number
100
9080
7060
25
2525
2525
PI-35130-585F-ZP34T
PI-35120-535F-ZP34TPI-35100-515F-ZP34T
PI-33090-435F-ZP34TPI-30080-355F-ZP34T
Ultra Low Loop Bonding Chip Scale Package BondingLow Loop & Short Wire Capability
BPP UseableWire Ø (µm)
Recommended SPTPart Number
1009080
7060
252525
2525
PI-35130-585F-ZP34T-XXXPI-35120-535F-ZP34T-XXXPI-35100-515F-ZP34T-XXX
PI-33090-435F-ZP34T-XXXPI-30080-355F-ZP34T-XXX
Standard Forward, Standard Reversed& Special Low Loop
BPP UseableWire Ø (µm)
Recommended SPTPart Number
100
9080
7060
25
2525
2525
PI-35130-585F-ZP34T-520
PI-35120-535F-ZP34T-520PI-35100-515F-ZP34T-520
PI-33090-435F-ZP34T-520PI-30080-355F-ZP34T-520
P R O G R A M M E D
I N T E L L I G E N C E
Programmed with
Your Solutions in Mind!
80µm BPP100µm BPP
www.smallprecisiontools.com
We reserve the right to make changes to design or specifications at any timewithout notice. Bonding responses shown may vary depending upon thebonding parameters, device metallization, substrate, etc, used.
The advancement in bonding technology and the market demandfor faster, smaller and better product, again poses newchallenges for the wire bonding process. The transition fromfine-pitch (FP) to ultra fine-pitch (UFP) volume production, andthe emergence of stacked die, multi-tier and low-K bonding hasincreased the level of difficulties in the wire bonding processwith more yield loss due to lifted ball, wire shorts, etc.
In compliance with these new bonding requirements, SPT hasembarked on an extensive study to develop a new generationand high-performance capillary. Designed with advancedprocess diagnostic tools, the new capillary design, known asthe PI (Programmed Intelligence) capillary has been extensivelytested in a variety of wire bonders and packages. In all tests,the PI capillary has demonstrated superior bonding performancewith good repeatability and portability using a wide range ofbonding platform.
Programmed Intelligence
P.I. Capillary
The PI capillary was derived from a series of physical modelingand finite element analysis (FEA) studies to analyze the stresslevel at the tip and transition profile for different designs, asthese are locations where breakage is most likely to occur. Anexample of the analysis – in this case, for the PI design is asshown below. Among the options considered, the PI designshowed the lowest overall stress. This result was validatedthrough destructive test, which showed that the breaking loadfor the PI design is 7% higher as compared to other designoption.
Ultra Fine Pitch Bonding Fine Pitch BondingBGA & QFP Bonding Application
BPP UseableWire Ø (µm)
Recommended SPTPart Number
50
45
40
35
30
2320
20
18
15
12
PI-28063-335F-ZP34TPI-25063-305F-ZP34T
PI-23055-281F-ZP34T
PI-21050-251F-ZP34T
PI-18045-221F-ZP34T
PI-15038-181F-ZP34T
BGA Bonding Application
40µm BPP
35µm BPP30µm BPP
BPP UseableWire Ø (µm)
Recommended SPTPart Number
10090
807060
2525
252525
PI-35130-585F-ZP34TPI-35120-535F-ZP34T
PI-35100-515F-ZP34TPI-33090-435F-ZP34TPI-30080-355F-ZP34T
60µm BPPSPT Roth Ltd
Werkstrasse 28, CH-3250 Lyss, Switzerland
Tel : + 41 32 387 80 80
Fax : + 41 32 387 80 88
E-Mail : [email protected]
Small Precision Tools Inc
1330 Clegg Street, Petaluma, CA 94954, USA
Tel : + 1 707 765 4545
Fax : + 1 707 778 2271
E-Mail : [email protected]
SPT Asia Pte Ltd
970 Toa Payoh North, #07-25/26, Singapore 318992
Tel : + 65 6253 5577
Fax : + 65 6250 2725
E-Mail : [email protected]
Small Precision Tools (Phil) Corp
35 Libertad Street, Mandaluyong City 1550, Philippines
Tel : + 632 533-7067
Fax : + 632 531-5780
E-Mail : [email protected]
Small Precision Tools Co Ltd
A2 Building, Liyuan Economic Development Zone,Wuxi, Jiangsu, P.R.China 214072
Tel : + 86 510 516 1968
Fax : + 86 510 516 5233
E-Mail : [email protected]
SPT Japan K.K.
9th floor, Shin-Yokohama U.U Building,2-5-2, Shin-Yokohama, Kohoku-ku,Yokohama-shi, Kanagawa, 222-0033 Japan
Tel: +81-45-470-6288
Fax: +81-45-470-6755
E-Mail: [email protected]
Laser interferometry technique is also used to determine theoptimum capillary profile through amplitude of vibrationmeasurement along the overall profile of the capillary. In wirebonding, the vibration characteristics of the capillary is animportant factor as its indicates the efficiency of the transfer ofthe ultrasonic energy from the bonding tool to the bond padinterface. Through the various design optimization, the PI designhas shown to be more responsive to the bonding parameters,producing better bond integrity.
DataSource
Design A Design BP.I.
Design
Stress @ Tip(x1011 Pa) Simulation 0.1269 0.1253 0.1167
BreakageLoad (gf)
Simulation 228 238 245
Figure 1: Correlation of the simulation data with the results ofdestructive test
Based on the various simulation and diagnosis, the PI capillarydesign was conceived. Actual bonding responses were testedusing standard QFP and BGA package for a 70um bond padpitch (BPP). The PI capillary was shown to be more responsiveto the bonding parameter producing better results on all themeasures (ball size, ball shear and stitch pull). In contrast, otherdesign options would require higher bond force and moreultrasonic power to achieve the same bond integrity. Thisobservation correlated with the result from the laserinterferometry test.
Today, the PI capillary has been qualified and used in volumeproduction by major assembly houses for a broad range ofbonding applications. Depending on the specific bondingapplication, the PI design can be used together with any existingdesign feature, such as the DFX (for small ball large wirebonding), CSP (for short loop/low wire bonding, BSB (ball stitchon ball bonding), Infinity (extended tool life), etc. Indeed, the PIcapillary has proved to be a new revolution in bonding solution.
Amplitude of Vibration (nm)
Design A Design BP.I.
Design
454 488 544
Figure 2: Laser interferometry test results
P.I. is Capillary ‘Intelligence’ Unprecedented
Design A Design BReadings P.I. Design
52.6 53.325 53.8Ball size (µm)
24.41.41
Ball sheared
25.01.48
Ball sheared25
25.71.33
Ball sheared
Ball shear (gf)Standard deviationFailure mode
7.32100% Break
@ stitch
7.41100% Break
@ stitch25
7.54100% Break
@ stitch
Stitch pull (gf)Standard deviationFailure mode
Designed with Advanced Process Diagnostic Tools
Stress @Transition(x109 Pa)
Simulation 0.6632 0.5687 0.5417
Figure 3: Average results from actual bonding responses
PORTABILITY REPEATABILITY
Apr
il 20
05