January 22, 2003 JCOV executive meeting CERN S.Popescu

TPC IROC Cooling measurements

U.Frankenfeld(GSI), S.Popescu(CERN), H.R.Schmidt(GSI)

• Introduction• Tests set-up• Test results• Conclusions

January 22, 2003 JCOV executive meeting CERN S.Popescu

3

ITS(pixels)

TPC

January 22, 2003 JCOV executive meeting CERN S.Popescu

TPC Requirements

• Stringent requirement of 0.1 0C stability/over the drift distance (~ 2.5 m)

• Measurements needed to understand the heat transfer from FEC to the PADs plane and the thermal behavior of the ReadOut Chambers

• 832W/sector where one sector (IROC + OROC) have 43 + 78 = 121 FEC cards

• In total 30.2 kW must be removed

January 22, 2003 JCOV executive meeting CERN S.Popescu

Set-up of tests

• July and September tests:– Common cooling circuits input for FEC and IROC

– Set-point t=15 0C for cooling circuits and Thermal box

• January test:• Separate cooling circuits

• Set-point t= 19 or 21 0C for cooling circuits (FEC and IROC)

• Set-point t= 21 0C for thermal box

January 22, 2003 JCOV executive meeting CERN S.Popescu

•Thermal box : water cooling system (Lauda)•T1,T2,T3on the Pad plane•T4in the Thermal Box, T5 between FEC•T6in IROC, T7In cool pipe,T8Out cool pipe•T9room temp•T10on the cooled side of FEC envelope•T11the opposite side of FEC envelope

PC W2K

Can

Bu

s

ELMBOPC server

PVSS client2.12

Operational Panel1st ver.

System set-up

PUMP

1) IROC circuit

2) FEC circuit

Lauda System

T4

1)

2)

IROC

T1 T2 T3

T5

T6

T7 T8

T9

Softw

are layout

Th

ermal B

ox T=

15 0C

T=17 0C

NI Labview application

ELMBOPC server

July & September 2003September 2003

January 2004

January 22, 2003 JCOV executive meeting CERN S.Popescu

Position of sensors inside Thermal Box

z

T4 ~ 17cm

~ 37cm

x

y

Air sensorSensors glued on the PADs plane

PADs plane

T1T2T3

~ 10cm ~ 10cm

~ 28.5cm

~ 43cm

~ 10cm

IROC Cooling input line

IROC Cooling output line

FEC coolingInput pipe

FEC coolingOuput pipe

FEC coolingenvelopes

FEC

T10 sensorT11 sensor

January 22, 2003 JCOV executive meeting CERN S.Popescu

FEC cardsLV PS for FEC

IN OUT

Thermal Box T=15 0C

T=15.5 0C

Cooling pipes

Temp sensorsPT1000 2w

January 22, 2003 JCOV executive meeting CERN S.Popescu

InnerReadout Chamber Prototype

Input Cooling circuit

Output Cooling circuit

FEC Cooling circuit OUT

Cha

mbe

r C

oolin

g c

ircu

it

FEC Cooling circuit IN

LV power lines forFEC

T5 T6

T8

T7

January 22, 2003 JCOV executive meeting CERN S.Popescu

ELMB + PT1000 2w connected

AI portPT1000 2w sensors connected Can Bus port

January 22, 2003 JCOV executive meeting CERN S.Popescu

Heat transfer from FEC to PADs plane while powering up of FEC.

t1,t3 sensorsInstalled on thePADs plane

~30 min

Sensor installed between FECs

LV OFF LV ON

T1T2

T4

T8T7

T3T6

T5

January 22, 2003 JCOV executive meeting CERN S.Popescu

Results: -heat transfer from FEC cards to PADs plane ~ 0.18 0C-relaxation time for PADs is approximately 30 minutes

∆ ~ 0.18 0C

January 22, 2003 JCOV executive meeting CERN S.Popescu

Air temperature inside the thermal box

Sensor on Padbehind FEC

∆ ~ 0.18 0C

∆ ~ 0.1 0CSensor on Pad10 cm away

January 22, 2003 JCOV executive meeting CERN S.Popescu

Chamber cooling On Off On

Sensor on IROC Chamber

Room temperature

PadsSensors on In/Out coolingpipes

∆ ~ 4 0C

~ 22 0C

~ 16 0C

∆ ~ 1 0C

January 22, 2003 JCOV executive meeting CERN S.Popescu

Air thermal box

Pad under FEC

Pad

Cooling In

~ 50 minutes relaxation for Chamber

∆ ~ 1.3 0C

January 22, 2003 JCOV executive meeting CERN S.Popescu

FEC Off On

Room temperature

January 22, 2003 JCOV executive meeting CERN S.Popescu

with Flat cable

without Flat cable

LV ONOFF

LV ONOFF

T5 behind FEC

T6 aside FEC

∆ ~ 0.14 0C

∆~ 0.18 0C

T6 aside FEC

T5 behind FEC

Heat transfer to PADs plane by the FEC’s flat cable

January 22, 2003 JCOV executive meeting CERN S.Popescu

Temperature difference fora single FEC outsidethe IROCWithout screws

LV OFFON

Temperature drop measured on a single FEC outside the IROC (while tightening the screws)

LV ON

Heat transfer between the cooling plates transported by screws

∆ ~ 4.5 0C

∆ ~ 5.5 0C

January 22, 2003 JCOV executive meeting CERN S.Popescu

∆ ~ 3.5 0C

Temperature difference between the FEC’s envelopeplates when the board is plugged inside the IROC between 2 other

boards all cooled, but without screws. Conclusion: we reduced by geometry with 2 0C

LV ON OFF

January 22, 2003 JCOV executive meeting CERN S.Popescu

Temperatures evolution during two compensation phases for the FEC cooling circuit

- IROC cooling circuit set point is 21 0C constant- Temperature inside thermal box is 21 0C constant

19 0C 24 0C 24 0C 19 0C

LV OFFON LV OFFON

Phase 1 Phase 2

Sensors on the PADs plane

Room temperature

Sensor between FEC board

Sensors on the FEC cooling envelope

Temperature at the inlet cooling circuit for FEC

19 0C 24 0CLV ONOFF

Phase 3

January 22, 2003 JCOV executive meeting CERN S.Popescu

Phase 224 0C 19 0CLV OFF ON

∆ ~ 0.05 0C

Phase 319 0C 24 0CLV ON OFF

∆ ~ 0.14 0CSensor behind FEC

Sensor behind FEC

Sensor aside FEC

Sensor aside FEC

∆ ~ 0.05 0C

Heating compensatebetter than cooling

January 22, 2003 JCOV executive meeting CERN S.Popescu

Temperatures evolution during two variations of temperature for the IROC cooling circuit

- FEC cooling circuit set point is 21 0C constant- Temperature inside thermal box is 21 0C constant- LV is off

21.2 0C 19.5 0C 21.2 0C19.5 0C

Temperature at the IROC cooling circuit inlet

Temperaturein the IROC (chamber)

~ 50 minutes relaxation for Chamber

January 22, 2003 JCOV executive meeting CERN S.Popescu

Summary• Heat transfer from FEC (LV OFFON) to PADs plane is ~0.2 0C • Relaxation time for PADs (OFF ON) ~30 minutes (independent of flow)• Temperature variation ~ 4 0C of Chamber body for cooling ONOFF or OFF ON (air

temp in average 22 0C and temp of ~ 15.5 0C inside the thermal box and for the FEC cooling circuits)

• On the PADs plane temperature varies with 1.3 0C for a 4 0C variation in temperature of the chamber’s body

• Relaxation time for chamber is ~ 50 minutes for the same transition• Heat influence between cards is ~ 3.5 0C and ~ 2 0C is removed by the neighbor cooled plates • Heat transfer from FEC to PADs plane through the flat cable is negligible (~ 0.04 0C)• The stainless screws are removing ~ 4.5 0C between the cooling plates of the FEC board• With a 5 0C variation in the input temperature of the FEC cooling circuit we reduced the heat

transfer from 0.2 0C to 0.05 0C• The two compensations scenarios are showing that a refined adjustment at the FEC cooling

circuit inlets and keeping a constant temperature at the IROC cooling inlets are recommended • This could be also a proposed method to power up the FEC

January 22, 2003 JCOV executive meeting CERN S.Popescu

FEC’s cooling circuits

ROC’s cooling circuits

Cooling Plant….

Appendix:

January 22, 2003 JCOV executive meeting CERN S.Popescu

Embedded Local Monitor Board ELMB128

1. General-purpose plug-on module (50 x 73 mm2): direct on subdetector FEC or on a general purpose motherboard

2. CANbus interface (Full-CAN controller)

3. CANopen communication protocol

4. In System Programmable also via CAN bus

5. Optional 64 inputs of 16-bit ADC with 7 bit gain

6. General I/O

1. with 18 I/O, 8 Out and 8 IN (or ADC), 3 wire SPI7. Flexible power supply circuits incorporated

8. Radition tolerant up to about 5 Gy and 3*1010 n/cm2 for 10 year

9. Tolerant in magnetic field up to 1.5 T

10. Est. cost is < 100 CHF for ADC +CAN

11. Diagnostic tools available

1. NI Server Explorer(runs on W2K)-> to have a quick look on OPC items

2. Canhost: a more dedicate tool(for diagnostics and configuration of ELMB+ bus)-runs on a MS-Dos window

3. CANalyser : is a universal software for Can bus protocol

• Technical Data

January 22, 2003 JCOV executive meeting CERN S.Popescu

General purpose motherboard (front side)

General purpose motherboard (back side)