Thin Films—Stresses and Mechanical Properties...

Thin Films—Stresses andMechanical Properties X

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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information

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http://www.cambridge.org/9781107409316

MATERIALS RESEARCH SOCIETYSYMPOSIUM PROCEEDINGS VOLUME 795

Thin Films—Stresses andMechanical Properties X

Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

EDITORS:

Sean G. CorcoranVirginia Tech

Blacksburg, Virginia, U.S.A.

Young-Chang JooSeoul National University

Seoul, Korea

Neville R. MoodySandia National LaboratoriesLivermore, California, U.S.A.

Zhigang SuoHarvard University

Cambridge, Massachusetts, U.S.A.

IMIRIS1Materials Research Society

Warrendale, Pennsylvania






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CONTENTS

Preface xvii

Materials Research Society Symposium Proceedings xviii

STRESS EVOLUTION

Mechanical Strain Evolution in Cu/low K Interconnect Lines 3Paul R. Besser and Qing-Ting Jiang

Irreversible Tensile Stress Development in PECVD SiliconNitride Films ....9

Michael P. Hughey and Robert F. Cook

X-ray Microbeam Diffraction Measurements inPolycrystalline Aluminum and Copper Thin Films 15

L.E. Moyer, G.S. Cargill III, W. Yang, B.C. Larson,and G.E. Ice

Use of the Curvature Method to Determine the MisfitStress of Epitaxial Semiconducting Systems: The Case ofSamples Thinned for TEM Observation 21

A. Ponchet, M. Cabie, L. Durand, M. Rivoal, and A. Rocher

MODELING STRESSES ANDFILM INSTABILITY

Dislocation Image Stresses at Free Surfaces by the FiniteElement Method 29

Meijie Tang, Guanshui Xu, Wei Cai, and Vasily Bulatov

Phase Field Modeling of Surface Instabilities Induced byStresses 35

D.J. Seol, S.Y. Hu, Z.K. Liu, S.G. Kim, W.T. Kim,K.H. Oh, and L.Q. Chen

An Atomistic View of Interface-Mediated DislocationPlasticity in Thin Metal Films 41

E.S. EgeandY.-L. Shen

Dislocation Dynamics in Semiconductor Thin Film-SubstrateSystems 47

E.H. Tan and L.Z. Sun






DEFORMA TIONAND ADHESION

* Fracture in Thin Oxide Films 55D.F. Bahr, A.L. Olson, K.R. Morasch, M.S. Kennedy,D. Rodriguez Marek, and A. Alamr

Measurement of Residual Stress in ZnO Thin Films Depositedon Silicon Wafers by the Indentation Fracture Test 63

Tong-Yi Zhang and Bin Huang

Thin Film Herringbone Buckling Patterns 69Xi Chen and John W. Hutchinson

The Effect of Oxygen on Adhesion of Thin Copper Filmsto Silicon Nitride 75

Mengzhi Pang, Monika Backhaus-Ricoult, andShefford P. Baker

Fracture Patterns in Thin Films and Multilayers 81Alex A. Volinsky, Dirk C. Meyer, Tilmann Leisegang,and Peter Paufler

The Thermal Annealing Effect on the Residual Stress andInterface Adhesion in the Compressive Stressed DLC Film 87

Heon Woong Choi, Myoung-Woon Moon, Tae-Young Kim,Kwang-Ryeol Lee, and Kyu Hwan Oh

Subcritical Delamination of Dielectric and Metal FilmsFrom Low-k Organosilicate Glass (OSG) Thin Films inBuffered pH Solutions 93

Y. Lin, J.J. Vlassak, T.Y. Tsui, and A.J. McKerrow

Bonding Characterization of Oxidized PDMS Thin Films 99J.J. McMahon, Y. Kwon, J.-Q. Lu, T.S. Cale, andR.J. Gutmann

Effects of Process Parameters on the Adhesion of CopperFilm on Polyethylene Tetrephthalate(Pet) SubstratePrepared by ECRMOCVD Coupled with a Periodic DC Bias 105

Jin Hyun, Bup Ju Jeon, Dongjin Byun, and Joong Kee Lee

*Invited Paper

VI






Adhesion Strength of Polymer Coatings Studied by LaserInduced Delamination I l l

A. Fedorov, A. van Veen, R. van Tijum, andJ.Th.M. de Hosson

FILM FRACTURE ANDFATIGUE

* Toughness and Contact Behavior of Conventional andLow-k Dielectric Thin Films 119

Robert F. Cook, Dylan J. Morris, and Jeremy Thurn

Understanding Adhesion Failure in Low-k Dielectric StackDuring Chemical-Mechanical Polishing 131

F. Iacopi, D. Degryse, I. Vos, M. Patz, and K. Maex

Solutions and Discussions of Thin Film Undergoing theNonlinear Peeling 137

Yueguang Wei, Siqi Shu, and Ying Du

Effects of Varying Mean Stress and Stress Amplitude onthe Fatigue of Polysilicon 143

H. Kahn, R. Ballarini, and A.H. Heuer

Fracture Behavior of Micro-Sized Specimens PreparedFrom a TiAl Thin Foil 153

K. Takashima, T.P. Halford, D. Rudinal, Y. Higo, andP. Bowen

A Membrane Deflection Fracture Experiment to InvestigateFracture Toughness of Freestanding MEMS Materials 159

H.D. Espinosa and B. Peng

Microstructural Aspects of Fracture in NanolayeredTiAlCrN Thin Films 167

A.E. Santana, A. Karimi, V.H. Derflinger, andA. Schiitze

* Invited Paper

vn






Resistance to Cracking of a Stretchable Semiconductor:Speed of Crack Propagation for Varying Energy Release Rate 173

Sheng Liu, Hee C. Lim, Min Qu, John F. Federici,Gordon A. Thomas, Helena Gleskova, and Sigurd Wagner

PROCESSING AND STRUCTURE

Effect of Dielectric Materials on Stress-Induced DamageModes in Damascene Cu Lines 181

Jong-Min Paik, Hyun Park, Ki-Chul Park, andYoung-Chang Joo

Young's Modulus Variation with Thickness of Thin Films 187L.G. Zhou and Hanchen Huang

Stretchable Conductors: Thin Gold Films on SiliconeElastomer 193

Stephanie P. Lacour, Sigurd Wagner, and Z. Suo

Stress-Assisted Copper-Induced Lateral Growth ofPolycrystalline Germanium 199

B. Hekmatshoar, D. Shahrjerdi, S. Mohajerzadeh,A. Khakifirooz, M. Robertson, and A. Afzali-Kusha

Stress Relaxation During Isothermal Annealing atElevated Temperatures in Electroplated Cu Films 205

Soo-Jung Hwang, Young-Chang Joo, and Junichi Koike

Stress and Texture in Sputter Deposited Cr Films 211S. Yu. Grachev, J.-D. Kamminga, and G.C.A.M. Janssen

Thickness Dependent Stress Relaxation With the Onset ofLl0 Ordering in FePt Thin Films 217

K.W. Wierman, C.L. Platt, and J.K. Howard

Single-Crystal and Nano-Columnar Growth ofGadolinium-Doped Ceria Thin Films on Oxide SubstratesStudied Using Electron Microscopy 223

D.X. Huang, C.L. Chen, and A.J. Jacobson

Strain Control in SrRuO3 Thin Films by Using a LatticeConstant Tunable Buffer 229

K. Terai, T. Ohnishi, M. Lippmaa, H. Koinuma, andM. Kawasaki






Thermal Stability and Internal Stress for Strongly (111)Oriented Cu Films 235

Sinji Takayama, Makato Oikawa, and Tokuji Himuro

Stress and Defect Generation in Si Epitaxy 241Tien Wang and Douglas Carlson

Interdiffusion in Coherent Sio.9oGeo.1o/Sio.95Geo.o5 Superlattices 247D.B. Aubertine and P.C. Mclntyre

In Situ Investigation of Growth of Gold on CrystallineTiO2 and Amorphous A12O3 Substrates 253

L. Lauter and R. Abermann

Formability of Ultra-Thin Plasma-Polymer FilmsDeposited on Metal Sheet: Mesoscopic and NanoscopicAspects of Defect Formation 257

B. Baumert, M. Stratmann, and M. Rohwerder

Investigation of Mechanical Properties of MesoporousMethyl-Substituted SiO2 Thin Films (MethylsilesquioxaneMaterials) 263

M. Verdier, M. Montagnat, S. Maitrejean, and G. Passemard

In Situ, Real-Time Curvature Imaging During ChemicalVapor Deposition 269

David A. Boyd, Ashok B. Tripathi, Mohamed El-Naggar,and David G. Goodwin

Microstructure Evolution of On-Substrate NiTi ShapeMemory Alloy Thin Films 275

Xi Wang, Ann Lai, Joost J. Vlassak, and Yves Bellouard

Guided Formation of Nanostructures in Thin Films 281Wei Lu and Dongchoul Kim

INDENT A TION TESTING

Probing Strain Fields About Thin Film Structures UsingX-ray Microdiffraction 289

C.E. Murray, I.C. Noyan, P.M. Mooney, B. Lai, and Z. Cai

IX






Effects of the Substrate on the Determination of Hardnessof Thin Films by the Nanoscratch and NanoindentationTechniques: A Comparative Study for the Cases of SoftFilm on Hard Substrate and Hard Film on Soft Substrate 295

Noureddine Tayebi, Andreas A. Polycarpou, andThomas F. Corny

Dislocation Nucleation and Segregation in Nano-ScaleContact of Stepped Surfaces 301

H.H. Yu, P. Shrotriya, J. Wang, and K.-S. Kim

Determination of Residual-Stress-Free State and Mappingof Residual Stress Fields Using Speckle Interferometry andThermal Relaxation 307

Dong-Won Kim, Jong-jin Kim, Dongil Son, Nak-Kyu Lee,Kyung-Hoan Na, and Dongil Kwon

Cracking and Phase Transformation in Silicon DuringNanoindentation 313

Jae-il Jang, Songqing Wen, M.J. Lance, I.M. Anderson,and G.M. Pharr

Mechanisms Controlling the Hardness of Si and Ge 319LJ. Vandeperre, F. Giuliani, SJ. Lloyd, and W.J. Clegg

Computational and Experimental Characterization ofIndentation Creep 325

Ming Dao, Hidenari Takagi, Masami Fujiwara, andMasahisa Otsuka

Nanoindentation Behavior of Gold Single Crystals 331Martha M. McCann and Sean G. Corcoran

Indentation Curve Analysis for Pile-Up, Sink-In andTip-Blunting Effects in Sharp Indentations 339

Yeol Choi, Baik-Woo Lee, Ho-Seung Lee, andDongil Kwon

Determining Stress-Strain Curves for Thin Films byExperimental/Computational Nanoindentation 345

Baik-Woo Lee, Yeol Choi, Yun-Hee Lee, Ju-Young Kim,and Dongil Kwon

A Theoretical Study on the Indentation of ViscoelasticMaterials 351

Guanghui Fu

x






Effects of Thickness and Indenter Geometry in Nanoindentationof Nickel Thin Films 355

Padma Parakala, Reza A. Mirshams, Seifollah Nasrazadani,and Kun Lian

MECHANICAL PROPERTIES

Determination of Mechanical Parameters for RotatingMEMS Structures as a Function of Deposition Method 363

S. Soare, S.J. Bull, A. Oila, A.G. O'Neill, N. Wright,A. Horsfall, and J. dos Santos

Direct Observations of Grain Boundary PhenomenaDuring Indentation of Al and Al-Mg Thin Films 369

W.A. Soer, J.Th.M. De Hosson, A.M. Minor, E.A. Stach,and J.W. Morris Jr.

Experimental Measurements of Surface Residual StressCaused by Nano-Scale Contact of Rough Surfaces 375

J. Wang, P. Shrotriya, H.H. Yu, and K.-S. Kim

Mechanical Properties and Morphology of Poly crystalline3C-SiC Films Deposited on Si and SiO2 by LPCVD 381

Xiao-an Fu, Jeremy Dunning, Srihari Rajgopal, andMing Zhang

Thermo-Mechanical Behavior of Fe Thin Films 387Nail R. Chamsoutdinov, Amarante J. Bottger,Rob Delhez, and Frans D. Tichelaar

Thermomechanical Behavior of Tantalum Thin Films:The Effects of Oxygen and thefi-a Phase Transformation 393

Robert Knepper, Blake Stevens, and Shefford P. Baker

Temperature Dependence of Biaxial Modulus and ThermalExpansion Coefficient of Thin Films Using Wafer CurvatureMethod 399

M. Capanu, A. Cervin-Lawry, A. Patel, I. Koutsaroff,P. Woo, Lynda Wu, J. Oh, J. Obeng, and B. McClelland

Measurement of Thin-Film Stress, Stiffness, and StrengthUsing an Enhanced Membrane Pressure-Bulge Technique 405

Aaron J. Chalekian, Roxann L. Engelstad, andEdward G. Lovell

XI






Thermal-Mechanical Evaluation of Plated Electro-MagneticNiFe for MEMS Generators 411

Yibin Xue, Keithan Hillman, and David Veazie

The Effects of Passivation Layer and Film Thickness onthe Mechanical Behavior of Freestanding Electroplated CuThin Films With Constant Microstructure 417

Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado,Ting Y. Tsui, and Andrew J. McKerrow

Monotonic Testing and Tension-Tension Fatigue Testingof Free-Standing Al Microtensile Beams 423

Nicholas Barbosa III, Paul El-Deiry, and Richard P. Vinci

Effect of Monazite Coating on Tensile Properties of Nextel720 Fibers, Tows and Minicomposites 429

Devdas M. Pai, Sergey Yarmolenko, Jagannathan Sankar,Balasubramanian Kailasshankar, Christopher Murphy,Edwardo Freeman, and Larry P. Zawada

PROPERTIES AND PERFORMANCE

Bulge Test on Free Standing Gold Thin Films 437Yawen Li and Michael J. Cima

Microstructure—Mechanical Properties Relationship ofLaser Interference Irradiated Ni/Al Multi-Film 443

C. Daniel, A. Lasagni, and F. Mticklich

Early Yielding and Stress Recovery in (111) and (100)Texture Components in Cu Thin Films Determined UsingSynchrotron X-ray Diffraction 449

D.E. Nowak and S.P. Baker

Indentation and Finite Element Modeling Investigations ofthe Indentation Size Effect in Aluminium Coatings onBorosilicate Glass Substrates 455

I. Spary, N.M. Jennett, and AJ. Bushby

Young's Modulus, Poisson's Ratio, and NanoscaleDeformation Fields of MEMS Materials 461

I. Chasiotis, S.W. Cho, T.A. Friedmann, andJ.P. Sullivan

xn






Hinge Sensitivity in a Micro-Rotating Structure forPredicting Induced Thermo Mechanical Stress inIntegrated Circuit Metal Interconnects 467

J.M.M. dos Santos, K. Wang, S.M. Soare, SJ. Bull,A.B. Horsfall, N.G. Wright, A.G. O'Neill, J.G. Terry,AJ. Walton, A.M. Gundlach, and J.T.M. Stevenson

Modeling and Optimal Design of Multilayer CantileverMicroactuators 473

L.H. Han and T.J. Lu

Evaluation on Stress and Optical Property of Thin FilmsUsed in Optical MEMS Device 479

Lianchao Sun and Ping Hou

Internal Oxidation and Mechanical Properties of Pt-IrO2

Thin Films 485Richard R. Chromik, Thirumalesh Bannuru, andRichard P. Vinci

Scratch Test Measurements on CrNx Coatings 491R. Hoy, P. van Essen, J.-D. Kamminga, G.C.A.M. Janssen,and A.P. Ehiasarian

Tuning the Mechanical Properties of SiO2 Thin Film forMEMS Application 497

Wang-Shen Su, Weileun Fang, and Ming-Shih Tsai

Optimization of Film Stresses Utilized in CompositePiezoelectric Membrane Microgenerators 503

M.S. Kennedy, M. Zosel, CD. Richards, R.F. Richards,D.F. Bahr, K.W. Hipps, and N.R. Moody

Stress and Strength of Free-Standing 2-DimensionalTetrahedral Amorphous Carbon Bridge Arrays 509

Daniel H.C. Chua, T.H. Tsai, W.I. Milne, D. Sheeja,and B.K. Tay

Residual Stress in Silicon Nitride Thin Films Deposited byECR-PECVD 515

E. Cianci and V. Foglietti

Xlll






A Study on Selective Etching of SiGe Layers in SiGe/SiSystems for Device Applications 521

Takashi Yamazaki, Tomohide Sekikawa, Shinya Morita,Yoshitaka Hakamada, Hiroyuki Ohri, Shun-ichiro Ohmi,and Tetsushi Sakai

Thin Film Material Parameters Derived From Full FieldNanometric Displacement Measurements in Non-UniformMEMS Geometries 527

Jaime F. Cardenas-Garcia, Sungwoo Cho, andIoannis Chasiotis

Characterizing Thin-Film Stress Fields by Resonance ofMembrane Arrays 533

R. Engelstad, E. Lovell, A. Chalekian, S. Janowski,M. Cash, and H. Eguchi

MULTILA YERS AND NANOLAMINA TES

Stress-Field in Sputtered Mo Thin Films and Mo/NiSuperlattices: Origin and Evolution After Ion-Irradiation 541

A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guerin,and M. Drouet

Asymmetry in Multilayer Adhesion: the Zinc Oxide/SilverInterface 547

E. Barthel, P. Nael, O. Kerjan, and N. Nadaud

Design Maps for the Tensile Yield Strength of NanoscaleMetallic Multilayers 553

Adrienne V. Lamm and Peter M. Anderson

DLC/Hydroxyapatite Nanocomposites 559Roger J. Narayan

Investigation of Structural and Mechanical Properties ofUV and Microwave-Irradiated Al2O3/ZrO2 Multilayers bySol-Gel Coating 565

A.R. Phani and H. Haefke

xiv






Microstructure and Current Transport Properties ofYBa2Cu307_x/(Bao.o5, Sr0.95)TiO3 Multiple-LayerThin Films 571

Y. Luo, R.A. Hughes, J.S. Preston, and G.A. Botton

Author Index 577

Subject Index 581

xv






PREFACE

This proceedings volume contains written versions of the contributions to Symposium U,"Thin Films—Stresses and Mechanical Properties X," held December 1-5 at the 2003 MRS FallMeeting in Boston, Massachusetts. The symposium was the tenth in a series devoted to themechanical behavior of thin films, and attracted an international group of researchers and studentsfrom industry, academia, and national laboratories. Contributions in the areas of experimental,theoretical and modeling research as well as technique development were presented. Thissymposium series now spans 15 years since the first symposium at the 1998 MRS Fall Meetingand interest in the symposium continues to grow. The symposium had 203 contributions presentedover five days in these areas: stress evolution; modeling stresses and film instability; deformationand adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanicalproperties; properties and performance; and multilayers and nanolaminates.

We would like to thank all who participated for making the symposium a success and forcontributing to the stimulating discussions that followed each presentation. We also thank the staffof the Materials Research Society for their endless support in the organization of the symposiumand the publishing of these proceedings. Finally, we gratefully acknowledge the financial supportfrom Advanced Micro Devices, Inc., Hysitron, Inc., and MTS Systems Corporation.

Sean G. CorcoranYoung-Chang JooNeville R. MoodyZhigang Suo

February 2004

xvn






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 762— Amorphous and Nanocrystalline Silicon-Based Films—2003, J.R. Abelson, G. Ganguly,H. Matsumura, J. Robertson, E. Schiff, 2003, ISBN: 1-55899-699-0

Volume 763— Compound Semiconductor Photovoltaics, R. Noufi, D. Cahen, W. Shafarman, L. Stolt,2003, ISBN: 1-55899-700-8

Volume 764— New Applications for Wide-Bandgap Semiconductors, S J. Pearton, J. Han, A.G. Baca,J-I. Chyi, W.H. Chang, 2003, ISBN: 1-55899-701-6

Volume 765— CMOS Front-End Materials and Process Technology, T-J. King, B. Yu, R.J.P. Lander,S. Saito, 2003, ISBN: 1-55899-702-4

Volume 766— Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics—2003, A. McKerrow, J. Leu, O. Kraft, T. Kikkawa, 2003, ISBN: 1-55899-703-2

Volume 767— Chemical-Mechanical Planarization, M. Oliver, D. Boning, D. Stein, K. Devriendt, 2003,ISBN: 1-55899-704-0

Volume 768— Integration of Heterogeneous Thin-Film Materials and Devices, H.A. Atwater, M. Levy,M.I. Current, T. Sands, 2003, ISBN: 1-55899-705-9

Volume 769— Flexible Electronics—Materials and Device Technology, B.R. Chalamala, B.E. Gnade,N. Fruehauf, J. Jang, 2003, ISBN: 1-55899-706-7

Volume 770— Optoelectronics of Group-IV-Based Materials, T. Gregorkiewicz, R.G. Elliman,P.M. Fauchet, J.A. Hutchby, 2003, ISBN: 1-55899-707-5

Volume 771— Organic and Polymeric Materials and Devices, P.W.M. Blom, N.C. Greenham,CD. Dimitrakopoulos, CD. Frisbie, 2003, ISBN: 1-55899-708-3

Volume 772— Nanotube-Based Devices, P. Bernier, S. Roth, D. Carroll, G-T. Kim, 2003,ISBN: 1-55899-709-1

Volume 773— Biomicroelectromechanical Systems (BioMEMS), C Ozkan, J. Santini, H. Gao, G. Bao,2003, ISBN: 1-55899-710-5

Volume 774— Materials Inspired by Biology, J.L. Thomas, L. Gower, K.L. Kiick, 2003,ISBN: 1-55899-711-3

Volume 775— Self-Assembled Nanostructured Materials, CJ. Brinker, Y. Lu, M. Antonietti, C. Bai,2003, ISBN: 1-55899-712-1

Volume 776— Unconventional Approaches to Nanostructures with Applications in Electronics, Photonics,Information Storage and Sensing, O.D. Velev, T.J. Bunning, Y. Xia, P. Yang, 2003,ISBN: 1-55899-713-X

Volume 777— Nanostructuring Materials with Energetic Beams, S. Roorda, H. Bernas, A. Meldrum,2003, ISBN: 1-55899-714-8

Volume 778— Mechanical Properties Derived from Nanostructuring Materials, H. Kung, D.F. Bahr,N.R. Moody, K.J. Wahl, 2003, ISBN: 1-55899-715-6

Volume 779— Multiscale Phenomena in Materials—Experiments and Modeling Related to MechanicalBehavior, K.J. Hemker, D.H. Lassila, L.E. Levine, H.M. Zbib, 2003,ISBN: 1-55899-716-4

Volume 780— Advanced Optical Processing of Materials, I.W. Boyd, M. Dinescu, A.V. Rode,D.B. Chrisey, 2003, ISBN: 1-55899-717-2

Volume 78IE—Mechanisms in Electrochemical Deposition and Corrosion, J.C Barbour, R.M. Penner,P.C Searson, 2003, ISBN: 1-55899-718-0

Volume 782— Micro- and Nanosystems, D. La Van, M. McNie, A. Ayon, M. Madou, S. Prasad, 2004,ISBN: 1-55899-720-2

Volume 783— Materials, Integration and Packaging Issues for High-Frequency Devices, P. Muralt, Y.S. Cho,J-P. Maria, M. Klee, C. Hoffmann, CA. Randall, 2004, ISBN: 1-55899-721-0

Volume 784— Ferroelectric Thin Films XII, S. Hoffmann-Eifert, H. Funakubo, A.I. Kingon, I.P. Koutsaroff,V. Joshi, 2004, ISBN: 1-55899-722-9






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 785— Materials and Devices for Smart Systems, Y. Furuya, E. Quandt, Q. Zhang, K. Inoue,M. Shahinpoor, 2004, ISBN: 1-55899-723-7

Volume 786— Fundamentals of Novel Oxide/Semiconductor Interfaces, C.R. Abernathy, E. Gusev,D.G. Schlom, S. Stemmer, 2004, ISBN: 1-55899-724-5

Volume 787— Molecularly Imprinted Materials—2003, P. Kofinas, MJ. Roberts, B. Sellergren, 2004,ISBN: 1-55899-725-3

Volume 788— Continuous Nanophase and Nanostructured Materials, S. Komarneni, J.C. Parker, J. Watkins,2004, ISBN: 1-55899-726-1

Volume 789— Quantum Dots, Nanoparticles and Nanowires, P. Guyot-Sionnest, NJ. Halas, H. Mattoussi,Z.L. Wang, U. Woggon, 2004, ISBN: 1-55899-727-X

Volume 790— Dynamics in Small Confining Systems—2003, J.T. Fourkas, P. Levitz, M. Urbakh, KJ. Wahl,2004, ISBN: 1-55899-728-8

Volume 791— Mechanical Properties of Nanostructured Materials and Nanocomposites, R. Krishnamoorti,E. Lavernia, I. Ovid'ko, C.S. Pande, G. Skandan, 2004, ISBN: 1-55899-729-6

Volume 792— Radiation Effects and Ion-Beam Processing of Materials, L. Wang, R. Fromknecht, L.L. Snead,D.F. Downey, H. Takahashi, 2004, ISBN: 1-55899-730-X

Volume 793— Thermoelectric Materials 2003—Research and Applications, G.S. Nolas, J. Yang, T.P. Hogan,D.C. Johnson, 2004, ISBN: 1-55899-731-8

Volume 794— Self-Organized Processes in Semiconductor Heteroepitaxy, R.S. Goldman, R. Noetzel,A.G. Norman, G.B. Stringfellow, 2004, ISBN: 1-55899-732-6

Volume 795— Thin Films—Stresses and Mechanical Properties X, S.G. Corcoran, Y-C. Joo, N.R. Moody,Z. Suo, 2004, ISBN: 1-55899-733-4

Volume 796— Critical Interfacial Issues in Thin-Film Optoelectronic and Energy Conversion Devices,D.S. Ginley, S.A. Carter, M. Gratzel, R.W. Birkmire, 2004, ISBN: 1-55899-734-2

Volume 797— Engineered Porosity for Microphotonics and Plasmonics, R. Wehrspohn, F. Garcial-Vidal,M. Notomi, A. Scherer, 2004, ISBN: 1-55899-735-0

Volume 798— GaN and Related Alloys—2003, H.M. Ng, M. Wraback, K. Hiramatsu, N. Grandjean, 2004,ISBN: 1-55899-736-9

Volume 799— Progress in Compound Semiconductor Materials III—Electronic and OptoelectronicApplications, D. Friedman, M.O. Manasreh, I. Buyanova, F.D. Auret, A. Munkholm, 2004,ISBN: 1-55899-737-7

Volume 800— Synthesis, Characterization and Properties of Energetic/Reactive Nanomaterials,R.W. Armstrong, N.N. Thadhani, W.H. Wilson, JJ. Gilman, Z. Munir, R.L. Simpson, 2004,ISBN: 1-55899-738-5

Volume 801— Hydrogen Storage Materials, M. Nazri, G-A. Nazri, R.C. Young, C. Ping, 2004,ISBN: 1-55899-739-3

Volume 802— Actinides—Basic Science, Applications and Technology, L. Soderholm, J. Joyce, M.F. Nicol,D. Shuh, J.G. Tobin, 2004, ISBN: 1-55899-740-7

Volume 803— Advanced Data Storage Materials and Characterization Techniques, J. Ahner, L. Hesselink,J. Levy, 2004, ISBN: 1-55899-741-5

Volume 804— Combinatorial and Artificial Intelligence Methods in Materials Science II, R.A. Potyrailo,A. Karim, Q. Wang, T. Chikyow, 2004, ISBN: 1-55899-742-3

Volume 805— Quasicrystals 2003—Preparation, Properties and Applications, E. Belin-Ferre, M. Feuerbacher,Y. Ishii, D. Sordelet, 2004, ISBN: 1-55899-743-1

Volume 806— Amorphous and Nanocrystalline Metals, R. Busch, T. Hufhagel, J. Eckert, A. Inoue,W. Johnson, A.R. Yavari, 2004, ISBN: 1-55899-744-X

Volume 807— Scientific Basis for Nuclear Waste Management XXVII, V.M. Oversby, L.O. Werme, 2004,ISBN: 1-55899-752-0

Prior Materials Research Society Symposium Proceedings available by contacting Materials Research Society






Thin Films—Stresses and Mechanical Properties...

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