Thin films technologies for SRF EUcard2 WP12.2 Thin films prospectives
Thin Films: Stresse s and Mechanical Properties...
Transcript of Thin Films: Stresse s and Mechanical Properties...
Thin Films: Stresses and Mechanical Properties II
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 188
Thin Films:Stresses and Mechanical Properties II
Symposium held April 16-19, 1990, San Francisco, California, U.S.A.
EDITORS:
M. F. DoernerIBM General Products Division, San Jose, California, U.S.A.
W. C. OliverOak Ridge National Laboratory, Oak Ridge, Tennessee, U.S.A.
G. M. PharrRice University, Houston, Texas, U.S.A.
F. R. BrotzenRice University, Houston, Texas, U.S.A.
IM1RTSI MATERIALS RESEARCH SOCIETYPittsburgh, Pennsylvania
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
cambridge university press Cambridge, New York, Melbourne, Madrid, Cape Town, Singapore, São Paulo, Delhi, Mexico City
Cambridge University Press32 Avenue of the Americas, New York ny 10013-2473, USA
Published in the United States of America by Cambridge University Press, New York
www.cambridge.orgInformation on this title: www.cambridge.org/9781107410114
Materials Research Society506 Keystone Drive, Warrendale, pa 15086http://www.mrs.org
© Materials Research Society 1990
This publication is in copyright. Subject to statutory exceptionand to the provisions of relevant collective licensing agreements, no reproduction of any part may take place without the written permission of Cambridge University Press.
This publication has been registered with Copyright Clearance Center, Inc.For further information please contact the Copyright Clearance Center,Salem, Massachusetts.
First published 1990 First paperback edition 2012
Single article reprints from this publication are available throughUniversity Microfilms Inc., 300 North Zeeb Road, Ann Arbor, mi 48106
CODEN: MRSPDH
isbn 978-1-107-41011-4 Paperback
Cambridge University Press has no responsibility for the persistence oraccuracy of URLs for external or third-party internet websites referred to inthis publication, and does not guarantee that any content on such websites is,or will remain, accurate or appropriate.
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
Contents
PREFACE xi
ACKNOWLEDGMENTS xiii
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS xiv
PART I: STRESSES: MEASUREMENT AND THEORY
•STRESSES IN PASSIVATED FILMS 3Paul A. Flinn
FINITE ELEMENT CALCULATIONS OF THERMAL STRESSES INPASSIVATED AND UNPASSIVATED LINES BONDED TO SUBSTRATES 15
Anne I. Sauter and W.D. Nix
DEFLECTION SHAPES DUE TO INTRINSIC STRESS IN THIN FILMS 21Christine B. Masters, N.J. Salamon, andD.E. Fahnline
MEASUREMENT OF STRESSES IN THIN FILMS USING HOLOGRAPHICINTERFEROMETRY: DEPENDENCE ON ATMOSPHERIC CONDITIONS 29
Michele A. Maden, Kun Tong, and Richard J. Farris
A VIBRATIONAL TECHNIQUE FOR STRESS MEASUREMENT IN FILMS 35A. Jagota, S. Mazur, and R.J. Farris
THE IN-SITU MEASUREMENT OF BIAXIAL MODULUS AND RESIDUALSTRESS OF MULTI-LAYER POLYMERIC THIN FILMS 41
Pinyen Lin and Stephen D. Senturia
ANALYSIS OF STRESS VARIATIONS IN EPITAXIAL FILMS USINGCATHODOLUMINESCENCE MICROSCOPY AND SPECTROSCOPY 47
B.G. Yacobi and P. Sheldon
NON-DESTRUCTIVE ASSESSMENT OF THIN FILM STRESSES ANDCRYSTAL QUALITY OF SILICON ON INSULATOR MATERIALSWITH RAMAN SPECTROSCOPY 53
Ingrid De Wolf, Jan Vanhellemont, and Herman E. Maes
PART II: STRESSES: PROCESSING ANDMICROSTRUCTURAL EFFECTS
IN SITU STRESS MEASUREMENTS DURING THE FORMATION OFTiSi2 C49 ON Si WAFERS
J.F. Jongste, G.C.A.M. Janssen, and S, Radelaar
•Invited Paper
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
IN SITU STUDY OF STRESSES GENERATED DURING THE FORMATIONOF COBALT DISILICIDE AND THE EFFECT OF POST SILICIDEPROCESSING 67
A.R. Sitaram, J.C. Kalb, Jr., and S.P. Murarka
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF DIELECTRICFILMS: CORRELATION OF STRESS TO FILM STRUCTURE ANDPLASMA CHARACTERISTICS 73
Radhika Srinivasan, B.C. Nguyen, and A.P. Short
CORRELATION BETWEEN PROCESSING, COMPOSITION, ANDMECHANICAL PROPERTIES OF PECVD-SiNx THIN FILMS 79
D.C.H. Yu and J.A. Taylor
INTRINSIC STRESS OF PECVD SILICON OXYNITRIDE FILMSDEPOSITED IN A HOT-WALL REACTOR 85
K. Aite and R. Koekoek
STRESSES IN AMORPHOUS Gd-Fe ALLOY THIN FILMS DEPOSITEDBY MAGNETRON SPUTTERING 91
Zhi-Feng Zhou, Qi-Gang Zhou, and Yu-Dian Fan
INTERNAL STRESSES AND ADHESION PROPERTIES OF FILM/SUBSTRATE INTERFACES 97
M. Ignat, A. Chouaf, and Ph. Normandon
TEMPERATURE DEPENDENCE OF STRESS FOR COPPER,COPPER-SILVER AND COPPER-TIN FILMS 103
Richard Haynes
PART III: MICROINDENTATION
*THE INFLUENCE OF ION IMPLANTATION ON THE NEAR-SURFACEMECHANICAL PROPERTIES OF CERAMICS 111
C.J. McHargue, M.E. O'Hern, and D.L. Joslin
MECHANICAL PROPERTIES OF CARBON-IMPLANTED NIOBIUM 121S.J. Zinkle and J.S. Huang
MECHANICAL PROPERTIES OF COATINGS AND INTERFACES 127B.D. Fabes and W.C. Oliver
MECHANICAL PROPERTIES OF SILICA COATINGS 133Kenneth D. Cornett, B.D. Fabes, and W.C. Oliver
THE HARDNESS AND ELASTIC MODULUS OF TiN FILMS ASDETERMINED BY ULTRA-LOW LOAD INDENTATION 139
M.E. O'Hern, W.C. Oliver, C.J. McHargue,D.S. Rickerby, and S.J. Bull
PART IV: TIME DEPENDENT DEFORMATION
DETERMINATION OF ELASTIC CONSTANTS AND VISCOSITY OFAMORPHOUS THIN FILMS FROM SUBSTRATE CURVATURE 147
Ann Witvrouw and Frans Spaepen
*Invited Paper
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
X-RAY STRESS STUDIES OF PASSIVATED AND UNPASSIVATEDNARROW ALUMINUM METALLIZATIONS 153
C.A. Paszkiet, M.A. Korhonen, and Che-Yu Li
MEASUREMENT OF STRESS RELAXATION IN THIN ALUMINUMMETALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAYTECHNIQUES 159
M.A. Korhonen, W.R. LaFontaine, C.A. Paszkiet,R.D. Black, and Che-Yu Li
INDENTATION LOAD RELAXATION EXPERIMENTS ON Al-SiMETALLIZATIONS 165
W.R. LaFontaine, B. Yost, R.D. Black, andChe-Yu Li
CREEP BEHAVIOR OF SPUTTERED TiN FILMS USING INDENTATIONTESTING 171
V. Raman and R. Berriche
MECHANICAL PROPERTIES OF THIN FILM ALUMINUM FIBERS:GRAIN SIZE EFFECTS 177
James E. Steinwall and H.H. Johnson
STUDYING MECHANICAL PROPERTIES OF THIN FILMS UNDER HIGHPRESSURES 183
B.C. Cai, D. Kuhlmann-Wilsdorf, and R.B. Nelson
PART V: TRIBOLOGY
*MICROSCRATCH TEST FOR ULTRA-THIN FILMS 191T.W. Wu
MICROSCRATCH TEST ON CARBON FILMS AS THIN AS 20 nm 207T.W. Wu, A.L. Shull, and J. Lin
MECHANICAL PROPERTIES OF CARBON FILMS FOR THIN FILMDISKS 213
Richard L. White, Mary F. Doerner, andGeorge W. Walker
NANOTRIBOLOGY OF DIAMOND FILMS STUDIED BY ATOMIC FORCEMICROSCOPY 219
Gabi Neubauer, Sidney R. Cohen, Gary M. McClelland,and Hajime Seki
ION BEAM ANNEALING OF VAPOR-DEPOSITED CARBON FILM 225Kazuo Higuchi, Shoji Noda, Sumiko Iritani,Tomoji Ishiguro, and Osami Kamigaito
DIAMOND-LIKE FILMS AS OPTICAL AND PROTECTIVE COATINGS 231D. Das Gupta, F. Demichelis, R. Spagnolo, andA. Tagliaferro
EXPERIMENTS ON, AND A TWO-COMPONENT MODEL FOR, THEBEHAVIOR OF WATER NANO-FILMS ON METALS 237
Chao Gao and D. Kuhlmann-Wilsdorf
•Invited Paper
vii
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
PART VI: FRACTURE AND ADHESION
MEASUREMENT OF INTERFACE STRENGTH BY LASER PULSEINDUCED SPALLATION 245
V. Gupta and A.S. Argon
COMPRESSIVE STRESSES, BUCKLING AND SPALLING OF TUNGSTENLPD FILMS 251
Aidan Borer and Brian Derby
CRACKING AND DELAMINATION OF VAPOUR-DEPOSITED TANTALUMFILMS 257
R.M. Fisher, J.Z. Duan, and J.B. Liu
INDENTATION FRACTURE OF BRITTLE MATERIALS 263Barry N. Lucas, W.C. Oliver, and J.J. Wert
MOLECULAR DYNAMICS COMPUTER SIMULATION OF THE RUPTUREOF THE TWO-DIMENSIONAL LENNARD-JONES FILM 269
John F. Maguire and Chun-Pok Leung
FRACTURE-EXAFS: A NEW METHOD FOR THE STUDY OF INTERFACESIN THIN FILMS AND POLYCRYSTALLINE MATERIALS 275
E.V. Barrera, Benji Maruyama, and S.M. Heald
PROPERTIES OF A SUBMICRON-HONEYCOMB THIN FILM 281R.C. Furneaux, J.S. Crompton, and D.J. Fitchett
PART VII: MULTILAYERS
MECHANICAL PROPERTIES OF COMPOSITIONALLY MODULATEDAu-Ti THIN FILMS USING INDENTATION AND MICROBEAMDEFLECTION TECHNIQUES 289
Shefford P. Baker, Alan F. Jankowski, Soonil Hong,and William D. Nix
MECHANICAL PROPERTIES OF MULTILAYERED COPPER-NICKELTHIN FILMS MEASURED BY INDENTATION TECHNIQUES 295
T.E. Schlesinger, R.C. Cammarata, C. Kim,S.B. Qadri, and A.S. Edelstein
TRIBOLOGICAL AND MECHANICAL PROPERTIES OF Fe/TiMULTILAYERED FILMS 301
M. Nastasi, J-P. Hirvonen, T.R. Jervis,and S.N. Basu
THE MECHANICAL PROPERTIES OF Cu/TiB2 MULTILAYERSTRUCTURES 307
Kevin M. Hubbard, S.N. Basu, J-P. Hirvonen,T.R. Jervis, and M. Nastasi
PART VIII: MICROSTRUCTURE AND DEFECTS
•MECHANISMS AND KINETICS OF MISFIT DISLOCATION FORMATIONIN HETEROEPITAXIAL THIN FILMS 315
W.D. Nix, D.B. Noble, and J.F. Turlo
*Invited Paper
viii
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
MECHANICAL PROPERTIES OF NANOCOMPOSITE COATINGSFABRICATED BY SPUTTERING 331
G.M. Chow, R.L. Holtz, C.Cm. Wu, A.S. Edelstein,T.E. Schlesinger, and R.C. Cammarata
*HARD COATINGS 337S.J. Bull and D.S. Rickerby
PHOTOREFLECTANCE CHARACTERIZATION OF SILICON FILMS ONINSULATOR 349
Adriana Giordana, R. Glosser, Joseph G. Pellegrino,S. Qadri, M.E. Twigg, E.D. Richmond, Keith Joyner,and Gordon Pollack
STRUCTURAL DEPENDENCE OF THE ELASTIC CONSTANTS OFPOLYMERIC LANGMUIR-BLODGETT FILMS STUDIED USINGBRILLOUIN SCATTERING 355
Sukmock Lee, J.R. Dutcher, B. Hillebrands,G.I. Stegeman, W. Knoll, G. Duda, G. Wegner,and F. Nizzoli
AUTHOR INDEX 361
SUBJECT INDEX 363
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 365
*Invited Paper
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
Preface
This volume is a compilation of papers presented at the1990 Spring Meeting of the Materials Research Society in asymposium entitled "Thin Films: Stresses and MechanicalProperties II". As indicated by the title, the symposium wasthe second in a series, the first of which was held at the FallMeeting in 1988.
Interest in thin film mechanical properties continues togrow. The symposium was attended by a large internationalaudience representing universities, national laboratories andindustry who presented basic and applied research results infields such as semiconductor technology, magnetic recordingtechnology, and hard coating technology. The importance of thinfilm mechanical properties in these fields is now recognized tothe extent that basic characterization techniques such asmicroindentation and thin film stress measurement are performedroutinely, and new characterization techniques are beingdeveloped on a daily basis. Many of the papers in the symposiumdealt with the developments in these characterization methodsand their application to a broad spectrum of materials such ascompositionally modulated structures, ion implanted materials,optical coatings, and the numerous metals, ceramics and organicsused in semiconductor device manufacture.
The editors are encouraged by the rapidly growing interestin thin film mechanical properties. It is hoped that thisvolume will be useful to newcomers to the field, as well asstimulate new ideas for those who are already familiar with it.
Mary F. DoernerWarren C. OliverGeorge M. PharrFranz R. Brotzen
June 1990
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
Acknowledgments
The editors gratefully acknowledge financial supportprovided by:
Nano Instruments, Inc.Knoxville, Tennessee
IBM General Products DivisionSan Jose, California
UltraTherm, Inc.Kingston, Tennessee
Oak Ridge National LaboratoryOak Ridge, Tennessee
The organizational and typing assistance provided byMs. Gwen Sims, Oak Ridge National Laboratory, is alsoappreciated.
Mary F. DoernerWarren C. OliverGeorge M. PharrFranz R. Brotzen
June 1990
xiii
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Recent Materials Research Society Symposium Proceedings
Volume 157—Beam-Solid Interactions: Physical Phenomena, J.A. Knapp, P. Borgesen,R.A. Zuhr, 1989, ISBN 1-55899-045-3
Volume 158—In-Situ Patterning: Selective Area Deposition and Etching, R. Rosenberg,A.F. Bernhardt, J.G. Black, 1989, ISBN 1-55899-046-1
Volume 159—Atomic Scale Structure of Interfaces, R.D. Bringans, R.M. Feenstra,J.M. Gibson, 1989, ISBN 1-55899-047-X
Volume 160—Layered Structures: Heteroepitaxy, Superlattices, Strain, andMetastability, B.W. Dodson, LJ. Schowalter, J.E. Cunningham,F.H. Pollak, 1989, ISBN 1-55899-048-8
Volume 161—Properties of II-VI Semiconductors: Bulk Crystals, Epitaxial Films,Quantum Well Structures and Dilute Magnetic Systems, J.F. Schetzina,F.J. Bartoli, Jr., H.F. Schaake, 1989, ISBN 1-55899-049-6
Volume 162—Diamond, Boron Nitride, Silicon Carbide and Related Wide BandgapSemiconductors, J.T. Glass, R.F. Messier, N. Fujimori, 1989,ISBN 1-55899-050-X
Volume 163—Impurities, Defects and Diffusion in Semiconductors: Bulk and LayeredStructures, J. Bernholc, E.E. Haller, DJ. Wolford, 1989,ISBN 1-55899-051-8
Volume 164—Materials Issues in Microcrystalline Semiconductors,P.M. Fauchet, C.C. Tsai, K. Tanaka, 1989, ISBN 1-55899-052-6
Volume 165—Characterization of Plasma-Enhanced CVD Processes, G. Lucovsky,D.E. Ibbotson, D.W. Hess, 1989, ISBN 1-55899-053-4
Volume 166—Neutron Scattering for Materials Science, S.M. Shapiro, S.C. Moss,J.D. Jorgensen, 1989, ISBN 1-55899-054-2
Volume 167—Advanced Electronic Packaging Materials, A. Barfknecht, J. Partridge,C-Y. Li, CJ. Chen, 1989, ISBN 1-55899-055-0
Volume 168—Chemical Vapor Deposition of Refractory Metals and Ceramics,T.M. Besmann, B.M. Gallois, 1989, ISBN 1-55899-056-9
Volume 169—High Temperature Superconductors: Fundamental Properties and NovelMaterials Processing, J. Narayan, C.W. Chu, L.F. Schneemeyer,D.K. Christen, 1989, ISBN 1-55899-057-7
Volume 170—Tailored Interfaces in Composite Materials, C.G. Pantano, EJ.H. Chen,1989, ISBN 1-55899-058-5
Volume 171—Polymer Based Molecular Composites, D.W. Schaefer, J.E. Mark, 1989,ISBN 1-55899-059-3
Volume 172—Optical Fiber Materials and Processing, J.W. Fleming, G.H. Sigel,S. Takahashi, P.W. France, 1989, ISBN 1-55899-060-7
Volume 173—Electrical, Optical and Magnetic Properties of Organic Solid-StateMaterials, L.Y. Chiang, D.O. Cowan, P. Chaikin, 1989,ISBN 1-55899-061-5
Volume 174—Materials Synthesis Utilizing Biological Processes, M. Alper, P.D. Calvert,P.C. Rieke, 1989, ISBN 1-55899-062-3
Volume 175—Multi-Functional Materials, D.R. Ulrich, F.E. Karasz, A.J. Buckley,G. Gallagher-Daggitt, 1989, ISBN 1-55899-063-1
Volume 176—Scientific Basis for Nuclear Waste Management XIII, V.M. Oversby,P.W. Brown, 1989, ISBN 1-55899-064-X
Volume 177—Macromolecular Liquids, C.R. Safinya, S.A. Safran, P.A. Pincus, 1989,ISBN 1-55899-065-8
Volume 178—Fly Ash and Coal Conversion By-Products: Characterization, Utilizationand Disposal VI, F.P. Glasser, R.L. Day, 1989, ISBN 1-55899-066-6
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Volume 179—Specialty Cements with Advanced Properties, H. Jennings, A.G. Landers,B.E. Scheetz, I. Odler, 1989, ISBN 1-55899-067-4
Volume 180—Better Ceramics Through Chemistry IV, C.J. Brinker, D.E. Clark,D.R. Ulrich, B.J.J. Zelinsky, 1990, ISBN: 1-55899-069-0
Volume 181—Advanced Metallizations in Microelectronics, A. Katz, S.P. Murarka,A. Appelbaum, 1990, ISBN: 1-55899-070-4
Volume 182—Polysilicon Thin Films and Interfaces, B. Raicu, T.Kamins,C.V. Thompson, 1990, ISBN: 1-55899-071-2
Volume 183—High-Resolution Electron Microscopy of Defects in Materials, R. Sinclair,DJ. Smith, U. Dahmen, 1990, ISBN: 1-55899-072-0
Volume 184—Degradation Mechanisms in III-V Compound Semiconductor Devices andStructures, V. Swaminathan, SJ. Pearton, O. Manasreh, 1990,ISBN: 1-55899-073-9
Volume 185—Materials Issues in Art and Archaeology II, J.R. Druzik, P.B. Vandiver,G. Wheeler, 1990, ISBN: 1-55899-074-7
Volume 186—Alloy Phase Stability and Design, G.M. Stocks, D.P. Pope, A.F. Giamei,1990, ISBN: 1-55899-075-5
Volume 187—Thin Film Structures and Phase Stability, B.M. Clemens, W.L. Johnson,1990, ISBN: 1-55899-076-3
Volume 188—Thin Films: Stresses and Mechanical Properties II, W.C. Oliver,M. Doerner, G.M. Pharr, F.R. Brotzen, 1990, ISBN: 1-55899-077-1
Volume 189—Microwave Processing of Materials II, W.B. Snyder, W.H. Sutton,D.L. Johnson, M.F. Iskander, 1990, ISBN: 1-55899-078-X
Volume 190—Plasma Processing and Synthesis of Materials III, D. Apelian, J. Szekely,1990, ISBN: 1-55899-079-8
Volume 191—Laser Ablation for Materials Synthesis, D.C. Paine, J.C. Bravman, 1990,ISBN: 1-55899-080-1
Volume 192—Amorphous Silicon Technology, P.C. Taylor, M.J. Thompson,P.G. LeComber, Y. Hamakawa, A. Madan, 1990, ISBN: 1-55899-081-X
Volume 193—Atomic Scale Calculations of Structure in Materials, M.A. Schluter,M.S. Daw, 1990, ISBN: 1-55899-082-8
Volume 194—Intermetallic Matrix Composites, D.L. Anton, R. McMeeking, D. Miracle,P. Martin, 1990, ISBN: 1-55899-083-6
Volume 195—Physical Phenomena in Granular Materials, T.H. Geballe, P. Sheng,G.D. Cody, 1990, ISBN: 1-55899-084-4
Volume 196—Superplasticity in Metals, Ceramics, and Intermetallics, M.J. Mayo,J. Wadsworth, M. Kobayashi, A.K. Mukherjee, 1990, ISBN: 1-55899-085-2
Volume 197—Materials Interactions Relevant to the Pulp, Paper, and Wood Industries,J.D. Passaretti, D. Caulfield, R. Roy, V. Setterholm, 1990,ISBN: 1-55899-086-0
Volume 198—Epitaxial Heterostructures, D.W. Shaw, J.C. Bean, V.G. Keramidas,P.S. Peercy, 1990, ISBN: 1-55899-087-9
Volume 199—Workshop on Specimen Preparation for Transmission ElectronMicroscopy of Materials II, R. Anderson, 1990, ISBN: 1-55899-088-7
Volume 200—Ferroelectric Thin Films, A.I. Kingon, E.R. Myers, 1990,ISBN: 1-55899-089-5
Earlier Materials Research Society Symposium Proceedings listed in the back.
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information