Thermal Management Design Guide - we-online.com · Thermal vias in pad Thermal vias in pad and...
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Combination microvia, buried via as thermal via Thermal vias filled (filled & capped via) Thermal vias unfilled Thermal Management Design Guide DESIGN GUIDE Version 1.0 www.we-online.om 1/2 800 µm Pitch 400 µm Pitch Buried Via Final Ø 300 µm Microvia Final Ø 100 µm Al heatsink Thermal via Drill diameter Pitch PCB thickness PCB thickness at least 0.40 mm Thermal adhesive tape 50 µm/190 µm Heatsink AlMg3 1 – 4 mm Pitch 800 µm Final Ø 300 µm; at least 25 µm copper in the hole Al heatsink Microvia Buried via
Transcript of Thermal Management Design Guide - we-online.com · Thermal vias in pad Thermal vias in pad and...
Combination microvia, buried via as thermal via
Thermal vias filled (filled & capped via) Thermal vias unfilled
Thermal Management Design Guide
DESIGN GUIDEVersion 1.0
www.we-online.om 1/2
800 µm Pitch
400 µm Pitch
Buried ViaFinal Ø 300 µm
Microvia Final Ø 100 µm
Al heatsink
Thermal via
Drill diameterPitch
PCB thickness
PCB thickness at least 0.40 mm
Thermal adhesive tape 50 µm/190 µm
Heatsink AlMg3 1 – 4 mm
Pitch 800 µm Final Ø 300 µm; at least 25 µm copper in the hole
Al heatsink
MicroviaBuried via
Find more information to thermal management of PCBs on our website:www.we-online.com/heat
Thermal vias in pad Thermal vias in pad and external
Cut-out in heatsink Heatsink larger than PCB
DESIGN GUIDEVersion 1.0
www.we-online.com 2/2
Positive micro edges
The breaking point is located in the rout path
outside the PCB outline.
Negative micro edges
Breaking point inside the PCB outline.
To ensure stability of the panel additional
ribs are required.
Standard Design Rules
Heatsink breaking points, micro edges Scope for design
Microvias Thermal vias
Heatsink
Pitch 800 µm
Pad Ø 650 µm
Final Ø 300 µm
Pad Ø 300 µm
Final Ø 100 µm
Pad Ø 650 µm(inner)
Final Ø 300 µm
Pitch ≥ 400 µm
Prepreg
PrepregAdhesive
CoreBuried
Via Thermal vias
Thermal viasMicrovias
65 µm
