Thermal Analysis of an Icy IC
16
Thermal Analysis of an Icy IC Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010
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Thermal Analysis of an Icy IC. Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010. Page 1. Page 2. Two processes for releasing the silicon nitride membrane:. Thin PolySi Removed by XeF 2. Page 3. - PowerPoint PPT Presentation
Transcript of Thermal Analysis of an Icy IC
Thermal Analysis of anIcy IC
Shiree BurtCryogenic Electronics Group
San Francisco State UniversityPresented October 2, 2006Revised October 18, 2010
Page 1
Page 2
Two processes for releasing the silicon nitride membrane:
Thin PolySiRemoved by XeF2
Page 3
Without Etch Stop With Etch Stop
Confinement of XeF2 etch by SiO2 etch stop “tub”
Page 4
Membrane Undercutting
Test Structure
Page 5
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